NOTICE: This Document is a complete rewrite.

Transcription

1 Background Statement for SEMI Draft Document 5817 REVISION TO SEMI E (REAPPROVED 0305), SPECIFICATION AND GUIDE FOR 300 MM EQUIPMENT FOOTPRINT, HEIGHT, AND WEIGHT WITH TITLE CHANGE TO: SPECIFICATION AND GUIDE FOR EQUIPMENT FOOTPRINT, HEIGHT, AND WEIGHT Notice: This background statement is not part of the balloted item. It is provided solely to assist the recipient in reaching an informed decision based on the rationale of the activity that preceded the creation of this Document. Notice: Recipients of this Document are invited to submit, with their comments, notification of any relevant patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this context, patented technology is defined as technology for which a patent has issued or has been applied for. In the latter case, only publicly available information on the contents of the patent application is to be provided. Background SEMI E72 is long overdue for a reapproval and subject to becoming inactive. The previous reapproval ballot failed due to persuasive negatives pointing out a number of technical errors. Extensive changes were made by the task force to correct these technical errors and to clarify ambiguity. NOTICE: This Document is a complete rewrite. The ballot results will be reviewed and adjudicated at the meetings indicated in the table below. Check under Calendar of Events for the latest update. Review and Adjudication Information Task Force Review Committee Adjudication Group: Global PIC Maintenance TF PIC NA TC Chapter Date: April 5, 2016 April 6, 2016 Time & Time zone: 1:00 PM - 2:00 PM PDT 9:00 AM - 12:00 Noon PDT Location: SEMI Headquarters SEMI Headquarters City, State/Country: San Jose, CA/USA San Jose, CA/USA Leader(s)/Authors: Larry Hartsough (U A Associates)/ Alan Crockett Matt Fuller (Entegris) Stefan Radloff (Intel) Standards Staff: Laura Nguyen (lnguyen@semi.org ) Laura Nguyen (lnguyen@semi.org ) This meeting s details are subject to change, and additional review sessions may be scheduled if necessary. Contact the task force leaders or Standards staff for confirmation. Telephone and web information will be distributed to interested parties as the meeting date approaches. If you will not be able to attend these meetings in person but would like to participate by telephone/web, please contact Standards staff. Check on calendar of event for the latest meeting schedule.

2 SEMI Draft Document 5817 REVISION TO SEMI E (REAPPROVED 0305), SPECIFICATION AND GUIDE FOR 300 MM EQUIPMENT FOOTPRINT, HEIGHT, AND WEIGHT WITH TITLE CHANGE TO: SPECIFICATION AND GUIDE FOR EQUIPMENT FOOTPRINT, HEIGHT, AND WEIGHT NOTICE: This Document is a complete rewrite. 1 Purpose 1.1 In order for, device manufacturers to plan or retrofit their fabs efficiently, they need drawings from equipment suppliers that show the footprint occupied by equipment during operation, and also the areas needed for maintenance and service. 1.2 Equipment suppliers need to know what limitations there are for equipment configurations and for moving equipment into facilities. 2 Scope 2.1 This Standard specifies limits on the footprint, height, and weight of equipment for wafer fabs. Separate limits are given for the parts of the equipment in the main fab and in the sub-fab. Separate limits are also given for the equipment after it is installed and for the components of the equipment as it is moved into the fab. The actual footprint may vary by equipment type. 2.2 This Standard limits the kinds of activities that may occur near the load face plane of the equipment. 2.3 This Standard is intended to set an appropriate level of specification that places minimal limits on supplier innovation while ensuring opportunities for users to be globally (though possibly not locally) efficient with equipment volumes. NOTICE: SEMI Standards and Safety Guidelines do not purport to address all safety issues associated with their use. It is the responsibility of the users of the Documents to establish appropriate safety and health practices, and determine the applicability of regulatory or other limitations prior to use. 3 Referenced Standards 3.1 SEMI Standards and Safety Guidelines SEMI E15 Specification for Tool Load Port SEMI E15.1 Specification for 300 mm Tool Load Port SEMI E154 Mechanical Interface Specification for 450 mm Load Port NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions. 4 Terminology 4.1 Definitions Ae area of the easement rectangle (We * De) Af area of the footprint rectangle (Wf * Df) cost footprint, A the area of the footprint rectangle plus half the area of the easement rectangle (for use as the floor space metric in Cost of Ownership calculations) depth the horizontal dimension perpendicular to the load face plane easement area the area immediately adjacent to equipment that is required for service or maintenance access Discussion This includes safety aisles, ergonomic maintenance access space, component removal space, and room for doors to swing out, but does not extend in front of the load face plane (see Figure 1). Page 1

3 4.1.6 easement depth, De the depth of the easement rectangle easement rectangle the smallest rectangle extending from the load face plane to the furthest extent of the easement areas to the rear, the left and the right sides easement width, We the width of the easement rectangle Discussion This includes safety aisles, ergonomic maintenance access space, component removal space, and room for doors to swing out, but not in front of the load face plane (see Figure 1) load face plane the furthest physical vertical boundary plane from the cassette centroid or carrier centroid on the side (or sides) of the tool where loading of the tool is intended. [SEMI E15] equipment footprint the area covered by parts of the equipment during operation Discussion This includes any temporary projections from the equipment during loading or processing, such as carriers that stick out from the equipment or equipment load ports that protrude only when the equipment is being loaded, but not in front of the load face plane (See Figure 1) footprint depth, Df the depth of the equipment footprint footprint rectangle the smallest rectangle extending from the load face plane to the rear and side extents of the equipment footprint width, Wf the width of the equipment footprint width the horizontal dimension parallel to the load face plane. 5 Requirements and Recommendations 5.1 Dimensions The dimensions cited in 5 are specified in Table The width and depth of the footprint and easement rectangles are shown in Figure 1. Page 2

4 Figure 1 Equipment Footprint Dimensions The cost footprint is calculated using the following equation. 5.2 Sub-Fab vs. Main Fab Footprint A = Af + ½ (Ae Af) = ½ Af + ½ Ae = ½ Wf * Df + ½ We * De Requirements Both the cost footprint and the equipment footprint of the remote parts of any equipment in the sub-fab shall be less than or equal to the cost footprint and the equipment footprint (respectively) of the parts of that equipment in the main fab (the cleanroom including both bays and chases, if any). Furthermore, the remote parts of the equipment in the sub-fab shall be capable of being installed so that the rectangle defining the cost footprint in the sub-fab is entirely underneath the rectangle defining the cost footprint in the main fab. In some fab designs (such as slab on grade), there is no sub-fab (or basement). In such cases, these requirements apply to the remote parts of the equipment in whichever equipment support area contains the same remote parts of the equipment as a sub-fab. Also, some fabs have multiple sub-fab levels. In such cases, these requirements apply to the sum of the areas of remote parts of the equipment in all sub-fab levels Recommendations Because the sub-fab is likely to have more columns than the main fab, the remote parts of the equipment in the sub-fab should come in modules that can be arranged to accommodate a variety of layouts. 5.3 Equipment Height Requirements The maximum height of any equipment (other than a stocker) shall be less than or equal to H in the main fab and Hs in the sub-fab. Any connections for utilities and required overhead maintenance access shall also be included within these limits. These limits also apply during installation, so if a part of the equipment must be rotated up into place, the maximum height during the rotation shall be less than these limits Recommendations Thus, equipment suppliers are advised to not plan on ceilings higher than these limits. Page 3

5 5.4 Floor Loading Requirements The maximum mass of any equipment in the main fab divided by its equipment footprint shall be less than or equal to M (except when support pedestals are used). Furthermore, the maximum mass on any 0.6 m by 0.6 m (2 ft. by 2 ft.) floor tile (in any installation configuration) shall be less than or equal to Mt. These limits also apply when the equipment is being moved into the fab and installed, unless spreader plates are used Recommendations Seismic loading should also be considered when designing equipment weight distribution. 5.5 Move-In-Size Requirements To clarify the size of the doors and hallways needed in the fab, this paragraph specifies the size of the equipment's components after it has been uncrated, while it is being moved into the fab, and before it is installed. All parts of the equipment destined for the main fab shall come in packages that are no taller than Z and that are smaller than X by Y in two orthogonal horizontal dimensions. All parts of the equipment destined for the sub-fab shall come in packages that are no taller than Zs and that are smaller than Xs by Ys in two orthogonal horizontal dimensions. Furthermore, none of these packages shall weigh more than Mm each. This paragraph does not apply to stockers and AMHS transport equipment Recommendations Equipment suppliers and device manufacturers might also consider carrier stocker size, move-in timing, and move-in path during stocker and facility design. Equipment that conforms to these limits may still be too large to fit into standard truck trailers or aircraft cargo bays. 5.6 Maintenance Access Requirements To avoid interfering with carrier transport systems, equipment shall not require regularly scheduled maintenance from the front. This requirement does not apply to maintenance performed on user interfaces, cart-docking interfaces, load ports, carrier buffers, and load locks Recommendations As little regularly scheduled maintenance as possible should be required from the side. 5.7 Width vs. Depth Recommendations In general, in order to allow for most efficient fab layout, equipment should be designed to minimize width rather than depth. 5.8 Linked Equipment Recommendations To make linked equipment (such as cluster tools or steppers with litho tracks) jointly space efficient, they should be designed to minimize the cost footprint of the entire system as a whole. Table 1 Equipment Move-in, Height, and Weight Dimensions Symbol Used Value Specified Dimension Description H 3.5 m (11 ft. 5 in.) height of equipment in the main fab Hs 2 m (6 ft. 6 in.) height of equipment in the sub-fab M 1500 kg/m 2 (2.1 lbm./in. 2 ) mass of equipment divided by its equipment footprint Mm 6000 kg (13227 lbm.) mass of equipment move-in packages Mt 1000 kg (2204 lbm.) mass of equipment on any 0.6 m by 0.6 m (2 ft. by 2 ft.) floor tile X 2.2 m (7 ft. 2 in.) Length (perpendicular to Y) of equipment move-in packages destined for the main fab Xs 2 m (6 ft. 6 in.) Length (perpendicular to Ys) of equipment move-in packages destined for the sub-fab Y 2.8 m (9 ft. 2 in.) Length (perpendicular to X) of equipment move-in packages destined for the main fab Ys 1.7 m (5 ft. 6 in.) Length (perpendicular to Xs) of equipment move-in packages destined for the sub-fab Z 2.8 m (9 ft. 2 in.) Height of equipment move-in packages destined for the main fab Zs 2 m (6 ft. 6 in.) Height of equipment move-in packages destined for the sub-fab Page 4

6 6 Related Documents 6.1 SEMI Standards SEMI E6 Facilities Interface Specifications Guideline and Format SEMI E26.1 Radial Cluster Tool Footprint 300 mm Standard SEMI E35 Cost of Ownership for Semiconductor Manufacturing Equipment Metrics SEMI E76 Guide for 300 mm Process Equipment Points of Connection to Facility Service SEMI S2 Safety Guidelines for Semiconductor Manufacturing Equipment NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions. Page 5

7 RELATED INFORMATION 1 APPLICATION NOTES NOTICE: This Related Information is not an official part of SEMI [designation number] and was derived from the work of the [committee name] Global Technical Committee. This Related Information was approved for publication by full letter ballot procedures on [A&R approval date]. R1-1 Application Notes R1-1.1 The maximum height of equipment in the main fab was set so that the equipment could be installed in existing fabs with ceilings just above the equipment height of 3.5 m (11 ft. 5 in) or in fabs with ceiling heights of 3.66 m (12 ft. 0 in.) where more clearance is provided for such things as parts of some overhead carrier transport systems, fire sprinkler systems at the ceiling, and/or extra room for installation of equipment. R1-1.2 The maximum height of equipment in the sub-fab was set so that no part of the equipment (other than connections to the main fab area) sticks up into the piping and duct-work immediately under the waffle slab. In those cases where a part of the equipment must be taller than 2 m (6 ft. 6 in.), it is recommended that it not be taller than 2.5 m (8 ft. 2 in.) to stay under the waffle slab. R1-1.3 If equipment must have easement area on the side, versions should be designed in mirror-image configurations such that easement area would be needed on only one side or the other, so that half of the total easement area on the sides can be deleted. However, it is recommended that the resulting increase in equipment cost, complexity, and spare parts inventory be taken into account. R1-1.4 Equipment that conforms to the limits given in this standard may be too large or heavy to fit into buildings that were originally designed for equipment that processes smaller wafers. NOTICE: SEMI makes no warranties or representations as to the suitability of the Standards and Safety Guidelines set forth herein for any particular application. The determination of the suitability of the Standard or Safety Guideline is solely the responsibility of the user. Users are cautioned to refer to manufacturer s instructions, product labels, product data sheets, and other relevant literature, respecting any materials or equipment mentioned herein. Standards and Safety Guidelines are subject to change without notice. By publication of this Standard or Safety Guideline, SEMI takes no position respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this Standard or Safety Guideline. Users of this Standard or Safety Guideline are expressly advised that determination of any such patent rights or copyrights and the risk of infringement of such rights are entirely their own responsibility. Page 6