Inductors for Power Circuits

Transcription

1 Inductors for Power Circuits Multilayer/SD magnetic shielded MLP series ype: MLP212 MLP216 MLP252 [85 inch]* [86 inch] [18 inch] * Dimensions Code [EIA] Issue date: September 211 Conformity to RoHS Directive: his means that, in conformity with EU Directive 22/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.

2 (1/8) Inductors for Power Circuits Multilayer/SD Magnetic Shielded Conformity to RoHS Directive MLP Series MLP212 With its internal structure optimized, the MLP212 type has achieved DC superimposition characteristics that are comparable to those of the existing MLP252 type. In addition, because low-loss materials are used, the core loss of the coil can be minimized within a wide frequency range. MLP212's choke coils are therefore best suited to several MHzdrive switching power supplies, the use of which is especially prominent in mobile devices. PRODUC IDENIFICAION MLP 212 S 2R2 M (1) (2) (3) (4) (5) (6) (1) Series name (2) Dimensions L W mm FEAURES MLP212 has DC super imposition characteristics that are comparable to that of the existing MLP252 type. Optimized ferrite materials enable the reduction of losses. Magnetically shielded configuration allowing for high-density mounting. he products contain no lead and also support lead-free soldering. It is a product conforming to RoHS directive. (3) Product characteristics classification code S SD (4) Inductance value 2R2 (5) Management number t=.5mm M t=.85mm APPLICAIONS Cellular phones, DSCs, DVCs, HDDs, etc. (6) Packaging style aping [reel] SPECIFICAIONS Operating temperature range Storage temperature range RECOMMENDED SOLDERING CONDIION REFLOW SOLDERING 25 to 26 C 23 C 18 C 15 C Preheating 6 to 12s ime(s) 4 to +125 C [Including self-temperature rise] 4 to +85 C 1s max. Soldering 3 to 6s Natural cooling PACKAGING SYLE AND QUANIIES Packaging style Quantity aping 4 pieces/reel HANDLING AND PRECAUIONS Before soldering, be sure to preheat components. he preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 15 C. After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. he inductance value may change due to magnetic saturation if the current exceeds the rated maximum. Do not expose the inductors to stray magnetic fields. Avoid static electricity discharge during handling. When hand soldering, apply the soldering iron to the printed circuit board only. emperature of the iron tip should not exceed 35 C. Soldering time should not exceed 3 seconds. Conformity to RoHS Directive: his means that, in conformity with EU Directive 22/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. Please contact our Sales office when your application is considered the following: he device s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)

3 (2/8) SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PAERN ± ±.2.5±.3.5±.5.85±.15 Weight(mg) ELECRICAL CHARACERISICS Classification SD Low profile Part No. Inductance Inductance est frequency DC resistance Rated current hickness (µh) tolerance (MHz) (Ω )±3% (ma)max. (mm)max. MLP212SR47M.47 ±2% MLP212S1RM ±2% MLP212S1R5M 1.5 ±2% MLP212S2R2M 2.2 ±2% MLP212S3R3M 3.3 ±2% MLP212S4R7M 4.7 ±2% MLP212SR47.47 ±2% MLP212SR82.82 ±2% MLP212S1R ±2% MLP212S1R5 1.5 ±2% MLP212S2R2 2.2 ±2% YPICAL ELECRICAL CHARACERISICS INDUCANCE vs. FREQUENCY CHARACERISICS =mm max. INDUCANCE CHANGE vs. DC SUPERPOSIION CHARACERISICS =mm max µh µh.47µh Frequency(MHz).47µH =.55mm max. =.55mm max µh.82µh.47µh µh.82µh.47µh Frequency(MHz)

4 (3/8) PACKAGING SYLES REEL DIMENSIONS ø6min. ±.5 ø13±.2 ø21±.8 ø18± max. APE DIMENSIONS Sprocket hole Cavity 1.75±.1 8.±.3 3.5±.5 1.1max. 1.5±.2 4.±.1 4.±.1 ±.5 2.3±.2 16min. aping 2min. Drawing direction 3min.

5 (4/8) Inductors for Power Circuits Multilayer/SD Magnetic Shielded Conformity to RoHS Directive MLP Series MLP216 With its internal structure optimized, the MLP216 type has achieved DC superimposition characteristics that are comparable to those of the existing MLP252 type. In addition, because low-loss materials are used, the core loss of the coil can be minimized within a wide frequency range. MLP216's choke coils are therefore best suited to several MHzdrive switching power supplies, the use of which is especially prominent in mobile devices. PRODUC IDENIFICAION MLP 216 S 2R2 M (1) (2) (3) (4) (5) (6) (1) Series name (2) Dimensions L W mm FEAURES MLP216 has DC super imposition characteristics that are comparable to that of the existing MLP252 type. Optimized ferrite materials enable the reduction of losses. Magnetically shielded configuration allowing for high-density mounting. he products contain no lead and also support lead-free soldering. It is a product conforming to RoHS directive. APPLICAIONS Cellular phones, DSCs, DVCs, HDDs, etc. SPECIFICAIONS Operating temperature range Storage temperature range RECOMMENDED SOLDERING CONDIION REFLOW SOLDERING 25 to 26 C 23 C 18 C 15 C Preheating 6 to 12s 4 to +125 C [Including self-temperature rise] 4 to +85 C 1s max. Soldering 3 to 6s Natural cooling (3) Product characteristics classification code S SD (4) Inductance value 2R2 (5) Management number M t=.85mm (6) Packaging style aping [reel] PACKAGING SYLE AND QUANIIES Packaging style Quantity aping 3 pieces/reel HANDLING AND PRECAUIONS Before soldering, be sure to preheat components. he preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 15 C. After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. he inductance value may change due to magnetic saturation if the current exceeds the rated maximum. Do not expose the inductors to stray magnetic fields. Avoid static electricity discharge during handling. When hand soldering, apply the soldering iron to the printed circuit board only. emperature of the iron tip should not exceed 35 C. Soldering time should not exceed 3 seconds. ime(s) Conformity to RoHS Directive: his means that, in conformity with EU Directive 22/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. Please contact our Sales office when your application is considered the following: he device s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)

6 (5/8) SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PAERN ±.2 1.6±.2.5± ±.15 Weight(mg) 12 ELECRICAL CHARACERISICS Classification SD Part No. Inductance Inductance est frequency DC resistance Rated current hickness (µh) tolerance (MHz) (Ω )±3% (ma)max. (mm)max. MLP216SR47M.47 ±2% MLP216S1RM ±2% MLP216S1R5M 1.5 ±2% MLP216S2R2M 2.2 ±2% MLP216S4R7M 4.7 ±2% YPICAL ELECRICAL CHARACERISICS INDUCANCE vs. FREQUENCY CHARACERISICS =mm max. INDUCANCE CHANGE vs. DC SUPERPOSIION CHARACERISICS =mm max µh.47µh µh.47µh Frequency(MHz) PACKAGING SYLES REEL DIMENSIONS APE DIMENSIONS Sprocket hole Cavity ø6min. 1.75±.1 8.±.3 3.5±.5 1.1max. 1.5±.2 4.±.1 4.±.1 ±.5 2.3±.2 ±.5 ø13±.2 ø21±.8 ø18± max. 16min. aping 2min. Drawing direction 3min.

7 (6/8) Inductors for Power Circuits Multilayer/SD Magnetic Shielded Conformity to RoHS Directive MLP Series MLP252 In response to market demands for smaller mobile devices with a longer lasting life, mounted switching supply circuits with even higher frequencies are now being developed. With optimized materials the MLP252 type contributes to the improved efficiency of power sources, and reduces the losses caused by ferrite, even if the products are used for supply circuits with high drive frequencies. FEAURES Optimized ferrite materials enable the reduction of losses. Compared to the existing MLP252 type, DC superposition characteristics have been substantially improved. he products contain no lead and also support lead-free soldering. It is a product conforming to RoHS directive. APPLICAIONS Cellular phones, DSCs, DVCs, HDs, etc. SPECIFICAIONS Operating temperature range Storage temperature range 4 to +125 C [Including self-temperature rise] 4 to +85 C PRODUC IDENIFICAION MLP 252 S 1R M (1) (2) (3) (4) (5) (6) (1) Series name (2) Dimensions L W mm (3) Product characteristics classification code S (4) Inductance value 1R 1R5 2R2 3R3 4R7 S1RS: 1.2µH, S2R2S: 2.5µH (5) Management number M S SD µh t=mm max. t=1.2mm max. RECOMMENDED SOLDERING CONDIION REFLOW SOLDERING (6) Packaging style aping [reel] 25 to 26 C 23 C 1s max. Natural cooling PACKAGING SYLE AND QUANIIES Packaging style hickness (mm) Quantity aping mm max. 3 pieces/reel 1.2mm max. 3 pieces/reel 18 C 15 C Preheating 6 to 12s ime(s) Soldering 3 to 6s HANDLING AND PRECAUIONS Before soldering, be sure to preheat components. he preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 15 C. After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. he inductance value may change due to magnetic saturation if the current exceeds the rated maximum. Do not expose the inductors to stray magnetic fields. Avoid static electricity discharge during handling. When hand soldering, apply the soldering iron to the printed circuit board only. emperature of the iron tip should not exceed 35 C. Soldering time should not exceed 3 seconds. Conformity to RoHS Directive: his means that, in conformity with EU Directive 22/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. Please contact our Sales office when your application is considered the following: he device s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)

8 (7/8) SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PAERN 2.5± ±.2.5±.3.5±.3 (hickness) max. 1.2max. Weight(mg) ELECRICAL CHARACERISICS ype General Part No. Inductance Inductance est frequency DC resistance Rated current hickness (µh) tolerance (MHz) (Ω )±3% (ma) (mm)max. MLP252S1RM ±2% MLP252S1R5M 1.5 ±2% MLP252S2R2M 2.2 ±2% MLP252S3R3M 3.3 ±2% MLP252S4R7M 4.7 ±2% MLP252S1RS 1.2 ±2% MLP252S2R2S 2.5 ±2% MLP252S3R3S 3.3 ±2% MLP252S4R7S 4.7 ±2% YPICAL ELECRICAL CHARACERISICS INDUCANCE CHANGE vs. DC SUPERPOSIION CHARACERISICS =1.2mm max. =mm max. MLP252S-S series MLP252S-M series µh µh

9 (8/8) PACKAGING SYLES REEL DIMENSIONS ø6min. ±.5 ø13±.2 ø21±.8 ø18± max. APE DIMENSIONS Sprocket hole Cavity 1.75±.1 8.±.3 3.5±.5 K Q 4.±.1 4.±.1 ±.5 2.3±.1 2.7±.1 16min. aping 2min. Drawing direction 3min.