TECHNICAL DATA SHEET 1 / 7 MATERIALS BERYLLIUM COPPER BERYLLIUM COPPER BERYLLIUM COPPER POLYETHER ETHERCETONE 30% GF
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1 .. pn ao TECHNICAL DATA SHEET 1 / 7 All dimensions are in mm. COMPONENTS BODY CENTER CONTACT OUTER CONTACT INSULATOR GASKET OTHERS PARTS MATERIALS BERYLLIUM COPPER BERYLLIUM COPPER BERYLLIUM COPPER POLYETHER ETHERCETONE 30% GF PLATINGS (µm) GOLD 0.5 OVER NICKEL 2 GOLD 0.5 OVER NICKEL 2 GOLD 0.5 OVER NICKEL 2
2 TECHNICAL DATA SHEET 2 / 7 PACKAGING SPECIFICATION Standard Unit Other 100 W option Contact us ELECTRICAL CHARACTERISTICS ENVIRONMENTAL Impedance 50 Ω Operating temperature 40/+90 C Frequency 06 GHz Hermetic seal Atm.cm3/s VSWR x F(GHz) Maxi Panel leakage Insertion loss 0.2 F(GHz) db Maxi RF leakage ( F(GHz)) db Maxi Voltage rating 100 Veff Maxi Dielectric withstanding voltage 350 Veff mini Insulation resistance 3000 MΩ mini OTHERS CHARACTERISTICS Assembly instruction MECHANICAL CHARACTERISTICS Others : Weight reel : 75 g Center contact retention Axial force Mating end Axial force Opposite end Torque N mini N mini N.cm mini Recommended torque Mating Panel nut N.cm N.cm Mating life Weight 20 Cycles mini g
3 TECHNICAL DATA SHEET 3 / 7 SOLDER PROCEDURE 1. Deposition of solder paste Sn Ag4 Cu0.5 on mounting zone by screen printing application. We recommend a low residue flux. We advise a thickness of 150 microns ( microinch ). Verify that the edges of the zone are clean. 2. Placement of the receptacle on the mounting zone with an automatic machine of pick and place type. Video camera is recommended for the positioning of the component. Adhesive agents must not be used on the receptacle. 3. This process of soldering has been tested with convection oven. Below please find, the typical profile to use. 4. Cleaning of printed circuit boards. 5. Checking of solder joints and position of the component by visual inspection. TEMPERATURE PROFILE Parameter Value Unit Temperature rising Area 1 4 C/sec Max Peak Temperature 260 C Max dwell C 10 sec Min dwell C 20 sec Max dwell C 60 sec Temperature drop in cooling Area 1 to 4 C/sec Max dwell time above 100 C 420 sec
4 TECHNICAL DATA SHEET 4 / 7 IMPSERIESINFORMATION PRESSURE PCB 2 SOLDER PAST A B DIMENSION A OBTAINED WITH A SPACER A : DIMENSION IN COMPRESSION B : DIMENSION FREE CONNECTOR PCB 1 ELASTICITY TABLE OF CORRESPONDENCE A CONNECTOR COMPRESSION ALLOWABLE (Dimension obtained in compression) 3.1 mm 3 mm 2.9 mm 2.8 mm 2.7 mm B PRODUCT DIMENSION AFTER COMPRESSION (Dimension obtained after elastic return) 3.20 mm mini 3.15 mm mini 3.10 mm mini 3.05 mm mini 3.00 mm mini THE CONNECTOR IS NOT A SPACER,SO DIMENSION A MUST BE ENSURED WITH AN ADDED PIECE PART SETTED 10 mm MAX.FAR FROM THE IMP CONNECTOR. SHADOW OF IMP RECEPTACLE FOR VIDEO CAMERA All dimensions are in mm.
5 TECHNICAL DATA SHEET 5 / 7 IMP SERIES INFORMATION All dimension are in mm PCB 1 PCB EDGE CENTER CONTACT Metallization Land for solder paste (area free of varnish) Vias and transmission line inside PCB are not represented. The impedance of the transmission line should be 50 ohms PCB EDGE PCB 2 Metallization CENTER CONTACT Contact area (area free of any surface contaminant) Vias and transmission line inside PCB are not represented. The impedance of the transmission line should be 50 ohms
6 TECHNICAL DATA SHEET 6 / 7 IMP SERIES INFORMATION The aspiration port should be in contact with the insulator Aspiration port Alveoles Connector CONNECTOR OUTLINE VIEW ONLY Pcb Aspiration port Aspiration area
7 TECHNICAL DATA SHEET 7 / 7 IMP SERIES INFORMATION CONNECTOR OUTLINE VIEW ONLY
R Series : IMP SMT BOARD TO BOARD ADAPTATOR H3 REEL OF 600 TECHNICAL DATA SHEET 1 / 7 COMPONENTS MATERIALS.
.. pn ao TECHNICAL DATA SHEET 1 / 7 All dimensions are in mm. COMPONENTS BODY CENTER CONTACT OUTER CONTACT INSULATOR GASKET OTHERS PARTS MATERIALS BERYLLIUM COPPER BERYLLIUM COPPER BERYLLIUM COPPER POLYETHER
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TURNS INTERNAL STRUCTURE!! FEATURES Lead-free soldering, Cadmium-free Fine adjustment is possible Automatic mounting is possible (Taping) Flow/reflow soldering is possible Sealed construction (Washable)
MULTILAYER CERAMIC ANTENNA
RFANT Series RoHS Compliance MULTILAYER CERAMIC ANTENNA 2.4 GHz ISM Band Working Frequency P/N: RFANT5220110A1T *Contents in this sheet are subject to change without prior notice. Page 1 of 9 ASC_RFANT5220110A1T_V02
P/N: RBBPF C67B1U. Halogens Free Product. RBBPF Series 3225(1210)- RoHS Compliance MULTILAYER CERAMIC BAND PASS FILTER
RBBPF Series 3225(1210)- RoHS Compliance MULTILAYER CERAMIC BAND PASS FILTER Halogens Free Product 1125 ~ 1675 MHz RF Application 50 ohm impedance with DC blocking caps in I/O pins P/N: RBBPF3225180C67B1U
SMA/RF316 SMA-J-P-H-ST-EM3/RF316-01SP1-01SP1-0700
Project Number: Design Qualification Test Report Tracking Code: 116049_Report_Rev_3 Requested by: John Liao Date: 6/23/2011 Product Rev: 0 Part #:SMA-J-P-H-ST-EM3/RF316-01SP1-01SP1-0700 Lot #: N/A Tech:
5W, 4527, SL Type Low Resistance Chip Resistor (Lead / Halogen Free)
5W, 4527, (Lead / Halogen Free) 1. Scope This specification applies to 7.1mm x 12mm size 5W, fixed metal foil current sensing resistors used in electronic equipment. 2. Type Designation RL4527JW (1) (2)
TYPE APPLICATION SPECIFICATION TABLE OF CONTENTS
1 of 10 C TABLE OF CONTENTS 1.0 OBJECTIVE... 4 2.0 SCOPE... 4 3.0 APPLICABLE DOCUMENTS... 4 4.0 PCB DESIGN... 4 4.1 BOARD LAYOUT... 4 4.2 BOARD THICKNESS... 4 5.0 PACKAGING... 6 6.0 APPLICATION INFORMATION...
Test specimens were representative of normal production lots. Specimens identified with the following part numbers were used for test:
Qualification Test Report 501-703 25Jun09 Rev B MINIPAK* HDL Board Mount Receptacle or Plug Connector System 1. INTRODUCTION 1.1. Purpose Testing was performed on MINIPAK* HDL Board Mount Receptacle or
Product Specification JUL 14 Rev. A1
Industrial SCSI Connector 1. Scope 1.1 Contents This specification covers the requirements for product performance, test methods and quality assurance provisions of SCSI Connector. 2. Applicable Documents
Eco Friendly Gasket Sheet. Extremely high Temp
specially created with environmentally friendly solvent free process. Unique features of superior sealability, strong durability and excellent flexibility are distinguished from the conventional products.