Nanium Overview Company Presentation
Nanium Overview Our name and logo nano prefix of Greek origin referring to small objects ium suffix of Latin origin that includes the formation of scientific terms such as the name of elements The logo suggests a crystalline atomic structure as a unifying symbol of different resources 2
1996-1999 1999-2006 NANIUM s historical background 2006-2009 1996 1999 2006 2010 NANIUM is an independent company in the semiconductor market, providing contract Assembly and Engineering Services for WLP, Packaging, Assembly & Test. Qimonda Portugal s Restructuring Plan was approved on 25th November 2009 with a new and stable shareholder structure: Tex t Tex t Portuguese State 41,06% 17,88% 41,06% Tex t
NANIUM s differentiated value proposition High Quality High Volume / Cost effective manufacturing High Flexibility / Fast prototyping capability Large technology diversity Complete engineering service offer World-class facilities & equipment Big projects start small
A world-class facility in Europe A state-of-the-art facility located in Portugal, near Porto. with > $1B cumulated investment!
NANIUM s overall infrastructure Labs & Engineering 200/300mm WLP & RDL Wafer test Package Assembly Final test Shipping Electrical characterization Material analysis Qualification Reliability Failure analysis Lithography Sputtering Plating Wet Etching Furnace Wafer molding Wafer thinning Ball dropping Probe test Parametric wafer test Laser repair Grinding Dicing Die attach SMT for modules Wire bonding Pick, flip & place Molding Plating Trim & form Marking Singulation Final test Burn-in Modules test Inspection systems Packing (trays, Tape & reel) Preconditioning Shipping A world-class facility for die / wafer / module level assembly, test & packaging Plus associated labs for characterization, reliability & failure analysis
NANIUM s Four Business Offers 1-High volume Packaging, Assembly & Test services 2-High volume 200mm / 300mm WLP & Wafer Test services Lead frame based Laminate based MCP, MCM, stacked dies SiP RDL Fan-in WLP Fan-Out WLP Wafer Test Wafer Thinning Wafer Molding Wafer Bumping Fast prototype and qualification runs Production of small series Innovative package prototypes Flexible technology diversity management Technology transfer Package development Test engineering & development Quality & Supply Chain Management consulting services Laboratories 3-Flexible pilot line for Packaging, Test & SMT 4-Turnkey engineering services Package & Test development, Lab and Consulting
Lead frame based Laminate based MCP, MCM, stacked dies SiP 1 - High volume Packaging, Assembly & Test services
Packaging, Assembly & Test services Lead frames & Laminates Package portfolio include Leadframe-based TSOP, QFP, QFN, SO Laminate-based LGA, BGA Interconnections available Wire-Bonding, Flip-Chip
Packaging, Assembly & Test services Multi Chip Packages (MCP) / Micromodules NANIUM also has extensive volume manufacturing experience of multi-chip memory packages, combining Wafer-level RDL techniques (redistribution) with multiple die stacking in a package. NANIUM s large technology portfolio combined with its strong engineering knowhow and experience enable new innovative MCP/SiP configurations (stacked, sideby-side, MEMS, Sensors, cpv, HB-LED Packages) SiP / MCM Complex MCP Micromodules / Chip on board COB MEMS & Sensor packages
2 - High volume 200mm / 300mm WLP & Wafer Test services RDL Fan-in WLP Fan-Out WLP Wafer Test Wafer Thinning Wafer Molding Wafer Bumping
Sample for a product: New Packaging Technologies Wafer Level Packaging (WLP) 200mm / 300mm Fan-in WLCSP Fan-in WLCSP Technology Features Bare-die handling Full wafer ball-apply Assembly of WLP on DIMM PCB & over-mold (Wafer Level Package on Board) Pitch 0.500-0.800mm Ball size 0.300-0.450 Standard component test & burn-in (FBGA like) Si Chip Si Chip Metal II Photo-IMID RDL-ISOI RDL-metal traces RDL-ISOII Solder ball bond pad WLP WLPoB NANIUM has long time experience in WLCSP development and manufacturing memory applications WLCSP services offer include: RDL / UBM / Balling / Test + other BE steps (such as marking, singulation and tape&reel) 12
New Packaging Technology 300mm Fan-Out WLP (FO-WLP) Reconstitution Re-building of artificial wafer of dies and mold compound Molded artificial wafer is the starting point for thin-film technology Redistribution Using thin-film-technologies for application of dielectric, metal line and solder stop Ball Apply and Singulation Standard BGA-Ball apply Test, Mark, Scan, Pack Standard or wafer level based test flow
First ever 300mm Fan-out WLP realization! (1/2) Based on Infineon s ewlb technology Production line ramping in high volume production by Q3-2010!
First ever 300mm Fan-out WLP realization! (2/2) 300mm Recon-Wafer (chip backside) Overmolded (before backside grinding) 300mm Recon-Wafer (active chip side) Solder Spheres placed Epoxy mold compound Recon-Wafer = Chip Carrier
Fast prototype and qualification runs Production of small series Innovative package prototypes 3 - Flexible pilot line for Packaging, Test & SMT Flexible technology diversity management Technology transfer
Flexible pilot line for Packaging, Test & SMT Modules & Micro-modules NANIUM is set to become a one-stop-shop for module design, qualification and manufacturing across a very wide range of applications as the company is based on A strong experience of volume manufacturing of memory modules A wide internal technology portfolio (including SMT mounting) High engineering skills NANIUM s services include Fast prototype and Qualification runs Production of small series Innovative package prototypes: SiP, MCM, HB-LED, MEMS, sensors, c-pv Technology transfer and Flexible technology diversity management
Flexible pilot line for Packaging, Test & SMT From concept to production ramp-up New package Technologies Fast Prototyping Proof of concept, design validation, customer sampling Qualification runs Electrical characterization, reliability stress tests Packaged IC or module Production of small series Flow enhancement, yield tracking, early failure rate analysis NANIUM has long experience in transferring new package technologies in HVM to third-parties in Asia! Technology transfer To industrial partner
4 - Turnkey engineering services Package / test development, Lab & Consulting Package development Test engineering & development Quality & Supply Chain Management consulting services Laboratories
Turnkey engineering services for Package & Test development, Lab and Consulting Complete semiconductor Business line Marketing IC/system Design Product Engineering Test Engineering Supply Chain Management Quality Engineering Package design Definition of production flow Co-design & thermomechanical modeling Test program development DfM, DfT Yield tracking Electrical characterization Choice and follow-up of contracted partners Production planning Follow-up of production quality and reliability Handling of customer returns Failure analysis Root cause tracking Containment plan Qualification NANIUM s Turnkey engineering services Rely on NANIUM s full engineering services for part or all of your business line engineering tasks and focus on your value adding priorities: marketing and IC / System design!
Thank you for your attention NANIUM S.A. Avenida 1 de Maio 801 4485-629 Vila do Conde Portugal