Counterfeit Risk Mitigation

Transcription

1 Counterfeit Risk Mitigation NASCO provides our clients with an alternative-purchasing solution for new and authentic components [i] documented and certified by our rigorous inspection system. Our system is a FIREWALL protecting the integrity of our clients supply chain from counterfeit [ii] parts. FACT: The majority of suspect counterfeit parts can be caught visually and quarantined without any added expense of further testing. Current accepted industry counterfeit inspection standards and the equipment that is required to meet these certifications are well below the Nasco standards. Nasco utilizes what is considered the top of the line digital microscope system, the Keyence VHX The Dilemma: Authorized component manufacturer channels are usually the first choice when procuring components. But there are circumstances where buyers justifiably turn to an alternative channel for new and authentic parts. How can Buyers: Buy new authentic obsolete and allocated electronic and aerospace components from the open market Get Fast, reliable, accurate electrical testing with photographic Objective evidence you can count on Keep product costs low Have guaranteed on time delivery NASCO s Firewall NASCO s preparation for protecting your business began years ago. We ve invested in pre-empting any questions about any order, for any component. To minimize the risk of purchasing substandard/counterfeit components, Nasco utilizes a Risk Assessment process to determine the inherent risk associated with each and every source of supply PRIOR to a quote being issued. STEP 1 - Knowledge Base NASCO s system begins by maintaining an exhaustive, proprietary library of manufacturers component data including: Component s Production History o o o Date Of First Production Revision dates and detail of changes Date Licensed To Partner Manufacturers

2 o Date Production Stopped (EOL) Reporting services GIDEP, ERAI and NASCOCIA Current Status and availability Manufacturer s Authorized Distribution Channels Official Data Sheets Can this part be Electrically tested Any History Of Problems Encounter By NASCO With That Component Or Source Check Of a Known Good Device (KGD [i] ) Our history of sourcing, New and Authentic parts from reliable sources Check Library of photographs of internal & external visual data Step 2 Assure Reliable Sourcing Product Source: NASCO standard procurement order is: 1. Factory authorized sources 2. Pre-approved, vetted vendors 3. When we prepare a quote for you, normally the pre-vetted, authenticated and documented component in stock are already sitting in our secure warehouse 4. We provide a documented Counterfeit Risk Assessment with all of our quotes that identifies the risks involved when purchasing the parts. *NOTE: NASCO does not procure product directly or indirectly from Asia/China or Africa unless it from factory authorized sources or has manufacturer s traceability. Any vendors that procure product from Asia/China or Africa and knowingly sell it to NASCO will be disqualified as a vendor in our database. Not only that, but NASCO quarantines and confiscates any product that is deemed counterfeit and reports these instances (vendor name, part number and pictures) to GIDEP and the ERAI. Step 3- Customer Service NASCO strives to keep you informed and will never misrepresent any information about your order via of customer support team and processes. Quote Formal Quote: When we prepare a quote for you, normally the pre-vetted, authenticated and documented component that are in stock are already sitting in our secure warehouse Our formal quotes, includes all testing so your costs are true net costs. Quantity Full Manufacture Part Number

3 Traceability Origin Of Product Testing Pricing Risk Assessment Order Confirmation: Full Details Of Your Purchase Restate Details Of Order Shipping Confirmation: Component Analysis Tracking Number Hyperlink - Exact Location and Progress Of Your Order Tier 1 - Visual Inspection High quality visual inspection equipment is a must. Ninety-five percent of all counterfeit components are used, remarked and recycled. With a powerful digital microscope and experienced qualified inspector, the majority of counterfeit parts can be caught and quarantined without the added expense of further testing. Current Industry Counterfeit Inspection Standards for visual inspection are significantly below the NASCO system. Digital Microscope: NASCO utilizes the Keyence VHX-1000 [iii] digital microscope system providing state-of-the-art visual inspection. Its ability to detect anomalies using different magnifications up to 2000X, lighting and 3-D imaging is superb. Data sheet review Traceability review Dimensions Co-planarity Texture comparison ( Top / Bottom) Marking permanency Scrape Test XRF ( RoHs and Element analysis ) Dynasolve X-Ray Fluorescence; XFR [iv] : XRF analysis is primarily used to verify the RoHS [v] status of components. Additionally, elemental composition of the sample is compared to the manufacturer s material declaration or a KGD. NASCO uses the Oxford X-Strata 980 [vi], a stand-alone analyzer that is more accurate than handheld devices. The X- Strata980 also performs plating thickness analysis. This is useful when analyzing military devices as well as verifying the plating thickness of RoHS compliant parts that have been converted to Sn/Pb plated parts as per GEIA-STD Solderability: NASCO performs solderability tests on Sn (tin), Pb (lead) and RoHS components. All tests are performed in compliance with the J-STD-002C [vii] standard, the hot dip and look method. NASCO also has the capability of steam-aging acceleration to artificially age the components before performing the hot dip and look solderability test.

4 VIEW UNDER NORMAL LIGHTING SPECIAL RELIEF VIEW SHOWS MORE DETAIL

5 EXAMPLES OF KNOWN GOOD DEVICES AND SUSPECT COUNTERFEIT PARTS KNOWN GOOD DEVICE

6 SUSPECT PART-THIS PART HAS BEEN ALTERED BY BLACKTOPPING SUSPECT DEVICE ON LEFT/KNOWN GOOD DEVICE

7 MOLD MARKS ON A KNOWN GOOD DEVICE ARE GENERALLY SMOOTH SUSPECT REMARKED PART THAT HAS BEEN BLACKTOPPED SUSPECT PART THAT HAS BEEN SWABBED WITH ACETONE

8 THE SCRAPE TEST IS PERFORMED ON SUSPECT PARTS THAT ARE IMPERVIOUS TO THE ACETONE SWAB. IF THIS WAS A NEW AUTHENTIC DEVICE THE AREA SCRAPE WOULD ONLY LOOK SCARRED AND WOULD NOT FLAKE THE LEAD FRAME OF A NEW AUTHENTIC PART

9 THE LEADS OF A SUSPECT PART THE LEADS OF A SUSPECT PART

10 LEAD TIP OF A KNOWN GOOD DEVICE LEAD TIP OF A SUSPECT PART THAT HAS BEEN RETINNED

11 KNOW GOOD CERAMIC DIP SIDE VIEW OF THE LEADS OF A KNOWN GOOD PLASTIC DIP

12 USED PARTS THAT HAVE BEEN RETINNED BGA PACKAGES KNOWN GOOD BGA DEVICE

13 SUSPECT BGA-DEVICE HAS BEEN REBALLED SUSPECT BGA-DEVICE HAS BEEN REBALLED

14 SUSPECT BGA-DEVICE HAS BEEN REBALLED SUSPECT BGA-DEVICE HAS BEEN REBALLED

15 OTHER PACKAGE TYPES SUSPECT METAL CAN THAT HAS BEEN REWORKED

16 SUSPECT PGA (PIN GRID ARRAY) THAT HAS BEEN REMARKED A 3 DIMENSIONAL VIEW OF THE LEADS

17 Tier 2 Decapsulation & Internal Die Inspection NASCO uses the Nisene Jet Etch Decapsulation System for all PEMs [1] and BGAs [1]. Then we use the Keyence digital microscope system to inspect and photographically document the internal die. The manufacturer s logo and part number are verified, and the die is compared to the manufacturer s data sheet and/or KGD s. Tier 3 Electrical Testing compliant laboratory NASCO s in-house Electrical Testing department s team of experienced, professionals (70 years combined of postdegree experience) employ an array of the industry s most advanced equipment used for the electrical testing of devices, comparing samples to manufacturers data sheets and KGD s. More importantly knowing how to use the equipment is paramount. *Advantages: Testing process 24 hours vs. 7-10days in most cases *keeps cost at a fraction of most test houses *Testing Quotes in 15 minutes vs. days *In the case of a detected failure you are notified in hours not 7-10days Component Capabilities & Sevices Digital IC s Analog IC s Discrete semiconductors Memory IC s VHDL IC s Passives Optocouplers Passives Capacitors Counterfeit Mitigation Authentication De-Capsulation Programming Counterfeit IC Detector Full Parametric Test X-ray XRF RoHs Element composition Plating thickness Solderability NOTE: The high level of equipment used by NASCO is far beyond what is required by any Industry counterfeit avoidance certification program.

18 Tier 4 Component Analysis NASCO s Certificate of Authenticity is backed up with extensive documentation, including Photographic evidence of our Inspection process providing you, our client, with the assurance that your supply chain has been protected by the most stringent system in the industry. Our customers are assured that the NASCO parts they receive are 100% new and authentic. SUMMARY 10 Years Experience CCAP 101 Certification ISO Certification AS 9120a Certification ESD Cert IDEA Trained Inspectors IDEA-Std-1010 Standards In-House Engineering Staff ISO Complaint Test Lab Advanced Equipment 150,000 Line Items In Stock User Friendly Website References o o o ITT Boeing SESI

19 ENDNOTES [i] Components: Electronic chips, systems and circuit boards, as well as certifiable aerospace hardware. [ii] Counterfeit: New or used components NOT produced and/or distributed by the original manufacturer, or parts which have be processed and/or recycled to deceive the end-user. [i] KGD: A known good device is golden sample originating with authentication from the manufacturer, or a sample which has been authenticated. [iii] Keyence VHX-1000: The VHX Series Digital Microscope is an all-in-one microscope system that can observe, measure and record all within a single system. Extremely versatile, this equipment combines the capabilities of a conventional stereomicroscope, compound microscope, and metallurgical microscope. Elevating digital microscopy to a new level, the VHX Series achieves a 0.1x 5,000x magnification range. One of the main benefits of this digital microscope is its incredibly large depth-of-field, making it possible to inspect an object from any angle and perform 2D/3D observation and measurement. [iv] X-Ray Fluorescence (XRF): The emission of characteristic "secondary" (or fluorescent) X-rays from a material that has been excited by bombarding with high-energy X-rays or gamma rays. The phenomenon is widely used for elemental analysis and chemical analysis, particularly in the investigation of metals, glass, ceramics and building materials, and for research in geochemistry, forensic science and archaeology. [v] RoHS: The Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment commonly referred to as the Restriction of Hazardous Substances Directive or RoHS) was adopted in February 2003 by the European Union.[1] The RoHS directive took effect on 1 July 2006, and is required to be enforced and become law in each member state. This directive restricts the use of six hazardous materials in the manufacture of various types of electronic and electrical equipment. It is closely linked with the Waste Electrical and Electronic Equipment Directive (WEEE) 2002/96/EC which sets collection, recycling and recovery targets for electrical goods and is part of a legislative initiative to solve the problem of huge amounts of toxic e-waste. In speech, RoHS is often spelled out, or pronounced /ˈrɒs/, /ˈrɒʃ/, /ˈroʊz/, /ˈroʊhɒz/. [vi] Oxford X-Strata 980: The new X-STRATA 980 X-ray Fluorescence Spectrometer combines a high power 100 W X-ray tube and high resolution detector which delivers limits of detection in single digit ppms. This unit suitable both for RoHS or ELV Analysis and Multiple Coating Thickness Analysis at the same time. Besides X-STRATA 980 is equipped with 25 mm2 PIN Detector, multiple collimator, Mapping Software and Combined Calibration Method X-STRATA 980 also suitable to measure solder alloy composition and thickness of metal finish, CVD, PVD, precious metal alloy assay and identification as well as RoHS testing capability. [vii] J-STD-001 Standards: Requirements for Soldered Electrical & Electronic Assemblies, describes materials, method and acceptance criteria for producing soldered electrical and electronic assemblies. This document has been adopted for use by the Department of Defense (DoD) effective July 19, 2001.