TECHNICAL BULLETIN. Recommended Procedures For Splicing And Bonding Armored FuturePath

Transcription

1 TECHNICAL BULLETIN Recommended Procedures For Splicing And Bonding Armored FuturePath CONTENTS: 1.0 General Information 2.0 Recommended Tools and Material 3.0 Recommended Installation Instructions 4.0 Recommended Joining (Splicing) Procedures 5.0 Contact Information While this information is presented in good faith and believed to be accurate, A-D Technologies does not, however, guarantee satisfactory results from reliance on such information due to the many variables attendant with every situation. Persons or parties utilizing this publication are solely responsible for the proper selection, installation, operation, maintenance and utilization of all products. Nothing contained herein is to be construed as a warranty or guarantee, express or implied, regarding the performance, merchantability, fitness, or any other matter with respect to the products, nor as a recommendation to use any product in conflict with the intellectual property rights of any third party. A-D Technologies reserves the right, without notice, to alter or improve the design or specifications of the products described herein. [All sales are pursuant to A-D Technologies terms and conditions of sale] Reproduction of this document, in part or in whole, is permitted solely for the purpose of distribution to other persons within your organization or contractors doing work for your company. All other distribution will require written consent from A-D Technologies. Page 1 of 19

2 1.0 GENERAL INFORMATION 1.1 FuturePath applications provide the ability to install additional fiber cables as the network grows, all within the same duct structure. Utilizing MicroTechnology, FuturePath allows for maximum cost effectiveness and greatest return on investment for existing and future network builds. Current telecommunications infrastructure reaches its maximum utilization when MicroTechnology is introduced. 1.2 This Technical Bulletin provides information about A-D Technologies Armored FuturePath. Buried installations that are subject to ground movement, frost heave, or that may require protection from gophers or other rodents will benefit from Armored FuturePath. Increased impact resistance plus the additional safeguard from incidental shovel damage is another advantage when using Armored FuturePath. The armored layer provides a superior level of crush resistance as well as supplemental defense against moisture, ballistics, and chemicals. It is constructed with a corrugated steel armor that is coated on both sides with a corrosion-resistant copolymer. It is then overlaid with an HDPE (High Density Polyethylene) jacket for superior protection in rugged environments. A cross-section of 12.7mm X 10mm 7-way Armored FuturePath is shown (Figure 1). Figure 1 Page 2 of 19

3 2.0 RECOMMENDED TOOLS AND MATERIAL 2.1 Bonding and grounding the steel shield on Armored FuturePath is recommended for power and lightning protection. Personnel should be familiar with local companies bonding and grounding practices, which will supersede any recommendations in this Technical Bulletin. 2.2 The following tools will aid in the recommended bonding and grounding procedures described in this document. These tools will also make it easier to access and splice the Armored FuturePath. Several methods will be discussed in this Technical Bulletin which relate to the access and splicing of the Armored FuturePath, and will give recommendations to the worker as to the best method to employ. While these methods are not warranted to be the only procedures available, the suggested tools and processes are meant as a guide by which the worker may determine his or her preferred technique. The recommended tools are shown below (Figure 2) and described in (Table A). Figure 2 Page 3 of 19

4 1 Tape Measure (36-inch Minimum Length) 2 A-D Technologies MicroDuct Straight Cutter Part # Razor Knife with Hook Blade for Cutting MicroDuct Oversheath 4 A-D Technologies Conduit Slitting Tool Part # Permanent Marker for Marking the Oversheath 6 Heavy Duty Work Gloves or Cut Resistant Gloves 7 GMP Tabbing Shears for Cutting Slots for Bond Clamps 8 Small Hammer for use with GMP Cable Sheath Slitting Knife 9 3/8-inch Wrench for Tightening Bond Clamps C Can Wrench Tool for Tightening Bonding Clamp 11 Large Prying Screwdriver 12 Large Conduit Cutters for Ring-Scoring Oversheath Part # Pliers for Gripping Armored Sheath 14 Cable Sheath Knife for Scoring Oversheath 15 Electricians Scissors for Cutting Ripcords and Stripping Locate Wire X Large Duct Cutters for 1.9-inch and Above Diameter Part # TABLE A 2.3 The A-D Technologies Technical Bulletin DCEB outlines splicing standard 12.7mm X 10mm 7-way FuturePath. A copy of this document may be obtained by contacting an A-D Technologies Customer Service Representative or Customer Engineer at (800) The slight differences between the procedures in this Technical Bulletin and DCEB relate primarily to bonding and grounding of the metallic shield and access to the Armored FuturePath. 3.0 RECOMMENDED INSTALLATION INSTRUCTIONS 3.1 Technical Bulletin DCEB describes the applications and recommended placing procedures for FuturePath, and may be helpful when planning an installation involving Armored FuturePath. A copy of this Bulletin is available for A-D Technologies clients from a Customer Service Representative or Customer Engineer at (800) Armored FuturePath may be direct buried, plowed, or horizontally directional drilled. The steel shield and additional HDPE layer provides robust protection for MicroFiber Installations. Technical Bulletin DCEB outlines the installation of a cable grip onto the Armored FuturePath for use during underground or buried installations. Page 4 of 19

5 3.3 When placing FuturePath, attempt to keep the color pattern of both ends facing the same direction. This will make splicing easier and there will not be any braiding or weaving involved. This will also create a smaller splice bundle. If it is not possible to keep the ends facing the same direction due to outside plant conditions, that is acceptable and will not affect the performance of the FuturePath. 3.4 Avoid cutting or damaging the FuturePath shield and outer HDPE sheath in any way during installation. This will help ensure that the metallic shield retains electrical continuity throughout the length of the installation. When field conditions require cutting or joining Armored FuturePath, a continuous bond can be maintained by inserting a mechanical shield bond connection. While fiber optic glass is not affected by power or lightening, the cable can be damaged significantly should there be a catastrophic power influence near the route of the cable. Following local operating companies bonding and grounding practices minimizes this effect and can help protect the communication facilities for many years. 3.5 Bonding and grounding Armored FuturePath will help protect workers and the public from incidental contact with possibly hazardous voltages, and minimize the likelihood for damage to valuable electronic components placed in the outside plant environment. Bonding differs from grounding as bonding is simply connecting nearby metallic structures electrically in order to maintain the same potential. Significant change in potential or ground potential rise (GPR) is what can cause transient voltages to move from one metallic structure to another. Often times this can create an abundant amount of heat, which can damage even a dielectric or non-metallic cable. Grounding refers to the practice of providing a periodic source to an earth ground in order to bleed off unwanted voltage. A-D Technologies recommends grounding buried or underground Armored FuturePath at manholes, pedestals, power company MGNs (Multi-Grounded Neutrals), at cabinet or building entrances, and at least every 3000 feet if none of the above is available. Building and cabinet entrances should have a common bonding location (BUS bar) for all communications cables and shields, which is attached to the earth electrode or grounding system. Alternatively, a ground rod bed may be constructed (per local practices) and will provide a suitable path to ground. Page 5 of 19

6 3.6 The properties of power induction can affect un-bonded communications plant by allowing foreign voltage to travel along any metallic path within the field. Overhead power lines can affect even buried cable, providing the voltages involved are great enough. Un-bonded or un-grounded plant can result in electric shock to individuals who may contact it, even at relatively low induced voltage (<60v AC). A periodically placed path to ground can help to eliminate this effect, while providing safer outside plant conditions. 3.7 It is recommended to ground the armored sheath of the FuturePath at either end or at termination locations. FuturePath entrances in buildings and cabinets should be electrically connected to the building ground system or the cabinet ground ring. Any metallic components present in the communications cables placed into the FuturePath such as shields or strength members should be connected to the grounding system as well. Adherence to local bonding and grounding practices will help limit foreign voltage hazards to workers and outside plant facilities. 3.8 Always use care when removing the armored layer. Heavy-duty leather or cut resistant gloves should be worn to help prevent injury. Safety glasses or goggles are recommended for added personal protection. All other local safety practices should be observed as well. The bonding solution must be able to have an appliance that penetrates the thin copolymer film that protects the steel shield. The shield is coated on both sides with the film to limit corrosion. It is recommended that shield bond clamps be used for this connection (Figure 3). The armored layer is shown removed from the FuturePath (Figure 4). Figure 3 Figure 4 Page 6 of 19

7 4.0 RECOMMENDED JOINING (SPLICING) PROCEDURES 4.1 FuturePath installations are maximized when placed as continuous sections where joining or splicing is not required. Due to the various outside plant conditions that may be encountered, this section describes recommended splicing procedures when cutting the FuturePath is necessary. Splicing accessories are available through A-D Technologies Customer Service at A straight splice protection sleeve is available which provides mechanical protection for the MicroDuct and couplers (Figure 5). Recommended accessories are listed in Table B. Figure 5 Page 7 of 19

8 PART # ACCESSORIES APPLICATION AND CONTENTS STRAIGHT SPLICE PROTECTION SLEEVE 3 X 32 LONG SCHEDULE 40 STRAIGHT SPLICE PROTECTION SLEEVE A-D TECHNOLOGIES STRAIGHT CUTTER CUTS MICRODUCT AT 90 DEGREES WITHOUT DISTORTING SHAPE. IDEAL FOR USE WITH A-D TECHNOLOGIES ROUND CUTTER RATCHET SHEARS- LARGE (RECOMMENDED) RATCHET SHEARS- COUPLERS SCORES OUTSIDE SURFACE OF MICRODUCT AT 90 DEGREES WITHOUT DAMAGING INTERIOR FIBER CABLE SHEARS FOR CUTTING LARGER DIAMETER FUTUREPATH DUCT RANGE 1-1/2 TO 2 DIAMETER SHEARS FOR CUTTING FUTUREPATH DUCT RANGE ¾ TO 1-1/4 DIAMETER SMALL SLITTING TOOL SHEATH SLITTING TOOL FOR REMOVAL OF OVERSHEATH MM COUPLER 12.7 MM X 10MM CLEAR COUPLER MM AIRTIGHT END CAP WATER RESISTANT LOCATE WIRE CONNECTOR 12.7 MM X 10MM AIRTIGHT ENDCAP FOR SEALING MICRODUCTS WATER RESISTANT LOCATE WIRE SILICON FILLED CONNECTOR FOR JOINING THE 20 GAUGE LOCATE WIRE SHIELD BOND CLAMP 2-EA. SHIELD BOND CLAMPS WITH STUD AND 2 LOCKNUTS FOR INSERTING UNDER SHIELD TABLE B 4.2 Begin the joining (splicing) operation by overlapping each end of the Armored FuturePath by a minimum of 22. Slide the Straight Splice Protection Sleeve onto one end of the Armored FuturePath and continue sliding until it is out of the way of the splicing location (Figure 6). Figure 6 Page 8 of 19

9 4.3 Mark the outer sheath for the opening on the Armored FuturePath at least 22 from each end using a permanent marker (Figure 7). This location will be referred to as the outer ring cut during the remainder of this Technical Bulletin. Figure 7 Using a sheath knife or razor knife, score the HDPE sheath, down to, but not past the armor. Completely encircle the conduit with the score cut at the marked location (Figure 8). A large pipe cutter may also be used to cut a ring all the way around the outer sheath (Figure 9). Avoid penetrating the armor and just score the HDPE outer layer. Figure 8 Figure The A-D Technologies conduit-slitting tool can be used to make the longitudinal cut along the sheath (Figure 10) between the end of the FuturePath and the outer ring cut. It is operated by starting the blade between the FuturePath sheath and the outer armored layer. Ratchet the handle so that the ridged treads contact the oversheath and perform the longitudinal cut (Figure 11). Page 9 of 19

10 Figure 10 Figure At the outer ring cut, pry up one corner of the armored sheath, and using a flat screwdriver blade, peel the armored layer away from the FuturePath (Figures 12-13). Do not penetrate the oversheath beneath the armor with the tip of the screwdriver blade. If the armored layer does not tear away easily, try re-scoring the outer ring cut. Completely remove and carefully dispose of the armored sheath layer (Figure 14). Figure 12 Figure 13 Figure 14 Page 10 of 19

11 The corrugated steel armor can be extremely sharp and should only be handled while wearing protective gloves. Cut resistant or heavy-duty leather gloves are suggested. 4.6 Cut a 1-1/4 slot horizontally along the sheath. This will be for the bond clamp base. Tabbing shears (Figure 15) or a cable sheath slitter may be used to cut the slot. Figure 15 Figure 16 Place the bond clamp base into the slot with the threaded stud extending from the slot. Tape around the ring cut with vinyl electrical tape, covering the bond clamp base and any exposed shield. Make a second inner ring cut on the inner FuturePath sheath at approximately ½-inch inside the outer ring cut, (Figure 16). The vinyl tape covering is not shown in this photo, for clarity. CAUTION: Take care not to penetrate the oversheath since the MicroDucts do not need to be scored or cut (Figure 16). 4.7 Locate and mark where the ripcords are on the end cut of the FuturePath. With a hook blade or knife, cut approximately 2-4 along the sheath to expose the cord (Figure 17). Pull the ripcords down along the oversheath (Figure 18) to the scored inner ring cut on the oversheath. Page 11 of 19

12 Figure 17 Figure Grip the oversheath at the end of the FuturePath and split apart. The covering should peel away easily (Figure 19). Do not cut away the ripcords or the copper locate wire, as they will be tied together in the splice. Where the ring cut was made, tear along the scored location using a twisting motion on the oversheath. Figure 19 Figure Tape over the bond slot and armored edge (Figure 20). This will help protect against accidental contact with the corrugated steel and will serve to anchor the bond clamp base into the slot. It is not necessary to extent the layer of tape over the MicroDucts. The other end of the FuturePath will be prepared for splicing by repeating steps 4.2 to After steps 4.2 to 4.9 have been repeated, locate the MicroDucts toward the back of the bundle, or with those that are furthest away from the worker, and mark the first MicroDuct to be spliced. Mark the Duct at four inches from the inner ring cut (Figure 21). Cut the MicroDuct with A-D Technologies straight cutter in order to obtain a smooth 90-degree cut. Page 12 of 19

13 Figure While maintaining the 22-inch opening between both outer ring cuts, mark the corresponding (same color) MicroDuct to be spliced coming from the opposite direction. Using the A-D Technologies straight cutter, remove the excess MicroDuct from the opposite end of the FuturePath. Grip the MicroDuct firmly and insert into the coupler until the end is pushed past the o-ring and visible in the coupler inspection window. The end of the MicroDuct will extend about ¼ past the coupler o-ring toward the center of the coupler (Figure 22). A slight twisting motion on the coupler may help facilitate installing the MicroDuct into the coupler. Figure After this first MicroDuct is spliced, measure across the bundle again to ensure that the opening is still 22 inches. If it is too far apart, remove the coupler by pressing in on the release rings while at the same time pulling the MicroDuct out of the coupler (Figure 23). Trim the MicroDuct as necessary to maintain the 22- inch opening. The couplers can be released and reused up to 10 times without degrading the performance of the coupler. Figure 23 Page 13 of 19

14 4.13 Continue splicing the MicroDucts moving from the rear of the bundle toward the front of the bundle. Chose the second MicroDuct to be spliced and lay a coupler so that one end is about 1/2 inch from the end of the first coupler. This 1/2-inch gap will stagger the splicing and result in the smallest splice bundle. Mark the second MicroDuct at the center of where coupler will be positioned. Continue splicing the MicroDucts in this manner until all seven are completed (Figure 24). Figure Locate the two ends of the insulated copper wires. These are spliced in order to maintain electrical continuity should the FuturePath need to be located after placement. Electronic locating equipment used for this procedure needs a good continuous metallic conductor as a path for the locate equipment signal Strip ¾ inch of insulation from each locate wire end. Twist both ends together in a clockwise direction (Figure 25). Place the water-resistant locate wire connector over wires and twist on in a clockwise motion until the connector begins to tighten (Figure 26). The connector is filled with silicon to deter moisture from contacting the exposed copper wire and help inhibit corrosion. Secure the water-resistant locate wire connector to one end of bundle with vinyl electrical tape (Figure 27). Fold the excess wire slack into the bundle. Figure 25 Figure 26 Figure 27 Page 14 of 19

15 4.16 It is now possible to tie the ripcords together using two overhand knots. Tying the ripcords together will allow them to be used should a new splice opening be required nearby Measure the distance between the bond studs. They should be approximately 23-1/2 apart, providing the 22-inch outer ring cut opening was maintained. Place the bond clamp caps in place and install one lock nut onto each of the bond studs. Wrench-tighten the nuts to provide sufficient grip on both sides of the armored sheath. Teeth on the bond clamp base will penetrate the polymer film from below the corrugated steel and provide a good electrical connection. Place metal eyelets on approximately 25 of # 6 gauge copper wire (or equivalent), install onto the bond clamp studs and tighten securely with the self-locking nuts (Figure 28). Place an external bond wire if external bonding is required (see sections 3.5 to 3.7 for recommendations). Figure 28 A completed splice is shown (Figure 29). This example shows how FuturePath can be spliced when outside plant field conditions result in braiding of the MicroDucts (see section 3.3). Figure Prior to installing the straight splice protection sleeve, it is recommended to install a water-resistant barrier seal around the bonding and grounding connections in order to inhibit corrosion. While the straight splice protection sleeve limits Page 15 of 19

16 migration of water and debris, it mainly provides mechanical protection, and is not meant to be a water or airtight closure. The MicroDuct couplers provide the water and airtight seal. Using sealing tape strips, place a layer below the bonding eyelet(s), and wrap the sealing tape around the inner ring cut on the FuturePath. Folding a 2 X 12 strip of tape in half length-wise, will help build up this area quicker. Continue wrapping tape until the entire connection is covered (Figures 30-32). The inside diameter of the straight splice protection sleeve is 3, so do not exceed this diameter when covering the bonding connection. Typically, only 3 strips of 2 X 12 sealing tape will be required to cover each bonding connection. Cover the sealing tape layer with vinyl electrical tape to complete the water-resistant barrier seal on the bonding connection (Figure 33). Figure 30 Figure 31 Figure 32 Figure Slide the splice protection sleeve onto splice opening, centering the opening (Figure 34). The sleeve should extend past the bond stud by about four inches on each side. Page 16 of 19

17 Figure Build up collars with the sealing tape on each side of the sleeve. Five strips of sealing tape are needed for each end. Form the collars into cones from the protection sleeve onto the oversheath of the FuturePath (Figures 35 and 36). It is acceptable to overlap the tape used on the bonding connection barrier seal if the seal extends outside the end of the straight splice protection sleeve. Use fingers to smooth and fill any gaps in the collars. Figure 35 Figure Use vinyl electrical tape to cover the sealing tape collars, using 2 half-lapped layers on each end. Extend the vinyl tape 1-2 inches onto the protection sleeve and 1-2 inches onto the FuturePath (Figure 37). Do not stretch the vinyl tape tightly as it may deform the sealing tape cone over time. Page 17 of 19

18 Figure The completed splice may now be covered in the trench or supported in the manhole or vault (Figure 38). If the FuturePath splice is to be buried, backfill the splice pit and tamp the soil to support the protection sleeve and FuturePath. Backfilling without supporting the splice can place undue stress on the splice and couplers. Figure Armored FuturePath utilizing MicroTechnology provides another option in the FuturePath arsenal for delivering cost-effective fiber optic service in a variety of adverse conditions, whether it be environmental, such as soil conditions or animal presence, or additional requirements from physical damage such as military installations or frequently excavated locations. Whatever the application, A-D Technologies has a knowledgeable Sales Staff, Customer Service Representatives and Customer Engineers available to assist its customers. Page 18 of 19

19 5.0 CONTACT INFORMATION 5.1 Customer Service or , Fax Web: For further information on this product, contact Customer Service who can arrange for a Field Support Engineer to contact you directly. 5.5 A-D Technologies has a library of Technical Bulletins that are for use by our customers and their placing crews. Page 19 of 19