Environmentally Conscious Electronics (ECE) Roadmap Summary Report

Transcription

1 Environmentally Conscious Electronics (ECE) Roadmap Summary Report Environmental Workshop February 24, 2011 Jackie Adams, IBM Ted Reichelt, Intel TWG Co-Chairs 0

2 Contents 2011 ECE Roadmap Overarching themes Framework Environmentally Conscious Electronics Executive Summary Materials Energy Recycling Eco-design Sustainability Situation Analysis Cross Cutting Issues Critical Issues Gaps Analysis Recommendations 1

3 Overarching Themes Awareness Continuous monitoring, and forecasting Engage with policy makers, stakeholders Flexibility and Collaboration Continuous, forward - looking research Tools for quick execution/decisions Coordinated - engaged supply chain/ ecosystem Creation and Architecture Technical roadmap that sets the ECE agenda rigorous, credible, trusted Engage and deliver to the electronics supply chain Standards that keep up with technology Harmonization 2

4 Global Regulations Over Time US and Canada Asia Pacific 3/1/2011

5 Types of Regulations Over Time Energy/Power Substances Climate change 3/1/2011

6 Merging Regulations considered across the entire electronics supply chain Semi/Raw Mfr Sub Assemblers Mining Electronic Mfg Supplier OEM Headquarters Channel / Partner Retailers Customers Governm al Orgs Fabless Semicon Distribution In\outbound Warehousing Distributors Companies- Consumers Foundry Component Suppliers Contract Mfr Original Design Mfr Factories Resellers GO s/ NGOs

7 Examples - Environmental Compliance DfE Manufacture Supply Chain Take-Back, Disposal, & compliance Design for Environment Compliant Processes Identify Categorize Treatment Reporting/ Analysis Site Inspection Material Compliance for WW RoHS Lead Free reliability Identify Parts & Assemblies Substance Data mining (IT) Waste Water and Energy Disposal Confirmation Audit Design for Recyclability Design For EuP ECO- Design Design For PS Design verification RoHS /REACH Compliant Product Information Management Proof Of Compliance Support Changing legislation Packaging Compliance Alternative technologies Date of Mfg (DoM) Retailer, distributor Material Declaration (PCD) Ship to Restrictions HazMat Country Specific Legislation WEEE Recovery Treatment Disposal Operations Transportation ELV (Vehicles) Material Manifest Destruction Certificate ESI Package distribution Non- Conformance Corrective Action Process

8 ECE Roadmap Findings Materials Gaps/ Issues Harmonize Global Restrictions of Hazardous Substances (RoHS) regulations Common tools and methods based on science for life cycle assessments (LCA) Industry standard materials characteristics databases similarly - green screen/ alternatives Industry standard material data collection, verification and reporting mechanisms On- going lead-free and HFR/PVC challenges; and supply chain alignment Lead free transition just beginning for low volume and specialty products Reliability concerns with Telco, defense, etc. Continued need for PVC free and HFR board laminates, cables, etc. Low halogen vs. elemental Br - / Cl HBCDD (BFR) and DEHP, BBP and DBP (phthalates) are targets Rare earth metals ( Source risk) and conflict minerals ( Data collection) Nano technology regulatory threat or technology challenge 7

9 ECE Roadmap Findings Materials Collaboration Initiatives Continue projects on PVC Alternatives, HFR& lead-free transitions Conceptual challenges still exist in thicker cable jacketing, High reliability/high thermal impacted materials (laminates) Support standards development for HFR and PVC materials Survey materials requirements information R&D collaboration opportunities: Refining of LCA and LCT methodologies Materials data management systems and databases (NIST, etc.) Manufacturing and logistics tracking databases, product information mgmt systems When you build it where does it go, is it compliant t order taking Green screening tools including preferred alternatives Nanomaterials impact methodologies Biomaterial replacements in electronics development with LCA information Support Global RoHS harmonization Continuing facilitation of supply chain enablement Regulations, alternative materials, standards, cross cutting with technology TWGs 8

10 Energy Gaps/ Issues ECE Roadmap Findings Need for harmonization of requirements, measurement metrics both systems and data center PUE ( Power Use Efficiency) Efficiency data metric performance Cloud computing analysis and update of 2% consumption /98% Opportunity for the technologies optimization of carbon foot printing Update 2020 Greater data center efficiency vs. data traffic explosion Consider VDI virtual desktop, mass data storage, etc. LCA actuals and carbon foot print tools, methodologies, Proposals are in the embryonic stage must will catch wind soon Need workable supplier GHG reporting methodologies Conflicting trends of more ambitious energy performance requirements with standing addition of features to electronics, e.g. T/H increases requirements Harmonized marking/ labeling schema required 9

11 Energy Collaboration Opportunities Collaborate on technical update addressing cloud computing impacts and updating the 2% - 98% discussion ( note Energy ) inemi carbon footprint position as a springboard for industry consensus Support supply chain carbon consensus methodology Investigate material supplier agreements to pursue a common strategy Investigate development of a library for designers Support consensus data center efficiency metrics / PUE Support metrics for: idle and energy efficiency; 3-phase testing Policy influencing: Global harmonization of EE requirements via trade associations Cost effective requirements ECE Roadmap Findings Measurable, consensus metrics Transparency in standards development Compliance by self certification with post market surveillance 10

12 ECE Roadmap Findings Recycling Gaps / Issues Need for harmonized regulations, design standards, and consistent infrastructure on regional, national basis in most geos Patchwork of varying regulations both in the US and globally Cost effective metals recovery technology for electronics Better plastics sorting technology and stable markets for co-mingled polymers Need stable market for recovered CRT materials Reused components reliability issues - validation systems Management tools for recycling facilities operations Policy and research to cover hazardous exposures in recycling Conflicts between design for the marketplace versus design for recycling Need coordination between designers and recyclers 11

13 ECE Roadmap Findings Recycling Collaboration Opportunities Facilitate collaboration forum including manufacturers, recyclers, other stakeholders Support global harmonization of requirements Promote industry consensus approach and model Support more global collaboration within industry Support trade association harmonization efforts R&D to promote sustainable infrastructure Develop market for post consumer, commingled plastics Develop market for recovered CRT materials Develop new applications in electronics for post consumer plastics Build on mature metals recycling infrastructure Support an efficient market driven by competition and market based incentives 12

14 Eco-Design Gaps / Issues Standards issues ECE Roadmap Findings Consensus Eco-design standard divergence - EPEAT, UL, Sustainability Consortium, others in competition EPEAT expansion and more eco-labels EPEAT scope creep and contentious process No consistent recycling approach - limits effectiveness of design to enable recycling More industry input to assure eco-labels reflect new technology No industry consensus on approaches to product life extension Design tools issues Need for workable LCA / LCT tools comprehending all product lifecycle stages Material owner s data Product content data structures and management not in place Better materials screening tools needed Align supply chain on key objectives and information flow 13

15 ECE Roadmap Findings Eco-Design Collaboration opportunities Continue with a second phase of the inemi Eco Impact Estimator project including collaboration with PAIA project and TSC Promote an industry consensus design standard leveraging EPEAT, UL, TSC, and other prominent eco-labels (TCO, Blue angel, etc.) Collaborate for eco-design standards that emphasize innovation - keep up with new technology Promote industry consensus on design for end of life approaches Develop mfg. and developers design tools such as a materials evaluator, LCA library, screeners, etc. Develop data management standards through collaboration between industry and standards setting organizations 14

16 ECE Roadmap Findings Sustainability Gaps / Issues Develop enabling opportunities identified in the Smart 2020 report; add a focus on dematerialization. ICT Information and Communication Technologies Continuously improve the 2% footprint (i.e., take on a radical approach to addressing how we employ electronics / ICT, such as the Green Touch Initiative). Develop and adopt tools to estimate and provide eco-impact information on products; promote open source databases for eco-impact information; and provide a mechanism for continuous and transparent updates. Continuously improve on its water footprint. Innovate better ways to measure and report on energy efficiently / eco-impact reduction. This includes, Supply chain implementation eco-impact (including carbon) inventories and disclosure Disclosing the risks and opportunities associated with climate change as outlined in a guidance document by the US Securities and Exchange Commission (SEC) 17 Preparing information to more effectively respond to customer questions about environment impacts of products (as opposed to entity impact) Cloud computing - evaluate / show that we will not contribute to growing or have direct impact to % contribution to global GHG emissions and then transparently report results. 15

17 Sustainability collaboration opportunities ECE Roadmap Findings Push strongly within the electronics industry as well as in other industry sectors to implement the enabling effect of ICT Information and Communication Technologies Continue promoting smart technologies implementation - develop a policy and marketing white paper Updated Smart 2020 Report include analysis of cloud computing and ICT footprint (2%) Provide tools and standards to measure and demonstrate the net environmental benefit Evaluate factory eco-efficiency metrics systems Evaluate water management foot printing/ sensors technologies/opportunity Develop technologies that measure and track energy GHG progress Take into consideration privacy (e.g., compliance / regulatory monitoring and tracking) and security concerns (e.g., data in the cloud) when developing and implementing solutions to avoid slow uptake Collaborate with regulators and other stakeholders to assure policies, standards and regulations allow fast uptake Collaborate to assure policies and regulations do not undermine accomplishments Influence to establish policies and cross-sector business collaborations that promote Smart technologies ecosystem 16

18 Materials Summary Energy Global regulatory growth is slowing Harmonize regulations HFR/BFR and PVC global standards Industry data repository Global growth in regulations Utilization vs. contribution relative to data centers is in question Recycling Collaboration manufacturers, recyclers, other stakeholders Common trade and regulatory requirements Facilitate increased use of post consumer materials Eco-Design LCA tools developed with information from the material suppliers Eco-design standard divergence - EPEAT, UL, Sustainability Consortium, others in competition Sustainability Develop common tools to evaluate enabling effects of ICT Information and Communication Technologies Collaborate to assure policies and regulations do not undermine accomplishments Communication of that to the industry 17

19 Backup 3/1/ 201

20 46 SVHC s EU REACH *2,4-Dinitrotoluene Cobalt dichloride 4,4'- Diaminodiphenylmethane (MDA) *Diarsenic pentaoxide 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene) *Diarsenic trioxide Acrylamide Dibutyl phthalate (DBP) Alkanes, C10-13, chloro (Short Chain Chlorinated Paraffins) *Diisobutyl phthalate (DIBP) Aluminosilicate Refractory Ceramic Fibres Hexabromocyclododecane (HBCDD) Anthracene *Lead chromate Anthracene oil *Lead chromate molybdate sulphate red (C.I. Pigment Red 104) Anthracene oil, anthracene paste Lead hydrogen arsenate Anthracene oil, anthracene paste, anthracene fraction *Lead sulfochromate yellow (C.I. Pigment Yellow 34) Anthracene oil, anthracene paste,distn. lights Pitch, coal tar, high temp. Anthracene oil, anthracene-low Sodium dichromate Benzyl butyl phthalate (BBP) Triethyl arsenate Bis (2-ethylhexyl)phthalate (DEHP) *Tris(2-chloroethyl)phosphate Bis(tributyltin)oxide (TBTO) Zirconia Aluminosilicate Refractory Ceramic Fibres Trichloroethylene Sodium chromate Boric acid Potassium chromate Disodium tetraborate, anhydrous Ammonium dichromate Tetraboron disodium heptaoxide, hydrate Potassium dichromate 2-ethoxyethanol Cobalt (II) dicarbonate 2-methoxyethanol Cobalt dinitrate Chromic acid, Oligomers of chromic acid and dichromic acid, Dichromic acid Cobalt (II) sulphate Cobalt diacetate Chromium trioxide 19

21 HFR and BFR PVC standards - CG Same threshold definitions (900ppm) as used by IPC 4101, IEC , and JPCA-ES JEDEC 709 covers actives Still looming Possibility of legislation restricting use of brominated and chlorinated flame retardants (BFRs & CFRs) as well as polyvinyl chloride (PVC). Availability and growing use of halogen free flame retardants and other materials in certain electronic products & components All materials and parts used in electronic equipment are effected Mechanical plastics Cables Printed circuit boards Electronic components Connectors Films, adhesives, tapes Vibration dampening parts Solder fluxes No the working group IPC 4-33 Homogenous or not? 20

22 15 Lanthanide Metals plus Yttrium/Scandium 21 IBM Conf

23 REM Usage Growth Rate Overview LRF Forecast Growth Of Rare Earth Metals Usage Element Application Consumption (Tonnes p.a. of REO) Growth Rate (% p.a) Ce, La, Nd, Pr Battery Alloy 17,000 43, Dy, Nd, Pr, Sm, Tb Magnets 20,500 42, Eu, Tb, Y Phosphors 8,500 14,000 9 Ceramics 5,500 9,000 9 Others 8,000 13,000 8 Ce, Nd, La Catalysts 21,500 32,000 7 Ce, La, Pr Polishing Powder 14,000 21,000 7 Ce, Er, Gd, La, Nd, Yb Glass Additives 13,000 14,000 1 Total 108, , REO = rare earth oxide Source: Roskill HK Rare Earth Conference, November IBM Conf

24 RoHS geographic locations/requirements * examples Geography EU EEU Ukraine Requirement < 1000ppm Pb, PBB, PBDE, and CrVI as well as < 100 ppm Cd and Hg Restrictions with Exemptions Combination harmonization, some registration, DoCs Documents of conformance (DoC) at import (TBD) India US Japan DoC, testing -TBD Varies by state, cities. Not all 6 substances Japan Green Procurement Survey Standardization Initiative, more comprehensive and restrictive China Korea Product marking for the six EU RoHS restricted substances for all applicable products. Disclosure can be at the component or are the sub assembly level, in a prescribed format in Chinese as detailed in "Marking for the control of Pollution Caused by Electronic Information Products". China RoHS also used to be referred to as RPCEP (Regulation for Pollution Control of Electronic Products) ( HST) Resource Recycling of Electrical and Electronic Equipment and Vehicles was adopted into law by the National Assembly of Korea Norway (PoH) prohibit 18 substances from consumer goods under new legislation which is much wider than EU RoHS rules. Of the 18 substances only lead and cadmium are in common with EU RoHS - Prohibition on Certain Hazardous Substances in Consumer Products Turkey DoC REO = rare earth oxide Source: Roskill HK Rare Earth Conference, November IBM Conf