MIL-PRF SUMMARY OF CHANGES FOR REVISION K November 15, 2017

Transcription

1 The following table summarizes the changes made to MIL-PRF Revision J resulting in MIL-PRF Revision K. REF No Paragraph Change Source Reason Page No. Cover page Add cover page to document. MIL-STD-961 requirement. cover page Cover page Add the following distribution statement to bottom of page MIL-STD-961 requirement. cover DISTRIBUTION STATEMENT A. Approved for public release. page Distribution is unlimited. Table of contents Add table of contents to front of document. MIL-STD-961 requirement. ii-xvii Add reference to Classes L and F. To allow Class E devices to be..1 Add MIL-PRF Integrated Circuits (Microcircuits) Manufacturing, General Specification for. based on Classes L and F. Add reference for MIL-PRF Add MIL-STD Test Methods for Semiconductor Devices...1 Add DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK- comment Handbook for parameters to be controlled for the specification of microcircuits. 3.9 Separate paragraph and list the requirements for allowing hybrid comment manufacturers to build monolithic devices in accordance with MIL-PRF e. Correct web address from arch.aspx to Add the following note NOTE: The appropriate class is specified by the device passing at any voltage in a given classification level range; passing the highest voltage level in the classification level range is not required (e.g. If a device passes at 900V and fails at 999 V, it will be classified as Class 1B) Correct second sentence from In accordance with C to..in accordance with C and D Remove and which are approved for listing on QML Table III Add row at bottom of table for marking of Non-SMD RHA devices. Add reference to MIL-STD-750. Add reference to MIL-HDBK To update requirements for creating 6 new monolithic SMDs built in accordance with MIL-PRF To correct reference to the current URL Correction to add reference to ESD qualification in Appendix D. 10 Qualified SCDs are not listed on the QML

2 Update definition of Production lot, Change last two sentences of definition from In addition for Class K devices, all materials will be from the same incoming inspection lot for each element. If necessary, rework requirements may be satisfied with materials from a different incoming inspection lot. to In addition for Class K devices, all materials will be from the same manufacturing lot or incoming inspection lot for each element. If necessary, rework requirements may be satisfied with materials from a different manufacturing lot or incoming inspection lot Renumber subsequent paragraphs Insert definition for Sub-assembly to state Sub-assembly. A standalone functional device with more than one element mounted on a substrate or in a package and not already defined in element evaluation table C-I In third sentence correct homo-geneous to homogeneous. comment Editorial correction. 6.5 Correct Internal water vapor test to Internal gas analysis (IGA). 6.7 Remove paragraph 6.7 Environmentally preferable material. 19 Footnote / page 19 Change RGA to IGA. 6.8 Change RGA to IGA Remove Appendix G is rewritten in its entirety and is annotated with an asterisk at the title of the appendix only. 6.8, 6.9, and 6.10 Renumber paragraphs 6.8, 6.9, and 6.10 to paragraphs 6.7, 6.8, and 6.9. Paragraph is no longer needed. Information is covered in paragraph This information referred to revision J. This does not apply to revision K. Renumber subsequent paragraphs after the removal of the current paragraph

3 A Update paragraph A from A Production lot traceability. The manufacturer will maintain production lot traceability. In addition for Class K devices, all materials will be from the same incoming inspection lot for each element. If necessary, rework requirements may be satisfied with materials from a different incoming inspection lot, and shall be traceable to the device serial number. to A Production lot traceability. The manufacturer will maintain production lot traceability. In addition for Class K devices, all materials will be from the same manufacturing lot or incoming inspection lot for each element. If necessary, rework requirements may be satisfied with materials from a different manufacturing lot or incoming inspection lot, and shall be traceable to the device serial number. comment Clarification and consistency with paragraph Table C-I Add row at bottom of table for Sub-assembly evaluation. To add requirements for the evaluation of sub-assemblies used in MIL-PRF qualified hybrid microcircuits. C.3.3 C.3.3 C C.3.8 through C and tables C-VI and C-VII Change second sentence from..mil-prf Class Q or Class V qualified die. to..mil-prf Class Q or Class V qualified die that is supplied on an SMD and listed on the applicable QML. Change last sentence from.mil-prf-3535, Class V qualified die. to.mil-prf-38535, Class V qualified die that is supplied on an SMD and listed on the applicable QML.. Remove NOTE: Final electrical tests that satisfy end-point electrical test requirements that are specified in preceding test methods do not need to be repeated. 37 To clarify that MIL-PRF Class Q and V must be on an SMD. 37 To clarify that MIL-PRF Class Q and V must be on an SMD. 37 Removing this note reduces schedule impact in event of failed lot acceptance testing. Package Element Evaluation update. To update requirements for evaluating packages used in MIL- PRF qualified hybrid microcircuits. Table C-VI Add footnotes at end on table. C.3.11 through C Insert sub-assembly element evaluation criteria into Appendix and C.3. Has been added as section C table C-VII Footnotes were erroneously omitted in first draft. 46 To add requirements for the evaluation of sub-assemblies used in MIL-PRF qualified hybrid microcircuits. 3

4 C.4.3 First sentence changed from All Class K devices will receive fine leak testing, without pressurization (bomb) within one hour of removal from sealing atmosphere and prior to any other test. To All Class K devices shall receive fine leak testing after sealing and prior to any other testing without pressurization (bomb) within one hour of removal from sealing atmosphere. C.4.3 Add /100% after He% in leak rate calculation. C.4.4 Correct title from Internal water vapor to Internal gas analysis. Table C-VIII Correct Internal water vapor to Internal gas analysis. C.5.4 Correct first sentence from Non-destructive 100 percent bond pull test will be to Non-destructive 100 percent bond pull test shall be C.5.4 C.5.4 C c () C c () Delete all wording after third sentence and replace with If the lot fails and resubmission is to be considered, the failed lot shall be subjected to failure analysis to determine the root cause(s) of the failures, and what corrective action, or rework is needed. The failure analysis shall also address the strength and bond integrity of the passing bonds in relationship to the process norm. The analysis, root cause, and corrective action shall be documented. After corrective action to bring the bond strengths back to process norms, a resubmission of the failed lot may be made which shall include 100% nondestructive pull of any rebonded wires, with zero failures allowed. Lots failing the Class K PDA requirement or resubmission will not be delivered as Class H, G, D, or E product. Correct from pull of any rebounded wires. to..pull of any rebonded wires Change first sentence from..known good, device of the device type being tested, utilizing the fixtures,.. to.known good, device utilizing the fixtures,.. Add new second sentence stating The device type being tested will be of the same device type as the known good device, or will be similar to the known good device per the criteria of section of this specification. To update wording for seal testing for Class K devices. 5 This is only a clarification of the calculation. It does not change the calculated leak rate values. Shall is used for requirements. Update paragraph to address corrective action and root cause, not just resubmit of non-destruct bond pull. To correct spelling of rebounded. To allow use of devices that meet the similarity criteria of section of MIL-PRF as known good devices. To allow use of devices that meet the similarity criteria of section of MIL-PRF as known good devices

5 Table C-Xc Subgroup 1 PIND test. Remove 5 passes from QML column. Table C-Xc Table C-Xc Table C-Xc Table C-Xc Footnotes C NOTE C.7.5. Add footnote 6/ to subgroup 1, seal test. Renumber subsequent footnotes. Correct name of subgroup 3 test from Internal water vapor content to Internal gas analysis. Subgroup 3 Internal gas analysis: Remove 5(1) option from Quality (accept number) column. Insert new footnote 6/ to state leak testing for C1 may be performed as specified or at the end of C1 testing. Renumber as remaining footnotes. Remove NOTE in its entirety and replace with new note stating Group D testing is not required when package evaluation has been performed at incoming inspection. Add the following wording to the end of paragraph C The screening level used in the qualification parts (e.g. class H or K or company defined) is the minimum baseline screening for qualified parts. For example, devices screened to class H requirements and qualified, cover class K devices, however class K screened devices that have been qualified have extra screening and do not cover class H devices unless the rejects were zero (e.g. PIND, non-destructive bond pull, Class K internal visual, and x-ray.) Delete Unless otherwise specified (C ) at beginning of paragraph. comment comment and JEDEC Qualification testing does not allow any failures or multiple passes as it 65 is not a screen. 65 To correct name of test to be consistent with MIL-STD To remove option allowing for failures Clarification to let the manufactures know that Group D package tests 67 are not required if package evaluation is done at incoming inspection. Class K screened devices should not be used during qualification. 69 C comment Paragraph C has been deleted. 70 C Correct title from Internal water vapor to Internal gas analysis. comment C Delete entire paragraph and replace with An internal gas comment Delete wording content sample of three devices (zero failures) will be selected related to quantity accept number from the subgroup 1 sample. The use of electrical rejects, or 5(1), which is no longer allowed. representative mechanical samples, is permissible provided these samples have seen, as a minimum, the environmental exposures required in subgroup 1 (e.g. temperature cycle or thermal shock, mechanical shock of constant acceleration, and seal tests as applicable). The internal gas analysis shall meet the requirements of method 1018 of MIL-STD

6 C Change second sentence from The use of electrical rejects, or representative. To The use of screened electrical rejects, or representative.. C Delete entire paragraph. C Add paragraphs C through C Appendix D Remove third sentence stating Each 15 piece sample fo wires will contain an even distribution of all wire sizes that can be qualified by that sample. New paragraphs were added to define requirements for marking and rework marking qualification. Update of Appendix D to incorporate requirements for the qualification of open architecture devices. Appendix D is rewritten with paragraph and table renumbering changes throughout. DLA certifies IGA labs to the same standards. The process for IGA testing has improved and there is no need for correlation between IGA labs. Update qualification requirements to require 15 of each wire size instead of allowing the sample to be split for other wire sizes. Guidance for part markings in MIL- PRF exists only as part of PI for package evaluation. Guidance for qualifying part markings and qualifying rework for part markings is not specified. To update Appendix D and add requirements for Open Architecture Technology D.1.1 Correct second sentence from.for compliance of compliant non-hermetic. to.for compliance of non-hermetic. D.1. Correct Internal water vapor content to Internal gas analysis content. D.3..1 Add gross leak after PIND test in first sentence. Clarification, this is to clarify that gross leak test is also required for cavity devices D.3.3, Table D-XV footnote 1/, and D New paragraphs D.3.4 and D Correct group to subgroup. To add requirements for the hermetic cavity of open architecture devices. Clarification to state which seal requirements in method 1014 of MIL-STD-883 need to be used for Class F and L OA devices that have a hermetic cavity. 76,104,

7 D.4.3 D.4.3 Change second sentence from..mil-prf Class Q or Class V qualified die. to..mil-prf Class Q or Class V qualified die that is supplied on an SMD and listed on the applicable QML. Change last sentence from.mil-prf-3535, Class V qualified die. to.mil-prf-38535, Class V qualified die that is supplied on an SMD and listed on the applicable QML. Table D-IV Add new subgroup 4 for alternate element evaluation. D.6.11 Add non-hermetic before cavity. Table D-IX Correct reference paragraph for Radiography from D.6.1 to D.6.13 and reference paragraph for Gross leak from D.6.11 to D.6.1. Table D-IX Add footnote 5/ next to gross leak test stating Gross leak seal test applies only to non-hermetic cavity devices. Not required for non-cavity devices. Table D-IX Renumber footnote 5/ to footnote 6/ next to Seal (fine and gross) test. Table D-IX Add footnotes 5 and 6 at end of table. Table D-XVI Correct Internal water vapor content test to Internal gas analysis. Table D-XVI Subgroup C3: Remove 5(1) option from Quantity (accept number) column. Table D-XVI Add 1018 under MIL-STD-883 column for Internal gas analysis comment test. E.3..1.e (1) (c) Correct from Post-seal burn-in may be reduced to 40 hours at 15 C, or at the time temperature equivalent, provided total preseal burn-in on active devices is 30 hours or at the time temperature equivalent. to Post-seal burn-in may be reduced to 40 hours at 15 C, or at the time temperature equivalent, provided total burn-in (pre-seal and post-seal) on active devices is 30 hours or at the time temperature equivalent. To clarify that MIL-PRF Class Q and V must be on an SMD. 77 To clarify that MIL-PRF Class Q and V must be on an SMD To correct name of test to be consistent with MIL-STD To correct name of test to be consistent with MIL-STD Correction to state that total burn-in time has to be 30 hrs E.4..9 Delete in its entirety and replace with Circuit design analysis shall be performed in accordance with the manufacturer s internal procedure and shall include the following evaluations as a minimum (applicable to the design). Update paragraph by removing worst case and replacing with circuit design. Also update requirement for derating and adding Group A test conditions. 11 7

8 E.4..9 a. Add (Tc, Ta or Tj) before conditions. Update requirement for derating criteria. 11 E.4..9 b. Add (Tc, Ta or Tj) before conditions. Update requirement Group A test conditions. 11 G Correct Internal water vapor monitor to Internal gas analysis monitor. 138 Table G-V Correct Quantity (accept number) column for ELDRS characterization test to add unit after control. 144 Table G-V Correct Quantity (accept number) column for end point electrical at bottom of table from 1(0) to Condition A or C and D. 10(0) 144 HDR, 10(0) LDR, and 1 control unit. 8