DISTRIBUTION LIST CHANGE RECORD

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2 DISTRIBUTION LIST In charge of the document: L. LE ROY- Quality Director Copy to: Responsibility P. MAURICE President P.E. BERTHET Marketing and Sales Director P. RIGOBERT Manufacturing Director N. FIANT Design Center Manager P. COUDERC Research and Development Manager L. MURPHY ESA M. BILLOT CNES CHANGE RECORD Ed./Rev. Date Verified and approved by Description writer 1 09/12/02 DB/CV Initial document (First issue): The table of module quality level was extracted from 3DPA-0350 procedure. 2 06/03/03 PM/CV 4 Module Quality Classification Levels Traceability of lot components: Option 1 (note 1) -> Screening module: Stab. Bake 72hrs +125 C Option 2 (note 2) -> Thermal cycles (x10) 55 C/+125 C Option 2 (note 2) -> Burn-in 168hrs +125 C: -> Option 2 (note 2) for Industrial quality level added Electrical test 3 Temp. after burn-in: Industrial -> GoNoGo added Note (1): New text: If Option 1 is chosen, the modules are serialized. Note (2): New text: If Option 2 is chosen, the duration of the burn-in module is 168 hrs. Note (8) : T min = -40 C instead of 30 C PM DB Doc. N :3DPA Page 2 / 9

3 3 25/07/13 PM/ LLR/ DB Modification in the French text «Flow» by «Filière». Change «filière 2» by «filières 2» and «flow 2» by flows 2 in the all document 1 and 2: ECSS-Q superseded by ECSS-Q-ST C 3: Revision index update RD2 and RD3. 4 August10th,16 PMa/DB/FS Translation in English of all the document (French paragraph removed) 1 CTA_Ref 3DPI-0080 obsolete and canceled. 3. Addition of Acronyms DPA, EM, FM, IAW, PDA, PI, R&R, TM, VI Chapter4 table Module Quality Level Classification: removed note 2 and 4 Burn-In option, notes counting changed. Module Burn In 240hrs = standard Note 8 changed to Tmin Tmax for module testing after LAT. Removed drift calculation after module LAT DC LLR Doc. N :3DPA Page 3 / 9

4 TABLE OF CONTENTS 1 SCOPE APPLICABLE AND REFERENCES DOCUMENTS References documents Applicable documents DEFINITIONS/ ACRONYMS MODULES QUALITY LEVEL CLASSIFICATION... 7 TABLES Table 1: Sequence of requirement for the three quality level of 3D PLUS module... 7 Doc. N :3DPA Page 4 / 9

5 1 SCOPE This document describes each of these three quality levels (Commercial / Industrial / Space) applicable to the modules manufactured by 3D PLUS according to the 3D assembly Technology split in 2 stacking technologies (see Flow 1 or Flows 2). This procedure describes also the organization and the type of test applicable to the modules according to the quality level. This procedure is applicable for a product manufactured with the 3D PLUS Process Identification Document (PID) with a design approved by a Circuit Type Approval CTA document ref: 3303-xxxx-x extracted from paragraph 7.3 of ECSS-Q-ST-60-05C. Prototypes, demonstrators or mechanicals samples are not addressed. This technology is protected by a portfolio of 14 patents owned by 3D PLUS. 2 APPLICABLE AND REFERENCES DOCUMENTS 2.1 References documents - RD1 MIL STD 883: «Test method standard microcircuits» - RD2 ECSS-Q-ST-60-05C: «Space Product Assurance Generic procurement Requirements for Hybrid Microcircuits» - ESA/ESCC standards 2.2 Applicable documents - AD : «3D PLUS Process Identification Document» - AD2 3DPA-0460: «General requirements for PCB s procurement and Incoming inspection» - AD3 3DPA-0350: «General requirements for EEE components procurement and incoming inspection» - AD4 3DPA-0040: «General requirements for resin and glue procurement and incoming inspection» - AD5 3DPQ-0050: «EIDP writing» - AD6 3DPA-0850: «Modules quality level classification» - AD : «Glossary of 3D PLUS quality criteria» 3 DEFINITIONS/ ACRONYMS Bare die component (CPN): Integrated circuit intended to be assembled on flex using die attach and wire bonding processes. (Only silicon substrate is used, AsGa or other semiconductors are not included in this definition). CoC: DS: DPA: EEE components: components Certificate of Conformance Delivery Sheet Destructive Physical Analysis Electricals, Electronically and Electro mechanicals EIDP: End Item Data Package. Document including several documents (traceability, tests results and screening,) delivered with modules of space quality level. The format of the document is described in AD5 procedure. Doc. N :3DPA Page 5 / 9

6 EM: Engineering Model Flex: Printed flexible circuit used by 3D PLUS in flow 2 technology Flex (equipped): Flow 1: Flows 2: FM: Printed Circuit Board equipped with EEE components 3D PLUS Process stacking of TSOPs 3D PLUS Process stacking of Flex Flight Model Homogeneous Component Lot: Components from a homogeneous matter lot having undergone the same steps of a manufacturing process and of high reliability processing at the same time. A homogeneous lot has the same date code. IAW: LAT: In Accordance With Lot Acceptance Test Module: 3D PLUS module manufactured according to 3D patents and P.I.D. AD1 and quality levels defined in AD6 Module detailed specifications: Document which describes all the module manufacturing and tests steps. The format of this document is defined in annex 2 of RD2. Modules lot: Modules made from a homogeneous lot of components, matters and all, and that has undergone the same manufacturing process stages and the high reliability processing at the same time. A homogeneous lot of modules could have several date codes, differentiated at the laser etching step Module tests specifications: and parameters boundaries values. Document which describes module electrical test steps PAC: Packaged Active Component. This definition includes encapsulated semiconductors in the form of «plastics packaged»: TSOP, SOP, QFP, and PLCC, Ceramic or metallic PAC will be treated from case to case. The use of this kind of packages, requires the implementation of specifics tests (shocks, vibrations, PIND test, Fine and Gross leak ). PC: Passive Component (capacitors, resistances and inductances). Bare die passives components are included in CPN group (high accuracy resistance). PDA: R&R: TM: VI: Percent Defective Allowable Read and Record Test Method Visual Inspection Doc. N :3DPA Page 6 / 9

7 Manufacturing flex Element evaluation 3D PLUS applicable documentation 4 MODULES QUALITY LEVEL CLASSIFICATION Three quality levels have been defined: Commercial / Industrial / Space. The table below describes each of these levels for two stacking technologies (Flow 1 - Flow 2). As per space terminology, EM or MI modules correspond to the industrial level, and FM or MV modules correspond to the space level. RD1 Tests Methods are followed. The sequence of RD2 required inspections is described below: sequence Commercial Industrial Space 3D PLUS applicable documentation Element evaluation Manufacturing flex Screening flex Module manufacturing Process control Screening module Module LAT Shipment Delivery note + Delivery note + CoC CoC Delivery + EIDP Table 1: Sequence of requirement for the three quality level of 3D PLUS module Sequence Steps Flow 1 Flow 2 Commercial Industrial Space AD1 Detail specification of the module Test specification of the module Traceability of lot components Components Lot Acceptance Test (LAT) Flex assembly according to PID Flex electrical test at +25 C GoNoGo Option 1 (note 1) Option 1 (note 1) Burn-in flex 168 hrs C followed by an electrical test at +25 C GoNoGo Option 3 (note 3) Pre cap visual inspection of flex before stacking Doc. N :3DPA Page 7 / 9

8 shipment Module LAT (note 5) screening module module manufacturing Module manufacturing according to PID Module electrical test at +25 C GoNoGo Stab. Bake 72 hrs C Thermal cycles (x10) 55 C/+125 C Electrical test at +25 C before burn-in with R&R Burn-in 240 hrs at +125 C Option Final electrical test at 3 temp after burn-in (note 6) (GoNoGo) (R&R) Parameters drift calculation at +25 C P.D.A. Calculation (note 4) Final Visual Inspection Dimensional measurement (3 modules) Modules serialization Life test 1000 hrs. at +125 C Option 2 (note 2) Electrical test with R&R after burn-in (note 6) Final visual inspection Final DPA (1 module) Material Review Board Shipment documents Delivery Note + CoC Delivery Note + CoC Delivery Note + EIDP Notes: (1) If Option 1 selected, each flex is tested individually. (2) If Option 2 selected, the modules are serialized. (3) If Option 3 selected, each flex undergoes a burn-in of 168 hrs. In this case, the duration of the burn-in module can be reduced to 96 hrs. (4) The P.D.A. calculation conforms to of RD2. If the number of modules not satisfying the parameters drift calculation at +25 C is greater than 5%, the lot is rejected. Doc. N :3DPA Page 8 / 9

9 If the cumulative number of modules not satisfying the parameters drift calculation at +25 C and the electrical tests (Tmin, +25 C, Tmax) after burn-in is greater than 10%, the lot is rejected. (5) The quantity of parts for the LAT is defined in of RD2 (Table C): Module Lot Size 1 to to to 90 >90 Sample, first lot Sample, subsequent lots (6) Final electrical test is performed: at 3 temperatures (25 C, maximum & minimum rated operating temperature) in static, dynamic and functional mode Doc. N :3DPA Page 9 / 9