Research into high thermal conductivity materials related to the upgrade of the CMS tracker

Transcription

1 Summer 2010 Research into high thermal conductivity materials related to the upgrade of the CMS tracker Mukund Gupta Chandana Avasarala Technical Students

2 Table of Contents Introduction... 4 Structural Materials... 6 Carbon Fibers... 6 CYTEC Thornel Carbon fibers... 6 CYTEC ThermalGraph fibers... 7 TPG... 9 Minteq Pyrolytic Graphite... 9 Momentive Pyrolytic Graphite Optigraph Thermal Management Graphite Machining Pyrolytic Graphite Panasonic PGS Graphite Sheets SGL Group Expanded Natural Graphite Diamond Sumitomo Diamonds Element 6 Synthetic CVD Diamond Carbon Foams POCO Graphite POCO HTC Koppers K Foam Other Materials Sumitomo Heat spreader Materials Nanocyl Carbon Nanotubes Adhesives Dow Corning Thermally Conducting Materials Aratherm Advanced Thermal Conductive Encapsulants Sunray Scientific Maxiglow TedPella Conducting Adhesives... 53

3 PELCO High Performance Silver Paste Epoxy Technology H20-E Henkel Ablestik Semiconductor Materials Ellsworth Adhesives Tra-Con Tra-Bond Arctic Silver Premium Silver Thermal Epoxy Diamond Technologies Diamond Powder Product List References... 71

4 Introduction This document is a market survey of high thermal conductivity materials for the upgrade of the CMS tracker. The first part of the paper considers structural materials that are light weight and that could be manufactured into thin sheets. The sheets are to be used as a support structure in the CMS Pixel detector where there is a need for efficient heat transfer between the cooling pipes and the silicon wafers. The second part deals with high performance adhesives to glue the sheets to the cooling pipes with the best conductivity possible. Mainly three types of structural materials are considered: carbon fiber materials, thermal pyrolytic graphite (TPG) and diamond. It is noted that the first two can have a highly anisotropic thermal conductivity. Carbon fibers and graphite fibers materials have extremely thin fibers of about mm in diameter. They are highly conductive, but only along these fibers. Also, they lose conductivity when mixed with epoxy. In the material, the fibers can be oriented in one, two or all three directions. Depending on the required performance, different ratios of fibers along each axis can be chosen. TPG is a unique form of graphite manufactured by decomposition of a hydrocarbon gas at very high temperature in a vacuum furnace. Its layered structure is responsible for the material being highly anisotropic. Thus, TPG has high thermal conductivity along the horizontal plane but very low along the vertical plane. Some experiments done at Fermilab revealed that the TPG substrate needs to be stiffened due to delamination and strengthened because parts got damaged easily. They used CFRP encapsulation to avoid too much mass and for good conductivity. The material was successfully used for Fermilab MTest Pixel Detector and the Phenix Pixel Detector. Finite Element Analysis was made with this material for the CMS FPIX Detector. The results were quite satisfying since the temperature differences across each module were within 5 C. For more details on the experiments, refer to this link: Diamond is known for its high thermal conductivity. Several methods exist to produce diamond synthetically, such as Chemical Vapour Deposition (CVD) and High-Pressure High-Temperature (HPHT) synthesis. Diamond offers conductivity in all directions but the limiting factor is the shaping.

5 The market research confirms that these materials are high end products. Their applications include heat sinks, semiconductor manufacturing equipment, aerospace industry, optical communications equipment and medical diagnostic imaging instruments. The thermal conductivity of these materials exceeds that of gold, copper and silver and they are very light weight compared to these metals. For the purpose of the CMS tracker, low density materials should be used, partly because they need to be transparent to radiation. TPG and carbon fiber materials can be made into thin sheets. However, these sheets don t transfer heat across their thickness very well. Diamond sheets are available but in small dimensions.

6 Typical Properties for Thornel carbon fibers - Standard Products BP Amoco Chemicals Long. Thermal Trans. Thermal Electrical Cross Yield g/m Yield Specific Fiber Fiber Conductivity Conductivity Resistivity Section Yield Relative Tex Heat Resistance Resistance Diameter Density Grade W/mK W/mK(EST) micro ohm-m in 2 *10-5 grams/m To T-3003k g/km (300K) ohms/cm ohms/ft microns g /cc PAN Based Carbon Fibers T-350 Ablative Products /21X AB 3k % /23X AB 3k % /25X AB 3k % T-300 1k % k % k % k % T-650/35 3k % k % k % T-650/42 6k % k % Pitch Based Carbon Fibers P-25 2k % k % P-30X 2k % k (GPX-7) % k (GPX-8) % P-55S 2k % k % P-75S 2k % P-100S 2k % P-120S 2k % K k % The information contained in this publication is not comprehensive. Despite our efforts, it may not be accurate, up to date or applicable to the circumstances of any particular case. We cannot accept any liability for any inaccuracies or omissions in this publication and any decisions you make based on information contained in this publication are your sole responsibility. We are of course happy to discuss with you the implications of any issue raised if you contact us. No information contained in this publication constitutes an invitation by or on behalf of BP Amoco p.l.c. or any of its subsidiaries to enter into a contract with you. Page 1

7 Typical Properties of ThermalGraph DKD Fiber Properties Reported Fiber Properties Electrical Resistivity Bulk Density Range < 3.0 micro ohm-m g/cc Characteristic Fiber Properties Estimated Thermal Conductivity Average Filament Length Filament Diameter Filament Length Distribution Tensile Strength Tensile Modulus Fiber Density W/mK 200 microns 10 microns < 20% less than 100 microns and < 20 % greater than 300 microns 200 ksi Msi g/cc Carbon Assay 99+% Surface Area 0.4 m 2 /g

8 CYTEC - Engineered Materials 1 of 2 7/22/2010 2:14 PM Cytec Engineered Materials Overview Product Information Selector Guides Thornel and ThermalGraph Performance & Design Advantages Browse Related Products: Thornel (Pitch Based) Thornel (Pan Based) ThermalGraph All Carbon Fiber Products Select a Carbon Fiber Product: Low Density Back to Carbon Fiber Home Graphite fibers have significantly lower density than aluminum. This not only allows reduced weight, but also makes thinner components possible. Compared to copper, graphite fibers are 75 percent lighter and have 7 times the modulus. For aerospace and satellite applications where every ounce is critical, Thornel and ThermalGraph products present tremendous opportunities for the designer. Manufacturers can tailor CTE to a variety of materials by combining a metal or polymer with ThermalGraph fibers, which have a negative CTE along the fiber axis. Negative CTE Controlling the coefficient of thermal expansion (CTE) is becoming a critical factor in electronic packaging. Unlike metals, graphite fibers have a negative CTE along the fiber axis. By combining Thornel and ThermalGraph products with a metal or polymer, you can tailor CTE to a wide range of materials. Composites containing these materials can be used to create components with zero CTE. They also can be used to fine-tune the CTE of other materials to give you an impressive degree of dimensional stability. Inertness Unlike metals, graphite fibers are inert. They are extremely stable to very high temperatures, even in corrosive environments, and are generally unaffected by strong acids, bases, oxidants, salt water and atmospheric moisture. Design Flexibility The distinct advantages of Thornel and ThermalGraph products offer designers a broad range of opportunities Exceptional static and dynamic fatigue strength High tensile strength Excellent friction and wear characteristics Easily combined with a wide range of matrices Available in a variety of forms Easy to machine and plate High Thermal Conductivity For applications that need fast, high-capacity heat transfer, graphite fibers offer outstanding performance. In fact, only diamond can conduct more heat than highly crystalline graphite products. Because of their directional conduction capability, graphite fibers can be used in applications where far more metal would have to be used to accomplish the same heat transfer objective. Thornel and ThermalGraph products can be produced in grades that have 2 to 3 times the thermal conductivity of copper Cytec Industries Inc. All Rights Reserved. Site Map Important Notices Corporate Contact

9 Minteq: PYROID Pyrolytic Graphite 1 of 5 7/21/2010 1:57 PM Minteq - Home > Our Products > Minteq Pyrogenics Group > PYROID Pyrolytic Graphite Minteq Pyrogenics Group About Us PYROID Pyrolytic Graphite Carbon Composites Pyrolytic Film / Foil Applications PYROID HT Pyrolytic Graphite FIREX Fire and Thermal Protection Coatings PYROID Pyrolytic Graphite PYROID pyrolytic graphite (PG) is a specialized, "five-nine" purity, chemical vapor deposition (CVD), carbon product grown atom-by-atom with unique thermal, electrical and chemical properties including superior EMI performance. These materials have applications where extreme temperature up to 6000 F (3300 C) and corrosive environments exist, conducting heat across its (a-b) planar surface like copper and insulating like ceramics in the (c) thickness direction. As a result of our proprietary finishing process we achieve extremely low particulates and chemical resistance to fluorine-based gases that provide solutions to problems in plasma and semi-conductor etching systems. In addition, PG has been determined to be highly diamagnetic, conducive to enhanced imaging process for medical applications. The Pyrogenics Group provides parts and CNC machining, of diameters up to 18 in. (46 cm) and thickness up to 1 in. (2.5 cm). We supply PG in custom free standing as deposited shapes, having diameters up to 18 in. (46 cm) and varying wall thickness. Shapes can be manufactured such as cylindrical tubes, spherical domes, rods, plates, cones, and other intricate geometries. We are also the leading supplier of a special grade of freestanding PYROID pyrolytic graphite films (2-75µm thickness) for use in high energy and radiation projects. With its unique thermal and electrical characteristics. PYROID pyrolytic graphite is used by industries facing problem applications resulting from excessively high temperature, stress, corrosion, and friction, requiring a lightweight material solution. Technical Data Listed below is a general description of the processing and a summary of the key properties of pyrolytic graphite. The summary also lists important parameters of the product as it pertains to applications for thermal management. PYROID pyrolytic graphite is markedly different from polycrystalline graphite and is in a specialty category. The absence of granular components and the unique structures of CVD deposited PG, yields components that achieve dropout rates at or below 10 per wafer far below commercial graphite, and approaching that of silicon. In addition to having the lowest erosion material rate known, the size of the particulates generated is <0.1 µm and dropout distribution is uniform. The low ion sputtering rate in plasma applications results in enhanced lifetime, approaching several hundred hours in RF driven plasma devices, and is therefore, economically beneficial providing total cost solutions and enhanced productivity. PG is used widely in ion and rail gun applications due to its combination of high conductivity (in the a-b plane) and the very low sputtering rate offered by carbon in general. According to Ion Tech, PG offers the lowest sputtering erosion rate of any material used to construct ion grids. Exceptionally low metallic impurities (typical GDMs data avaiable upon request.) PG performs well at high temperatures and is stable up to 2200 C. PG approaches carbon s theoretical density of 2.25 g/cc, and hence is essentially non-porous resulting in no outgassing of contaminants and is very stable in the more chemically active etching plasma applications, employing chlorofluro carbons and nitrogen trifluoride, that attack silicon. PG has excellent thermal conductivity, approaching copper in the a-b direction, whereas it acts almost as a ceramic on the 'c' direction. In an annealed PYROID HT state, the thermal conduction properties increase up to four to eight times that of copper and aluminum,

10 Minteq: PYROID Pyrolytic Graphite 2 of 5 7/21/2010 1:57 PM respectively (thermal conductivity as high as 1700 W/m K). We are able to selectively bond the planes through special fixturing to take maximum advantage of its directional conductivity. In this regard it is an excellent material in special thermal management applications, including lids and heat sinks. MINTEQ supplies PG in flat machined pieces as required by the customer or fully machined parts (such as etching cathodes or grids) from customer specification or drawing. We have a CNC equipped machine shop and access to laser machining to fabricate complex shapes, critical dimensions and hole patterns in grids. We also offer a special surface treatment process after parts are machined to virtually eliminate particulate debris from the parts.

11 Minteq: PYROID Pyrolytic Graphite 3 of 5 7/21/2010 1:57 PM

12 Minteq: PYROID Pyrolytic Graphite 4 of 5 7/21/2010 1:57 PM Learn more: About Us Applications Carbon Composites Firex Fire and Thermal Protection Coatings PYROID HT Heat Spreaders and Thermal Vias

13 Pyrolytic Graphite Pyrolytic graphite (PG) is a unique form of graphite manufactured by decomposition of hydrocarbon gas at very high temperature in a vacuum furnace. The result is an ultra-pure product which is near theoretical density and extremely anisotropic. As an example, PG exhibits thermal conductivity consistent with the best conductors in the ab plane and lower than alumina brick in the c direction. Mechanical, thermal, and electrical properties are generally far superior to conventional graphites. PG is available as plate and as an impermeable coating on graphite and other substrates. Features Chemically inert High purity Stable to 3000ºC Impermeable Directional electrical and thermal characteristics Self-lubricating Non-dusting Low etch rate Applications Sputtering Targets Ion Beam Grids Ion Implant Hardware Liquid Phase Epitaxy Hardware Crucibles for Ultra High Vacuum Thermal Insulators Rocket Nozzles Heater Elements Typical Properties (@ 300K) PROPERTY VALUE Density g/cc Flexural Strength (a,b) 18,000 psi (120 MPa) Tensile Strength (a,b) 12,000 psi (80 MPa) Compressive Strength (a,b) 15,000 psi (100 MPa) Young s Modulus (a,b) 3 x 10 6 psi (20,000 MPa) Thermal Expansion (a,b) 0.5 x 10-6 /K (c) 20 x 10-6 /K Thermal Conductivity (a,b) 300 W/m-K (c) 3.5 W/m-K Electrical Resistivity (a,b) 0.5 x 10-3 ohm-cm (c) 0.5 ohm-cm Crystal Structure Hexagonal C/2 Spacing 3.42 Å Melting Point (Atmosphere) Sublimes at 3650ºC Impurities Total 0.01% Maximum Metallic 10 ppm Outgassing Negligible Sales Offices USA T: F: E: cs-na.ceramics@momentive.com Germany T: F: E: cs-eur.ceramics@momentive.com Japan T: F: E: cs-jp.ceramics@momentive.com China T: F: E: cs-asia.ceramics@momentive.com DISCLAIMER: THE MATERIALS, PRODUCTS AND SERVICES OF MOMENTIVE PERFORMANCE MATERIALS INC., MOMENTIVE PERFORMANCE MATERIALS USA INC., MOMENTIVE PERFORMANCE MATERIALS ASIA PACIFIC PTE. LTD., MOMENTIVE PERFORMANCE MATERIALS WORLDWIDE INC., MOMENTIVE PERFORMANCE MATERIALS GmbH & Co. KG, MOMENTIVE PERFORMANCE MATERIALS SUISSE Sarl, THEIR SUBSIDIARIES AND AFFILIATES DOING BUSINESS IN LOCAL JURISDICTIONS (collectively SUPPLIERS ), ARE SOLD BY THE RESPECTIVE LEGAL ENTITY OF THE SUPPLIER SUBJECT TO SUPPLIERS STANDARD CONDITIONS OF SALE, WHICH ARE INCLUDED IN THE APPLICABLE DISTRIBUTOR OR OTHER SALES AGREEMENT, PRINTED ON THE BACK OF ORDER ACKNOWLEDGMENTS AND INVOICES, AND AVAILABLE UPON REQUEST. ALTHOUGH ANY INFORMATION, RECOMMENDATIONS, OR ADVICE CONTAINED HEREIN IS GIVEN IN GOOD FAITH, SUPPLIERS MAKE NO WARRANTY OR GUARANTEE, EXPRESS OR IMPLIED, (i) THAT THE RESULTS DESCRIBED HEREIN WILL BE OBTAINED UNDER END-USE CONDITIONS, OR (ii) AS TO THE EFFECTIVENESS OR SAFETY OF ANY DESIGN INCORPORATING SUPPLIERS PRODUCTS, MATERIALS, SERVICES, RECOMMENDATIONS OR ADVICE. AFOREMENTIONED EXCLUSIONS OR LIMITATION OF LIABILITY ARE NOT APPLICABLE TO THE EXTENT THAT THE END-USE CONDITIONS AND/OR INCORPORATION CONDITIONS CORRESPOND TO THE RECOMMENDED CONDITIONS OF USE AND/OR OF INCORPORATION AS DESCRIBED BY SUPPLIER IN ITS PRODUCT DATA SHEET AND/OR PRODUCT SPECIFICATIONS. EXCEPT AS PROVIDED IN SUPPLIERS STANDARD CONDITIONS OF SALE, SUPPLIERS AND THEIR REPRESENTATIVES SHALL IN NO EVENT BE RESPONSIBLE FOR ANY LOSS RESULTING FROM ANY USE OF ITS MATERIALS, PRODUCTS OR SERVICES DESCRIBED HEREIN. Each user bears full responsibility for making its own determination as to the suitability of Suppliers materials, services, recommendations, or advice for its own particular use. Each user must identify and perform all tests and analyses necessary to assure that its finished parts incorporating Suppliers products, materials, or services will be safe and suitable for use under end-use conditions. Nothing in this or any other document, nor any oral recommendation or advice, shall be deemed to alter, vary, supersede, or waive any provision of Suppliers Standard Conditions of Sale or this Disclaimer, unless any such modification is specifically agreed to in a writing signed by Suppliers. No statement contained herein concerning a possible or suggested use of any material, product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right of Suppliers or any of its subsidiaries or affiliates covering such use or design, or as a recommendation for the use of such material, product, service or design in the infringement of any patent or other intellectual property right. Copyright Momentive Performance Materials Inc. All rights reserved. ISO 9001 Certified CVD (11/07)

14 TPG * Thermal Management Material TPG (thermal pyrolytic graphite) is a unique form of pyrolytic graphite manufactured from thermal decomposition of hydrocarbon gas in a high temperature chemical vapor deposition reactor. Benefits Thermal conductivity to 4 times copper Lighter than aluminum Compatible with many encapsulating techniques Sizes from dies and packages to PWB s Passive, high performance heat transfer Features Highly oriented crystals in a layered structure In-plane conductivity typically 1350 to 1700 watts/m-k Fully dense ceramic High c-direction modulus, contributing to improved section properties in composite structures Layered structure avoids brittle, catastrophic failure Easily machined, provided as plates or as final shapes Thickness ranges from less than 0.010" (0.25 mm) to over 0.200" (5 mm) Plate sizes up to 5" (125 mm) x 20" (500 mm) Special sizes can usually be provided upon request Applications The high thermal conductivity of TPG comes from a crystal structure that usually requires capturing the TPG material in some structural member. Final products typically include encapsulations such as aluminum, copper, AlSiC and carbon fiber composite to solve thermal problems in such needs as: Heat spreaders in packages Thermal cores for PWB's Heat spreaders for improved performance of finned sinks Laser diode mounts ITRS Impact - The International Technology Roadmap for Semiconductors shows power dissipation increasing by 10 watts per year from 130 watts in 2002 at the 130 nm node to 160 watts in 2005 at the 100 nm node. TPG can enable transparent thermal solutions without the need for dramatic changes in fans or forced cooling.

15 Typical TPG* Properties Typical Thermal Performance Thermal Conductivity 1500 Watts/m-K, a-b axis <20 Watts/m-K, c axis Density 2.26 gm/cc Thermal Expansion 0 to -1 ppm/ o C, a-b axis Coefficient 25 ppm/ o C, c axis Specific Heat 0.71 J/gm- o 25 o C Flexural Strength /-4%, MPa, ab /-4%, MPa, ab Delta T (C) Dissipated Power (W) Aluminum Copper TC1050 TPG Stiffness /-2%, GPa, c /-3%, GPa, c 33 Compressive Strength nil ab Tensile Strength nil ab TPG shows over 5X the power dissipation capability of aluminum Thermal Images 6061 Aluminum Tmax = 115 o C TPG T max = 44 o C SALES OFFICES USA T: F: E: cs-na.ceramics@momentive.com GERMANY T: F: E: cs-eur.ceramics@momentive.com JAPAN T: F: E: cs-jp.ceramics@momentive.com CHINA T: F: E: cs-asia.ceramics@momentive.com DISCLAIMER: THE MATERIALS, PRODUCTS AND SERVICES OF MOMENTIVE PERFORMANCE MATERIALS INC., MOMENTIVE PERFORMANCE MATERIALS USA INC., MOMENTIVE PERFORMANCE MATERIALS ASIA PACIFIC PTE. LTD., MOMENTIVE PERFORMANCE MATERIALS WORLDWIDE INC., MOMENTIVE PERFORMANCE MATERIALS GmbH & Co. KG, MOMENTIVE PERFORMANCE MATERIALS SUISSE Sarl, THEIR SUBSIDIARIES AND AFFILIATES DOING BUSINESS IN LOCAL JURISDICTIONS (collectively SUPPLIERS ), ARE SOLD BY THE RESPECTIVE LEGAL ENTITY OF THE SUPPLIER SUBJECT TO SUPPLIERS STANDARD CONDITIONS OF SALE, WHICH ARE INCLUDED IN THE APPLICABLE DISTRIBUTOR OR OTHER SALES AGREEMENT, PRINTED ON THE BACK OF ORDER ACKNOWLEDGMENTS AND INVOICES, AND AVAILABLE UPON REQUEST. ALTHOUGH ANY INFORMATION, RECOMMENDATIONS, OR ADVICE CONTAINED HEREIN IS GIVEN IN GOOD FAITH, SUPPLIERS MAKE NO WARRANTY OR GUARANTEE, EXPRESS OR IMPLIED, (i) THAT THE RESULTS DESCRIBED HEREIN WILL BE OBTAINED UNDER END-USE CONDITIONS, OR (ii) AS TO THE EFFECTIVENESS OR SAFETY OF ANY DESIGN INCORPORATING SUPPLIERS PRODUCTS, MATERIALS, SERVICES, RECOMMENDATIONS OR ADVICE. AFOREMENTIONED EXCLUSIONS OR LIMITATION OF LIABILITY ARE NOT APPLICABLE TO THE EXTENT THAT THE END-USE CONDITIONS AND/OR INCORPORATION CONDITIONS CORRESPOND TO THE RECOMMENDED CONDITIONS OF USE AND/OR OF INCORPORATION AS DESCRIBED BY SUPPLIER IN ITS PRODUCT DATA SHEET AND/OR PRODUCT SPECIFICATIONS. EXCEPT AS PROVIDED IN SUPPLIERS STANDARD CONDITIONS OF SALE, SUPPLIERS AND THEIR REPRESENTATIVES SHALL IN NO EVENT BE RESPONSIBLE FOR ANY LOSS RESULTING FROM ANY USE OF ITS MATERIALS, PRODUCTS OR SERVICES DESCRIBED HEREIN. Each user bears full responsibility for making its own determination as to the suitability of Suppliers materials, services, recommendations, or advice for its own particular use. Each user must identify and perform all tests and analyses necessary to assure that its finished parts incorporating Suppliers products, materials, or services will be safe and suitable for use under end-use conditions. Nothing in this or any other document, nor any oral recommendation or advice, shall be deemed to alter, vary, supersede, or waive any provision of Suppliers Standard Conditions of Sale or this Disclaimer, unless any such modification is specifically agreed to in a writing signed by Suppliers. No statement contained herein concerning a possible or suggested use of any material, product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right of Suppliers or any of its subsidiaries or affiliates covering such use or design, or as a recommendation for the use of such material, product, service or design in the infringement of any patent or other intellectual property right. Copyright Momentive Performance Materials Inc. All rights reserved. *TPG is a trademark of Momentive Performance Materials Inc. CVD Rev (11/07)

16 TC1050 * Thermal Management Materials Momentive Performance Materials has developed a family of thermal management products based upon its high conductivity TPG* (thermal pyrolytic graphite) material. TPG is a unique form of pyrolytic graphite manufactured from thermal decomposition of hydrocarbon gas in a high temperature, chemical vapor deposition reactor. TC1050 is a macrocomposite of a TPG core encapsulated in various structural materials: Aluminum (TC1050.ALY) Copper (TC1050.COP) Other encapsulations and systems are often available, such as kovar, tungsten/copper, carbon fiber composites, etc. The thermal expansion properties are defined by the selection of the encapsulating material. Benefits Thermal conductivity to 3 times copper Lighter than aluminum Adjustable coefficients of thermal expansion Low thermal resistance High reliability from passive conduction Sizes from diode mounts to whole chassis panels Applications Heat spreaders in packages Thermal cores for PWB's Improved performance of finned sinks Laser diode mounts Avionics thermal cores Satellite traveling wave tube mounts Electronic chassis

17 Typical TPG* Properties Typical Thermal Performance Thermal Conductivity 1500 Watts/m-K, a-b axis <20 Watts/m-K, c axis Density 2.26 gm/cc Thermal Expansion 0 to -1 ppm/ o C, a-b axis Coefficient 25 ppm/ o C, c axis Specific Heat 0.71 J/gm- o 25 o C Delta T [C] Dissipated Power [W] Aluminum Copper TC1050 TPG Flexural Strength /-4%, MPa, ab /-4%, MPa, ll ab Stiffness /-2%, GPa, c /-3%, GPa, c 33 TPG shows over 5X the power dissipation capability of Al Compressive Strength nil ll ab Tensile Strength nil ll ab Thermal Images 6061 Aluminum T max = 115 o C TPG T max = 44 o C SALES OFFICES USA T: F: E: cs-na.ceramics@momentive.com GERMANY T: F: E: cs-eur.ceramics@momentive.com JAPAN T: F: E: cs-jp.ceramics@momentive.com CHINA T: F: E: cs-asia.ceramics@momentive.com DISCLAIMER: THE MATERIALS, PRODUCTS AND SERVICES OF MOMENTIVE PERFORMANCE MATERIALS INC., MOMENTIVE PERFORMANCE MATERIALS USA INC., MOMENTIVE PERFORMANCE MATERIALS ASIA PACIFIC PTE. LTD., MOMENTIVE PERFORMANCE MATERIALS WORLDWIDE INC., MOMENTIVE PERFORMANCE MATERIALS GmbH & Co. KG, MOMENTIVE PERFORMANCE MATERIALS SUISSE Sarl, THEIR SUBSIDIARIES AND AFFILIATES DOING BUSINESS IN LOCAL JURISDICTIONS (collectively SUPPLIERS ), ARE SOLD BY THE RESPECTIVE LEGAL ENTITY OF THE SUPPLIER SUBJECT TO SUPPLIERS STANDARD CONDITIONS OF SALE, WHICH ARE INCLUDED IN THE APPLICABLE DISTRIBUTOR OR OTHER SALES AGREEMENT, PRINTED ON THE BACK OF ORDER ACKNOWLEDGMENTS AND INVOICES, AND AVAILABLE UPON REQUEST. ALTHOUGH ANY INFORMATION, RECOMMENDATIONS, OR ADVICE CONTAINED HEREIN IS GIVEN IN GOOD FAITH, SUPPLIERS MAKE NO WARRANTY OR GUARANTEE, EXPRESS OR IMPLIED, (i) THAT THE RESULTS DESCRIBED HEREIN WILL BE OBTAINED UNDER END-USE CONDITIONS, OR (ii) AS TO THE EFFECTIVENESS OR SAFETY OF ANY DESIGN INCORPORATING SUPPLIERS PRODUCTS, MATERIALS, SERVICES, RECOMMENDATIONS OR ADVICE. AFOREMENTIONED EXCLUSIONS OR LIMITATION OF LIABILITY ARE NOT APPLICABLE TO THE EXTENT THAT THE END-USE CONDITIONS AND/OR INCORPORATION CONDITIONS CORRESPOND TO THE RECOMMENDED CONDITIONS OF USE AND/OR OF INCORPORATION AS DESCRIBED BY SUPPLIER IN ITS PRODUCT DATA SHEET AND/OR PRODUCT SPECIFICATIONS. EXCEPT AS PROVIDED IN SUPPLIERS STANDARD CONDITIONS OF SALE, SUPPLIERS AND THEIR REPRESENTATIVES SHALL IN NO EVENT BE RESPONSIBLE FOR ANY LOSS RESULTING FROM ANY USE OF ITS MATERIALS, PRODUCTS OR SERVICES DESCRIBED HEREIN. Each user bears full responsibility for making its own determination as to the suitability of Suppliers materials, services, recommendations, or advice for its own particular use. Each user must identify and perform all tests and analyses necessary to assure that its finished parts incorporating Suppliers products, materials, or services will be safe and suitable for use under end-use conditions. Nothing in this or any other document, nor any oral recommendation or advice, shall be deemed to alter, vary, supersede, or waive any provision of Suppliers Standard Conditions of Sale or this Disclaimer, unless any such modification is specifically agreed to in a writing signed by Suppliers. No statement contained herein concerning a possible or suggested use of any material, product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right of Suppliers or any of its subsidiaries or affiliates covering such use or design, or as a recommendation for the use of such material, product, service or design in the infringement of any patent or other intellectual property right. Copyright Momentive Performance Materials Inc. All rights reserved. *TPG and TC1050 are trademarks of Momentive Performance Materials Inc. CVD Rev (2/08)

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20 PGS Graphite Sheets PGS Graphite Sheets Type: EYG PGS (Pyrolytic Graphite Sheet) is a thermal interface material which is very thin, synthetically made, has high thermal conductivity, and is made from a higly oriented graphite polymer film. It is ideal for providing thermal management/heat-sinking in limited spaces or to provide supplemental heat-sinking in addition to conventional means. This material is flexible and can be cut into customizable shapes. Features Excellent thermal conductivity : 700 to 1600 W/(m K) (2 to 4 times as high as copper, 3 to 6 time as high as aluminum) Lightweight: Specifi c gravity : 0.85 to 1.9 g/cm 3 (1/4 to 1/10 of copper, 1/1.3 to 1/3 of aluminum in density) Flexible and easy to be cut or trimmed. (withstands repeated bending) Low thermal resistance Recommended applications Cellular phone, DVC, DSC, PC and peripherals, pickup Semiconductor manufacturing equipment (Sputtering, Dry etching, Steppers) Optical communications equipment Handling Precautions (See Page 182) Explanation of Part Numbers E Y G S Product Code Dimension X (Short) Dimension Y (Long) Suffix S A C M Style PGS only Taping Coating Other materials laminated Thickness (mm) Custom product is suffix. Dimensions in mm (not to scale) Dimension of representative Part No. Dimension X (Short) Dimension Y (Long) Thickness (mm) Y(mm) 1 0 EYGS ±5 mm 230±5 mm 0.10±0.03, 0.07± X(mm) 1 0 EYGS ±5 mm 180±5 mm 0.10±0.03, 0.07±0.015, 0.025± EYGS ±5 mm 115±5 mm 0.10±0.03, 0.07±0.015, 0.025± Please contact us for other dimensions other than those above. Characteristics Characteristics Specifi cation Specifi cation Specifi cation Thickness 0.10 ± 0.03 mm 0.07 ± mm ± mm Density 0.85 g/cm g/cm g/cm 3 Thermal conductivity a-b plane 700 W/(m K) 1000 W/(m K) 1600 W/(m K) Electrical conductivity S/cm S/cm S/cm Extensional strength 19.6 MPa 22.0 MPa 30.0 MPa Expansion coeffi cient a-b plane /K /K /K c axis /K /K /K Heat resistance 400 C Bending(angle 180,R5) cycles Values are for reference, not guaranteed. Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 01 May EC178

21 PGS Graphite Sheets Thermal conductivity of PGS compared to other Layered structure of PGS PGS 25 μm PGS 70 μm PGS 100 μm Conventional graphite Pure copper Aluminum Pure iron Stainless steel Magnesium alloy Heat-conductive sheet Thermal conductivity: 2 to 4 times as high as copper, Specific gravity: 1/10 to 1/4 that of copper C axis a-b plane to cm Coefficient of thermal conductivity (W/(m k)) Electric fi eld shield performance Effect of shield (db) a-b plane(kec method) Effect of shield (db)= 20 log (Vs/V0) Effect of electric field shield Effect of magnetic field shield Frequency (MHz) Rating and Characteristics Standard series ( PGS 100, 70, 25 μm ) Type PGS Only Adhesive Type Laminated type (Insulation & Adhesive) S type A-A type A -M type A-PA type A-PM type A-SM type Front face Rear face Structure PGS Graphite sheet Insulative adhesion type 30 μm PGS Graphite sheet Insulative thin adhesion type 10 μm PGS Graphite sheet Polyester tape standard type 30 μm Insulative adhesion type 30 μm Polyester tape standard type 30 μm Insulative thin adhesion type 10 μm PGS Graphite sheet PGS Graphite sheet Polyester(PET) Polyester(PET) tape 30 μm tape 30 μm Polyester tape thin type 10 μm Insulative thin adhesion type 10 μm PGS Graphite sheet Polyester(PET) tape 10 μm Features High Thermal Conductivity High Flexibility Low Thermal Resistance Available up to 400 C Conductive Material Acrylic Adhesive tape 30 μm Separating paper With insulation material on one side With strong adhesive tape for putting chassis Withstanding Voltage : 2 kv Acrylic Adhesive tape 10 μm Separating paper With insulation material on one side Low thermal resistance comparison with A-A type Withstanding Voltage : 1 kv Please contact our engineering section or factory about to special applications. Acrylic Adhesive tape 30 μm Separating paper With insulation material on both side Withstanding Voltage PET tape : 4 kv Adhesive Tape : 2 kv Acrylic Adhesive tape 10 μm Separating paper With insulation material on both side Withstanding Voltage PET tape : 4 kv Adhesive Tape : 1 kv Acrylic Adhesive tape 10 μm Separating paper With insulation material on both side Withstanding Voltage PET tape : 1 kv Adhesive Tape : 1 kv Withstand temperature 400 C 100 C 100 C 100 C 100 C 100 C Standard Size mm mm mm mm mm mm 100 μm 70 μm 25 μm Maximam size mm mm(25 μm) mm mm mm mm mm Part No. EYGS Thickness 100 μm Part No. EYGS EYGA091207A EYGA091207M EYGA091207PA EYGA091207PM EYGA091207SM Thickness 70 μm 100 μm 80 μm 130 μm 110 μm 90 μm Part No. EYGS EYGA091203A EYGA091203M EYGA091203PA EYGA091203PM EYGA091203SM Thickness 25 μm 55 μm 35 μm 85 μm 65 μm 45 μm Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 May EC179

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26 Product Detail 1 of 1 7/22/ :12 AM Home Basket (0 items) Register Login CVD Diamond eshop Technology & Materials About eshop About E6 Product Details Product Ref. No. Description Qty. Price GBP TM100 10x10 mm, 0.25 mm thick Buy CVD Diamond eshop Optical Grade CVD Thermal Management Grade CVD Mechanical Grade CVD Electrochemistry Grade CVD Single Crystal Diamond Plate Electronic Grade Plates Custom Product Request Form Contact FAQ How To Buy Specifications and Standard Tolerances Tolerances +0.2 / -0.0 mm on lateral dimensions, +/ mm on thickness Surface finish: 1 side polished Ra < 50 nm, 1 side lapped Ra < 250 nm Laser Kerf <3, Dimensions to smaller side Properties Thermal conductivity >1000 Wm -1 K -1 Bulk resistivity (Rv) > Ωcm, Surface resistivity (Rs) > Ω Laser cut edges, edge features < 200 µm Related Products Product Ref. No. Description Qty. Price GBP TM100 10x10 mm, 0.50 mm thick Buy View Specifications CVD Diamond eshop Materials & Technology About eshop About E6 How to Buy FAQ - Frequently Asked Questions Contact Privacy Policy Terms & Conditions Copyright Element Six , All rights reserved

27 Product Detail 1 of 1 7/22/ :13 AM Home Basket (0 items) Register Login CVD Diamond eshop Technology & Materials About eshop About E6 Product Details Product Ref. No. Description Qty. Price GBP TM180 10x10 mm, 0.25 mm thick Buy CVD Diamond eshop Optical Grade CVD Thermal Management Grade CVD Mechanical Grade CVD Electrochemistry Grade CVD Single Crystal Diamond Plate Electronic Grade Plates Custom Product Request Form Contact FAQ How To Buy Specifications and Standard Tolerances Tolerances +0.2 / -0.0 mm on lateral dimensions, +/-0.05 mm on thickness Surface finish: 1 side polished Ra < 50 nm, 1 side lapped Ra < 250 nm Laser Kerf <3, Dimensions to smaller side Properties Thermal conductivity >1800 Wm -1 K -1 Bulk resistivity (Rv) > Ωcm, Surface resistivity (Rs) > Ω Laser cut edges, edge features < 200 µm CVD Diamond eshop Materials & Technology About eshop About E6 How to Buy FAQ - Frequently Asked Questions Contact Privacy Policy Terms & Conditions Copyright Element Six , All rights reserved

28 Typical Material Properties Thermal Management Material AVERAGE Density 0.9 g/cc Compressive Strength 855 psi Thermal conductivity Out of Plane 245 W/m K In Plane 70 W/m K Total Porosity 61% Open Porosity (% of total) 95% Average Pore Diameter 400 microns CTE Temperature Range In-Plane Out-of-Plane AVG AVG 323 to 423 K/50 to 150 C to 573 K/150 to 300 C to 873 K/300 to 600 C to 1073 K/600 to 800 C Values in ppm/ K or ppm/ C POCO HTC Poco Graphite, a manufacturer of specialty materials, has developed a new graphite material specifically designed for applications that require high thermal performance. A unique manufacturing process yields a lightweight, porous graphite that has high thermal conductivity and very efficient thermal energy transfer characteristics. Thermal management applications for POCO HTC include heat sinks, heat exchangers, heat pipes, evaporative coolers, and phase-change cooling systems. POCO HTC can be laminated into thermal structures for satellite thermal panels and avionics enclosures. As the base material for a thermal composite, the open porosity of POCO HTC allows it to be filled with other materials such as copper, polymer or additional carbon. The versatility of this porous graphite makes it desirable for a number of industries that currently use non conductive carbon, aluminum foam, copper or other metals. These markets include electronics, aerospace, ground vehicles, medical, electrochemical (fuel cells, batteries) and general industrial. Material Features l High specific thermal conductivity 272 W/m K / g/cc l Wetted by liquid nitrogen, methanol, Fluorinert l RF shielding capability RF energy is not transmitted through the material l Chemical inertness highly graphitic structure makes it inert to most acids and organic solvents US Patent Number Poco Graphite, Inc., 300 Old Greenwood Rd., Decatur, Texas USA (Toll Free) Fax: info@poco.com EUROPEAN REGIONAL OFFICES Poco Graphite, SARL, 1, rue des Vergers, Limonest - France Tel: +33 (0) Fax: +33 (0) sales@poco-graphite.fr Poco Graphite, Inc All rights reserved

29 Technical Data Sheet Koppers Inc. Technical Center 1005 William Pitt Way Pittsburgh, PA Grade L1a Property Units Value Density [g/cc] 0.34 Compressive Strength MPa 1.7 Compressive Modulus GPa 0.15 Tensile Strength MPa 4.4 Tensile Modulus GPa 0.19 Flexural Strength MPa 2.1 Flexural Modulus GPa 0.12 Shear Strength MPa 0.54 Shear Modulus GPa 0.06 Coefficient of Thermal Expansion E -6 / 650 C 1.72 Thermal Conductivity - Z W/m K 55 Electrical Resistivity - Z μ m 40.8 Average Pore Size μm 500 Average Pore Volume % 78

30 Technical Data Sheet Koppers Inc. Technical Center 1005 William Pitt Way Pittsburgh, PA Grade L1 Property Units Value Density [g/cc] 0.38 Compressive Strength MPa 3.4 Compressive Modulus GPa 0.31 Tensile Strength MPa 7.95 Tensile Modulus GPa 0.31 Flexural Strength MPa 3.2 Flexural Modulus GPa 0.26 Shear Strength MPa 0.67 Shear Modulus GPa 0.09 Coefficient of Thermal Expansion E -6 / 650 C 3.0 Thermal Conductivity - Z W/m K 70 Electrical Resistivity - Z μ m 47.6 Average Pore Size μm 600 Average Pore Volume % 70

31 Technical Data Sheet Koppers Inc. Technical Center 1005 William Pitt Way Pittsburgh, PA Grade D1 Property Units Value Density [g/cc] 0.48 Compressive Strength MPa 2.5 Compressive Modulus GPa 0.40 Tensile Strength MPa 6.8 Tensile Modulus GPa 0.31 Flexural Strength MPa 2.5 Flexural Modulus GPa 0.34 Shear Strength MPa 0.89 Shear Modulus GPa 0.16 Coefficient of Thermal Expansion E -6 / 650 C 0.69 Thermal Conductivity - Z W/m K 110 Electrical Resistivity - Z μ m 31.5 Average Pore Size μm 650 Average Pore Volume % 72

32 Heatspreader Confidential Category Material Trade Name Composition [10-6 /K] 25ºC 100ºC SiSiC Invavder SSC200 18Si-SiC 200 N/A 3 SSC230 18Si-SiC 230 N/A N/A 0.35 N/A N/A Ceramics SALN-20 White >200 >180 AlN SALN-17 White 4.5 >170 > , N/A SALN-14B Black >140 >120 β8 70SiC-30Al N/A N/A 0.24 N/A 0.13 N/A N/A Sintered β10 60Sic-40Al N/A N/A 0.24 N/A 0.13 N/A N/A Metal Ceramics Al-SiC Al-SiC β12 50SiC-50Al N/A N/A 0.28 N/A 0.12 N/A N/A β14 40SiC-60Al N/A N/A 0.28 N/A 0.10 N/A N/A Metals Metals Semiconductor Ceramics Organic DMCH Diamond-Metal Cu-W Cu-Mo Cu-Buster Cub 15 Al-20SiC-α N/A N/A 0.25 N/A 0.10 N/A N/A W-10 89W-11Cu x10-8 N/A SUMICRYSTAL CVD-DIAMOND W-15 85W-15Cu x10-8 N/A W-20 80W-20Cu x10-8 N/A W-10S 89W-11Cu N/A x10-8 N/A W-15S 85W-15Cu N/A x10-8 N/A W-20S 80W-20Cu N/A x10-8 N/A W-30S 70W-30Cu N/A N/A N/A N/A N/A N/A N/A N/A N/A W-40S 60W-40Cu N/A N/A N/A N/A N/A N/A N/A N/A N/A CM-15 85Mo-15Cu x10-8 N/A PCM30 70Mo-30Cu x7.0-y N/A x10-8 N/A PCM35 65Mo-35Cu x7.2-y N/A x10-8 N/A RCM60 40Mo-60Cu x10.2-y N/A x10-8 N/A CMC111 Cu/Mo/Cu N/A N/A 0.40 N/A N/A N/A CPC141(30) Cu/PCM/Cu x7.3-y N/A N/A N/A N/A CPC232(30) Cu/PCM/Cu x7.5-y N/A N/A N/A N/A DC40 DC60 W Mo Si GaAs InP GaN Al 2 O 3 BeO SiO 2 High C.T.E. Glass Ceramics SiC Cu Al Fe-Ni-Co FR-4 Polyimide Comparison of Physical and Mechanical Properties of Heatspreader Materials Coefficient of Thermal Expansion Thermal Conductivity [W(m.K)] Specific Heat [kj/(kg-k)] Specific Gravity Hardness [Hv] Transverse Rapture Strength [GPa] Tensile Strength [GPa] Young's Modulus [TPa] A.L.M.T. Corp Electric Resistivity [Ωm] Dielectric Constant [at 1MHz] N/A N/A x10-8 N/A N/A N/A x10-8 N/A 2.3 2, ~ N/A >1000 N/A ~ N/A x Diamond-Cu N/A N/A N/A N/A x10-4 N/A Diamond-Cu N/A N/A N/A N/A x10-4 N/A N/A N/A 0.2 N/A x N/A N/A x N/A N/A N/A N/A x a5.6-c N/A N/A N/A N/A N/A N/A N/A , N/A , N/A N/A N/A 0.70 N/A N/A N/A N/A N/A N/A N/A N/A 1.00 N/A N/A N/A N/A N/A N/A , N/A N/A x10-8 N/A N/A N/A N/A N/A 0.08 N/A N/A N/A x10-7 N/A x15-y N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A

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35 P R O D U C T I N F O R M A T I O N Information About Dow Corning Brand Thermally Conductive Materials Thermally Conductive Materials Long-term, reliable protection of sensitive circuits and components is important in many of today s delicate and demanding electronic applications. With the increase in processing power and the trend toward smaller, more compact electronic modules, the need for thermal management is growing. Dow Corning s family of thermally conductive materials provides excellent thermal management options. Thermally conductive silicones function as heat transfer media, durable dielectric insulation, barriers against environmental contaminants and as stress-relieving shock and vibration absorbers over a wide temperature and humidity range. In addition to sustaining their physical and electrical properties over a broad range of operating conditions, silicones are resistant to ozone and ultraviolet degradation and have good chemical stability. Dow Corning s line of thermal management materials includes adhesives, encapsulants, compounds and gels. Good heat transfer is dependent on a good interface between the heat producing device and the heat transfer media. Silicones have a low surface tension that enables them to wet most surfaces, which can lower the thermal contact resistance between the substrate and the material. Thermally s Type Noncorrosive, one-part, moisture-cure RTV and one- or twopart heat-cure silicone elastomers Physical Form Nonflowing and flowable options; cure to flexible elastomers Special Properties Room-temperature or fast thermal cure; variety of thermal conductivities; resist humidity and other harsh environments; good dielectric properties; self-priming adhesion; low stress Potential Uses Heat sink or base plate attach; potting power supplies Thermally Conductive Encapsulants Type Two-part silicone elastomers Physical Form Flowable liquid; cures to flexible elastomer Special Properties Constant cure rate, regardless of sectional thickness or degree of confinement; no post-cure required Potential Uses Potting of high-voltage transformers and sensors; assembly of substrates to heat sinks; gap fill material between heat sources and heat sinks Thermally Conductive Compounds Type Non-curing; thermally conductive silicone pastes Special Properties High thermal conductivity; low bleed; high-temperature stability Potential Uses Gap fill materials between heat sources and heat sinks Thermally Conductive Gels Type Two-part heat-cure gels Physical Form 1:1 mix ratio; low viscosity Special Properties Heat accelerable; wide operating temperatures; cure to lowmodulus materials Potential Uses Gap fill material; potting of electronic modules; base materials for thermally conductive gel sheet Materials for Pad Manufacturing Type Two-part heat-cure materials Special Properties Soft, good thermal conductivity, low viscosity Potential Uses Base material for thermally conductive pads

36 PRODUCT INFORMATION THERMALLY CONDUCTIVE ADHESIVES Dow Corning Brand Product Description Features Thermally s SE4420 Thermally SE4422 Thermally One-part moisture cure One-part moisture cure Flowable with moderate thermal conductivity; fast tack-free High viscosity with moderate thermal conductivity; UL 94 V-1 rating; fast tack-free SE4486 CV Thermally SE9184 CV Thermally SE4400 Thermally SE4402 CV Thermally SE4450 Thermally Thermally Thermally Q Thermally Thermally Q Thermally Conductive Encapsulant Thermally Conductive Elastomer Thermally Thermally Flowable; one-part moisture cure One-part; non-flow; moisture cure Two-part; semi-flowable One-part; gray; heat cure One-part; gray; heat cure One-part; low flow; gray One-part; low flow; gray Two-part; semi-flowable One-part; gray Two-part; gray; 1:1 Two-part; gray; 1:1; medium viscosity; heat cure Two-part; gray One-part; gray Flowable with good thermal conductivity and controlled volatility (D4-D10 < 0.002); fast tack-free Moderate thermal conductivity; UL 94 V-0 rating; controlled volatility (D4-D ); fast tack-free Long pot life; rapid heat cure; self-priming Moderate thermal conductivity; controlled volatility High thermal conductivity Rapid heat cure; high thermal conductivity Rapid heat cure; high thermal conductivity; contains 7-mil (178-micron) glass beads for bond line control Long pot life; rapid heat cure; self-priming Rapid heat cure and primerless adhesion to common substrates used in the electronics industry; contains 7-mil (178 micron) glass beads for bond line control Rapid heat cure; long pot life; excellent flow; self-priming; UL 94 V-1 rating Good flowability Low modulus; low viscosity; heat curable; UL94 V-0 rating Rapid heat cure and primerless adhesion to common substrates used in the electronics industry Thermally Two-part; gray; heat cure Low modulus; low viscosity; contains 7-mil (178 micron) glass beads for bond line control 2

37 Dow Corning Brand Product Potential Uses Application Methods Thermally s SE4420 Thermally SE4422 Thermally SE4486 CV Thermally SE9184 CV Thermally SE4400 Thermally SE4402 CV Thermally SE4450 Thermally Thermally Thermally Q Thermally Thermally Adhesive for power supply components, ink jet printer heads; bonding ICs with heat sinks Adhesive for power supply components, ink jet printer heads; bonding ICs with heat sinks; sealing gas hot water heater burners Adhesive for power supply components, ink jet printer heads; bonding ICs with heat sinks Bonding integrated circuit substrates; adhering lids and housings; heat sink attach Bonding hybrids or microprocessors to heat sinks Adhesive for power supply components, ink jet printer heads; bonding ICs with heat sinks Adhesive for power supply components, ink jet printer heads; bonding ICs with heat sinks Bonding integrated circuit substrates; adhering lids and housings; base plate attach; heat sink attach Bonding integrated circuit substrates; adhering lids and housings; base plate attach; heat sink attach Bonding hybrids or microprocessors to heat sinks Bonding heat sinks to electronics devices; bonding printed circuit boards to substrates Automated or manual dispensing Automated or manual dispensing Automated or manual dispensing Automated or manual dispensing Automated or manual dispensing Automated or manual dispensing Automated or manual dispensing Automated or manual dispensing Automated or manual dispensing Automated or manual dispensing Manual or automated dispensing Q Thermally Thermally Thermally Thermally Thermally Potting of high voltage transformers and sensors; assembly of hybrid substrates to heat sinks Bonding integrated circuit substrates; adhering lids and housings; base plate attach; heat sink attach Bonding heat sinks to electronics devices; bonding printed circuit boards to substrates Bonding hybrid circuit substrates, power semiconductor components and devices to heat sinks as well as for use in other bonding applications where flexibility and thermal conductivity are needed Bonding heat sinks to electronic devices; bonding printed circuit boards to substrates Automated or manual dispensing Automated, two-part airless mix equipment; manual mixing and de-airing Manual or automated meter-mix and dispensing Manual or automated dispensing Manual or automated meter-mix and dispensing 3

38 PRODUCT INFORMATION THERMALLY CONDUCTIVE MATERIALS Dow Corning Brand Product Description Features Thermally Conductive Encapsulants SE4410 Thermally Conductive Encapsulant SE4447 CV Thermally Conductive Encapsulant SE4448 CV Thermally Conductive Encapsulant Q Thermally Conductive Encapsulant Thermally Conductive Encapsulant Two-part; low viscosity Two-part; gray Two-part, thermally conductive elastomer Two-part; gray Two-part; gray Heat cure; moderate thermal conductivity; UL 94 V-0 rating Excellent thermal conductivity; low volatility; excellent high temperature stability and low temperature resistance Excellent thermal conductivity; low volatility (D4-D % wt); heat cure; high viscosity Rapid heat cure; long pot life; excellent flow; self-priming; UL 94 V-1 rating Low modulus; low viscoisty; good thermal conducitivity; UL 94 V-0 rating Thermally Conductive Encapsulant Two-part; gray Low modulus; thixotropic; good thermal conductivity Thermally Conductive Encapsulant Two-part; gray Low viscosity; soft; excellent thermal conductivity; UL 94 V-0 Thermally Conductive Compounds SC102 Thermally Conductive Compound Non-curing, thermally conductive silicone paste Moderate thermal conductivity; low bleed; stable at high temperatures 340 Heat Sink Compound Non-curing, thermally conductive silicone paste Low bleed; stable at high temperatures SE4490CV Thermally Conductive Compound TC-5021 Thermally Conductive Compound TC-5022 Thermally Conductive Compound Thermally Conductive Gels SE4440-LP Thermally Conductive Gel SE4445CV Thermally Conductive Gel SE4446CV Thermally Conductive Gel Non-curing, thermally conductive silicone paste Non-curing, thermally conductive silicone paste Non-curing, thermally conductive silicone paste Two-part; thermally conductive gel Two-part; thermally conductive gel Two-part; thermally conductive gel Thermally Conductive Materials for Pad Manufacturing High thermal conductivity; low bleed; stable at high temperatures; low volatility; low thermal-cycle-induced pump-out Low thermal resistance; high thermal conductivity Low thermal resistance; high thermal conductivity Heat cure; low viscosity Heat cure; moderate viscosity; UL 94 V-0 rating; controlled volatility (D4-D ) Heat cure; moderate viscosity; controlled volatility (D4- D ) SE4430 Two-part; thermally conductive elastomer Soft; good thermal conducitvity; low viscosity 4

39 Dow Corning Brand Product Potential Uses Application Methods Thermally Conductive Encapsulants SE4410 Thermally Conductive Encapsulant SE4447 CV Thermally Conductive Encapsulant SE4448 CV Thermally Conductive Encapsulant Q Thermally Conductive Encapsulant Thermally Conductive Encapsulant Thermally Conductive Encapsulant Thermally Conductive Encapsulant Thermally Conductive Compounds SC102 Thermally Conductive Compound Adhesive for power supply components, ink jet printer heads; bonding ICs with heat sinks Cured-in-place gap filling between heat-generating electronic components and the case or heat sink Excellent cured-in-place gap filling between heatgenerating electronic components and the case or heat sink Potting of high voltage transformers and sensors; assembly of hybrid substrates to heat sinks Potting or encapsulating power supplies, power convertors and similar electronic applications where heat dissipation is critical Gap filler where a soft, thermally conductive material is required; thixotropic property allows the user to dispense onto specific components without flow onto other components Potting or encapsulating power supplies, power convertors and similar electronic applications where heat dissipation is critical Gap fill material between electronic heat sources and heat sinks 340 Heat Sink Compound Thermal coupling of electrical/electronic devices to heat sinks SE4490CV Thermally Conductive Compound Gap fill material between electronic heat sources and heat sinks Automated or manual dispensing Automated meter-mix Automated meter-mix Automated or manual dispensing Manual or automated meter-mix Manual or automated meter-mix Manual or automated meter-mix Automated or manual dispensing Automated or manual dispensing Automated or manual dispensing TC-5021 Thermally Conductive Compound TC-5022 Thermally Conductive Compound Thermally Conductive Gels SE4440-LP Thermally Conductive Gel SE4445CV Thermally Conductive Gel SE4446CV Thermally Conductive Gel Thermal interface for CPUs, etc. Thermal interface for CPUs, etc. Thermally Conductive Materials for Pad Manufacturing Gap fill or potting material between electronic heat sources and heat sinks Gap fill or potting material between electronic heat sources and heat sinks Gap fill or potting material between electronic heat sources and heat sinks Screen print, stencil print or dispense Screen print, stencil print or dispense Automated or manual dispensing Automated or manual dispensing Automated or manual dispensing SE4430 Base material for thermally conductive pads Manual or automated meter-mix 5

40 TYPICAL PROPERTIES THERMALLY CONDUCTIVE ADHESIVES Specification Writers: Please contact your local Dow Corning sales office or your Global Dow Corning Connection before writing specifications on these products. Dow Corning Brand Product Product Form Color Viscosity/Flowability, centipoise or mpa*s Durometer (Shore scale) Specific Gravity Working Time 1 at RT Cure Time at RT, hr at 100 C (212 F) Heat Cure Time 2, minutes at 125 C (257 F) at 150 C (302 F) Unprimed Adhesion, Lap Shear psi N/cm 2 kgf/cm 2 Thermally s SE4420 Thermally SE4422 Thermally SE4486 CV Thermally SE9184 CV Thermally SE4400 Thermally SE4402 CV Thermally SE4450 Thermally Thermally Thermally Q Thermally Thermally Q Thermally Conductive Encapsulant Thermally Conductive Elastomer Thermally Thermally One-Part White 108, A 2.26 <10 min NA NA NA One-Part Gray 200, A 2.17 <10 min NA NA NA One-Part White 19, A 2.59 <4 min NA NA NA One-Part White Nonflow 72 A 2.22 NA 48 3 NA NA NA Two-Part Gray 76, A hr One-Part Gray 34, A 2.16 NA One-Part Gray 61, A 2.74 NA One-Part Gray 58, A 2.7 NA One-Part Gray 58, A 2.71 NA Two-Part Gray 50, A hr One-Part Gray 68, A 2.6 NA Two-Part Gray 4, A hr Two-Part Gray 47, A 2.14 >24 hr < Two-Part Gray 10, A hr NA One-Part Gray 81, A 2.6 NA NA Thermally Two-Part Gray 11, A hr NA Time to double initial mixed viscosity. 2 Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature. 3 Cure time for 3 mm thickness at 20 C (68 F) and 55 percent relative humidity. 4 Material will cure after 24+ hours at room temperature, but requires heat cure for chemical bonding adhesion. 6

41 Dow Corning Brand Product Thermal Conductivity at 25 C (77 F), Watt/meter-K Tensile Strength psi MPa kgf/cm 2 Elongation,% Compression Modulus at 10%, psi Linear CTE, micron/mc Dielectric Strength volts/mil kv/mm Dielectric Constant at 100 Hz Dielectric Constant at 100 khz Dielectric Constant at 1 MHz Dissipation Factor at 100 Hz Dissipation Factor at 100 khz Dissipation Factor at 1 MHz Volume Resistivity, ohm-cm Shelf Life from Date of Manufacture, months Thermally s SE4420 Thermally SE4422 Thermally SE4486 CV Thermally SE9184 CV Thermally SE4400 Thermally SE4402 CV Thermally SE4450 Thermally Thermally Thermally Q Thermally Thermally Q Thermally Conductive Encapsulant Thermally Conductive Elastomer Thermally Thermally Thermally E E E E E E , E < E E E < E E < E E < E E C 5 C 5 C 7

42 TYPICAL PROPERTIES THERMALLY CONDUCTIVE MATERIALS Specification Writers: Please contact your local Dow Corning sales office or your Global Dow Corning Connection before writing specifications on these products. Dow Corning Brand Product Product Form Color Viscosity/Flowability, centipoise or mpa*s Durometer (Shore scale) Penetration (1/10 of mm) Specific Gravity Working Time 1 at RT Cure Time at RT, hr at 100 C (212 F) Heat Cure Time 2, minutes at 125 C (257 F) at 150 C (302 F) psi Unprimed Adhesion, Lap Shear N/cm 2 kgf/cm 2 Thermal Conductivity at 25 C (77 F), Watt/meter-K Thermally Conductive Encapsulants SE4410 Thermally Conductive Encapsulant SE4447 CV Thermally Conductive Encapsulant Two-Part Gray 3, A NA hr Two-Part Gray 140, OO NA NA NA 2.5 SE4448 CV Thermally Conductive Encapsulant Two-Part Gray 102, OO hr C NA NA NA 2.2 Q Thermally Conductive Encapsulant Thermally Conductive Encapsulant Thermally Conductive Encapsulant Thermally Conductive Encapsulant Two-Part Gray 4, A NA hr NA NA NA 0.77 Two-Part Gray 32, OO NA min NA NA NA 1.1 Two-Part Gray 34, OO NA 2.7 >6 hr NA NA NA 1.9 Two-Part Gray 33, OO NA hr NA NA NA 1.8 Thermally Conductive Compounds SC102 Thermally Conductive Compound 340 Heat Sink Compound SE4490CV Thermally Conductive Compound TC-5021 Thermally Conductive Compound TC-5022 Thermally Conductive Compound One-Part White Nonflowing NA NA 2.37 NA NA NA NA NA NA NA NA 0.8 One-Part White Nonflowing NA NA 2.1 NA NA NA NA NA NA NA NA 0.59 One-Part White 500,000 NA NA 2.62 NA NA NA NA NA NA NA NA 1.7 One-Part Gray 102,000 NA NA 3.5 NA NA NA NA NA NA NA NA 3.3 One-Part Gray 91,000 3 NA NA 3.23 NA NA NA NA NA NA NA NA 4.0 Thermally Conductive Gels SE4440-LP Thermally Conductive Gel SE4445CV Thermally Conductive Gel SE4446CV Thermally Conductive Gel Two-Part Gray 3,600 NA hr C NA NA NA 0.83 Two-Part Gray 14,000 NA hr 45 NA NA NA 1.26 Two-Part Gray 22,000 NA hr Thermally Conductive Materials for Pad Manufacturing C NA NA NA 1.26 SE4430 Two-Part Gray 5, OO hr NA NA NA Time to double initial mixed viscosity. 2 Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature. 3 Measurement after dilution with 1 wt % Dow Corning OS-30 Fluid. 8

43 Dow Corning Brand Product Tensile Strength psi MPa kgf/cm 2 Elongation,% Compression Modulus at 10%, psi Linear CTE, micron/mc Dielectric Strength volts/mil kv/mm Dielectric Constant at 100 Hz Dielectric Constant at 100 khz Dielectric Constant at 1 MHz Dissipation Factor at 100 Hz Dissipation Factor at 100 khz Dissipation Factor at 1 MHz Volume Resistivity, ohm-cm Shelf Life from Date of Manufacture, months Thermally Conductive Encapsulants SE4410 Thermally Conductive Encapsulant SE4447 CV Thermally Conductive Encapsulant SE4448 CV Thermally Conductive Encapsulant Q Thermally Conductive Encapsulant Thermally Conductive Encapsulant Thermally Conductive Encapsulant Thermally Conductive Encapsulant E < E E E < E < E < E Thermally Conductive Compounds SC102 Thermally Conductive Compound 340 Heat Sink Compound SE4490CV Thermally Conductive Compound TC-5021 Thermally Conductive Compound NA NA NA NA E NA NA NA NA E NA NA NA NA E NA NA NA NA E TC-5022 Thermally Conductive Compound NA NA NA NA khz 1 khz 5.5E Thermally Conductive Gels SE4440-LP Thermally Conductive Gel SE4445CV Thermally Conductive Gel SE4446CV Thermally Conductive Gel NA NA NA NA E NA NA NA NA E+15 6 NA NA NA NA E+16 6 Thermally Conductive Materials for Pad Manufacturing SE E

44 THERMALLY CONDUCTIVE ADHESIVES Dow Corning offers a variety of noncorrosive, thermally conductive silicone adhesives that are ideally suited for use in bonding hybrid circuit substrates, power semiconductor components and devices to heat sinks as well as for use in other bonding applications where flexibility and thermal conductivity are major concerns. The flowable versions are also ideal for use as thermally conductive potting materials for transformers, power supplies, coils and other electronic devices that require improved thermal dissipation. The thermally conductive adhesives cure either with moisture or heat to produce durable, relatively low-stress elastomers. The one-part RTV-cure materials have a noncorrosive by-product and are available in a variety of viscosities. RTV-cure thermally conductive adhesives with controlled volatility and UL listings are available. The heat-cure, thermally conductive adhesives produce no by-products in the cure process, allowing their use in deep section and complete confinement. These adhesives will develop good, primerless adhesion to a variety of common substrates including metals, ceramics, epoxy laminate boards, reactive materials and filled plastics. Controlled volatility adhesives and UL-rated adhesives are available. THERMALLY CONDUCTIVE ENCAPSULANTS Dow Corning thermally conductive silicone encapsulants are supplied as two-part liquid component kits. When the liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, suitable for the protection of electrical/electronic applications where heat dissipation is critical. These elastomers cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. Dow Corning thermally conductive elastomers require no post-cure and can be placed in service immediately at operating temperatures of -45 to 200 C (-49 to 392 F) following the completion of the cure schedule. THERMALLY CONDUCTIVE COMPOUNDS Dow Corning thermally conductive compounds are greaselike silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. The compounds resist changes in consistency at temperatures up to 177 C (350 F), maintaining a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device. Refer to Table I for specific test results. THERMALLY CONDUCTIVE GELS Dow Corning silicone gels are soft and cure to form a cushioning, low-modulus, resilient, gelled material. Cured gels retain much of the stress relief capability while developing the dimensional stability of an elastomer. Dow Corning offers a line of thermally conductive gels that couple the stress-relieving capability of a silicone gel with the ability to dissipate heat from devices. These thermally conductive gels can be used as potting materials for transformers, power supplies, coils, relays and other electronic devices that require a low-modulus material for thermal dissipation. They can also be used as ingredients in formulations for thermally conductive gel sheets. These silicone gels cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. Dow Corning features thermally conductive gels that have controlled volatility, including one UL 94 V-0 approved product. Specific versions of thermally conductive gels contain glass beads designed to guarantee a minimum bond line, ensuring a reliable electrical insulation. Those materials find their use as liquid gap fillers and can favorably replace thermal pads. Table I. Thermally Conductive Compound Properties Dow Corning Product Test Test Method Result SC102 Thermally Oil Separation JIS K % Conductive Compound Consistency JIS K /mm 308 Volatile Content 24 hr/120 C 0.40% 340 Heat Sink Bleed after 24 hr/200 C Fed Std 791 Method % Compound Consistency ASTM D Evaporation after 24 hr/200 C Fed Std 791 Method % SE4490CV Thermally Oil Separation JIS K % Conductive Compound Consistency JIS K /mm 250 Volatile Content 24 hr/120 C 0.40% TC-5021 Thermally Volatile Content 24 hr/150 C <1% Conductive Compound Bleed 24 hr/150 C 0.15% TC-5022 Thermally Volatile Content 24 hr/150 C <0.05% Conductive Compound Thermal Resistance 0.02-mm Bond Line, 40 psi 0.06 C.cm 2 /W 10

45 Aratherm Advanced thermal conductive encapsulants Products and Properties Product Application Single component system XB 2720 (LMB 5667) XB 2721 (LMB 5665) Electro motors, generators, power modules, solenoids, power diodes... Key properties high thermal conductivity λ = 1.5 W/mK very low thermal expansion Colour of casting grey grey Single components (guideline values) 25 C Brookfield mpas 97, , C Brookfield mpas 24,000 35,000 Gel 90 C/110 C/120 C Gelnorm min 130 / 30 / / 30 / 15 Minimum curing time h/ C 1h/ 130 C 1h/ 130 C high thermal conductivity λ = 2.0 W/mK very low thermal expansion Properties of cured castings 1h/90 C + 1h/150 C 1h/90 C + 1h/150 (guideline values) Glass transition temperature ISO 6721/94 C Hardness DIN Shore D 90 D 91 Tensile strength ISO 527 MPa Elongation at break ISO 527 % Thermal expansion coefficient DIN ppm/k 23 (40 C C) 85 (115 C C) 20 (40 C C) 85 (115 C C) Thermal conductivity ISO 8894/90 W/mK C Flammability UL 94 Grade V-0 (internal test, not yet listed) V-0 (internal test, not yet listed) Dissipation factor tanδ IEC 250 % Hz/ 25 C Dielectric constant εr IEC 250 [-] Hz/ 25 C Specific volume 25 C IEC 93 Ωcm (1 kv) 6.4x10 14 (1 kv) 5.0x10 14 Product

46 Aratherm Advanced thermal conductive encapsulants Products and Properties Single component system XB 2730 (LMB 5668) XB 2731 (LMB 5672) Application Electro motors, generators, power modules, solenoids, power diodes... Key properties high thermal conductivity λ = 2.3 W/mK good thermal resistance very low thermal expansion room temperatur storage possible high thermal conductivity λ = 3.0 W/mK good thermal resistance very low thermal expansion room temperatur storage possible Colour of casting grey grey Single components (guideline values) 25 C Brookfield mpas 127, , C Brookfield mpas 40,000 84,000 Gel 90 C/110 C/120 C Gelnorm min 420 / 45 / / 85 / 30 Minimum curing time h/ C 1h/ 220 C 1h/ 220 C Properties of cured castings 1h/120 C + 1h/200 C 1h/120 C + 1h/200 C (guideline values) Glass transition temperature ISO 6721/94 C Hardness DIN Shore D 90 D 92 Tensile strength ISO 527 MPa Elongation at break ISO 527 % Thermal expansion coefficient DIN ppm/k 25 (40 C C) 38 (160 C C) 21 (40 C C) 50 (160 C C) Thermal conductivity ISO 8894/90 W/mK C Flammability UL 94 Grade V-0 (internal test, not listed) V-0 (internal test, not listed) Dissipation factor tanδ IEC 250 % Hz/ 25 C Dielectric constant εr IEC 250 [-] Hz/ 25 C Specific volume 25 C IEC 93 Ωcm (1 kv) 3.6x10 14 (100 V) 4.7x10 14 Product Resin CW 1312 GB XB 2710 (LMB 5669) XB 2710 (LMB 5669) Hardener HY 1300 HY 1300 XB 2711 (LMB 5670)

47 Aratherm Advanced thermal conductive encapsulants Products and Properties Application Electro motors, generators, power modules, solenoids, power diodes... Key properties high thermal conductivity λ = 1.0 W/mK) room temperature curing possible high thermal conductivity λ = 1.3 W/mK room temperature curing possible high thermal conductivity λ = 1.5 W/mK mix ratio: 1 : 1 by volume Colour of casting beige grey grey Single components and mixture (guideline values) Mix ratio Resin / Hardener pbw 100/9 100/8 100/ C Resin mpas 32,500 45,000 15,000 (60 C) Hardener mpas ,000 Mixture mpas 14,500 25,000 5,000 (60 C) Gel 25 C/40 C/60 C Gelnorm min 180 / 95 / / 50 / / 15 / 5 (90,110 u.120 C) Minimum curing time h/ C 48h/RT or 4h 60 C 48h/RT or 4h/60 C Properties of cured castings 4h/40 C + 2h/60 C 4h/40 C + 2h/60 C 1.5/90 C + 1h/150 C (guideline values) Glass transition temperature ISO 6721/94 C Hardness DIN Shore D 58 D 89 D 92 Tensile strength ISO 527 MPa Elongation at break ISO 527 % > Thermal expansion DIN ppm/k 103 (23 C - 82 C) - - coefficient Thermal 25 C ISO 8894/90 W/mK Flammability UL 94 Grade V-0 3,2 mm V-0 (internal test, not yet listed) V-0 (internal test, not yet listed) Dissipation factor tanδ IEC 250 % Hz/ 25 C Dielectric constant 50 Hz/ 25 C IEC 250 [-] Specific volume 25 C IEC 93 Ωcm (100 V) 2.6x10 11 (100 V) 5.8x10 14 (100 V) 2.3x10 15 Ciba Specialty Chemicals Inc. Performance Polymers Trademark APPROVED TO ISO 9000 ff All recommendations for use of our products, whether given by us in writing, verbally, or to be implied from results of tests carried out by us are based on the current state of our knowledge. Notwithstanding any such recommendations the Buyer shall remain responsible for satisfying himself that the products as supplied by us are suitable for his intended process or purpose. Since we cannot control the application, use or processing of the products, we cannot accept responsibility therefore. The Buyer shall ensure that the intended use of the products will not infringe any third party s intellectual property rights. We warrant that our products are free from defects in accordance with and subject to our general conditions of supply.

48 MAXIGLOW 501T Conductive Ag Epoxy MAXIGLOW Ag EPOX- IES SunRay Scientific offers high performance silver epoxies for structural attachment of surface mount devices on a variety of substrates such as polyester, PCBs, PWBs and lead frames. PROVEN RELIABILITY Our epoxies are RoHS compliant and have been used in flex circuits in appliances and telecom for over 15 years without any failures in the field. CUSTOM SOLUTIONS We work closely with customers to tailor the viscosity and resistivity to their requirements. DS-SRS501T REV1 PRODUCT DESCRIPTION MAXIGLOW TM 501T is a RoHS compliant, two-part, silver based conductive epoxy developed for electrical, thermal and mechanical attachment of surface mount devices to flexible substrates. MAXIGLOW TM 501T forms a strong bond with polyester and thermoplastic substrates, surface mount electronic devices, and printed circuit boards. MAXIGLOW TM 501T provides process flexibility, and is resistant to harsh environmental attacks. MAXIGLOW TM 501T is optimized for flexible circuit component assembly using MAXI- GLOW TM DS-1 and other SunRay silver conductor inks. KEY BENEFITS Rapid cure at low temperatures Long shelf life High die shear strength Resistant to Ag migration Outstanding corrosion resistance Low outgassing Excellent ductility for component attach to flex circuits RECOMMENDED PROCESSING Substrates: Polyester, thermoplastic substrates, ceramic substrates and packages, printed circuit substrates, printed wiring boards, lead frames Substrate cleaning: Rinse contaminated substrates with isopropanol before screening Epoxy application: Screen printing 1, stenciling 2 Mixing: Supplied as two components which must be mixed before application. The typical ratio is 4% of catalyst to 96% of conductive epoxy, by weight Typical box oven cure conditions: 45 min at 75 C, OR 30 min at 100 C, OR 20 min at 150 C Dilution & cleanup solvent: Dibasic ester-1 Screen printing: 325 WPI Stainless Steel Mesh, 1.5 mil dia wire, 0..5 mil emulsion Stenciling: 4 mil thick TYPICAL PROPERTIES OF UNCURED EPOXY PROPERTY Viscosity at RT (Brookfield RV #6, 10 rpm) Solids, Percent Filler Binder Appearance Density Shelf life Pot life Uncatalyzed condition SPECIFICATION >60,000 cp 90% Silver flake Catalyzed epoxy Dark silver 1.77 g/cc 6 months at 22 C hrs dependent on mass TYPICAL PROPERTIES OF CURED EPOXY PROPERTY SPECIFICATION Glass transition temperature (T g ) Coefficient of thermal expansion (CTE) below T g 50 C 67 ppm/ C Shrinkage < 4.4% Thermal conductivity Die shear strength Volume resistivity Elastic modulus (ISO 527-2) > 5 W/mK Meets MIL STD 883 Method 2006 < 0.3 m cm 3600 N/mm 2 Adhesion (DIN 1465) > 8.5 N/mm 2 Operating temperature Max. 180 C

49 MAXIGLOW 501S Conductive Ag Epoxy MAXIGLOW Ag EPOX- IES SunRay Scientific offers high performance silver epoxies for structural attachment of surface mount devices on a variety of substrates such as polyester, PCBs, PWBs and lead frames. PROVEN RELIABILITY Our epoxies are RoHS compliant and have been used in flex circuits in appliances and telecom for over 15 years without any failures in the field. CUSTOM SOLUTIONS We work closely with customers to tailor the viscosity and resistivity to their requirements. PRODUCT DESCRIPTION MAXIGLOW TM 501S is a RoHS compliant, one-part, silver based conductive epoxy developed for electrical, thermal and mechanical attachment of surface mount devices to flexible substrates. MAXIGLOW TM 501S forms a strong bond with polyester and thermoplastic substrates, surface mount electronic devices, and printed circuit boards. MAXIGLOW TM 501S provides process flexibility, and is resistant to harsh environmental attacks. MAXIGLOW TM 501S is optimized for flexible circuit component assembly using MAXI- GLOW TM DS-1 and other SunRay silver conductor inks. KEY BENEFITS Rapid cure at low temperatures Long shelf life High die shear strength Resistant to Ag migration Outstanding corrosion resistance Low outgassing Excellent ductility for component attach to flex circuits RECOMMENDED PROCESSING Substrates: Polyester, thermoplastic substrates, ceramic substrates and packages, printed circuit substrates, printed wiring boards, lead frames Substrate cleaning: Rinse contaminated substrates with isopropanol before screening Epoxy application: Syringe dispensing 1 Typical box oven cure conditions: 45 min at 75 C, OR 30 min at 100 C, OR 20 min at 150 C Dilution & cleanup solvent: Dibasic ester-1 supplied by DuPont TYPICAL PROPERTIES OF UNCURED EPOXY PROPERTY Viscosity at RT (Brookfield RV #6, 10 rpm) Solids, Percent Filler Binder Appearance Density Shelf life Pot life Uncatalyzed condition SPECIFICATION >60,000 cp 90% Silver flake Catalyzed epoxy Dark silver 1.77 g/cc 6 months at 22 C hrs dependent on mass TYPICAL PROPERTIES OF CURED EPOXY PROPERTY SPECIFICATION Glass transition temperature (T g ) Coefficient of thermal expansion (CTE) below T g 50 C 67 ppm/ C Shrinkage < 4.4% Thermal conductivity Die shear strength Volume resistivity Elastic modulus (ISO 527-2) > 5 W/mK Meets MIL STD 883 Method 2006 < 0.3 mω cm 3600 N/mm 2 Adhesion (DIN 1465) > 8.5 N/mm 2 Operating temperature Max. 180 C DS-SRS501S REV- Syringe dispensing: 0.024" dia needle (20 gauge)

50 MAXIGLOW 502T Conductive Ag Epoxy MAXIGLOW Ag EPOX- IES SunRay Scientific offers high performance silver epoxies for structural attachment of surface mount devices on a variety of substrates such as polyester, PCBs, PWBs and lead frames. PROVEN RELIABILITY Our epoxies are RoHS compliant and have been used in appliances and telecom for over 15 years without any failures in the field. CUSTOM SOLUTIONS We work closely with customers to tailor the viscosity and resistivity to their requirements. PRODUCT DESCRIPTION MAXIGLOW TM 502T is a RoHS compliant, two-part, silver based conductive epoxy developed for electrical, thermal and mechanical attachment of semiconductor die and other substrates to leadframes, printed wiring boards and ceramics. MAXIGLOW TM 502T provides process flexibility, and is resistant to harsh environments. KEY BENEFITS Extremely low ionic impurity levels Rapid cure at low temperatures Long shelf life High die shear strength Resistant to Ag migration Outstanding corrosion resistance Low outgassing RECOMMENDED PROCESSING Substrates: Ceramic substrates and packages, printed circuit substrates, printed wiring boards, lead frames Substrate cleaning: Rinse contaminated substrates with isopropanol before screening Mixing: 502T epoxy is supplied as two components which must be adequately mixed before application. The typical ratio is 4.0% of catalyst to 96% of conductive epoxy, by weight. Hand stirring is typically sufficient but a small hand stirrer might eliminate human mixing error Epoxy application: Screen printing 1, stenciling 2 Typical box oven cure conditions: 45 min at 75 C, OR 30 min at 100 C, OR 20 min at 150 C Dilution & cleanup solvent: Dibasic ester-1 supplied by DuPont Screen printing: 325 WPI Stainless Steel Mesh, 1.5 mil dia wire, 0..5 mil emulsion Stenciling: 4 mil thick TYPICAL PROPERTIES OF UNCURED EPOXY PROPERTY Viscosity at RT (Brookfield RV #6, 10 rpm) Solids, Percent Filler Binder Appearance Density Shelf life Pot life Uncatalyzed condition SPECIFICATION >60,000 cp 90% Silver flake Catalyzed epoxy Dark silver 1.77 g/cc 6 months at 22 C hrs dependent on mass TYPICAL PROPERTIES OF CURED EPOXY PROPERTY SPECIFICATION Glass transition temperature (T g ) Coefficient of thermal expansion (CTE) below T g 50 C 67 ppm/ C Shrinkage < 4.4% Thermal conductivity Die shear strength Volume resistivity Elastic modulus (ISO 527-2) Operating temperature Ionic content (ppm) Cl - Na + K + > 5 W/mK Meets MIL STD 883 Method 2006 < 0.3 mω cm 3600 N/mm 2 Adhesion (DIN 1465) > 8.5 N/mm 2 Max. 180 C < 20 DS-SRS502T REV1

51 MAXIGLOW 502S Conductive Ag Epoxy PRODUCT DESCRIPTION MAXIGLOW TM 502S is a RoHS compliant, one-part, TYPICAL PROPERTIES OF UNCURED EPOXY MAXIGLOW Ag EPOX- IES SunRay Scientific offers high performance silver epoxies for structural attachment of surface mount devices on a silver based conductive epoxy developed for electrical, thermal and mechanical attachment of semiconductor dies and other substrates to leadframes, printed wiring boards and ceramics. MAXIGLOW TM 502S provides process flexibility, and is resistant to harsh environments. PROPERTY Viscosity at RT (Brookfield RV #6, 10 rpm) Solids, Percent Filler Binder SPECIFICATION >60,000 cp 90% Silver flake Catalyzed epoxy variety of substrates such as polyester, PCBs, PWBs and lead frames. PROVEN RELIABILITY Our epoxies are RoHS compliant and have been used in appliances and telecom for over 15 years without any failures in the field. CUSTOM SOLUTIONS We work closely with customers to tailor the viscosity and resistivity to their requirements. KEY BENEFITS Extremely low ionic impurity levels Rapid cure at low temperatures Long shelf life High die shear strength Resistant to Ag migration Outstanding corrosion resistance Low outgassing RECOMMENDED PROCESSING Substrates: Ceramic substrates and packages, printed circuit substrates, printed wiring boards, lead frames Substrate cleaning: Rinse contaminated substrates with isopropanol before screening Epoxy application: Syringe dispensing 1 Typical box oven cure conditions: 45 min at 75 C, OR 30 min at 100 C, OR 20 min at 150 C Dilution & cleanup solvent: Dibasic ester-1 supplied by DuPont Appearance Dark silver Density 1.77 g/cc Shelf life 6 months at 22 C 1 Pot life 4-6 hrs dependent on mass Uncatalyzed condition TYPICAL PROPERTIES OF CURED EPOXY PROPERTY SPECIFICATION Glass transition temperature (T g ) 50 C Coefficient of thermal expansion (CTE) below T g 67 ppm/ C Shrinkage < 4.4% Thermal conductivity > 5 W/mK Die shear strength Meets MIL STD 883 Method 2006 Syringe dispensing: 0.024" dia needle (20 gauge) Volume resistivity Elastic modulus (ISO 527-2) < 0.3 mω cm 3600 N/mm 2 Adhesion (DIN 1465) > 8.5 N/mm 2 Operating temperature Ionic content (ppm) Cl - Na + K + Max. 180 C < 20 DS-SRS502S REV-

52 MAXIGLOW 502S Conductive Ag Epoxy CLICK TO: VISIT OUR WEBSITE US STORAGE AND DISPOSAL Unopened containers of silver filled epoxy can be stored for up to 6 months at 40 F and for up to 10 months at 0 F. Catalyzed epoxy should be used within 6 hours (pot life). The viscosity of blended material will vary during the pot life period. Unopened containers of catalyst can be stored for up to 6 months at 70 F. Dispose of properly. Generally as a solid it can be reclaimed as a highly silver filled material and sold to a reclaiming organization. Often all associated debris from the operation can be sold to a reclaiming organization for the silver content. We will be happy to assist in developing a cost effective mechanism for any customer requiring support. SAFETY AND HANDLING Use with adequate ventilation. This product contains organic solvents as well as silver flakes Avoid skin contact Avoid eye contact with catalyst to prevent eye damage If skin contact occurs wash immediately with soap and water Avoid breathing the vapor Refer to MSDS for more details For more information on any of our products or services contact us. New Jersey: SunRay Scientific 100 Technology Way, Mt. Laurel, NJ Tel: Fax: Indiana: SunRay Scientific 296 Gradle Drive Carmel, IN Tel: Fax: THIS TECHNICAL INFORMATION IS BASED ON DATA BELIEVED TO BE RELIABLE. HOW- EVER, NO WARRANTY IS EXPRESSED OR IMPLIED WITH RESPECT TO ACCURACY OF RESULTS AND SUNRAY SCIENTIFIC ASSUMES NO LIABILITY ARISING OUT OF ITS USE. USERS SHOULD CONDUCT THEIR OWN TESTS TO DETERMINE THE SUITABILITY OF THIS PRODUCT FOR THEIR APPLICATION. DS-SRS502S REV-

53 s - Comparison table 1 of 1 7/23/ :01 AM Printable Version (PDF 38KB) Prod. No. Description Form , Graphite Aerosol 283.5G PELCO Conductive Graphite, 50g PELCO Conductive Graphite, 30g Electrodag 502, 30g Leit-C-Plast 15g PELCO Gold Paste, 2g PELCO Colloidal Silver, 30g or 15g PELCO Colloidal Silver Paste, 25g Leitsilber 200, Silver Paint, 30g PELCO Conductive Silver 187, 30g PELCO High Performance Silver Paste, 50g Fast Drying Silver Suspension, 30g Silver Conductive Epoxy H20E, 1 oz. Silver Conductive Epoxy H22, 1 oz. Silver Conductive Epoxy, 14g Home Page Abbreviated Contents Customer Login Quick Order / View Order Contact Us Search Indexes Finish Order Service Temp. s Comparison Table Conductive Cure Media Temp. (%) aerosol 200 C graphite paint 140 C paint paint binder 93 C service 204 C -40 C to 260 C graphite 22% graphite 20% carbon 12.6% putty 120 C carbon paste -200 C to 65 C gold 75% Binder thermo-plastic resin Carrier Application Solvent Mechanical Strength Sheet (ohms/sq) Use In RoHs Compliant Mounting EDX/ EMI/RF High EDS Shield Cleaving Vacuum isopropanol medium 1200 X X X gel water low 30 X X X X cellulose resin Isopropanol low 1200 X X X X flouroelastomer resin proprietary putty lacquer paint 200 C silver 60% lacquer paint 200 C silver 60% lacquer paint 120 C silver 45% cellulose nitride lacquer MEK medium 130 X X X X ethanol medium X X X X Gold/Silver Extender Gold/Silver Extender Gold/Silver Extender ethoxy propanol or Extender low X X medium X X medium X X low X X X paint 100 C silver 50% acrylic resin acetone high.015 X X paste cryogenic to 927 C 93 C 2hr silver 60% inorganic silicate paint 105 C silver 58% thermoplastic resin 1:1 epoxy 100:4.5 epoxy 1:1 epoxy 200 C continuous, 400 C max 200 C continuous, C max -91 C to 100 C 80 C to 175 C 80 C to 175 C 25 C to 121 C silver 76% silver 60% silver epoxy low viscosity 2000cps epoxy high viscosity 20000cps epoxy Thermoconductivity BTU-in/ft2- hr-f water medium 0.08 X X Silver Suspension Diluent permanent bond permanent bond permanent bond medium.015 X X high.16 X X X X 13.9 high 2 X X X X 6.53 high 0.4 X X 11 Privacy Policy Website Questions Copyright Ted Pella, Inc., All rights reserved. All trademarks are the property of their respective owners. Page Last Updated: November 18, 2009

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56 EPO-TEK H20E Technical Data Sheet For Reference Only Electrically Conductive, Silver Epoxy Number of Components: Two Frozen Syringe Minimum Bond Line Cure Schedule*: Mix Ratio By Weight: 1:1 175 C 45 Seconds Specific Gravity: C 5 Minutes Part A C 15 Minutes Part B ºC 2 Hours Pot Life: 2.5 Days 80 C 3 Hours Shelf Life: One year at 23 C One year at -40 C Note: Container(s) should be kept closed when not in use. For filled systems, mix contents of each container (A & B) thoroughly before mixing the two together. *Please see Applications Note available on our website. Product Description: EPO-TEK H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is still the conductive adhesive of choice for new applications. Also available in a single component frozen syringe. EPO-TEK H20E Advantages & Application Notes: Processing info: It can be applied by many dispensing, stamping and screen printing techniques. o Dispensing: compatible with pressure/time delivery, auger screws, fluid jetting and G27 needles, in a single-component fashion. o Screen Printing: best using >200 metal mesh, with polymer squeegee blade with 80D hardness. o Stamping: small dots 6 mil in diameter can be realized. Misc / Other notes o Many technical papers written over year lifetime. Contact techserv@epotek.com. o Over 1 trillion chips attached at a single company: no failures, Six Sigma and Certified Parts Supplier award winner. o Versatility in curing techniques including box oven, SMT style tunnel oven, heater gun, hot plate, IR, convection, or inductor coil. o Many custom modified products available, for the following improvements: viscosity and appearance, flexibility and thermal conductivity. Contact techserv@epotek.com for your best recommendation. Typical Properties: (To be used as a guide only, not as a specification. Data below is not guaranteed. Different batches, conditions and applications yield differing results; Cure condition: 150 C/1 hour; *denotes test on lot acceptance basis) Physical Properties: *Color: Part A: Silver Part B: Silver Weight Loss: *Consistency: Smooth, thixotropic 200 C: 0.59% *Viscosity (@ 100 RPM/23 C): 2,200 3, C: 1.09% Thixotropic Index: 300 C: 1.67% *Glass Transition Temp.(Tg): 80 C (Dynamic Cure Operating Temp: C /ISO 25 Min; Ramp C/Min) Continuous: -55 C to 200 C Coefficient of Thermal Expansion (CTE): Intermittent: -55 C to 300 C Below Tg: 31 x 10-6 in/in/ C Storage 23 C: 808,700 psi Above Tg: 158 x 10-6 in/in/ C Ions: Cl - 73 ppm Shore D Hardness: 75 Na + 2 ppm + Lap Shear 23 C: 1,475 psi NH 4 98 ppm Die Shear 23 C: > 5 Kg / 1,700 psi K + 3 ppm Degradation Temp. (TGA): 425 C *Particle Size: 45 Microns Electrical Properties: *Volume 23 C: Ohm-cm Thermal Properties: Thermal Conductivity: 2.5 W/mK Thermal Resistance: (Junction to Case) Thermal Conductivity: 29 W/mK Based on Thermal Resistance Data: R = L x K -1 x A -1 TO-18 package with nickel-gold metallized 20 x 20 mil chips and bonded with EPO-TEK H20E (2 mils thick) EPO-TEK H20E: 6.7 to 7.0 C/W Solder: 4.0 to 5.0 C/W EPOXY TECHNOLOGY, INC. 14 Fortune Drive, Billerica, MA Phone: Fax: Rev. XI Feb 2010 Epoxies and Adhesives for Demanding Applications This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as to its accuracy and assumes no liability in connection with any use of this product.

57 EPO-TEK H20E Suggested Applications o o o o o Semiconductor IC Packaging Die-attaching chips to leadframes; compatible with Si and MEM s chips, 260ºC lead-free reflow and JEDEC Level I packaging requirements. Capable of being snap cured in-line, as well as traditional box oven techniques. Adhesive for solderless flip chip packaging and ultra fine pitch SMD printing. Hybrid Micro-electronics A comparable alternative to solder and eutectic die attach, in terms of thermal peformance; very commonly no more than 1-2ºC/watt difference in thermal resistance. Die-attaching of quartz crystal oscillators (QCO) to the Au posts of TO-can style lead-frame. Used with GaAs chips for microwave/radar applications up to 77GHz. SMD attach adhesive which can be cured simultaneously with die-attach processes. o Compatible with Au, Ag, Ag-Pd terminations of capacitors and resistor SMDs. NASA approved low outgassing adhesive. Adhesive for EMI and Rf shielding of Rf, microwave and IR devices. Electronic & PCB Circuit Assembly Used to make electrical contacts in acoustical applications of speakers/microphones. Electrical connection of piezo s to PCB. Pads of PZT are connected to many kinds of circuits using H20E, including ink jet heads, MEMs and ultrasound devices. Automotive applications include pressure sensing and accelerometer circuits. Electrically conductive adhesive (ECA) for connections of circuits to Cu coils in Rf antenna applications such as smart cards and RFID tags. ECA for attaching SMDs to membrane switch flex circuits. Compatible with Ag-PTF and carbon graphite PCB pads. A low temperature solder free solution. Solar-Photovoltaic industry o ECA for the electrical connection of transparent conductive oxide (TCO) to PCB pads. o Replacement of solder joints of Cu/Sn ribbon wire, from cell-to-cell; a common solar cell stringing adhesive. o Die-attach of III-V semiconductor chips to substrates used in solar concentrator technology, such as CdTe and GaAs. o An effective heat-sink on thermal substrates using Cu, BeO, aluminum nitride, etc. o Ability to be dispensed in high volumes via dots, arrays, and writing methods. Medical Applications USP Class VI adhesive for circuits requiring implantation/biocompatibility. Die-attaching photo diode arrays in X-ray circuits. Vibration resistant adhesive for ultrasound applications < 20 MHz frequency; making the electrical connection of PZT to Au/PCB substrate. Electrical connections of die, SMDs and QCO for pacemaker hybrid circuits. A common ECA for hearing aid applications using hybrid, ECM or MEMs technology. Opto-Electronic Packaging Applications Adhesive for fiber optic components using DIP, Butterfly or custom hybrid IC packages. As an ECA, it attaches waveguides, die bonds laser diodes and heat sinks the high power laser circuits. Die-attaching IR-detector chips onto PCBs or TO-can style headers. Die-attaching LED chips to substrates using single chip packages, or arrays. o Adhesion to Ag, Au and Cu plated leadframes and PCBs. Electrical connection of ITO to PCBs found in LCD industry. o A low temp ECA for OLED displays and organically printable electronics. Rev X 01/2009 EPOXY TECHNOLOGY, INC. 14 Fortune Drive, Billerica, MA Phone: Fax: Epoxies and Adhesives for Demanding Applications

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60 Contents Semiconductor Market Solutions Discrete Components... 5 Quad Flat Pack (QFP) Quad Flat No-Lead (QFN) Dynamic Random Access Memory (DRAM) Ball Grid Array/Chip Scale Package (BGA/CSP) Flash Memory Semiconductor Materials Die Attach Adhesives Semiconductor Underfills Hysol Semiconductor Encapsulants Hysol Thermal Compression Materials Hysol Coating Powders Hysol Electronic Molding Compounds Hysol and Hysol Huawei Semiconductor Molding Compounds Multicore Accurus Solder Spheres Periodic Table of Elements... 48

61 Material Solutions for Electronic Packaging and Assembly Semiconductor Materials Die Attach Adhesives Semiconductor Underfills Semiconductor Encapsulants Thermal Compression Materials Coating Powders Electronic Molding Compounds Semiconductor Molding Compounds Solder and Flux Materials 2

62 PCB Assembly Materials Flat Panel Display Materials Solder and Flux Materials Chip on Board Encapsulant Materials Board Level Underfills Thermal Management Materials Electrically s Surface Mount Adhesives Circuit Board Protection Solutions Adhesives Cleaners, Developers and Strippers Please see LT-5012 for PCB Assembly Solutions Guide Please see LT-5014 for Flat Panel Display Solutions Guide 3

63 Semiconductor Market Solutions Across the Board, Around the Globe. 4

64 Semiconductor Market Solutions Discrete components Discrete Components Die Attach Adhesives Electronic Molding Compounds Encapsulants Molding Compounds Conductive Non-Conductive GR2220 FP0087 Green Non-Green DA100 (Solder) QMI536HT GR2310 GR15F-A KL1000-3LX QMI529HT QMI547 GR2710 GR15F-1 KL1000-4T 2600AT GR2811 GR360A-F8 KL5000-HT 8008HT (WBC) MG40FS GR750 MG15F FS849-TI GR750-SC GR750HT-25 KLG100 KLG200 die attach Adhesives: CONDUCTIVE Product QMI529HT Description For component or die attach where very high electrical and thermal conductivity is required. Suitable for high heat dissipation devices and solder replacement applications. Finish (Cu, Ag, Au) MRT Electrical Conductivity Dispensability Ag, Au L x 10-5 Fair Cure Schedule C (SkipCure ) C (Oven) Thermal Conductivity, W/mK AT High thermal conductivity adhesive for thermal management applications. Cu, Ag, Au L x 10-5 Fair 30 min ramp to 200 C C HT (WBC) High electrical and thermal conductivity die attach. Excellent temperature resistance. Ag, Cu, Au L x 10-5 NA B-stage C 11 FS849-TI High thermal conductivity adhesive with low electrical resistance. Ag, Au L x 10-5 Good 15 min ramp to 175 C C 7.8 5

65 Tra-Con Tra-Bond 2153 Thermally Conductive Electrically Insulating... Advertise with MatWeb! Data sheets for over 79,000 metals, plastics, ceramics, and composites. HOME SEARCH TOOLS SUPPLIERS FOLDERS ABOUT US FAQ LOG IN Searches: Advanced Category Property Metals Trade Name Manufacturer Recently Viewed Materials Tra-Con Tra-Bond 2153 Thermally Conductive Electrically Insulating Compound Categories: Polymer; Adhesive; Thermoset; Epoxy Material Notes: TRA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. This two-part adhesive develops strong, durable, high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. TRA-BOND 2153 bonds readily to itself, and to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics and many other materials, because its coefficient of thermal expansion provides a good match for those materials over a farily wide temperature range. Fully cured TRA-BOND 2153 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils, and alcohol. Information provided by Tra-Con Inc. Vendors: Click here to view all available suppliers for this material. Please click here if you are a supplier and would like information on how to add your listing to this material. Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder: 0/0 Physical Properties Metric English Comments Specific Gravity 2.45 g/cc 2.45 g/cc Mixed Solids Content 100 % 100 % Reactive Solids Content Mechanical Properties Metric English Comments Hardness, Shore D Electrical Properties Metric English Comments Volume Resistivity 5.50e+15 ohm-cm 5.50e+15 ohm-cm 4.00e C Dielectric Constant 1000 Hz 4.00e F 1000 Hz Dielectric Strength 16.1 kv/mm 410 kv/in Dissipation Factor 1000 Hz 1000 Hz Thermal Properties Metric English Comments CTE, linear 18.0 µm/m C 10.0 µin/in F Thermal Conductivity 1.00 W/m-K 6.94 BTU-in/hr-ft²- F Maximum Service Temperature, 125 C 257 F Air Minimum Service Temperature, C F Air Glass Transition Temp, Tg 110 C 230 F Ultimate Tg Processing Properties Metric English Comments Cure Time min hour At 65 C 1440 min 24.0 hour At 25 C Pot Life 30.0 min 30.0 min Descriptive Properties 1 of 2 7/23/ :16 AM

66 Tra-Con Tra-Bond 2153 Thermally Conductive Electrically Insulating of 2 7/23/ :16 AM Color Dark Gray Mix Ratio, parts by weight 100/7 Resin/Hardener Outgassing, NASA Passes Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's disclaimer and terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb. Users viewing this material also viewed the following: Tra-Con Tra-Bond 2151 Thermally Conductive Electrically Insulating Compound Tra-Con Tra-Bond 2152 Thermally Conductive Electrically Insulating Compound Tra-Con Tra-Bond 2154 Thermally Conductive Electrically Insulating Compound Tra-Con Tra-Bond 2156 Heat Conductive Electrically Insulating Compound Tra-Con Tra-Bond 2155 Thermally Conductive Electrically Insulating Compound PTRAC035 / Subscribe to Premium Services Searches: Advanced Composition Property Material Type Manufacturer Trade Name UNS Number Other Links: Advertising Submit Data Database Licensing Web Design & Hosting Trade Publications Supplier List Unit Converter Reference News Links Help Contact Us Site Map FAQ Home Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at webmaster@matweb.com. We appreciate your input. The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright by Automation Creations, Inc. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from Automation Creations, Inc.

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