Survey Tool for Substances to Be Eliminated From Products

Transcription

1 English Version Survey Tool for Substances to Be Eliminated From Products Version 2.1 Established :November 15, 2003 Revised: October 1, 2016 Enacted: October 1, 2016 CS/Quality Assurance and Environment Department

2 Contents 1. Purpose 2. Scope 3. Content Elimination Standard 3. Procedure for Responding to Survey 4. Filling Out the Survey Response Tool 5. Additional clauses Attachment 1: Sample Parts Broken Down Into Their Elements Attachment 2:Important points for responding to Survey on Controlled Chemical Substances / Survey on Substance to Be Eliminated from Products Attachment 3: Measurement Guidelines for Substances Subject to Elimination 2

3 1. Purpose This survey tool is designed to provide Epson with an in-depth understanding regarding the use in products of chemical substances that the Epson Group ( Epson ) has decided to eliminate. Please answer the items in the survey that are needed for our elimination program. 2. Scope This survey tool covers only those production materials that Epson is scheduled to eliminate from its products and for which Epson needs information. ("Production material" herein refers collectively to any part, component, or raw materials that goes into any product of Epson, including packaging materials and OEM products.) * Packaging material used for transport and storage purposes falls outside the scope. * For production materials using lead whether for attaching components to substrates, for example, or for lead terminal plating, we ask that you fill out the separate "Lead-Free Solder Data Survey for Buy-Parts. Basic approach to Epson's production material survey Category Survey of controlled substances in products (Based on Epson Group Survey of substances subject to elimination in products Survey of lead-free solder data for buy-parts Green Purchasing Standard for Product Materials) Epson Group All production materials Production materials subject to elimination Production materials using solder Materials other than solder Not subject to elimination 3

4 3. Elimination Standards Definition of terms relating to elimination level Level 1: Immediate ban Level 2: Phase-out Presently, applications exempted from the RoHS Directive are being reviewed. The dates provided in the "Effective date of the prohibition" column in the tables on pages 4-7 are the dates that Epson has independently set as the final dates for accepting goods containing substances that are being phased out. Exempted applications and effective dates of the prohibition may change, depending on the results of reviews of applications exempted from the RoHS Directive. Substance Group to be Eliminated Cadmium and its compounds Elimination Level Level 1 Exempted applications Coverage Production materials used for products to which EU RoHS directive (2011/65/EU) applies Threshold Effective date of the prohibition 100 ppm Immediate Cd-99 Batteries - Substance Group to be Eliminated Hexavalent chromium compounds Elimination Level Coverage Production materials used for products to which Level 1 EU RoHS Directive (2011/65/EU) applies Exempted applications None Threshold Effective date of the prohibition 1000 ppm Immediate 4

5 Substance Group to be Eliminated Mercury and its compounds Elimination Level Level 1 Exempted applications Coverage Production materials used for products to which EU RoHS Directive (2011/65/EU) applies Hg-1 Hg-3 Threshold Mercury in single capped (compact) fluorescent lamps EU RoHS Exempted application No.: 1 Mercury in single capped (compact) fluorescent lamps not exceeding (per burner): 1(a) For general lighting purposes < 30 W: 2.5 mg 1(b) For general lighting purposes 30 W and < 50 W: 3.5 mg 1(c) For general lighting purposes 50 W and < 150 W: 5 mg 1(d) For general lighting purposes 150 W: 15 mg 1(e) For general lighting purposes with circular or square structural shape and tube diameter 17 mm: 7 mg 1(f) For special purposes: 5 mg Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL and EEFL) for special purposes EU RoHS Exempted application No.: 3 Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL and EEFL, Short length : 500 mm) for special purposes not exceeding (per lamp) 3.5 mg Effective date of the prohibition 1000 ppm Immediate Immediate Immediate Hg-4 Mercury in other lamps not specifically mentioned in the RoHS Directive Annex EU RoHS Exempted application No.: 4(f) - Mercury in other discharge lamps for special purposes not specifically mentioned in the RoHS Directive Annex Hg-99 Batteries - Exempted applications and effective dates of the prohibition may change, depending on the results of reviews of applications exempted from the RoHS Directive. 5

6 Substance Group to be Eliminated Lead and its compounds Elimination Level Level 1 Exempted applications Coverage Threshold Production materials used for products to which EU RoHS directive (2011/65/EU) applies Pb-1 Electrical and electronic components containing lead in a glass EU RoHS Exempted application No.: 7(c)-I - Lead in glass used for electrical and electronic components - Lead in compounds used in electrical and electronic components (glass matrix compounds) This does not apply to components other than glass. Check Pb-7 for ceramic components. If electric or electronic components contain both glass (Pb-1) and ceramic (dielectric Pb-35), as in a ceramic capacitor, check whether exempted applications for both apply. Pb-2 Lead as an alloying element in steel containing up to 0.35% lead by weight EU RoHS Exempted application No.: 6(a) - Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35 % lead by weight Pb-3 Aluminum containing up to 0.4% lead by weight, and copper alloy containing up to 4% lead by weight EU RoHS Exempted application No.: 6(b), 6(c) - Lead as an alloying element in aluminium containing up to 0.4 % lead by weight - Copper alloy containing up to 4 % lead by weight Pb-4 Lead in high melting temperature type solders (i.e. tin-lead solder alloys containing more than 85% lead) EU RoHS Exempted application No.: 7(a) - Lead in high melting temperature type solders (i.e. lead- Pb-5 based alloys containing 85% by weight or more lead) Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission, and network management for telecommunications EU RoHS Exempted application No.: 7(b) - Includes Pb-6 Lead in solders for network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunications from Rev. 3.5 and earlier revisions of this standard Effective date of the prohibition 1000 ppm Immediate - One year prior to the legally mandated exemption expiration date - Immediate 6

7 Lead and its compounds Exempted applications Pb-7 Lead in ceramic for electrical and electronic components EU RoHS Exempted application No.:7(c)-I, 7(c)-IV -Lead in ceramic used for electrical and electronic components (e.g. piezoelectronic devices) excluding lead in dielectric ceramic -Lead in PZT-based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors (single-function semiconductors) Check Pb-35 for capacitors having a rated voltage of 125 V AC or 250 V DC or higher. Ceramics in capacitors with a rated voltage less than this are no longer exempted applications. (Control to 1,000 ppm or less instead of Pb-7 criteria.) Pb-10 Lead in optical and filter glass. EU RoHS Exempted application No.: 13(a) -Lead in white glasses used for optical applications Pb-14 Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages EU RoHS Exempted application No.: 15 -Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages *See Pb-4 for high melting temperature type solders Pb-27 Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC EU RoHS Exempted application No.: 29 Pb-33 Lead in glass of fluorescent tubes not exceeding 0.2 % by weight EU RoHS Exempted application No.: 5(b) Pb-34 Lead in a dielectric body of a capacitance element (load capacity) integrated in a ceramic oscillator (3 external electrodes type) EU RoHS Exempted application No.:unique to the Epson Group Lead in a ceramic dielectric and lead in the body of a capacitance element (load capacity) only for ceramic oscillator (3 external electrodes type). * See Pb-7 for the piezoelectric body portion of ceramic Pb-35 oscillators (3 external electrodes type). Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher EU RoHS Exempted application No.: 7(c)-II There are no longer exempted applications for ceramic capacitors that have a lower rated voltage than this. - - Immediate Immediate Immediate Immediate Pb-99 Batteries - - Exempted applications and effective dates of the prohibition may change, depending on the results of reviews of applications exempted from the RoHS Directive. 7

8 4. Procedure for Responding to Survey Using "Attachment 3: Survey Tool for Substances to Be Eliminated From Products," provide responses for each production material. We ask that you provide your survey responses by submit only the survey tool Excel file. 5. Filling Out the Survey Response Tool Before you fill out the survey file, please review the following entry procedure and look at the entry sample. Please make entries using single-byte characters (for persons using PCs with a Japanese or Chinese operating system, for example). 1. Basic information Reference Number. Used by Epson as a file control number (Epson will enter) Ex.) Reference number: Epson-HQ (Epson - division & year - serial number) Date of data entry. The date Epson requested the survey. (Epson will enter) Ex) Date of date entry: 2016/03/01 Surveying Company. Epson s information. Columns 1-3 are used based on Epson s settings. * Do not make any entries. Epson will fill out this portion. Ex) Organization name: English: Global Environmental Policy Department Japanese: (leave blank) Contact name English: Gary Green Japanese: (leave blank) Telephone number: Fax number: address: rohs@exc.epson.co.jp Column 1: (leave blank) Column 2: (leave blank) Column 3: (leave blank) Surveyed Company Enter your company's information Note: Epson will enter the company name and vendor code in Column 5. Please fill in all the remaining requested information. Ex) Company name: English: Corporation A Japanese: (leave blank) Address: English: 0123 A Street, New York, New York Japanese: (leave blank) Organization Name: English: Division A, Department B, Section C Japanese: (leave blank) 8

9 Contact Name: English: Gary Green Japanese: (leave blank) Telephone Number: Fax Number: Address: Column 4 vendor entry date: 2016/03/01 Column 5 vendor code: (6-digit code assigned by Epson) Column 6: (leave blank) 2. Part information Part Number. (Filled in by Epson) The part number specified by Epson. Ex 1) Item code: (the 7-digit code assigned by Epson ) Ex 2) Item code: (the 7-digit code assigned by Epson + the 2-digit EC category code) Part Name. (Filled in by Epson) The part name specified by Epson. Ex) Part name: Upper case A (part name specified by Epson) Manufacturer's Name. (Filled in by Epson) The name of the manufacturer of the specified production material Ex) Manufacturer's name: Widgets, Inc. Part Number (used at surveyed company). (Filled in by Epson) The model number of the specified production material Ex) Model number: B5789 (manufacturer's model number) 3. Substance to which the survey pertains A circle (X) is provided to indicate which of the substances (among lead, cadmium, mercury, hexavalent chromium, and their respective compounds) the survey covers. Please provide information only for the substance indicated. Ex.) If Epson requests information on cadmium and its compounds: Cadmium (Cd) Mercury & its compounds Hexavalent chromium (Cr6+) compounds Lead (Pb) & its compounds Mercury (Hg) & its compounds X 9

10 4. Elimination compliance information (pulldown menu) Compliant with elimination standard? Determine whether requirements for compliance to elimination standards (p. 4 - p. 8 herein) are met, and select your response [ Yes: Y ] if compliant, and [ No: N ] if noncompliant from the pull-down menu. If the item is compliant with standards and you selected [ Yes: Y ] from the pull-down menu, move to the next section, "5. Details regarding compliance to the elimination standard." However, if the item is not compliant with standards and you selected [ No: N ] from the pull-down menu, and fill out the following items: Planned date of compliance. (Fill in only if you selected "No: N") Provide the date your company plans to become compliant with the elimination standard Ex.) Year/month/day (YYYY/MM/DD): 2016/10/01 Model number of compliant substitute item. (Fill in only if you selected "No: N") Enter the model number of a substitute item that is compliant with the elimination standards. Ex.) Model number of compliant substitute item: C5789 (manufacturer's model number) 5. Details regarding compliance to the elimination standard Please provide details regarding the state of compliance to the elimination standard. Part element Epson defines a "part element" as any item shown in a configuration drawing for a given component (product) or listed on a parts list, etc. Production materials purchased by Epson are classified as shown below, and an entry example is provided. A device or OEM product (complete products and electrical or electronic device products, etc. that are purchased on an OEM basis) Sample entry) Chassis, upper case, cable, board unit, manual, etc. Electronic components for assembly (unit electronic components, power supply boards, interface boards, etc.) Sample entry) Stacked ceramic capacitor, electrolytic capacitor, printed circuit board, solder for assembly Single electronic components (single components noted in electronic circuit schematics using notations such as L, C, R, etc.) Sample entry) Ceramic material, internal electrode material, and external electrode material in a stacked ceramic capacitor; lead wires, solder terminal plating, electrolytic fluid, sealing material and electrode foil in an electrolytic capacitor * Attachment 1 Sample Parts Broken Down Into Their Elements (Created by the Japanese Green Procurement Survey Standardization Initiative) Mechanical components (screws, chassis, and other components that are formed by working a material and that do not have an electrical function) Sample entry) Plastic materials such as ABS / PS; SECC / SPCC and other steel sheets; rod material, plating, coating,etc. Raw materials (raw materials of things such as plastic materials, steel sheets, rod materials, etc. Sample entry) Surface or in raw materials 10

11 Process materials (solder, marking ink and other materials used in manufacturing processes) Sample entry) Contained in material Packaging material is exempted Substance (Select from the pull-down menu. Required.) Select the applicable substance from the pull-down menu. Pull-down menu Selection 1: [Pb] Selection 3 [Hg] Selection 2: [Cd] Selection 4 [Cr6+] Content level (ppm). (Required) Please enter actual values found using an analytical instrument about Containment rate of the object substance in homogenous material (You do not need to submit data for exempted applications). You may use actual values found via analyses performed by your company, performed by your raw materials supplier, or performed by a special laboratory. See "Attachment 2: Measurement Guidelines for Substances Subject to Elimination" for analytical methods. Please enter theory value based on technique data in the case that analysis impossible to.ex.) The lead containment rate=lead content (the mg)/plating weight (the mg) of solder terminal plating. Item under which compliance is met. (Enter from the pull-down menu. Required) Select the applicable item from the pull-down menu. Refer to the elimination standards, and indicate how compliance is met, by selecting the applicable item indicating that the substance is present in a ratio equal to or less than threshold value or that it is used in an exempted application. Pull-down menu Selection 1: [Does not exceed threshold] Selection 2: [Exempted Cd-99] Selections 3-15: [Exempted Pb-1 Pb-5, 7, 10,14, 27, 33 35, 99] Selections 16-19: [Exempted Hg-1, 3, 4, 99] *Please check the effective date of the prohibition. Selection criteria Ex. 1: Lead contained in high-melting-point solder [Exempted usage Pb-4] Ex. 2: Cd content 20 ppm [Does not exceed threshold] Analysis data number If you selected the first item ("Does not exceed threshold") from the pull-down menu in the "Item under which compliance is met" column, please submit analytical results or technique data that substatiate this determination. The analytical results may be from analyses performed by your company, performed by your raw materials supplier, or performed by a special laboratory. See "Attachment 2: Measurement Guidelines for Substances Subject to Elimination" for analytical methods. Assign a reference number to the documentation you attach to the survey form, and provide this in the Excel survey form (under the "Basis for determining compliance" column). Remarks Enter any comments you may have regarding compliance. 11

12 6. Additional Clauses (1) Revision and withdrawal This standard is subject to revision and withdrawal pursuant to "EQS (ref. No. A )" (2) Revision history Version Established page Revisions Ver. 1.0 Oct. 15, First edition Ver. 1.4 Nov. 25, 2003 P3 2. table: Perform the survey of production materials using solder by using the survey tool for substances subject to elimination in products. P11 Line 13: Add (You do not need to submit data for exempted applications) Ver. 1.5 Mar. 22, 2004 P1 Change contents number Ver. 1.6 Jun. 30, 2004 P4,5, 6 Add note comment of EU Directive (98/101/EC) is complied with regarding the battery. P4,5, 6 Effective date of ban about device products. Old : New: immediate. P9 Part element : Single electronic components Add solder terminal plating P9 Part element : Mechanical components Add plating, coating P10 Part element : Battery and Packaging material is exempted Add battery P10 Content level (ppm) Add about Containment rate of the object substance in homogenous material Add Please enter theory value based on technique data in the case that analysis impossible to.ex.) The lead containment rate=lead content (the mg)/plating weight (the mg) of solder terminal plating P10 Item under which compliance is P10 Item under which compliance is met Delete 1500 ppm P10 Analysis data number (Change Subject name) Old : Basis for determining compliance New : Analysis data number P10 Analysis data number Add technique data Ver. 1.7 Sep. 26, 2011 P4-8 Revised Elimination Standards P12 P16-17 Pull-down menu Old : Selection 2-3: [Exempted Cd-1 Cd-2] New : Selection 2: [Exempted Cd-99] Deleted : Selections 4: [Exempted Cr-1] Old : Selection 5-9: [Exempted Pb-1 Pb-5] New : Selection 3-15: [Pb-1 Pb-5, 7, 10,14, 27, 33 35, 99] Old : Selections 10-14: [Exempted Hg-1 5] New: Selections 16-19: [Exempted Hg-1, 3, 4, 99] Added Attachment 2:Important points for responding to Survey on Controlled Chemical Substances / Survey on Substance to Be Eliminated from Products 12

13 Version Established page Revisions Ver. 1.8 Aug. 1, 2012 P5 Deleted (e.g. Projector lamp) from Hg-4. P7 Added Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors to exempted applications of Pb-7. Added 7(c)-IV to No. of application exempted from amended RoHS Directive of Pb-7. P17 Deleted (e.g. Projector lamp) from b) Mercury and its compounds Ver. 1.9 Oct. 1, 2014 P4 Appendix 4: Standards for Elimination Added As of July 2014, applications exempted from the RoHS Directive are being reviewed. The dates provided in the "Effective date of the prohibition column in the tables on pages 4-7 are the dates that Epson has independently set as the final dates for accepting goods containing substances that are being phased out. Exempted applications and effective dates of the prohibition may change, depending on the results of reviews of applications exempted from the RoHS Directive. Old :Hexavalent Chromium and Its Compounds New: Hexavalent Chromium Compounds P5 Hg-3: Old : Mercury in straight fluorescent lamps for special purposes New: Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL and EEFL) for special purposes Added Effective date of the prohibition for exempted applications(hg-1, Hg-3) and Exempted applications and effective dates of the prohibition may change, depending on the results of reviews of applications exempted from the RoHS Directive. P6 Added Effective date of the prohibition for exempted applications(pb-2, Pb-3,Pb-5) Pb-7 : Old : Lead in ceramic for piezoelectronic devices New: Lead in ceramic for electrical and electronic components Pb-7 Comment : Revised partially P7 Pb-7 Comment : Revised partially Pb-14 Comment:Added *See Pb-4 for high melting temperature type solders Added Effective date of the prohibition for exempted applications (Pb-14,Pb-27,Pb-33,Pb-34) and Exempted applications and effective dates of the prohibition may change, depending on the results of reviews of applications exempted from the RoHS Directive. Ver. 2.0 Oct. 1, 2015 P6 Revised Effective date of the prohibition for exempted applications(pb-2, Pb-3) Old : July 21, 2015 New:April 21,

14 Version Established page Revisions Ver. 2.1 Oct. 1, 2016 P5 Revised Effective date of the prohibition for exempted applications(hg-2, Hg-3) Old : July 21, 2015 New:Immediate P6 Revised Effective date of the prohibition for exempted applications(pb-2, Pb-3) Old : April 21, 2016 New: One year prior to the legally mandated exemption expiration date Revised Effective date of the prohibition for exempted applications(pb-5) Old : July 21, 2015 New:Immediate P7 Revised Effective date of the prohibition for exempted applications(pb-14, Pb-27, Pb-33) Old : July 21, 2015 New:Immediate 14

15 Attachment 1: Sample Parts Broken Down Into Their Elements (Created by the Japanese Green Procurement Survey Standardization Initiative) Part Elements, Example 1 Connectors Part elements: housing, contact Plating Contact Housing Part Elements, Example 2 Components having switches, relays, or other mechanical parts Part elements: part cases (resin molded, etc.), metal parts (levers, frames, terminals, etc.), moving parts (contacts, etc.) Case Moving part Case Contact Frame Coil bobbin Coil Molded base Terminal Solder terminal plating * Please take into consideration flame-retardants in resins and special metals (alloys) used for the purpose of the electrical characteristics of contacts, lubricants, etc Part Elements, Example 3 Surface-mounted chip components Part elements: terminals, main body cts, lubricants, etc. Main body Terminals Solder terminal plating * If the main body of the component comprises a plurality of materials and a substance of interest is present, please segmentalize it. Ex.) Main body comprises ceramics and an interior electrode Part Elements, Example 4 Semiconductor device Part elements: Lead pins (lead frame, etc.), package body (molded resin, etc.), chip Main body Package body Lead terminals Solder terminal plating * Please take into account flame retardants in the package resin material and lead material / treatments * Please answer as far as possible regarding the chip 15

16 Part Elements, Example 5 Transformers & inductors Part elements: Core, winding, bobbin, lead wire, insulation, case frame, etc Core Outgoing line Core Coil Coil bobbin * Please take into account flame-retardants in resin materials & insulation, coil impregnant, lead wire PVC and flame-retardant. Part Elements, Example 6 DC motor Part elements: Component case (resin mold, etc.), metal components (shaft, rotor core, terminals, frame, etc.), flange, magnet, coil, etc. Case Magnet Rotor core Flange Bearing Coil or Commutator Resin * Please take into account things such as flame retardants in resins, special metals (alloys) for the purpose of electrical characteristics or lubrication of commutators, or bearing grease. * If things such as lead wires or electronic circuits are included, calculate the total content Part Elements, Example 7 Electric cable (power cord) Part elements: Conductor (copper + plating), insulator (inner cladding), jacket (outer cladding)* If things such as lead wires or electronic circuits are included, calculate the total content of the component from the sum of the content included in the various element parts. (3) Jacket (outer cladding) (2) Insulator (inner cladding) (1) Conductor (copper + plating) (4) Plating 16

17 Attachment 2: Important points for responding to Survey on Controlled Chemical Substances / Survey on Substances to Be Eliminated From Products Please confirm that your response does not contain inappropriate information when you respond to the surveys. 1.Survey on Substances to Be Eliminated From Products 1)Please select suitable exempted applications. Major exempted applications for each part and material are as follows. a) Lead and its compounds Category of parts, materials Major exempted applications Item under which compliance is met Batteries Cd-99, Hg-99, Pb-99 Electrical and electronic components Pb-1, Pb-7, Pb-14 *, Pb-34 *, Pb-35 Steel Pb-2 * Aluminum, Copper alloy Pb-3 * Optical and filter glass Pb-10 Crystal glass Pb-27 * b) Mercury and its compounds Category of parts, materials Major exempted applications Item under which compliance is met Single capped (compact) fluorescent lamps Hg-1 * Cold cathode fluorescent lamps, external electrode fluorescent lamps Hg-3 * (e.g. used for display) Discharge lamps Hg-4 * Please note that effective date of the prohibition is set for those exempted applications. 2)Please meet the threshold of exempted applications. The threshold is set for the following exempted applications. Pb-2(Steel): up to 0.35%(3500ppm) by weight Pb-3(Copper alloy): up to 4%(40,000ppm) by weight Pb-3(Aluminum): up to 4%(4,000ppm) by weight Pb-4(high melting temperature type solders): more than 85%(850,000ppm) by weight 3)Please submit analytical results which provides evidence when Does not exceed threshold is selected for Item under which compliance is met. When Does not exceed threshold is selected, analytical results are required. 17

18 2. Survey on Controlled Chemical Substances 1)Please avoid lack of substance information. Familiar examples of lack of substance information: For materials/parts which use beryllium copper : Beryllium and its compounds(a03) is not input For materials/parts which use polyvinyl chloride : Polyvinyl chloride (B07) is not input For materials/parts which use brominated flame retardants : Halogenated resin additive (B04) is not input 3.Common subject matter 1) Please eliminate mismatch between survey data on Controlled Chemical Substance and survey data on Substance to be eliminated from products. e.g. Survey data on Controlled Chemical Substances does not contain lead, but survey data on Substances to Be Eliminated From Products contains lead. 18

19 Attachment 3 Measurement Guidelines for Substances Subject to Elimination Measurement Guidelines for Substances Subject to Elimination Ver. 1.0 Material Analysis and Research Center 19

20 Contents 1. Measured Substances Cadmium and cadmium compounds 15 Lead and lead compounds 15 Mercury and mercury compounds 16 Hexavalent chromium compounds Appendices Table 1 List of Analytical Methods 17 Table 2 Definitions 18 20

21 1.Measured Substances Substance of interest: Lead and lead compounds 1 Select one of either of the following preprocessing methods: Wet decomposition method Microwave decomposition method 2 Completely dissolve precipitates. 3 Use one of the following analytical instruments. (However, the determination limit must be 10 ppm or less.) ICP-AES (ICP-OES) ICP-MS AAS Substance of interest:cadmium and cadmium compounds 1 Select any one of the following preprocessing methods: Wet decomposition method (BSEN 1122;2001) Sulphate ashing Microwave decomposition method 2 Use at least 1g of the sample, or prepare the sample in the amount specified by the analytical laboratory. 3 Use one of the following analytical instruments. (However, the determination limit must be 10 ppm or less.) ICP-AES (ICP-OES) ICP-MS AAS 21

22 Substance of interest: Mercury and mercury compounds 1 Prepare at least 1g of the sample. 2 You may use the measurmenet method recommended by the analytical laboratory. 3 Use one of the following analytical instruments. (However, the determination limit must be 10 ppm or less.) ICP-AES (ICP-OES) AAS (hydride generation, heating vaporization) Substance of interest: Hexavalent chromium compounds Use one of the following methods: German food and commodies directive DIN53314 "Determination of Chromium (VI) compounds in leather" VOLVO STD 5713,102 "Determination of free hexavalent chromium (Cr6+) in chromate conversion coating" * EU directives and so forth may recommend an analytical method other than one listed above. If so, use the method recommended by the directive, etc. Specify the following information on analytical results: Name of organization that performed the analysis Analytical method used (preprocessing) Name of analytical instrument Date of analysis Name of person performing analysis Analysis data Measuring instrument calibration certification record Signature of rsponsible person 22

23 Table 1 List of Analytical Methods No. Substance of interest Analysis method Main Standards/ Legislation 1 Cadmium and cadmium Decomposition ICP, BS/EN 1122 compounds ICP-MS, AAS 2 Lead and lead compounds Decomposition ICP, Notification No. 13 ICP-MS, AAS 3 Hexavalent chromium Elution ICP, ICP-MS, AAS IC, UV Notification No. 13 DIN53314 EPA SW A 4 Mercury and mercury compounds Combustion extraction cool-vapor / hot-vapor AAS Notification No. 13 * The analytical methods listed herein are not necessary the method cited in public standards or legislation. There are analytical methods whose use has not yet been established for the samples of interest. Please use the list as a guideline. Table 2 Definitions ICP Inductively Coupled Plasma ICP-OES Inductively Coupled Plasma-Optical Emission spectrometry ICP-AES Inductively Coupled Plasma-Atomic Emission spectrometry * ICP-AES and ICP-OES are the same analytical instrument. "ICP" normally refers to ICP-AES and ICP-OES. ICP-MS Inductively Coupled Plasma Mass Spectrometry AAS Atomic Absorption Spectroscopy IC Ion Chromatography 23