Silicone Material Solutions for LED Packages and Assemblies

Transcription

1 Silicone Material Solutions for LED Packages and Assemblies

2 LED Packaging and Assembly Solutions from Momentive Performance Materials The growth of optoelectronic devices and LEDs in segments such as handheld devices, mobile phones, display backlights, automotive, and electronic signs, has led to an increase in demand for enhanced performance and longterm reliability. Designers of LEDs and optoelectronic devices will find a range of silicone material solutions from Momentive, that are excellent candidates to address a wide array of challenges facing the LED industry. InvisiSil* LED Encapsulants Momentive's InvisiSil series of silicone encapsulants exhibit unique optical efficiencies and a high refractive index, while providing longterm resistance against the yellowing and d e l a m i n a t i o n t y p i c a l o f conventional epoxybased materials. (p.34) Silicone Lens Materials For optical lens fabrication Momentive offers a series of products engineered to provide high transparency and mechanical strength. These moldable silicone materials are excellent candidates for injection molding systems that maximize the benefits of LIM processing. (p.6) Silicones for LED Die Attach Momentive's die attach silicones offer a high heat and UV resistant alternative to conventional epoxy based die attach materials. These silicone materials are characterized by minimal yellowing, and c o n t r i b u t e t o l o n g t e r m stability of light output. (p.7) Glob Top Encapsulants Momentive's Glob Top encapsulants exhibit good light transmittance, and are formulated to provide consistent dispensing performance and material flow to form a dome shape for COB (chip on board) encapsulation. Component designers with chipmounting and wirebonding capabilities can benefit from the process simplicity that these materials offer in LED COB packaging applications. (p.5) Dot Matrix and LED Assembly Materials LED dot matrix potting materials are available in room temperature and heataccelerated alternatives. The low viscosities of these potting materials make them great materials of choice for potting applications in intricate Dot Matrix applications and LED Assemblies. (p.8) Thermal Management Silicones Momentive's thermal management silicone materials help dissipate heat generated from power and highbrightness LEDs. Products includes silicone grease, and heatcure and condensation cure adhesives. (p.9) 1

3 Silicone Advantages The chemical structure of silicone provides several advantages over conventional materials used in optoelectronic applications. The backbone structure of polydimethylsiloxane consists of silicon (Si) and oxygen (O). The siloxane bond (SiO) is inorganic and has a higher bond energy of (444kJ/mol) than either carbon (C) carbon (C) bond (356kJ/mol), or carbon (C) oxygen (O) bond (339kJ/mol). One of the better thermal stability of silicone over that of epoxy resin is ascribled to this bond energy difference. R R R R R R O l l l l l l l R Si O SiOSi OSi OSi OSiOSi O l l l l l l l R R R R O R O l Inorganic Organic R SiR O l Performance Comparison The inorganic siloxane bond of silicone materials and its resultant bond energy, contributes to stable performance under harsh operating conditions. This is manifest in performance advantages to epoxy resins under some usage conditions. Thermal Resistance UV Resistance Hardness Adhesion Strength Thermal Expansion Moisture Absorption Moisture Permeability Silicone Excellent Excellent Good Good Fair Good Fair Epoxy Fair Poor Excellent Excellent Good Fair Good 2

4 InvisiSil* LED Encapsulants InvisiSil series, silicone encapsulants deliver high refractive index & light transmittance to effectively transmit light emitted from LEDs. They help contribute to durability and reliability of devices through their longterm resistance to yellowing and delamination of encapsulant from the substrate, and provide low viscosities that make them candidates for a wide variety of LED packages. Key features:. Selection from a range of refractive index up to 1.53 (n D 25). High light transmittance (>95%, 4000nm). Good workability. High purity. Adhesion to PPA, LCP Product Details Components Cure Type Property Appearance (A) Pa Viscosity:. s (B) Pa. s Mixing Ratio (A:B) Viscosity o C Pa. s Refractive Index (n D 25) Penetration Adhesion Strength (PPA) CTE 1/K IVS5022 Gel Packaging: 500g Bottles 1 Step cure o C@90min, 150 o C@1h High Refractive Index IVS x10 4 XE14C2860 Gel /1 35 Viscosity (Pa. S) InvisiSil Encapsulant Portfolio GEL RUBBER XE14C42 4 IVS4542 IVS4632 IVS5332 IVS IVS4012 TSJ3150 RED: RI>1.5 XE14C2860 IVS4312 BLUE: RI~ IVS4012 Gel / IVS x10 4 Normal Refractive Index IVS4542 IVS x x10 4 TSJ / (Al) XE14C x10 4 Components Cure Type Property Appearance Viscosity: (A) Pa. s (B) Pa. s Mixing Ratio (A:B) Viscosity o C Pa. s Refractive Index (n D 25) Penetration Adhesion Strength (PPA) CTE 1/K Packaging: 500g Bottles 1 Step cure o C@90min, 150 o C@1h 3

5 InvisiSil Encapsulants Technical Data Thermal Stability InvisiSil LED Encapsulants help contribute to longterm thermal stability of LEDs. This is represented in thermal stability tests conducted using IVS4542 and LED grade epoxy resins. Tests were performed by exposing both materials, sandwiched between glass plates, to 1 o C temperatures. While the transmittance of IVS4542 remained stable under prolonged periods of heat exposure, epoxy resins demonstrated deterioration in transmittance over time accompanied by yellowing of the encapsulant material. 1 O C Epoxy for 1 O C Transmittance % Initial 1 Day 4 Days 7 Days 14 Days Transmittance % Initial 1 Day 4 Days 7 Days 14 Days Test Conditions: IVS4542 and epoxy resin cured in glass sandwich specimens and exposed to 1 o C temperatures for specified time intervals Glass Glass 2mm UV Stability InvisiSil LED Encapsulants also help contribute to longterm UV stability of LEDs. This is represented in UV stability tests conducted using IVS4542 and LED grade epoxy resins. Tests were performed by exposing both materials, sandwiched between glass plates, to black lamp UV light. Change in transmittance against initial spectra values were measured. IVS4542 silicone encapsulant demonstrated stable performance, while LED epoxy resins generated results suggesting lower UV stability. 5 IVS Epoxy for LED Transmittance Change Ratio % h 46h h 8h Transmittance Change Ratio % h 46h h 8h Test Conditions: IVS4542 and epoxy resin cured in glass sandwich specimens and exposed to UV lamp: Black light, mj/cm 2 /min at 365nm detector Glass Glass 2mm Transparency Performance 1 InvisiSil Series Transmittance 95 Transmittance % 90 XE14C42 IVS4012 TSJ IVS4632 IVS4312 IVS4542 XE14C IVS5022 IVS Transmittance measured using 1mm liquid film 4

6 Glob Top Encapsulants Momentive's Glob Top encapsulants exhibit good light transmittance, and are excellent candidates to provide consistent dispensing performance and material flow to form a dome shape for COB (chip on board) encapsulation. Component designers with chipmounting and wirebonding capabilities can benefit from the process simplicity that these materials offer in LED COB packaging applications. Product Details Components Cure Type Property Appearance (A) Pa Viscosity:. s (B) Pa. s Mixing Ratio (A:B) Viscosity o C Pa. s Pot o C h Refractive Index (n D 25) Adhesive Strength (Al) Thermal Conductivity W/m. K CTE 1/K Volume Resistivity MΩ. m Dielectric Strength kv/mm Dielectric Constant (60Hz) Dielectric Loss (60Hz) Ionic Content (Na/K, Cl) ppm XE14B3445 Translucent x10 4 1x <2, <2, <5 XE14B5778 Translucent / x10 4 2x <2, <2, <5 XE13C0810 Translucent x <2, <2, <5 Packaging Transparency Performance 1 XE14B3445 (A) XE14B3445 (B) XE14B5778 (A) XE14B5778 (B) XE13C ml 500g 1kg syringe bottle can 4kg can Transmittance % Glob Top Series Transmittance XE14B5778 XE14B3445 XE13C Transmittance measured using 0.5mm liquid film 5

7 Lens Fabrication Materials For optical lens fabrication Momentive offers a series of products engineered to provide high transparency and mechanical strength. These moldable silicone materials are excellent candidates for injection molding systems that maximize the benefits of LIM processing. Product Details IVSM , x IVSM , > <5 2.2x XE14C Components Cure Type Property Appearance Viscosity: Translucent (A) Pa. s 85 (B) Pa. s 4 Mixing Ratio (A:B) :10 Viscosity o C Pa. s 93 Pot o C h 24 1/1 Refractive Index (n D 25) 1.53 Transmittance (400nm, 0nm) % Hardness (Shore D) 87.8, Young's Modulus CTE 1/K Shrinkage Packaging: 18kg Pails 1 Experimental grade Transparency Performance 1 Lens Material Transmittance Transmittance % IVSM4500 IVSM40 XE14C Transmittance measured using 1mm liquid film 6

8 Die Attach Silicones Momentive's die attach silicones offer a high heat and UV resistant alternative to conventional epoxy based die attach materials. These silicone materials are characterized by minimal yellowing, and contribute to longterm stability of light output. Product Details Characteristic Components Cure Type Property Appearance o C Pa. s Thermal Conductivity W/m. K Adhesive Strength (Al) Volume Resistivity MΩ. m Refractive Index (n D 25) Ionic Content (Na/K, Cl) ppm SDC ElectroConductive Yellow Metallic x10 4* <10, <2, <5 TSE3282G Thermally Conductive Gray x10 6 XE13C2476 ElectroInsulative Translucent Experimental grade *Ω. cm Packaging SDC5003 TSE3282G XE13C ml syringe 0g 500g 1kg tube bottle can 7

9 Dot Matrix and Assembly Materials LED dot matrix potting materials are available in room temperature and heataccelerated alternatives. The low viscosities of these potting materials make them excellent materials of choice for intricate Dot Matrix applications and LED Assemblies for a variety of industries ranging from signage, automotive, to lighting. These silicone materials provide enchanced weatherablility performance, especially in locations with high salt air concentrations, and represent a smart alternative to conventional epoxy or urethane materials. Product Details Components Cure Type Property Appearance (A) Pa Viscosity:. s (B) Pa. s Mixing Ratio (A:B) Viscosity o C Pa. s Pot o C h Tack Free Time min Hardness Adhesion Strength Dot Matrix Materials XE12B2543 XE14C0447 Room Temp. Black Black 1.8 : / (Type A) 14 (Type E) (Al) 0.15 (PC) TSE : / (Type A) LED Assembly Materials TSE / (Type A) (glass) RTV : / (Type A) Packaging XE12B2543 (A) XE12B2543 (B) XE14C0447 (A) XE14C0447 (B) TSE3032 (A) TSE3032 (B) TSE3033 (A) TSE3033 (B) RTV615 (A:B Kit) 30g g 1 lb bottle bottle (454g) 500g 1kg 10 lb bottle can (4.5kg) 15kg 18kg 44 lb pail pail (kg) 8

10 Thermal Management Silicones SilCool* Silicone Grease Property / Color Thermal Conductivity 1 W/m. K Thermal Resistance 2 (BLT) mm 2. K / W Penetration o C o C Pa. s Bleed o C/24h wt% o C/24h wt% Volume Resistivity 4 MΩ. m Dielectric Strength kv/0.25mm Volatile Siloxane (D 3D 10) ppm Ionic Content *5 (Na/K, Cl) ppm TIG00 Pale Blue Paste 24 (50µm) <0.1 <0.1 1x < Low Thermal Resistance TIG830SP Gray Paste (30µm) < x < 0.5, 0.0, Bulk sample measurement (hot wire method), 2 Laser flash analysis on a SiSi sandwiched material 3 JIS K 22, 4 MILS8660B, 5 Ion chromotography analysis on water extracts Packaging TIG00 TIG830SP 0g 2kg 2kg tube can bottle SilCool Silicone Adhesive Type Property (uncured) Color o C Pa. s Thermal Conductivity 1 W/m. K Thermal Resistance 2 (BLT) mm 2. K / W Adhesion (Lap Shear) 4 CTE ppm/k Glass Transition Temp o C Volume Resistivity 3 MΩ. m Dielectric Strength kv/mm Ionic Content 5 (Na/K, Cl) ppm Moisture Absorption wt% XE13C1822 SemiFlowable Gray (50µm) x10 6 each <5 <0.6 TSE3282G Flowable Gray 33 (50µm) x each <10 <0.6 1 Bulk sample measurement (hot wire method), 2 Laser flash analysis on a SiSi sandwiched material, 3 ASTM E 14561, 4 Aluminum lap shear, 5 Ion chromatography analysis Packaging XE13C1822 TSE3282G 0g tube 1kg can Condensation Cure Silicone Adhesives Type Property (uncured) Color o C Pa. s Tack Free Time Min Thermal Conductivity W/m. K Adhesive Strength CTE ppm/k Volume Resistivity MΩ. m Dielectric Strength kv/mm Volatile Siloxane (D 3D 10) wt% 9 XE11C3165 Flowable Light Gray x XE11B53 NonFlowable White x Packaging XE11C XE11B53 333ml cart. 1 Contact a Momentive Performance Materials sales reprersentative for package availability

11 Product Availability by Region 1 IVS5022 IVS5332 XE14C2860 IVS4012 IVS4312 IVS4542 IVS4632 TSJ3150 XE14C42 XE14B3445 XE14B5778 XE13C0810 IVSM40 IVSM4500 XE14C2508 SDC5003 TSE3282G XE13C2476 XE12B2543 XE14C0447 TSE3032 TSE3033 RTV615 TIG00 TIG830SP XE13C1822 XE11C3165 XE11B53 Japan Korea China US Europe 1 Contact a Momentive Performance Materials sales representative for availability in countries and regions not listed PATENT STATUS: Nothing contained herein shall be construed to imply the nonexistence of any relevant patents or to constitute the permission, inducement or recommendation to practice any invention covered by any patent, without authority from the owner of the patent. Other Electronic Solutions from Momentive Performance Materials 12page brochure provides detailed information on silicone materials used for thermal management applications in electronics and microelectronics. Includes SilCool* grease & a d h e s i v e s, a n d conventional grades for adhesion, encapsulation and potting. Comprehensive package of adhesion, sealing, coating, and encapsulation / potting solutions for a wide range of silicone applications in electric and electronic devices and component assemblies. 10

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