Design Verification Test Report PART DESCRIPTION SEAC TU-TU

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Project Number: Design Verification Test Tracking Code: TC0841 2024_Report Rev 2 Requested

Troy Cook Qty to test: 70 Test Start: 10/08/2008 Test Completed: 6/10/2009 Eng: Eric Mings

1 Project Number: Design Verification Test Tracking Code: TC _Report Rev 2 Requested by: Kevin Meredith Date: 7/22/2009 Product Rev: 0 Lot #: 0 Tech: Rodney Riley Gary Lomax Troy Cook Qty to test: 70 Test Start: 10/08/2008 Test Completed: 6/10/2009 Eng: Eric Mings Mark Shireman Design Verification Test Report PART DESCRIPTION SEAC TU-TU Page 1 of 38

2 CERTIFICATION All instruments and measuring equipment were calibrated to National Institute for Standards and Technology (NIST) traceable standards according to IS l and ANSI/NCSL , as applicable. All contents contained herein are the property of Samtec. No portion of this report, in part or in full shall be reproduced without prior written approval of Samtec. SCOPE To perform the following tests: Design verification test. See test plan. APPLICABLE DOCUMENTS Standards: EIA Publication 364 TEST SAMPLES AND PREPARATION 1) All materials were manufactured in accordance with the applicable product specification. 2) All test samples were identified and encoded to maintain traceability throughout the test sequences. 3) After soldering, the parts to be used for LLCR and DWV/IR testing were cleaned according to TLWI ) Either an automated cleaning procedure or an ultrasonic cleaning procedure may be used. 5) The automated procedure is used with aqueous compatible soldering materials. 6) Parts not intended for testing LLCR and DWV/IR are visually inspected and cleaned if necessary. 7) Any additional preparation will be noted in the individual test sequences. 8) Solder Information: Lead Free 9) Samtec Test PCBs used: PCB TST-XX / PCB TST-XX / PCB TST-XX Page 2 of 38

3 FLOWCHARTS Current Carrying Capacity TEST GROUP A (cable) GROUP B (connector) STEP 1 Mated Assembly 1 Mated Assembly 1 CONTACT POWERED 1 CONTACT POWERED 1 CCC CCC Tabulate calculated current at RT, 65 C, 75 C and 95 C after derating 20% and based on 105 C or 125 C for Au CCC, Temp rise = EIA Mating/Unmating/Gaps/Normal Force/Deflection Force LATCHES REMOVED TEST STEP GROUP A1 3 Boards End 1 (SEAF-DV) 01 Contact Gaps 02 Mating / Unmating 03 Data Review Cycles 05 Mating / Unmating 06 Contact Gaps 07 Data Review 08 Thermal Aging (Mated) 09 Mating / Unmating 10 Contact Gaps 11 Data Review 12 Humidity (Mated) 13 Contact Gaps 14 Mating / Unmating Thermal Aging = EIA , Test Condition 4, 105 deg C; Time Condition 'B' (250 hours) Humidity =EIA , Test Condition B (240 Hours) and Method III (+25 C to %RH to 98% RH) ambient pre-condition and delete steps 7a and 7b Mating/Un-Mating Forces = EIA Contact Gaps/Height - No standard method. Usually measured optically Page 3 of 38

4 IR / DWV LATCHES REMOVED TEST GROUP A GROUP B1 GROUP B2 GROUP B3 STEP 2 Boards 2 Boards 2 Boards 2 Boards Ambient Ambient Thermal Humidity 01 IR DWV/Working Voltage Thermal Aging Humidity 02 Data Review 03 Thermal Aging 04 IR 05 Data Review 06 Humidity 07 IR DWV/Working Voltage DWV/Working Voltage Thermal Aging = EIA , Test Condition 4, 105 deg C; Time Condition 'B' (250 hours) Humidity =EIA , Test Condition B (240 Hours) and Method III (+25 C to %RH to 98% RH) ambient pre-condition and delete steps 7a and 7b IR = EIA DWV = EIA Durability/Thermal Age/Cyclic Humidity/Gas Tight TEST STEP GROUP A (End 1 SEAF-DV) 10 Samples 100 Cycles 01 LLCR-1 02 Data Review Cycles 04 LLCR-2 05 Data Review 06 Thermal Age 07 LLCR-3 08 Data Review 09 Cyclic Humidity 10 LLCR-4 Thermal Aging = EIA , Test Condition 1, 55 C; Test Condition A (96 Hours) Humidity =EIA , Test Condition A (96 Hours) and Method III (+25 C to % RH to 98% RH) ambient pre-condition and delete steps 7a and 7b LLCR = EIA , LLCR use Keithley 580 in dry circuit mode, 10 ma Max Page 4 of 38

5 Gas Tight TEST STEP GROUP A 100 Points 01 LLCR-1 02 Gas Tight 03 LLCR-2 Gas Tight = EIA A LLCR = EIA , LLCR use Keithley 580 in the dry circuit mode, 10 ma Max Connector Pull TEST STEP GROUP 1A-STD 5 Pieces End 1 SEAF-DV SIG 0 01 Pull test, Continuity Secure both cables in the center Monitor continuity and pull record forces when continuity fails. Page 5 of 38

6 ATTRIBUTE DEFINITIONS The following is a brief, simplified description of attributes. THERMAL: 1) EIA , Temperature Life with or without Electrical Load Test Procedure for Electrical Connectors. 2) Test Condition 4 at 105 C. 3) Test Time Condition B for 250 hours. 4) All test samples are pre-conditioned at ambient. 5) All test samples are exposed to environmental stressing in the mated condition. HUMIDITY: 1) Reference document: EIA , Humidity Test Procedure for Electrical Connectors. 2) Test Condition B, 240 Hours. 3) Method III, +25 C to + 65 C, 90% to 98% Relative Humidity excluding sub-cycles 7a and 7b. 4) All samples are pre-conditioned at ambient. 5) All test samples are exposed to environmental stressing in the mated condition. TEMPERATURE RISE (Current Carrying Capacity, CCC): 1) EIA , Temperature Rise versus Current Test Procedure for Electrical Connectors and Sockets. 2) When current passes through a contact, the temperature of the contact increases as a result of I 2 R (resistive) heating. 3) The number of contacts being investigated plays a significant part in power dissipation and therefore temperature rise. 4) The size of the temperature probe can affect the measured temperature. 5) Copper traces on PC boards will contribute to temperature rise: a. Self heating (resistive) b. Reduction in heat sink capacity affecting the heated contacts 6) A de-rating curve, usually 20%, is calculated. 7) Calculated de-rated currents at three temperature points are reported: a. Ambient b. 80 C c. 95 C d. 115 C 8) Typically, neighboring contacts (in close proximity to maximize heat build up) are energized. 9) The thermocouple (or temperature measuring probe) will be positioned at a location to sense the maximum temperature in the vicinity of the heat generation area. 10) A computer program, TR 803.exe, ensures accurate stability for data acquisition. 11) Hook-up wire cross section is larger than the cross section of any connector leads/pc board traces, jumpers, etc. 12) Hook-up wire length is longer than the minimum specified in the referencing standard. CONTACT GAPS: 1) Gaps above the surrounding plastic surface were measured before and after stressing the contacts (e.g. thermal aging, mechanical cycling, etc.). 2) Typically, all contacts on the connector are measured. Page 6 of 38

7 MATING/UNMATING: 1) Reference document: EIA , Mating and Unmating Forces Test Procedure for Electrical Connectors. 2) The full insertion position was to within to of the plug bottoming out in the receptacle to prevent damage to the system under test. 3) One of the mating parts is secured to a floating X-Y table to prevent damage during cycling. INSULATION RESISTANCE (IR): To determine the resistance of insulation materials to leakage of current through or on the surface of these materials when a DC potential is applied. 1) PROCEDURE: a. Reference document: EIA , Insulation Resistance Test Procedure for Electrical Connectors. b. Test Conditions: i. Between Adjacent Contacts or Signal-to-Ground ii. Electrification Time 2.0 minutes iii. Test Voltage (500 VDC) corresponds to calibration settings for measuring resistances. 2) MEASUREMENTS: 3) When the specified test voltage is applied (VDC), the insulation resistance shall not be less than 5000 megohms. DIELECTRIC WITHSTANDING VOLTAGE (DWV): To determine if the sockets can operate at its rated voltage and withstand momentary over potentials due to switching, surges, and other similar phenomenon. Separate samples are used to evaluate the effect of environmental stresses so not to influence the readings from arcing that occurs during the measurement process. 1) PROCEDURE: a. Reference document: EIA , Withstanding Voltage Test Procedure for Electrical Connectors. b. Test Conditions: i. Between Adjacent Contacts or Signal-to-Ground ii. Barometric Test Condition 1 iii. Rate of Application 500 V/Sec iv. Test Voltage (VAC) until breakdown occurs 2) MEASUREMENTS/CALCULATIONS a. The breakdown voltage shall be measured and recorded. b. The dielectric withstanding voltage shall be recorded as 75% of the minimum breakdown voltage. c. The working voltage shall be recorded as one-third (1/3) of the dielectric withstanding voltage (onefourth of the breakdown voltage). LLCR: 1) EIA , Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets. 2) A computer program, LLCR 221.exe, ensures repeatability for data acquisition. 3) The following guidelines are used to categorize the changes in LLCR as a result from stressing a. <= +5.0 mohms: stable b to mohms: Minor c to mohms: Acceptable d to mohms: Marginal e to mohms: unstable f. >+2000 mohms: open Failure Page 7 of 38

8 GAS TIGHT: To provide method for evaluating the ability of the contacting surfaces in preventing penetration of harsh vapors which might lead to oxide formation that may degrade the electrical performance of the contact system. 1) EIA , Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets. 2) A computer program, LLCR 221.exe, ensures repeatability for data acquisition. 3) The following guidelines are used to categorize the changes in LLCR as a result from stressing a. <= +5.0 mohms: stable b to mohms: Minor c to mohms: Acceptable d to mohms: Marginal e to mohms: unstable f. >+2000 mohms: open Failure 4) Procedure: a. Reference document: EIA , Test Procedure for Determination of Gas-Tight Characteristics for Electrical Connectors, Sockets and/or Contact Systems. b. Test Conditions: i. Class II--- Mated pairs of contacts assembled to their plastic housings. ii. Reagent grade Nitric Acid shall be used of sufficient volume to saturate the test chamber iii. The ratio of the volume of the test chamber to the surface area of the acid shall be 10:1. iv. The chamber shall be saturated with the vapor for at least 15 minutes before samples are added. v. Exposure time, 55 to 65 minutes. vi. The samples shall be no closer to the chamber walls than 1 inches and no closer to the surface of the acid than 3 inches. vii. The samples shall be dried after exposure for a minimum of 1 hour. viii. Drying temperature 50 C ix. The final LLCR shall be conducted within 1 hour after drying. Page 8 of 38

9 SUPPLEMENTAL TEST CONNECTOR/CABLE PULL: 1) Secure cable near center and pull on connector a. At 0, in-line with cable Fig. 1 (Typical set-up, actual part not depicted.) 0 Connector pull, notice the electrical continuity hook-up wires. Page 9 of 38

10 RESULTS Actual Test Results: Temperature Rise, CCC at a 20% de-rating CCC for a 30 C Temperature Rise A per contact with 1 contact powered (cable) CCC for a 30 C Temperature Rise A per contact with 1 contact powered (connector) ***Specified Cable Rating A Contact Gaps Initial o Min o Max After 100 Cycles o Min o Max Thermal o Min o Max Humidity o Min o Max Mating Unmating Forces ***All forces taken with latches removed*** Initial o Mating Min Lbs o Max Lbs Unmating Min Lbs Max Lbs After 100 Cycles o Mating Min Lbs Max Lbs o Thermal o Mating o Unmating Min Lbs Max Lbs Min Lbs Max Lbs Unmating Min Lbs Max Lbs Humidity o Mating o Min Lbs Max Lbs Unmating Min Lbs Max Lbs Page 10 of 38

11 Insulation Resistance minimums, IR Initial o Mated ,000 Meg Pass o Unmated ,000 Meg Pass Thermal o Mated ,000 Meg Pass o Unmated ,000 Meg Pass Humidity o Mated ,000 Meg Pass o Unmated ,000 Meg Pass Dielectric Withstanding Voltage minimums, DWV Minimums o Breakdown Voltage VAC o Test Voltage VAC o Working Voltage VAC Initial DWV Passed Thermal DWV Passed Humidity DWV Passed Page 11 of 38

12 LLCR Durability - Signals (200 LLCR test points) Initial mohms Max Durability, 100 Cycles o <= +5.0 mohms Points Stable o +5.1 to mohms Points Minor o to mohms Points Acceptable o to mohms Points Marginal o to mohms Points Unstable o >+2000 mohms Points Open Failure Thermal o <= +5.0 mohms Points Stable o +5.1 to mohms Points Minor o to mohms Points Acceptable o to mohms Points Marginal o to mohms Points Unstable o >+2000 mohms Points Open Failure Humidity o <= +5.0 mohms Points Stable o +5.1 to mohms Points Minor o to mohms Points Acceptable o to mohms Points Marginal o to mohms Points Unstable o >+2000 mohms Points Open Failure LLCR Durability - Grounds (50 LLCR test points) Initial mohms Max Durability, 100 Cycles o <= +5.0 mohms Points Stable o +5.1 to mohms Points Minor o to mohms Points Acceptable o to mohms Points Marginal o to mohms Points Unstable o >+2000 mohms Points Open Failure Thermal o <= +5.0 mohms Points Stable o +5.1 to mohms Points Minor o to mohms Points Acceptable o to mohms Points Marginal o to mohms Points Unstable o >+2000 mohms Points Open Failure Humidity o <= +5.0 mohms Points Stable o +5.1 to mohms Points Minor o to mohms Points Acceptable o to mohms Points Marginal o to mohms Points Unstable o >+2000 mohms Points Open Failure Page 12 of 38

13 LLCR Gas Tight - Signals (80 LLCR test points) Initial mohms Max Gas-Tight o <= +5.0 mohms Points Stable o +5.1 to mohms Points Minor o to mohms Points Acceptable o to mohms Points Marginal o to mohms Points Unstable o >+2000 mohms Points Open Failure LLCR Gas Tight - Grounds (20 LLCR test points) Initial mohms Max Gas-Tight o <= +5.0 mohms Points Stable o +5.1 to mohms Points Minor o to mohms Points Acceptable o to mohms Points Marginal o to mohms Points Unstable o >+2000 mohms Points Open Failure SUPPLEMENTAL TESTING Connector/Cable Pull Lbs min Page 13 of 38

14 DATA SUMMARIES TEMPERATURE RISE (Current Carrying Capacity, CCC): 1) High quality thermocouples whose temperature slopes track one another were used for temperature monitoring. 2) The thermocouples were placed at a location to sense the maximum temperature generated during testing. 3) Temperature readings recorded are those for which three successive readings, 15 minutes apart, differ less than 1 C (computer controlled data acquisition). 4) Adjacent contacts were powered: a. Linear configuration with 1 conductor/contact powered (cable) Maximum Current, Amp per Contact Room Temp= 23.7 C TC (1x1) Contacts in Series (Cable) Part Numbers: SEAC TU-TU / SEAF S-06-A-L-P Current Rating per Contact (30 Deg. Rise, 20% Derated) = 1.3 Amps C Limit Base Curve Derated 20 % RT Peak Amp RT Derated Amp Measured Current 40 C 40 C Peak Amp 40 C Derated Amp 50 C 50 C Peak Amp 50 C Derated Amp Limit 70 C Peak Amp 70 C Derated Amp 70 C Room Temp 0.5 Useful Range Ambient Temperature, C ***Specified Cable Rating A Page 14 of 38

15 b. Linear configuration with 1 conductor/contact powered (connector) Maximum Current, Amp per Contact Room Temp= 23.7 C TC (1x1) Contacts in Series (Connector) Part Numbers: SEAC TU-TU / SEAF S-06-A-L-P Current Rating per Contact (30 Deg. Rise, 20% Derated) = 2.6 Amps C Limit Base Curve Derated 20 % RT Peak Amp RT Derated Amp Measured Current 40 C 40 C Peak Amp 40 C Derated Amp 50 C 50 C Peak Amp 50 C Derated Amp Limit 70 C Peak Amp 70 C Derated Amp 70 C Room Temp 1.0 Useful Range Ambient Temperature, C ***Specified Cable Rating A Page 15 of 38

16 CONTACT GAPS: Initial After 100 Cycles After Thermal After Humidity Measured in inches Measured in inches Measured in inches Measured in inches Minimum Minimum Minimum Minimum Maximum Maximum Maximum Maximum Average Average Average Average St. Dev St. Dev St. Dev St. Dev Count 270 Count 270 Count 270 Count 270 MATING/UNMATING: ***All forces taken with latches removed*** Mating Initial Unmating Mating After 100 Cycles Unmating Force (Oz) Force (Lbs) Force (Oz) Force (Lbs) Force (Oz) Force (Lbs) Force (Oz) Force (Lbs) Minimum Maximum Average Mating After Thermal Unmating Mating After Humidity Unmating Force (Oz) Force (Lbs) Force (Oz) Force (Lbs) Force (Oz) Force (Lbs) Force (Oz) Force (Lbs) Minimum Maximum Average INSULATION RESISTANCE (IR): Pin to Pin Mated Unmated Minimum SEAC/SEAF SEAF Initial Thermal Humidity DIELECTRIC WITHSTANDING VOLTAGE (DWV): Voltage Rating Summary Minimum SEAC/SEAF Break Down Voltage 480 Test Voltage 360 Working Voltage 120 Pin to Pin Initial Test Voltage After Thermal Test Voltage After Humidity Test Voltage Passed Passed Passed Page 16 of 38

17 LLCR: 1) A total of 250 points were measured. 2) EIA , Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets. 3) A computer program, LLCR 221.exe, ensures repeatability for data acquisition. 4) The following guidelines are used to categorize the changes in LLCR as a result from stressing. a. <= +5.0 mohms: stable b to mohms: Minor c to mohms: Acceptable d to mohms: Marginal e to mohms unstable f. >+2000 mohms: open Failure SIGNALS Date Jun Jun Jun Room Temp C RH 52% 41% 46% 0% Name Troy Cook Troy Cook Troy Cook Troy Cook mohm values Actual Delta Delta Delta Initial 100 Cycles Thermal Humidity Average St. Dev Min Max Count GROUNDS Date 06/18/09 Jun Jun Jun Room Temp C RH 52% 41% 46% 0% Name Troy Cook Troy Cook Troy Cook Troy Cook mohm values Actual Delta Delta Delta Initial 100 Cycles Thermal Humidity Average St. Dev Min Max Count Page 17 of 38

18 GAS TIGHT: 1) A total of 100 points were measured. 2) EIA , Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets. 3) A computer program, LLCR 221.exe, ensures repeatability for data acquisition. 4) The following guidelines are used to categorize the changes in LLCR as a result from stressing. a. <= +5.0 mohms: stable b to mohms: Minor c to mohms: Acceptable d to mohms: Marginal e to mohms: unstable f. >+2000 mohms: open Failure SIGNALS Date Jan Jan Room Temp C RH 23% 23% Name RILEY Lomax mohm values Actual Delta Initial Gas Tight Average St. Dev Min Max Count GROUNDS Date Jan Jan Room Temp C RH 23% 23% Name RILEY Lomax mohm values Actual Delta Initial Gas Tight Average St. Dev Min Max Count SUPPLEMENTAL TEST Connector/Cable Pull 0 Deg. Pull DV Force (Lbs) Minimum Maximum Average Page 18 of 38

19 CONTACT GAPS: Initial Measured in inches Pos.# B1 B2 B DATA Page 19 of 38

20 Page 20 of 38

21 After 100 Cycles Measured in inches Pos.# B1 B2 B Page 21 of 38

22 Page 22 of 38

23 After Thermal Measured in inches Pos.# B1 B2 B Page 23 of 38

24 Page 24 of 38

25 After Humidity Measured in inches Pos.# B1 B2 B Page 25 of 38

26 Page 26 of 38

27 MATING/UNMATING: ***All forces taken with latches removed*** Initial After 100 Cycles After Thermal After Humidity Sample# Mating Unmating Mating Unmating Mating Unmating Mating Unmating INSULATION RESISTANCE (IR): Initial Insulation Resistance Measured In Meg Ohms Pin-Pin Mated Unmated X X Sample# SEAC/SEAF SEAC SEAF 1 100, , , ,000 Thermal Insulation Resistance Measured In Meg Ohms Pin-Pin Mated Unmated X X Sample# SEAC/SEAF SEAC SEAF 1 100, , , ,000 Humidity Insulation Resistance Measured In Meg Ohms Pin-Pin Mated Unmated X X Sample# SEAC/SEAF SEAC SEAF 1 100, , , ,000 Page 27 of 38

28 DIELECTRIC WITHSTANDING VOLTAGE (DWV): Voltage Rating Summary Minimum SEAC/SEAF Break Down Voltage 480 Test Voltage 360 Working Voltage 120 Pin to Pin Initial Test Voltage After Thermal Test Voltage After Humidity Test Voltage Passed Passed Passed LLCR: mohm values Actual Delta Delta Delta Board Position Initial 100 Cycles Thermal Humidity 1 P P P P P P P P P P P P P P P P P P P P P P P P P P P P P Page 28 of 38

29 2 P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P Page 29 of 38

30 4 P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P Page 30 of 38

31 6 P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P Page 31 of 38

32 8 P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P Page 32 of 38

33 10 P P P P P P P P P P P P P P P P P P P P P P P P P Page 33 of 38

34 GAS TIGHT: mohm values Actual Delta Board Position Initial Gas Tight 1 P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P Page 34 of 38

35 2 P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P Page 35 of 38

36 4 P P P P P P P P SUPPLEMENTAL TEST Connector/Cable Pull 0 Deg. Sample# Maximum Force (Lbs) Page 36 of 38

37 EQUIPMENT AND CALIBRATION SCHEDULES Equipment #: MO-04 Description: Multimeter /Data Acquisition System Manufacturer: Keithley Model: 2700 Serial #: Accuracy: See Manual - DO NOT USE UNTIL CALIBRATED. Last Cal: 04/06/09, Next Cal: 04/06/2010 Equipment #: HPM-01 Description: Hipot Megommeter Manufacturer: Hipotronics Model: H306B-A Serial #: M Accuracy: 2 % Full Scale Accuracy Last Cal: 11/24/08, Next Cal: 11/24/09 Equipment #: OV-03 Description: Cascade Tek Forced Air Oven Manufacturer: Cascade Tek Model: TFO-5 Serial #: Accuracy: Temp. Stability: +/-.1C/C change in ambient Last Cal: 06/17/2009, Next Cal: 06/17/2010 Equipment #: THC-01 Description: Temperature/Humidity Chamber Manufacturer: Thermotron Model: SM Serial #: Accuracy: See Manual Last Cal: 04/07/2009, Next Cal: 04/07/2010 Equipment #: TCT-04 Description: Dillon Quantrol TC mm/min series test stand Manufacturer: Dillon Quantrol Model: TC2 I series test stand Serial #: Accuracy: Speed Accuracy: +/- 5% of indicated speed; Speed Accuracy: +/- 5% of indicated speed; Last Cal: 5/12/2009, Next Cal: 5/12/2010 Equipment #: MV-05 Description: 6" x 6" Video Measuring Machine Manufacturer: Micro-Vu Model: M Serial #: V9344 Accuracy: See Manual Last Cal: 02/10/2009, Next Cal: 02/10/2010 Page 37 of 38

38 Equipment #: TCT-03 Description: Dillon Quantrol TC2 Test Stand Manufacturer: Dillon Quantrol Model: TC2 Serial #: Accuracy: Speed Accuracy: +/- 5% of indicated speed; Speed Accuracy: +/- 5% of indicated speed; Last Cal: 5/12/2009, Next Cal: 5/6/2010 Equipment #: MO-01 Description: Micro-Ohmeter Manufacturer: Keithley Model: 580 Serial #: Accuracy: See Manual Last Cal: 06/16/09, Next Cal: 06/16/2010 Equipment #: MO-03 Description: Multimeter /Data Acquisition System Manufacturer: Keithley Model: 2700 Serial #: Accuracy: See Manual Last Cal: 06/16/09, Next Cal: 06/16/2010 Equipment #: MO-06 Description: Micro-Ohmeter Manufacturer: Keithley Model: 580 Serial #: Accuracy: See Manual Last Cal: 06/16/2009, Next Cal: 06/16/2010 Equipment #: MO-07 Description: Multimeter / Data Acquistion System Manufacturer: Keithley Model: 2700 Serial #: Accuracy: See Manual Last Cal: 6/16/2009, Next Cal: 6/16/2010 Equipment #: OV-5 Description: Nitrongen Purge IR Reflow Manufacturer: Vitronics Soltec Model: XPM-730 Serial #: XN Accuracy: +/- 5 deg. C Last Cal: 02/19/2009, Next Cal: 02/19/2010 Page 38 of 38

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DESIGN VERIFICATION TEST REPORT ERCDA SS-TD-TU. Mated with ERF L-DV-L

DESIGN VERIFICATION TEST REPORT ERCDA SS-TD-TU. Mated with ERF L-DV-L Project Number: Tracking Code: TC0810--1621 Requested by: John Riley Date: 05/27/2008 Product Rev: 0 Part #: ERCDA-25-09.00-1SS-TD-TU Lot #: N/A Tech: Eric Fox & Daniel Borgelt Eng: Troy Cook Qty to test: