Advances in Intense Pulsed Light Solutions For Display Manufacturing. XENON Corporation Dr. Saad Ahmed Japan IDW 2016

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Marion Webb
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1 Advances in Intense Pulsed Light Solutions For Display Manufacturing XENON Corporation Dr. Saad Ahmed Japan IDW 2016

2 Talk Outline Introduction to Pulsed Light Applications in Display UV Curing Applications Printed Electronics Tools Available for R&D Indexed Production Systems

3 Potential Applications for Intense Pulsed Light in Displays

UV Curing Application Most Famous Case Optical Disks Optical Disk Manufacture Nearly all Blue Ray Disk use Pulsed light for Manufacturing The process requires intense puled UV light and uniform cure.

4 UV Curing Application Most Famous Case Optical Disks Optical Disk Manufacture Nearly all Blue Ray Disk use Pulsed light for Manufacturing The process requires intense puled UV light and uniform cure. No temperature rise in substrate to avoid warping Custom designed uniform Light Sources UV Curing of Special coating on Lenses Optical transmissivity require chemical reactions outside the visible spectrum ( i.e. UV ) Cant use Lasers to produce Large area uniform Coatings Optical Disk and a special UV Lamp for Curing

energy field it goes from being an insulator to a conductor Excitation and recombination of ions within the arc plasma

5 Flash Lamps Xenon flash lamps have a broad spectrum of Light from deep UV to IR. Typically used for Curing and Sterilization where high photon energy is required When Xenon gas is broken down due to a high energy field it goes from being an insulator to a conductor Excitation and recombination of ions within the arc plasma creates light. The envelope used can determine the spectral content of the lamp Lamps can explode due to excess energy through lamp Typically operate at 10% of explosion energy

6 Pulsed vs. Continuous If we try to expend 100 Joules of energy we can do it in two ways 10 Watt lamp for 10 Seconds or 1 Megawatt pulse for 1 micro second. Continuous systems like mercury or halogen lamps cannot deliver these kinds of peak power. High peak power means the system is more efficient at delivering useful energy Intensity attenuates as it penetrates into a material so peak power phenomenon allows for deeper penetration depths Shorter pulse duration means that the process can take place quicker Pulsed is instant on-off. It is harder to do that with continuous systems Pulsed systems can be frequency adjusted to allow time for cooling

7 Current Printed Circuit Process Current process for printed electronic system requires multiple process steps They do not lend themselves to Reel-to-reel Systems Flexible substrates Low Temperature Substrates Complex steps A simpler process would be to print conductive traces and cure to form conductive traces

Photonic Sintering Basic Low temperature sintering of metal inks are possible because when particles become small their melting point is reduced.

8 Photonic Sintering Basic Low temperature sintering of metal inks are possible because when particles become small their melting point is reduced. This phenomenon is called Melting Point Depression When particles become small their absorption characteristics change Nanotechnology is where particles are in the range of 1 to 100nm in size and it is at this particle size that these special effects take place Nano conductive inks can absorb light and sinter at a low temperature. Once sintered they behave like bulk material Melting point depression of Gold nanoparticles Quantum Dots are same material but with different size which changes color

9 XENON Corp- An Introduction We manufacture High Energy Pulsed Light systems for industrial applications. We began in 1964 developing high energy pulsed lamps for Laser Pumping. We have 50 years of experience with our core technology of pulse light. Over 3,000 pulsed light systems worldwide on Industrial Production lines. Our Markets Include: Photonic Sintering Optical Disk Manufacture Pulsed UV Sterilization Display Surface Treatment We manufacture in the U.S.A. our own Lamps and Electronic systems We build the engine that integrates into industrial systems that need to run 24/7 Pulsed light is our expertise we pick up where other sources cannot compete in terms of energy, peak power and low temperature

applicable for In-line Roll to Roll Process A process

10 Thin Films for HDI Current process for creating thin copper films uses Vacuum Sputtering This is not applicable for In-line Roll to Roll Process A process alternative is to use Slot dye Copper ink and Photo Sinter Etch Plate

Advantages of Copper Sintering Process Coating with IM s nano

5-2um thickness copper foil over polyimide, single or double sided.

11 Advantages of Copper Sintering Process Coating with IM s nano copper solution will achieve 0.5-2um thickness copper foil over polyimide, single or double sided. Ultra thin FCCL can be used by traditional plating and etching process to achieve thin lines. It has smooth copper/polyimide interface, easy to make and low cost. Porosity of Sintered copper makes it easy to etch for better profilometry <100um

copper foil and polyimide, help signal integrity for high speed

12 Advantages Continued Uses Minimal Nano-ink for lower cost Uses Standard Processes Double Side Possible Smooth interface between copper foil and polyimide, help signal integrity for high speed applications. Nano- SEED layer (IML) Electroless Copper (ATO) Polyimide Substrate

Their size can be tightly controlled They can show improvement in their functionality with multiple pulses

13 Silver Sintering Silver inks are well suited to photonic sintering Both silver and its oxide are conductive Formulation and manufacture of silver nano inks are easier and more prevalent Their operational window is large Their size can be tightly controlled They can show improvement in their functionality with multiple pulses (contrary to the concept of nanoparticle advantage) SEM of Silver Nano particle 5-6nm in size AG Film on PET After sintering

14 Advantages of Photonic Sintering Conventional method of sintering conductive inks is to use low temperature ovens The time to achieve sintering is many minutes and not suited to Roll to Roll process Photonic sintering can take place in fractions of seconds Photonic sintering is a non contact process It requires no additional chemicals or special environment It is a low temperature process allowing use of low temperature flexible substrates like paper and PET It is easy to configure for different ink types, substrates and printing process. It can be fitted inline with an existing process without taking the space required for ovens or off-line solutions.

display for precise control of process parameters with tachometer speed control.

15 S-5100 Wide Web R2R First true Wide width Photonic Sintering System Multiple 50in Lamp housing with 1m wide web capability (system shown can drive 4 50in Lamps) Touchscreen display for precise control of process parameters with tachometer speed control. Unprecedented uniformity along length +-5% High power 5J/cm 2 Modular design for scalability

16 Modular Units for Integrators Automation Proven Flexible Integration High Volume Pricing Over 3,000 Systems Online

17 Thank you Questions and Comments

LOW TEMPERATURE PHOTONIC SINTERING FOR PRINTED ELECTRONICS. Dr. Saad Ahmed XENON Corporation November 19, 2015

LOW TEMPERATURE PHOTONIC SINTERING FOR PRINTED ELECTRONICS Dr. Saad Ahmed XENON Corporation November 19, 2015 Topics Introduction to Pulsed Light Photonic sintering for Printed Electronics R&D Tools for