Deposition Technology Equipment for Perpendicular Magnetic Recording Media

Transcription

1 Deposition Technology Equipment for Perpendicular Magnetic Recording Media Luke Marusiak Intevac, Chief Operating Officer Diskcon Asia Pacific March 2006 Think Lean Create Value

2 Computers hipped (Units/Yr) M Growing End Market for Hard Drives Emerging Country PC Markets Growing Rapid Growth in Consumer Applications External Hard Disk Drives otebook PCs Mobile Phone Digital Camcorder Automotive Digital Photo Digital Audio Digital Video Recorder Interactive Gaming Desktop PCs ervers & torage ub-ystems ource: Forrester Research Year ~ 32% CAGR Disks Per Hard Drive Increasing Areal Density Growth lowing Areal Density Growth 100% 60% 40% ource: Komag Investor Relations Overview 12/05 Disks Per Drive (Est.) 03/01/06_DIKCO_lide 2 Hard Drives (Millions Per Year) Global Hard Disk Drive Forecast Consumer Electronics Information Technology Information Technology HDTV Consumer Electronics ource: TrendFocus 2005

3 Perpendicular Transition % LMR / PMR Perpendicular Longitudinal ource: Coughlin Associates 03/01/06_DIKCO_lide 3

4 Perpendicular Transition < >2010 < 80GB 160 (Platter Capacity) Longitudinal 240 Perpendicular > 600GB 12 Process teps Process teps 03/01/06_DIKCO_lide 4

5 HDD Industry Technology Roadmap Technology LMR PMR Discrete Bit (Patterned) 0.11 Tb / in Tb/in 2 LMR 7nm 6nm 0.2 Tb/in Tb/in 2 Conventional PMR 0.4 Tb/in 2 5nm 1.3 Tb/in 2 Heat Assisted PMR 3.5nm 2.0 Tb/in 2 Patterned 1.0nm Continual Evolution in Areal Density & Grain izes Required 03/01/06_DIKCO_lide 5

6 Perpendicular Film tack Lubricant Carbon Overcoat Co-alloy Co Alloy (Reactive) Interlayer 2 Interlayer 1 oft Underlayer 2 Break Up Layer oft Under Layer 1 Pinning eed Layer Key Requirements urface moothness Corrosion Protection, Density Composition (Reactive) urface & Grain Control Magnetic Domain Uniformity Al or Glass ubstrate Multiple Layers With pecific Requirements 03/01/06_DIKCO_lide 6

7 ew Equipment Requirements 20+ Process teps Thick Layer Deposition (UL) Thin Layer Deposition (Interlayers) Reactive Deposition Uniform Fast Heating Cooling in a Magnetic Field Denser Thinner Carbon Overcoat Uniform Thin Lube Layer ew Film Requirements Drive ew Equipment Designs 03/01/06_DIKCO_lide 7

8 ource Technology Requirements Robust Design for all Pole/Target Combinations ew Magnet Poles for ew PMR Materials Magnet Poles High Target Utilization Full urface Erosion puttering With Thicker Targets Ability To Effectively Utilize Lower PTF Targets Consistent Good Film Uniformity Over Target Life UL Pole: Adjustable For Customer pecific Applications ynchronized and A-synchronized Rotation Modes Robust Designs Optimized For pecific Film Requirements 03/01/06_DIKCO_lide 8

9 ew Pole Requirements UL Pole High Field trength (1920G) Thick Targets (>0.25") High Target Inventory (25 MÅ) High Utilization > 50% UL Pole Designed For High Utilization and High Target Inventory 03/01/06_DIKCO_lide 9

10 High Utilization of All Films Target profile (in) 0.250" 0.25" FeCoXY Alloy Erosion Profile at 105 kwhrs Current Future Target radius (in) Material Mean Bt@Bz~0 Target Tested Target Utilization(TU) Full urface Erosion Maximum Target Thickness UL 1920 G FeCoB 47% Yes >0.25 >7%PTF CoTaZr 47% Yes >0.32 Mag 1060 G Co7Cr 58% Yes >0.32 >50%PTF on-mag 970 G Cr 60% Yes > 0.50 >65%PTF Poles Designed For High Utilization and High Target Inventory 03/01/06_DIKCO_lide 10

11 Uniformity Optimization Methods ource-to-ubstrate Distance (Target-to-Disk) Z Position Adjustment (Distance from Magnet to Heatsink) Pole Rotation Mode, Async Vs ync UL Pole Magnet Position Adjustment 2 (T2D) Z ync d / Async d Magnet Disk ync d / Async d Target Film Uniformity Is Key 03/01/06_DIKCO_lide 11

12 ormalized thickness Uniform Films CoCr Disk radius (mm) ormalized thickness Disk radius (mm) Uniform Films 03/01/06_DIKCO_lide 12 ormalized thickness CoTaZr < 1% (1σ) < 1% (1σ) ormalized thickness = (Average thickness at a radius) / (Average thickness for disk surface) Cr < 1% (1σ) Disk radius (mm)

13 Reactive Deposition Requires ew Gas Distribution Uniform Oxygen Reactive Gas Distribution Binary Injection Inside the hields, Into Dark-pace at Eight ymmetric Points Binary Channels in Custom hield tandoff Disk Gas In Target Dark-pace Between Ground and High Voltage Binary Channels tandard Orifices Blocked 03/01/06_DIKCO_lide 13

14 CT Carbon Overcoat CT Carbon Deposition ource Ultra-Thin (< 20Å) Excellent Corrosion Resistance High Density Carbon Production Proven Production Proven Ultra-Thin, High-Density Carbon Overcoat Technology 03/01/06_DIKCO_lide 14

15 Rapid Heat Technology Efficient and Uniform Heating (3.7%) for Glass & Aluminum Disk ubstrates Fast Ramp Heating *>220.0 C Resistive Carbon Element for Heat Transfer Greater Than 30ºC/kW-s Heating Rate on Glass Disks *<150.0 C Uniform, Fast Heating 03/01/06_DIKCO_lide 15

16 Dynamic Cooling tation High Rate Cooling Chamber for Efficient and Rapid Cooling Capability Capable of Cooling in a Magnetic Field (> 150G Radial Field) ecessary for UL Domain Orientation High Cooling Rate in a Magnetic Field 03/01/06_DIKCO_lide 16

17 Disk Rotation Designed for Glass Disk Processing (Bias Capability) 100% Metal Coverage Provided 10º Rotation Between Metal putter teps Glass Disk Capability 03/01/06_DIKCO_lide 17

18 mall Form Factor Capability mall Form Factor Capability Five Disks Per Carrier Five mall Factor Disks 03/01/06_DIKCO_lide 18

19 Lube Coating Technology DL-100 Gravity Lube ystem Production Proven Gravity Drain Disk Lubrication Lubricant Uniformity +/-1 Angstrom Vapor Lube Capability (Under Development) Lowers Cost and Enhances Corrosion Performance Extending Production Proven Lube Technology 03/01/06_DIKCO_lide 19

20 Future Applications / Requirements Production Proven: LMR, PMR Heat Assisted Perpendicular High temperature anneal Discrete Bit Patterned Media Keeping Up With Future Industry Requirements 03/01/06_DIKCO_lide 20

21 Questions? Running Perpendicular 03/01/06_DIKCO_lide 21