Technical Data Sheet DiPaMat TM Etch resist ER01 UV curable inkjet ink fr printing etch resist Octber 2017
PRODUCT verview Descriptin DiPaMat TM Etch resist ER01 DiPaMat TM Cleaning Slutin 01 02 Packing unit 2 x 1 L 2 x 1 L Order cde 4ORF8 4NQRK Technical Datasheet ER01 Page 2/7 ab
DiPaMat TM Etch Resist ER01 ink is a nn txic, blue UV-curable inkjet fr printing n metals and fits in currently used industrial prcesses f etching and stripping. The ink is designed t transfer by means f inkjet technlgy the etch resist pattern n metals. The metal can be cpper t prduce inner layers f a printed circuit bard but n ther metals it can be used fr chemical milling applicatins. The high cntrast image printed with industrial print heads with stands acid etching and can be stripped in alkaline stripping slutins. FEATURES - Blue UV curable ink generating high cntrast image - Fast UV curing with dped, nn-dped Hg bulb and ther UV lamp types - Fast UV curing with LED (395nm, 385nm and 365nm) - Excellent jetting perfrmance and rbustness n industrial print heads - Excellent image quality - Reliable reprductin f 75-100 µm sharp lines and spacings - Gd adhesin prperties n cpper (functin f cpper cleaning), brass, stainless steel etc. - Excellent shelf life - Nn txic, ROHS cmpliant, halgen free, n CMR s, n vlatile rganic cmpnents - Etch resistant in industrial acid etching slutins ( FeCl3 and CuCl2) - Strippable in industrial alkaline stripping slutins (NaOH, KOH, amin ethanl, ) INK PROPERTIES - Clr: Blue - Static Surface Tensin: 35.0 38.0 mn/m @ 25 C (Krüss K9 Tensimeter) - Density (25 C): 1.08 1.10 g/cm³ (Paar DM60/DMA602) - Viscsity : 8.5 10.5 mpa.s (45 C @ shear rate 1000 s-1 Haake Rtvisc 1) - Dynamic viscsity (AR2000 Rhemeter) Technical Datasheet ER01 Page 3/7 ab
PRETREATMENT Image quality, adhesin, etching perfrmance and stripping behaviur is in relatin t metal cleaning. Specifically fr cpper, it is strngly recmmended t perfrm a cleaning step f the cpper prir t printing. An effective cleaning prcedure is spraying r dipping the cpper panel in MecBrite CA-95 slutin during 5 secnds (micr etching) fllwed by rinsing with water fr 90 secnds. Other cleaning prcedures are suitable as well. Please cntact the Agfa representative. Fr ther metals, a prper cleaning and degreasing specifically fr the used metal is highly recmmended. PRINTER / PRINTHEAD PLATFORM - Suitable in printing systems equipped with industrial piez print heads - Typical printing mde fr DiPaMat TM Etch resist inks includes : Jetting temperature : brad windw, typical jetting at 38 C t 45 C Printing mde : suited fr binary printing and grey scale printing Imprtant nte: These settings are shwn as example. The peratin mde is nt limited t these settings. Furthermre, the printing mde depends n the chice f the substrate, printing reslutin, etc. APPROVED BY DiPaMat TM Etch Resist Ink ER01 is tested and apprved by these printer manufacturers: Micrcraft First EIE Meyer Burger www.micrcraft.jp www.firsteie.cm www.meyerburger.cm CURING DiPaMat TM Etch resist Ink ER01 is develped fr curing by bth bulb and/r UV LED curing. Curing by bulbs is pssible by bth H-bulb (undped) and D-bulb (Fe-dped). Curing with UV LED is fastest by LED with wavelength f 365 395 nm (fr current LEDs). Fr reference f cure dse, Agfa has tested the cure dse needed fr full cure f a slid patch f ink (btained fr drawdwn cating) and evaluating different cure speeds: - Drawdwn cating with 10 µm wet thickness n PET - Curing with bulb f type H-bulb (Fusin UV). - UV readings with UV PwerPuck 8651 fr curing at 10 m/min and lamp at 100% dse Speed 10m/min 100% Irradiance Energy Density Pwer Puck 8651 UV A 2587 mw/cm² 688 mj/cm² UV B 2050 mw/cm² 505 mj/cm² UV C 433 mw/cm² 106 mj/cm² UV V 1508 mw/cm² 383 mj/cm² Printing Speed Lamp dse H-bulb ER01 # f passes 20 m/min Full lamp OK 1 50 m/min Full lamp OK 1 70 m/min Full lamp OK 1 Technical Datasheet ER01 Page 4/7 ab
Nte: if nt cured at certain speed in ne pass, mre passes are dne until full cure Nte: evaluatin f curing is that full cure is reached when the surface f the cured cating cannt be damaged by gentle rub with dry cttn tp (Q-tip) Nte: thermal pst treatment is pssible but nt required. - Curing with UV LED Phsen Fireline 8 W 395 nm - UV readings with PwerPuck 16506 fr speed f 10 m/min Speed 10 m/min 8 W Irradiance Energy Density 395 nm Phsen Pwer Puck 16506 UV A2 5152 mw/cm² 712 mj/cm² Printing Speed Lamp dse H-bulb ER01 # f passes 5 m/min Full lamp OK 1 10 m/min Full lamp Nt fully cured in ne pass 2 Nte: if nt cured at certain speed in ne pass, mre passes are dne until full cure Nte: evaluatin f curing is that full cure is reached when the surface f the cured cating cannt be damaged by gentle rub with dry cttn tp (Q-tip) Nte: each supplier f UV LEDs refer t W/cm² utput f the LED, but it is recmmendable t verify the cure speed fr each specific LED. Nte: thermal pst treatment is pssible but nt required. Please nte that this indicative methd is based n curing f a 10 µm cating. The actual curing dse in the print system / applicatin will be dependent n the print mde (especially the printed ink vlume), the print speed, the curing system and the way it is installed (including the distance between substrate and the lamp / LED). Fr ER01 it is nt necessary t btain full curing: It is even better t cure at lwer dse t have less degradatin f the dye (cntrast can be reduced at t high UV dse) and better etch resistance ER01 is faster n reflective material (metals) ETCH RESISTANCE The printed ink is etch resistant in the fllwing etching slutins up t 20 minutes: Acid Ferric Chlride Acid FeCl3 35-50 C Pass Cpper Chlride CuCl2 35-50 C Pass Technical Datasheet ER01 Page 5/7 ab
STRIPPING BEHAVIOUR DiPaMat Etch Resist ER01 can be stripped in a variety f industrial stripping slutins and cnditins: Strng alkaline NaOH 2 6.5% 45-60 C Pass KOH 3% 45-60 C Pass 2-aminethanl 5% 45-60 C Pass Na2CO3 3% 50 C Mderate K2CO3 3% 50 C Mderate During stripping the ink layer will immediately break dwn int flake sizes f 5 t 10 mm depending n the type f curing lamp and stripping chemistry applied. Fig. Flake frmatin during stripping PERFORMANCE IN PCB Finally the reprduced cpper pattern is suitable t generate reliable and sharp cnductr lines f less than 75 µm when printed with a KM1024SHB print head n CA95 cleaned cpper laminate. Line width and quality are dependent n the cleaning prcedure f the cpper surface, the drp vlume f the print head, print reslutin and etching prcess (slutin temperature, spray pressure, etching time). Typical line reductin is 20 t 30% depending n the cpper thickness. Perfrmance prven fr cpper thicknesses f 18 and 35 µm. Fig. Line pattern f DiPaMat Etch Resist after etching/stripping Technical Datasheet ER01 Page 6/7 ab
PACKAGING DiPaMat TM Etch resist Ink ER01 is available in 1 L bttles. One rder cde is ne shipping cartn that cntains 2 bttles. SHELF LIFE 12 Mnths when stred under recmmended cnditins STORAGE Recmmended strage cnditins (in Agfa bttles) - 4 C t 23 C (39 F t 75 F): - Out f direct sunlight - Away frm heat and (UV)-radiatin surces ENVIRONMENTAL, HEALTH & SAFETY The DiPaMat TM Etch resist Inks have been develped in accrdance with Agfa s envirnmental plicy and respnsibility fr its prducts. The ingredients used in these UV curable inks have been specifically selected t have n txicity and can be safely handled as lng as rutine precautins are taken. Fr infrmatin n ingredients as well as n recmmendatins r infrmatin n envirnmental, health and safety issues, we refer t the Material Safety Data Sheets (MSDS) f these inks. DiPaMat is a trademark f AGFA. Ink develpment and manufacturing prcesses are executed accrding t the Quality Management System f Agfa, which is ISO9001 certified. Disclaimer: The infrmatin and recmmendatins cntained in this Technical Datasheet are based n AGFA in-huse testing f the prducts, accrding t ur knwledge. Hwever, n guarantee is given regarding the applicability fr any specific applicatin f these prducts, because the results may vary with variatin in the substrates and specific cnditins. All users shuld therefre make their wn tests t verify that any particular requirement fr the printing prcess and fr the end-user are fully met when using the AGFA prducts. While all infrmatin in this Technical Datasheet is prvided in gd faith the users bear sle respnsibility fr the use f the AGFA prducts fr their specific user applicatins. Visit ur website: http://www.agfa.cm/dipamat Yu can cntact us by e-mail: industrialimaging@agfa.cm Technical Datasheet ER01 Page 7/7 ab