Section 5 Curing, Draping, and CAD Interface. Composites Technology Day, February 2012 Copyright 2012 MSC.Software Corporation S1-0

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1 Section 5 Curing, Draping, and CAD Interface S1-0

2 Curing and Shrinkage during Manufacturing S5-1

3 MSC Composite Curing Capability Cure-induced heating and curing shrinkage Thermal heat generation due to curing Shrinkage strains associated with curing Causes distortion and residual stress in parts Prediction is critical for predicting final shape Coupled thermo-mechanical analysis Critical capability for process development Available for solid and shell elements Marc has this unique capability in the industry S5-2

4 Thermal-Cure-Mechanical Analysis Cure analysis is done to evaluate the degree of cure and curing reaction heat flux Cure rate evaluation is based on temperature and curing kinetics models Curing heat flux term due to the change of degree of cure is added to RHS of heat transfer pass An iterative time integration scheme has been developed so that the degree of cure is accurately calculated for the heat transfer pass Fraction of cure and temperatures are transferred to Mechanical pass Volumetric Resin Shrinkage is incorporated in the Mechanical pass Degree of Shrinkage is defined as function of degree of cure and temperature Curing Shrinkage Strain Components are calculated based on the volumetric resin shrinkage Post processing data includes degree of cure, curing heat flux, resin shrinkage strains User subroutine support for curing kinetics and curing shrinkage models S5-3

5 Thermal-Cure-Mechanical Analysis Flow Start of Thermal Cycle (Cure pass) Cure rate Reaction Heat flux Degree of cure Temperatures No Thermal pass End of Thermal Cycle Mechanical pass Yes Converged? S5-4

6 Laminate Forming Example Load case Heating and Forming Boundary conditions: Pressure Vacuum Temperature Pressure Vacuum Temperature S5-6

7 Laminate Forming Example Load case Base movement Boundary conditions: Pressure Vacuum Temperature Base move Base Dx Dx=0.002 Dy=0.002 Dy S5-7

8 Laminate Forming Example Load case Spring-back Boundary conditions: Pressure Vacuum Temperature Release_x Release_y Fix_z Release_x Release_y S5-8

9 History Plot: Degree of Cure & Degree of Cure Shrinkage S5-9

10 Shrinkage Strain S5-10

11 Residual Stresses (Before Springback) A. With Curing B. Without Curing A B S5-11

12 Residual Stresses (After Springback) A. With Curing B. Without Curing A B S5-12

13 Case Study : Sikorsky S-92 Helicopter 0 /90, +/- 45 Orthotropic Layup S5-13

14 Case Study Springback.35 actual.345 predicted S5-14

15 Draping and CAD Interface S5-15

16 Laminate Modeler An add-on to Patran Process simulation Ply based approach Ply draping Ply management allows for rapid modifications during model development Account for thickness and fiber direction changes in draped plies Model manufactured component accurately including splits/darts Direct interface to CAD S5-16

17 PCOMP Layers Global Plies Why Laminate Modeler? Real structures aren t flat plates Complex curvature requires draping Manufacturing: Flat pattern development Analysis: Accurate orientation information Complex layups require ply management PCOMP 1 PCOMP 2 PCOMP 3 Fiber orientations PCOMP 4 Countless plies Ply drop-off Element CID misalignment Results in countless PCOMPs and changes become costly Layer 5 Layer 4 Layer 3 Layer 2 Layer 1 Ply E Ply D Ply C Ply B Ply A Elements S5-17

18 Ply Draping Simulation Example Ply layup on hemisphere improved with splits S5-18

19 Direct CAD Interface - FiberSIM PCOMPs CATIA Layup info Nastran Optimization FiberSIM Patran/LM Analysis S5-19

20 Interface to FiberSIM Directly access layup data from FiberSIM FiberSIM plies and layup files are imported and mapped onto analysis mesh S5-20

21 Concluding Remarks MSC has a strong composites solution meeting your end-to-end product development process simulation needs Nastran/Patran/Laminate Modeler supports this composites solution workflow As required, Marc can easily be incorporated into this workflow to provide additional capabilities S5-21

22 Source: Frank Doerner, MSC 2011 User s Conference Keynote Speaker S5-22

23 Thank You! S5-23