Why HB Automation s Reflow system

Transcription

1 Why HB Automation s Reflow system 2015/6/29 1

2 HS series reflow oven offers: Totally meet the high requirements of lead free process; PLC+PID control system for stable temperature accuracy and uniformity. Easy maintenance reduce downtime Multi options available includes dual lane, nitrogen system, center support system; 2015/6/29 2

3 TP series reflow oven offers Powerful cooling performance with 3 up + 3 down cooling zone; Updated heating technology for power saving Longer heating length for lead free process Excellent flux management system 2015/6/29 3

4 Soldering theory 2015/6/29 4

5 The two key purposes for soldering: 1. Electrical and power conduction 2. Durable solid mechanical connection strength The temperature of the solder joints must be up to about 15 C above the melting point of solder, and maintains a certain amount of time. At this time of the solder joints can send chemical reaction, and in between welding plate and components pins to form a kind of new chemical substances, which is known as the intermetallic compounds, persistently makes strong connection. 2015/6/29 5

6 Lead free process puts forward a new challenges to reflow soldering oven system! PWI c 2015/6/29 6

7 The temperature ΔT caused by the different of the heat capacity of different components T e em er re ffere ce g etwee e g com e sma com e 2015/6/29 7

8 Accepted PWI Accepted PWI Liquid phase solid phase Liquid phase solid phase 2015/6/29 8

9 What is mportant in the lead free reflow soldering sys em? 2015/6/29 9

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11 In a reflow oven, the efficiency of the heat transfer has a primary effect on all aspects of quality. Productivity and running costs directly influence profitability. Our heat transfer guarantees a minimum ΔT which translates into maximum profile flexibility. 2015/6/29 11

12 The foundation of excellent heat transfer in the reflow is our in-depth understanding of convective heat generation, transfer and management. Our heater generate the desired temperature faster than any other reflow heat source and respond in less than half a second to temperature change of less than 0.1 C thus maintaining the highest level of temperature repeatability. The heater modules in the oven are also unique in heating air on the intake, allowing it to be blended into a uniformly mixed air blanket. 2015/6/29 12

13 In a reflow oven, the thermal uniformity has a primary effect to determine if the reflow process can be easily and quickly put into production or not. With our latest design in the air chamber, it offers a combination of innovation and industry-proven technologies in an easy to-use, reliable and efficient reflow system. Our innovative approach to thermal transfer delivers highly efficient heat transfer throughout the entire process. 2015/6/29 13

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15 mu -gear rack ar r ec Temper e re segme clear v erfere ce e ee e z e much. 2015/6/29 15

16 Full onsi ring diff CTE of diff al, the sp al s uctural design uaran the s abili of ail in lif -us is without an def tion in the high atur en onment. High quality Aluminum alloy with the special hardness surface treatment which is best for higher temperature in the lead free process!!! 2015/6/29 16

17 No vibration design in the rail Lead-free solder is no longer a eutectic alloy. At the 222 C to 217 C during the cooling process, the rail guide will not be allowed any vibration so that it can avoid to produce disturbance solder joints. 2015/6/29 17

18 The center support system with a retractable thimble design which allows the bottom clearance of PCB 25mm 2015/6/29 18

19 The al supp ult a-light design with high s th hani al prope i and is o high atur is no hea shielding ff on CB. The center support with a special parking sign which allo s the supp pins hidden un the chain and also ensu a fl xibl l on f diff uirements of different size PCB s lead free process. 2015/6/29 19

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21 Preheating, soldering and cooling zone multistage flux collection system. The friendly design of our reflow oven not only lowers waste gas emissions, but it also enhances flux recovery to reduce build up a flux residue inside the oven. 1. High powerful flux management modular; 2. Easy to access for cleaning; 2015/6/29 ting zone flux oll on s s

22 Full accessibility to cleaning the flux residue is accomplished through removable filters (front and back). 2015/6/29 22

23 Innovative Cooling Technology Air flow dynamics within cooling zones are efficiently controlled for a balanced environment and reduced exhaust temperatures. Air exhaust system in the cooling zone for the forced air cooling standard configuration significantly reduces the potential for flux dripping in the cooling area. Excellent separation between the heating and cooling areas produces tight control of TAL Enhanced water chiller cooling design achieves maximum airflow balance and reduces nitrogen consumption by 20 to 25%. 2015/6/29 23

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25 Heat preservation The oven has the new patented design in heating temperature protection to prevent the thermal loss, especially in the position of motor temperature insulation and the back surface of the oven. 2015/6/29 25

26 High efficient Heat preservation Lead free processes require higher temperatures but the surface of the oven should not be hot. Our surface temperature on the oven is only 5 C to 10 C above the factory environmenttemperature. 2015/6/29 26

27 Hermetic in the oven For a nitrogen reflow oven, if there is any smaller pinhole, it will cause to increase the nitrogen consumption!!! Full hermetic + multi-level Heat preservation = below 500PPM, 20m³/h- 21m³/h nitrogen consumption. 2015/6/29 27

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29 World -class Branded electrical parts: SIEMENS, GAVAZZI, Schneider, AB, Yamatake, NEMICON,SANYU CE certificates supported 2015/6/29 29

30 Thank you! HB Automation Equipment Co.,Ltd Add.: Haobao industrial park,no.43,xin Er Hong Road,Shajing,Shenzhen,China Tel.: ;Fax.: Website: Agents spread: UK, Spain, Italy, Benelux, Poland, Lithuania, Hungary,Russia. Cupio Ltd unit 2 & 62 Basepoint, 1 Winnall Valley Road, Winchester, Hampshire, SO23 0LD, UK. Tel: +44 (0) info@cupio.co.uk 2015/6/29 30