Markets / Customers. Fabless Semiconductor Companies Military / Space Automotive Medical IDM. 2 page 2
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1 Company Overview a semiconductor engineering and services company
2 Markets / Customers Fabless Semiconductor Companies Military / Space Automotive Medical IDM 2 page 2
3 Locations / Certifications Locations Currently 55 Employees Main Site Austin Texas, 20,000 sq. ft 2 nd Site Penrose Colorado, 15,000 sq. ft. Certifications Quality Systems Provide Framework Documentation Controls and Procedures ISO 9001:2008 ISO certified expected Q1, 2013 MIL-PRF / MIL-STD-883 DSCC Class Q Assembly and Test DSCC Lab Suitability (Reliability & ESD Testing) Quality Road Map: MIL-STD 19500/750 AS page 3
4 Trusted Sources Accreditation 4 page 4
5 Services Turn Key Product Support & Engineering Test Program Development Wafer Probe Package Test Package Development Production Package Assy Tape & Reel Quick Turn Proto Type Package Assy Counterfeit Parts Analysis ESD Testing Enhanced Capabilities DPA Device Upscreening Device Qualification 5 page 5
6 Test Services (2) Diamond LTX-Credence 384 Pin PMU s, 200Mhz 16 power supplies 3.2G max scan chain 16 four quadrant VIS channels Multiwave 24 bit (4) A/D and (4) D/A 64 DIBU drivers 100+ site wafer probe support Lab View / PXI Test Platform Lab View Pro with Test Step 24 pin PMU, 200Mhz NI PXI rack 4 quadrant SMU Cross point switch Power supplies Waveform generators 8 ½ digit DVM Diamond Lab View / PXI Test Platform Device Characterization 6 page 6
7 Test Apps Dev & Production Software: Test Development Engineers on site for Digital, Analog and Mixed Signal providing; Hardware Design/Debug Software Development/Debug Pre-Production Verification Hardware: Test Platforms on site: Diamond Probe Card & Load Board Development Probers EG 4090 s -55*C Cold probe capabilities KLA navigator with wafer mapping and product yield analysis Handler Interface: Deltaflex ThermoStreams 7 page 7
8 Packaging Services Process Engineering Development Process development, tooling design Package design and Fabrication Prepackaging and Wafer Handling Wafer Saw, sort and MIL inspection Class 1000 clean room, Class 100 critical areas Packaging Assembly /883 MIL Ceramic Assembly MCM, RF Assembly, Open cavity, TO Can Smart Card Assembly and Flex Board Assembly Chip on Board (Includes SMT Attachment) Stack die Flip chip Void Free Process Development and Assembly Process development Tooling development 8 page 8
9 Packaging Capabilities Wafer Saw 2 to 8 Die sort, manual & Automatic, including wafer mapping Die inspection, MIL-STD 883, method 2010 A or B Level Die attach- JM7000, 84-1/3, Silver Glass, Eutectic, Die Mat, Indium, other Plasma Clean- Ar, H, O gas Wire Bond- Wedge (Al & Au) Ball (Au) Pre cap inspection A or B Level Vacuum bake Solder Seal, Seam Seal, Resistance seal Vacuum solder seal PIND test X-Ray CSAM Full environmental screening page 9
10 Packaging Equipment SIKAMA REFLOW OVEN DATACON EVO-2200 SST VACUUM SEALER 10 page 10
11 Packaging Equipment (continued) F&K 6400 ESEC 3100 ELECTROX LASER MARKING 11 page 11
12 Device Qualification Services 12 page 12
13 PED Device Qualification Test Options Pre-Con (77 x 3) CSAM (22) THB(Per MSL) 3X Conv Reflow 220*C to 260*C CSAM (22) Auto Clave Solderability Bond Pull Die Shear Test Ball Shear Dimensions Lead Integrity Temp Cycle-( 77) Leak Test HAST (77) Condition B/C Standard JESD A Per MSL JESD22-A110-B HTS 77 units JESD22-A108-A HTOL- 77 units JESD22-A-1030-A Test LTS- 77 units 13 page 13
14 883 Groups A, B, C & D Testing Group B 40 samples RTS Method 2015 Solderability Method 2003 Bond strength Method 2011 Group C 45 samples Steady-State Life Test Method 1005 Group D1 15 samples Physical Dimension Method 2016 Group D2 45 samples Lead Integrity Method 2004 Group D3 15 samples Thermal soak Method 1011 Temp Cycle Method 1010 Moisture Method 1004 Fine/Gross Method 1014 Incoming QA 125 Units Pre-Tested Group D4 15 samples Mechanical Shock Method 2002 Vibration Method 2007 Centrifuge Method 2001 Fine & Gross Method 1014 Visual Method 1010 Group D7 15 samples Adhesion of Lead Method 2025 Qualified Product Group D5 15 samples Salt Atmosphere Method 1009 Fine & Gross Method 1014 Group D6 5 samples RGA Method 1018 Group D8 5 samples Lead Torque Method page 14
15 Reliability Equipment (2) ESPEC TSE-11-A Temp Cycle Chamber -65 to +150*C, paperless recording (2) Criterian Burn In Ovens +200* C (1) Dispatch Temp Humidity Oven (2) ESPEC Temp Humidity Chamber (TEMP -20*C to + 85*C) (Humidity 40% to 95% RH) Express Test HAST Oven, Model 1000 Low temp storage chamber Test Equity Temp cycle chamber +175*C to -65*C Scientific American Bake Oven (Up to 250*C) Blue M Bake Ovens (Up to 300*C) NAPCO 8300 Autoclave Oven Advanced Techniques Pro-1600 Reflow Profile Oven Dage Die Shear Dage Bond Pull tester Resistance to Solvents Station Steam Age Station Lead Integrity Station Associate Environmental-Salt Chamber 15 page 15
16 ESD Testing Services * Programming Development HBM Testing JESD22-A114/ AEC100 MM Testing JESD22-A115 AEC100 CDM Testing JESD AEC100 Latch Up Testing JESD78 AEC100 * Thermo Keytek Mark II - ESD/Latch-up Tester w/rcdm 16 page 16
17 DPA 1580/883/750/202 Services Monolithics Hybrids Transistors Diodes Caps Connectors Feedthru s Crystals Wafer acceptance 17 page 17
18 FA Equipment JEOL 6340F Scanning Electron Microscope, Oxford EDS Sono Scan Acoustic Micro-Imaging, Model DS6000 (CSAM) Karl Ziess Sub-micron Prober - 8 wafer capable Liquid Crystal Analysis/Light Emission Microscopy HP 4145B Parametric Tester Technics RIE with CF4 and O2 Zeiss-Axiotron microscope, coax light source, 5M Leica Hi resolution camera Leica MZ-12, coax and ring light sources, 5M Leica Hi resolution camera Leica LAS core image processing software Cross Sectioning X-Ray Fein Focus Nicene (Full de-capsulation process) Allied Parallel Polishing (Backside & Topside) 18 page 18
19 Tape and Reel Services Penrose Colorado Largest TnR house in the U.S.A. Tape Design and Fabrication Custom tooling High volume production capability for all surface mount devices (SMT) Meet or exceed all JEDEC or EIA standards 19 page 19
20 20 page 20
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