HOS LOW OHM POWER RESISTORS. SERIES Size As per AEC-Q Open frame strip type. 2W to 5W. R001 to R05.

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1 SERIES Open frame strip type. 2W to 5W. R1 to R5. As per AEC-Q2

2 PHYSICAL CONFIGURATION L W H T D Recommended PCB layout for high precision applications : Kelvin (4 terminal pad design) is suggested as per illustration below. The high current connections are made to the two pairs of larger pads and the voltage sense connections are made to the two smaller central pads. Recommended PCB layout for normal application 5W* 4 terminal pad design c b d c a Note: Recommended voltege sense pads for Kelvin connection Dimensions in mm DIMENSIONAL TABLE Sr No. HTR TYPE L H T D W a b c d (mm) (mm) ± ± ± nom nom nom nom.25 (mm).8 (mm).4 (mm) Low Med High 1 2W* > R3 to R W* > R3 to R W* / 3W* R W* / 3W* R W* R1 to R to 2.28 to NOTE : Dependent on Ohmic Value Typical weight per piece (Gms) Based on Resistance value Approx 5 Approx APPLICATIONS Current sensor for power hybrid applications In the automotive sector for high current applications Where reduced temperature is required on PCB FEATURES Reduced PCB heating due to open air flow design as compared to flat chip format. Flexible nature of termination design for thermal expansions.

3 Rated Dissipation (%) Temperature Derating Ambient Temperature (ºC) 12 Pulse Energy Rating 8 Energy (J) Resistance Value in milliohms 2W / 3W 5W NOTE : This graph relates to single pulses of short duration ( ms). Higher energy limits apply for longer pulses and overloads. Temperature Rise (K) Temperature Rise (K) Solder Joint Temperature Rise Mounting data : 7.6mm X 7.6mm pads, 2 oz copper on FR4, still air % Percentage of Rated Power Hot Spot Temperature Rise Mounting data : 7.6mm X 7.6mm pads, 2 oz copper on FR4, still air % 5% 75% % 5% 75% % Percentage of Rated Power Resistance Value in milliohms 5 / - 1 / 5 3 / 15 5 / 25 2W / 3W & 5W Resistance Value in milliohms 5 / 25 3 /15 1 / 5 5 / - 2W / 3W & 5W Note : Temperature rise data are given here for typical mounting conditions. Actual figures depend on PCB copper weight, mounting pad size, track width and substrate type. Also, the open air format responds better to forced air cooling than chip format resistors. For values below 5 milliohms allowance should be made for heat generated in the copper tracks themselves. Application-specific guidance is available on request from our application laboratory.

4 ELECTRICAL AND ENVIRONMENTAL CHARACTERISTICS PARAMETER / PERFORMANCE TEST & TEST METHOD PERFORMANCE REQUIREMENTS Power Rating (Rated Ambient Temperature ) Full power dissipation at 7 C and linearly de-rated to zero at C Insulation Not Insulated Resistance Tolerance ± 5% (Available up to ± 1%) Inductance < 1 nh Operating Temperature Range - 55 C to +16 C Voltage Rating / Limiting Voltage / Max. Working Voltage P x R subject to max. terminal temperature + 12 C For 2W & 3W 24ppm For Resistance value < R4. 4ppm For Resistance value R4 to R15 4ppm For Resistance value > R15. Temperature Co-efficient of Resistance For 5W [Measured from C to +125 C] 24ppm For Resistance value < R2. 4ppm For Resistance value R2 to R7. 4ppm For Resistance value > R7. Thermal Shock R ± [.75 ] Average For 2W & 3W R ± [ < 1. % ] For Resistance value < R4. R ± [ < 1. % ] For Resistance value R4 to R15. Temperature Cycling R ± [ <.75 % ] For Resistance value > R15. [Room temperature -55 C Room temperature 125 C For 5W Room temperature for 5 cycles] R ± [ < 1. % ] For Resistance value < R2. R ± [ < 1. % ] For Resistance value R2 to R7. R ± [ <.75 % ] For Resistance value > R7. For 2W & 3W R ± [ < 1.75 % ] For Resistance value < R4. R ± [ <.5 % ] For Resistance value R4 to R15. R ± [ < 1. % ] For Resistance value > R15. High Temp. Exposure ( 125 C- For 2 Hrs.) For 5W R ± [ < 1.75 % ] For Resistance value < R2. R ± [ <.5 % ] For Resistance value R2 to R7. R ± [ < 1. % ] For Resistance value > R7. Damp Heat ( Steady State ) R ± [.5 % ] Average ( 4 C at 93 % R.H. for Hrs. no load applied ) For 2W & 3W R ± [ < 2. % ] For Resistance value < R4. R ± [ < 1. % ] For Resistance value R4 to R15. Endurance Load Life R ± [ < 1. % ] For Resistance value > R15. [ 7 C with limiting voltage For 5W with temperature limitation on terminal kept at 12 C R ± [ < 2. % ] For Resistance value < R hours on /.5 hours off for hours] R ± [ < 1. % ] For Resistance value R2 to R7. R ± [ < 1. % ] For Resistance value > R7. Bias Humidity [+85 C, 85% RH, h] Mechanical Shock [ g. 6 ms half sine] Vibration, High Frequency [2 g. 1-2 Hz] Low Temperature Storage and Operation [-65 C for 24 h] Moisture Resistance [MIL-STD-22 method16] R ±.5% - Typical R ±.5% - Typical R ±.5% - Typical R ±.2% - Typical R ±.2% - Typical HOT SPOT TEMPERATURE RISE (IN STILL AIR) - From 18 C to 28 C at % power depending on the resistance value, pad and PCB thickness. Due to the nature of it s construction, the resistor keeps the hot spot from a thermal point of view from the solder joints and reduces the possibility of transfer of high temperature on to the PCB in contrast to the flat chip format. SOLDER JOINT TEMPERATURE RISE (IN STILL AIR) - From 6 C to 85 C at % power depending upon resistance value, pad and PCB thickness. CONSTRUCTION : The copper terminals are electron beam welded to the requisite alloy strip and then formed. Value variations are possible by variations of width without traditional abrasion / notch trimming.

5 MECHANICAL SPECIFICATIONS PARAMETER / PERFORMANCE TEST & TEST METHOD Resistance to Soldering heat - (35 C for 3 Secs) Solderabillity (Meets J-STD-2 Method B) Solvent Resistance (Meets MIL-STD-2 Method 215) PERFORMANCE REQUIREMENTS R ± [.2 % ] Typical must meet the requirements laid down must meet the requirements laid down RECOMMENDED SOLDER PROFILE Reflow, IR - and wave soldering Temperature ( C) Time (Sec) Peak 4 9 PACKAGING A. BULK resistors are packed in sealed plastic packets with silica gel pouch and place in small cardboard carton (Type I box) approx size 7 x 7 x 7 mm and 4 such boxes can be packed in Type A box approx size 2 x 15 x 7mm. 36 boxes (36 pieces) of Type I or 6 boxes (24 pieces) of Type A can be packed in master carton of approx size 32 x 245 x 245mm. B. TAPE & REEL PACKING +_ DIMENSIONAL TABLE Sr No. HTR TYPE A(mm) B(mm) C(mm) D(mm) E(mm) F(mm) G(mm) H(mm) PCS/Reel 1 2W & 3W R3 4.32± ±.1 24± ± ±.1 8.±.1 4.±.1 4.5±.1 18 pcs. 2 2W & 3W R2 4.32± ±.1 24± ± ±.1 8.±.1 4.±.1 4.5±.1 18 pcs. 3 5W 7.21± ±.1 24± ± ±.1 12.±.1 4.±.1 4.5±.1 1 pcs. Storage Condition (Packed) : Temp 25 C to 35 C, Humidity 3 to 8% RH, Shelf life-12 months Floor Life (Unpacked) : Temp 25 C to 35 C, Humidity 3 to 8% RH, Floor life-15 days