E-Manufacturing for the Semiconductor Industry

Transcription

1 E-Manufacturing for the Semiconductor Industry 鄭芳田 Fan-Tien Cheng e-manufacturing Research Center National Cheng Kung University Tainan, Taiwan, R.O.C. September 12, 2011

2 International SEMATECH e-manufacturing Hierarchy [6] Manufacturing Portion Engineering Portion 2

3 Introduction (e-manufacturing Definition) E-Manufacturing Manufacturing [1][2][3][4] is advanced manufacturing that takes advantage of Internet and information technologies to efficiently integrate the Manufacturing Execution System (MES) [16] and Equipment Engineering System (EES) [6][8][15] within a company (intra-company integration), and the Supply Chain (SC)[30][31][17] and Engineering Chain (EC) [11][12][18][19][20] among member companies (inter-company integration). 3

4 E-Manufacturing Components [18][20] Supply Chain (SC) Engineering Chain (EC) Inter-Company Intra-Company Manufacturing Portion Internet e-manufacturing Engineering Portion Manufacturing Execution System (MES) Equipment Engineering System (EES) 4

5 1. Manufacturing Execution System (MES)

6 Definition of MES Manufacturing Execution System (MES) is a shop floor control system which includes either manual or automatic labor and production reporting as well as on-line inquiries and links to tasks that take place on the production floor. MES includes links to work orders, receipt of goods, shipping, quality control, maintenance, scheduling, and other related tasks. The mission of MES is to increase productivity and yield. Cited from Bitpipe.com 6

7 MES Operations MCS RM WIP SPC Litho Etch Implantation Job In Processing Job Out Job Prepares FOUP Arrived Job In Job Starts Collecting data Job Out Job In Processing Previous Step Current Step Next Step Tracking Alarms Job Out Lot 1111 Lot 2222 Lot 3333 Lot 4444 Lot 5555 Lot 6666 Lot xxxx EQP Manager HSMS / GEM.. MES Client SPC GUI 7

8 SEMI CIM Framework Functional Architecture CIM Applications (example groupings) Factory Mgmt Material Mgmt WIP Tracking Specification Mgmt Machine Control Advanced Process Control CIM Framework Interoperability via Common components & component managers Plug-and-play via Standard component interfaces - messages, events, exceptions, behaviors - standard application partitioning at component level Factory Material Movement Factory Transfer Job Material Mgmt wafer Lot Product Spec Mgmt Product Spec Process Definition Mgmt Process Step Process Flow Object Request Broker Machine Mgmt Machine Storage Unit CORBAservices and CORBAfacilities Processing Mgmt Process Job OMG s Distributed Computing Infrastructure 8

9 MES Framework Architecture [29][16] Application 1 Applications Other Component Scheduler Design Pattern B System Management Design Pattern A Equipment Management Design Pattern A Labor Management Design Pattern A Material Management Design Pattern A Components MES Framework Object Request Broker CORBA Infrastructure Object Services Common Facilities 9

10 2. Supply Chain (SC)

11 Definition of SC Ganeshan and Harrison [30] defined Supply chain (SC) as a network of facilities and distribution options to perform the functions of materials procurement; transformation of materials into intermediate and finished products; and distribution of these finished products to customers. SC is designed to achieve timely and economical delivery of desired products for accomplishing the cycle of order-to-delivery (O2D) [31]. 11

12 Supply-Chain Architecture and Key Processes SC architecture supports the collaborative operations of the semiconductor industry to assure coherent IC manufacturing operations. SC consists of a customer interfacing module for accessing demand forecasts and order inputs, and a planning module for allocating capacity to accomplish customer demands and orders to generate work orders for the production floor. 12

13 Semiconductor Holonic Supply Chain System [17][24] Company II ERP Application Data Warehouse MES Application Real Time Control Task Assignment Logistics Planning Virtual Factory Exchange Holon RosettaNetBusinessMessage Shop Floor Holon WIP Holon Scheduling Holon Equipment Holon CORBA / IIOP Communication Holon For Inter-Company Information Integration HICS CORBA / IIOP Company III Communication Holon RosettaNet Business Message Communication Holon Company IV ERP Application Communication Holon MES Application RosettaNetBusinessMessage Real Time Control Task Assignment Logistics Planning Virtual Factory Exchange Holon Shop Floor Holon WIP Holon Scheduling Holon Equipment Holon CORBA / IIOP HERP Data Warehouse 13 HIES CORBA / IIOP HMES Company I For Intra-Company Information Integration

14 3. Equipment Engineering System (EES)

15 Definition of EES Equipment Engineering System (EES) is defined as the physical implementation of Equipment Engineering Capabilities (EECs), which are applications that address specific areas of Equipment Engineering, such as Fault Detection & Classification, Predictive Maintenance, Virtual Metrology, Run-to-Run Control, etc. The main purpose of EES is to enhance the overall equipment effectiveness (OEE). 15

16 Interfaces for e-manufacturing SECS/GEM The Primary Equipment Control I/F Interface A Equipment Data Acquisition [5] Interface (Getting more & better data from the equipment) Interface B Among Applications and to FICS/MES [9] Interface C External Access to e-diagnostics [7] PMS VMS International SEMATECH EES Architecture [6][8] 16

17 EE Applications of BISTel s EES Framework [Source: BISTel] 17

18 Proposed EES Framework 18

19 EEC Example 1: Predictive Maintenance [33] Predictive Maintenance: detect a failure symptom, then predict the residual life of equipment before the failure occurs, finally perform failover process Node 2 Node 1 Data Buffer FOS Historical Anamneses Prediction Module SNMP API Detection Module MIB Intelligent Performance Evaluator 19 Ethernet FOS Application Interface Ethernet FOS FOS Application Interface SNMP API MIB

20 EEC Example 2: APC/R2R Control Advanced Process Control & Run-to-Run Control [13] [Source: AMD APC/AEC XIV] 20

21 EEC Example 3: Virtual Metrology Virtual Metrology [14][15] [25][26] is a method to conjecture manufacturing quality of a process tool based on data sensed from the process tool and without physical metrology operation. Product Real Metrology Data Metrology Equipment UCL output value Production Equipment T yi T IBM Monitoring Wafer Transportation Time T LCL ti PH A SE 2 P HA SE 3 P H AS E 4 PH AS E 5 DE PT 2 DE PT 3 DE PT 4 DE PT 5 DE PT 6 Sensor Data x ij ti T Virtual Metrology Data D EPL OY M EN T CH A RT PH A SE 1 DE PT 1 output value Virtual Metrology System UCL LCL Real-Time & On-Line t i t i 1 t i 2 t i 3 t i 4 t j t j 1 t j 2 t j 3 t j 4 s a m p le d a ta a t t i 21 t j t j T sa m p le d a ta a t t i y i

22 Applying Virtual Metrology for Fab Fab--wide R2R Control [14][34] VM I VM II VM II VM I VM II VM II VM I 22 VM II VM II VM I VM II

23 4. Engineering Chain (EC)

24 Definition of EC ITRS proposed the concept of Engineering Chain (EC) to cope with design collaboration in the semiconductor industry [32]. EC in the semiconductor industry was defined as a network of facilities and distributed services that performs device design; verification of design; manufacturing pilot run; assembly and test operations; yield improvement; and final release for massproduction [20]. The goal of EC is to shorten the time-to-market (T2M). 24

25 Concept of Engineering Chain Challenge Customers want new products delivered much faster. Key Concept The Engineering Chain integrates rapid, accurate, flexible data exchange from design to new chip delivery to the customer to ensure customer cycle times are met. Modified from 2003 ITRS Factory Integration Factory Information & Control Systems 25

26 EC Integrating with EES, MES, & SC [11] 26

27 Engineering Chain Management System [20] Security 3. Large Data Complicated Consideration Transfer Business(i.e. Flow GDS II File) Applications Extranet Intranet Intranet Extranet Exchange Mechanism 27

28 New CIM Scope to Support Engineering Chain [20] 28

29 Vision and Conclusions With e-manufacturing, the productivity, yield, and overall equipment effectiveness (OEE) of the complete production platform can be improved, the cycles of timeto-market (T2M) and order-to-delivery (O2D) can be shortened; and further the goal of improving agility, efficiency, and decision-making for the entire semiconductor manufacturing processes can be reached. MES improves Productivity and Yield EES enhances OEE SC shortens O2D cycle EC reduces T2M cycle 29

30 References [1] An e-manufacturing Strategy Need Developed from the Manufacturing Strategy, AMR Research, Inc, August, [2] M. Koc, J. Ni, and J. Lee, Introduction of e-manufacturing, NAMRC 2003, e-manufacturing Panel, McMaster University, May, [3] Exploiting e-manufacturing: Interoperability of Software Systems Used by U.S. Manufacturers, National Coalition for Advanced Manufacturing (NACFAM), Washington, D.C., [4] A. Yurko, Beyond Six Sigma - e-manufacturing in the Dot.com Era, in GEO European Conference, May [5] SEMI EDA Standards: E120, E125, E132, E134, Web Site of Semiconductor Equipment and Material International (SEMI). [Online]. Available: [6] Equipment Engineering Capabilities (EEC) guidelines, v2.5, International SEMATECH, July, [Online]. Available: [7] e-diagnostics Guidebook, version 1.7, International SEMATECH, October [Online]. Available: [8] L. Rist, e-manufacturing/eec Standards from e-mfg Workshop at SEMICON West, in 1st Symposium on Current SEMI Standards Information & Control Activities, [9] SEMI Interface B Standard: E133, Web Site of Semiconductor Equipment and Material International (SEMI). [Online]. Available: [10] Web site of the Center for Intelligent Maintenance Systems (IMS). [Online]. Available: [11] ITRS Factory Integration: Factory Information & Control Systems, International Technology Roadmap of Semiconductor (ITRS), [Online]. Available: 30

31 References (Continued) [12] Definition of Engineering Chain, INITIA Business Terms Dictionary, [Online]. Available: [13] EEC High-level Requirements for APC, June 15, 2004, [Online] Available: [14] F.-T. Cheng, H.-C. Huang, and C.-A. Kao, "Dual-Phase Virtual Metrology Scheme," IEEE Transactions on Semiconductor Manufacturing, vol. 20, no. 4, pp , November [15] F.-T. Cheng, Y.-T. Chen, Y.-C. Su, and D.-L. Zeng, "Evaluating Reliance Level of a Virtual Metrology System," IEEE Transactions on Semiconductor Manufacturing, vol. 21, no. 1, pp , February [16] F.-T. Cheng, C.-F. Chang, and S.-L. Wu, "Development of Holonic Manufacturing Execution Systems," Journal of Intelligent Manufacturing, vol. 15, no. 2, pp , April [17] F.-T. Cheng, H.-C. Yang, and J.-Y. Lin, "Development of Holonic Information Coordination Systems with Failure-Recovery Considerations," IEEE Transactions on Automation Science and Engineering, vol. 1, no. 1, pp , July [18] J. Chang and F.-T. Cheng, "Engineering-Chain Requirements for Semiconductor Industry," in Proc IEEE International Conference on Automation Science and Engineering, Edmonton, Canada, pp , August [19] J. Chang and F.-T. Cheng, "Framework Development of an Engineering-Chain-Management-System for the Semiconductor Industry," in Proc. the 3rd International IEEE Conference on Industrial Informatics INDIN 05, Perth, Western Australia, August

32 References (Continued) [20] J. Chang, F.-T. Cheng, and Tsung-Li Wang, "Novel Semiconductor Business Model Engineering Chain for the Semiconductor Industry, in Proc IEEE International Conference on Robotics and Automation, Roma, Italy, PP , April [21] Y.-C. Su, M.-H. Hung, F.-T. Cheng, and T.-P. Lee, " Development of a Data Pre-processing Scheme and Pluggable Application Modules for an Intelligent Equipment Prognostics System," in Proc. the 3rd International IEEE Conference on Industrial Informatics INDIN 05, Perth, Western Australia, August [22] M.-H. Hung, F.-T. Cheng, and S.-C. Yeh, "Development of a Web-Services-based e-diagnostics Framework for the Semiconductor Manufacturing Industry," IEEE Transactions on Semiconductor Manufacturing, vol. 18, no. 1, pp , February [23] M.-H. Hung, T.-L. Wang, F.-Y. Hsu, and F.-T. Cheng, "Development of an Interface C Framework for Semiconductor e-diagnostics Systems," to appear in Robotics and Computer-Integration Manufacturing. [24] F.-T. Cheng and C.-T. Lin, "A Holonic Information Exchange System for e-manufacturing," in Proc. of The 30th Annual Conference of the IEEE Industrial Electronics Society (IECON 2004), Busan, Korea, November [25] F.-T. Cheng, J. Y.-C. Chang, H.-C. Huang, C.-A. Kao, Y.-L. Chen, and J.-L. Peng," Benefit Model of Virtual Metrology and Integrating AVM into MES, IEEE Transactions on Semiconductor Manufacturing, vol. 24, no. 2, pp , May [26] F.-T. Cheng, H.-C. Huang, and C.-A. Kao, "Developing an Automatic Virtual Metrology System," to appear in IEEE Transactions on Automation Science and Engineering. 32

33 References (Continued) [27] J. Chang and F.-T. Cheng, "Manufacturability of Multivariate Applications in the Semiconductor Industry," in Proc IEEE International Conference on Automation Science and Engineering, Shanghai, China, October [28] Y.-T. Huang, F.-T. Cheng, and Y.-T. Chen, "Importance of Data Quality in Virtual Metrology, in Proc. of The 32th Annual Conference of the IEEE Industrial Electronics Society (IECON 2006), Paris, France, November [29] F.-T. Cheng, E. Shen, J.-Y. Deng, and K. Nguyen, "Development of a System Framework for the Computer-Integrated Manufacturing Execution System a Distributed Object-Oriented Approach," International Journal of Computer Integrated Manufacturing, vol. 12, no. 5, pp , September/October, [30] R. Ganeshan and T. P. Harrison, An Introduction to Supply Chain Management, Penn State University, [Online]. Available: [31] Performance Indicators in Logistics, IFS Publications / Springer-Verlag, NEVEM-workgroup, [32] International Technology Roadmap for Semiconductor 2005 Edition, ITRS, Dec [Online]. Available: [33] F.-T. Cheng, S.-L. Wu, P.-Y. Tsai, Y.-T. Chung, and H.-C. Yang, "Application Cluster Service Scheme for Near-Zero-Downtime Services," in Proc IEEE International Conference on Robotics and Automation, Barcelona, Spain, pp , April [34] C.-A. Kao, F.-T. Cheng, and W.-M. Wu, "Preliminary Study of Run-to-Run Control Utilizing Virtual Metrology with Reliance Index," in Proc IEEE International Conference on Automation Science and Engineering, Trieste, Italy, pp , August, [35] F.-T. Cheng, W.-H. Tsai, T.-L. Wang, J. Chang, and Y.-C. Su, Advanced e-manufacturing Model, IEEE Robotics and Automation Society Magazine, vol. 17, no. 1, pp , March