Minutes and Actions of Site Qualification Task Force

Size: px
Start display at page:

Download "Minutes and Actions of Site Qualification Task Force"

Transcription

1 Minutes and Actions of Site Qualification Task Force Phone Conference - 7 th of April 2004 Present: G. Darbo, M. Garcia-Sciveres, P. Gerlach, D. Giugni. F. Huegging, L. Rossi, E. Vigeolas. Status and Updates from Loading Sites. Genova. Flex trimming tool has been upgraded by the use of German blades. The trimming has been improved and the test on last 5 flexes gives values of µm, to compare with µm obtained by old blades. The vacuum holder of the robot has been modified by adding aspiration on the 2 middle metal legs. This reduces the bow of the loaded module to 20 µm (measure made by a graduated microscope reticle). Other 5 modules (10 in total) loaded on the FE-I2 stave. Stave cold box completed. Next week are planned qualification test of the loaded stave. Lack of R/O electronics: PP0, TPLL/TPCC, ST regulator board, will require sharing with other setups and partial stave powering and R/O. CPPM. No new modules added on stave. The flex trimming tool has been upgraded, but not tested on modules yet. It is under study a shipping box for stave. Measures of module displacement as function of pull force on pigtail have been made. Lateral (y) module displacement is elastic up to 500 g and of 0.1 µm/g. Results are reported in the document: Module position stability measurements. Wuppertal. The new clean room is ready and the loading robot is in reassembly phase. Next week also the stave test setup will be moved in and put to function. The FE-I1 stave will be moved to Bonn to repair damaged wire bonds on two FE chips (modules were not potted). LBL. The 3 rd sector is in phase of loading with 3 FE-I2 modules. A new scheme of sector cooling has been made using two cooling circuits and a heat exchanger. The sector is cooled with C 6 F 14. No test of efficiency of the system and temperature drop made yet. Glue deposition procedure. Eric has prepared the document SE4445 mixing and deposition which describes the procedure to prepare and use the glue for attaching the modules to stave/sector. The main issues of the procedure and the difference from site to site are: Mixing 1:1 (±3%) ratio by weight of the grey/white compounds. Genova uses the same mixing ratio. LBL used 36/40 by weight chosen by a test of least tackiness after curing. They now standardize on 1/1. To apply the glue the procedure specifies syringes (ref LL-B), needles (ref /0.35 mm length/internal diameter) and pistons (ref PE-B) from EFD ( LBL is now using the same, Genova will order them. Pressure and flux. Pressure must be regulated to obtain 18 drops/minute. CPPM obtains it with 1 bar pressure, Genova with 1.8 bar. The difference is mainly due to the use of different kind of piston (CPPM needs bar to move the piston in empty syringe, while Genova needs 1.0 bar).

2 Quality control of the glue is made by applying 5 drops on a glass slide. The procedure specifies that the size of squeezed spot between two slides is 10 mm. After discussion we propose to leave the spot un-squeezed (diameter = 3.5 mm). Shear test is made on a sample for each glue preparation. Stave and sector cooling, cleaning and thermal qualification. Long discussion on how to cool the stave and sector for qualification test. The use of perfluorohexane (C 6 F 14 ) cannot be made in unsealed circuit because it is extremely volatile. LBL has made a sealed system and will perform test on it to see if it is good enough for qualification test. In case of stave the requirements are bigger due to the number of modules. The perfluorohexane doesn t need particular cleaning procedure of the aluminum pipe. It has been decided to investigate the use of aqueous glycol liquid or other coolants. The liquid to be used must not cause corrosion of the pipe. It is also necessary to find a cleaning procedure for the pipe afterwards. Danilo has been asked to investigate for solution with experts at CERN. Other groups in contact with chemical departments have to propose a solution. Because all the bare staves have been tested by cooling them with glycol (probably) a cleaning procedure is needed anyway. The cooling setup needed to qualify the modules must be capable of: Reach 30ºC without powering modules. Reach 10ºC with at least a module powered. Reach (0 10ºC) with all modules powered. Thermal qualification seems quite difficult with the use of IR camera. In particular seems difficult to find missing glue under FE chips or effect of bowing on module temperature. More tests will be done on stave and sectors in all sites to verify the sensibility of the method. Procedure log sheet and qualification results template. Giovanni presented a proposal of procedure log sheet (what in the module world is called traveler) to be used to annotate the operations of module loading on stave. A draft of the presented log sheet is in the appendix. This log sheet includes the flex trimming, the glue deposition and the module placement (in the site qualification master document ATL- IP-QA-0023 there were proposed separate log sheets). The TF members had a general agreement, but they will look at it in detail and make comments. The log sheet will be used for the preproduction. For qualification test we want to use a template where the tests will be made and the results will be presented in a coherent way amongst the different sites. For the electrical qualification Fabian will make a proposal at the next System Test TF phone conference (22/04) and we will have a first discussion there. Genova and CPPM will propose a template for geometrical qualification of staves and LBL of sectors. Those templates must exist in the draft form and filled with results from FE-I1/I2 assemblies before starting preproduction (end of April) and in their final version to qualify preproduction (June PW). Next phone conference. Next phone conference will be held on the 29 th of April. The goal of that phone conference will be prequalification of sites. For being able of qualifying a site the SQTF must receive a report with qualification results of the FE-I1/I2 assemblies. Those results should be prepared in conformity to the qualification templates.

3 Action list Tasks to be completed before loading FE-I3 modules, i.e. preproduction 1) Finalize flex trimming setups (for stave). Routine test that <300µm cut is safely made. Action on All stave sites. Status: done 2) Implement weighing procedure on modules to be loaded. 10 mg precision. Put on procedure log sheet. Action on All. Status: already implemented in Genova and LBL. 3) A detailed description with quantities and times of the procedure to prepare and use the glue. Action on Eric. Status: prepared, some modifications requested. 4) Measure location of deposited modules as a function of pigtail / type 0 cable bending / plugging-unplugging. Action on Eric. Status: done 5) Perform bow measurements on FE-I2.1 loaded modules and compare with flex module bow. Determine cut for maximum acceptable flex module bow for loading. Action on All. Status: to be done by all sites. 6) Implement and test cleaning procedure for cooling pipes after having used C6F14 liquid coolant. Action on Maurice. Status: done for C6F ) Cleaning procedure for bare staves and for a possible different coolant liquid to be used in place of C 6 F 14. Action on Danilo. Status: new action. 7) Measure deposition yield of production quality FE-I2.1 modules (modules with travelers are production quality). Must define an initial set of cuts for deposition yield, based on initial experience (delta-bumps, delta leakage, delta x,y,z, delta-t, etc.). Check that real fittings are not damaged/degraded by connections to liquid coolant system. Action on All. Status: to be done. 8) Test with IR of missing glue under a FE chip. To check the sensitivity of the thermal imaging method a FE chip at the time will be put in condition of low power and IR image will be taken. To reduce the heating hot spot of the MCC the clock can be switched off. In this case the MCC power is reduced by 60%, but also the digital power in the FE chip is reduced significantly. Action on Genova/Wuppertal/LBL. Status: to be done.

4 9) Prepare (update) module deposition log sheet (traveler) with the main operations for review by collaboration. Action on SQTF. Status: draft made, waiting for comments. Task to be completed before full qualification of preproduction: 10) Prepare electronic logbook or qualification template format to be used for qualification test. Status: electrical test from Fabian, geometrical qualification for stave Giovanni and Eric, geometrical qualification for sector Maurice. Status: to be done 11) Prepare & test storage box for loaded stave/sector. Action on All. Status: to be done. Eric has some prototype on the way. 12) Survey and raw DB. Action on All. Status: to be done 13) Commission test setup allowing 1-module-at-a time testing on stave or sector with C6F14 cooling. Action on All. Status: to be done

5 Appendix ATLAS Pixel Module Loading on Stave Procedure Logsheet Stave S/N: Site (circle): GE / CPPM / WU Responsible: Start Date (dd/mm/yy): End Date (dd/mm/yy): Module # xx Receiving test Date: Operator: Flex cut Date: Operator: Distance cut/sensor (µm) FE#0/F side: FE#7/8 side: Weight (g): Glue deposition / module place Date: Operator: Glue opening date: Time mix/deposition: Weight grey/white (g): Drops/minute: Pressure: Needle: S/N Shear test Quality of glue deposition (comment) Distance needle to stave (µm) Distance / force plot (comment) Bow (µm) Gap sensor/step (µm) Quick test Date: Operator: Yield evaluation Status pass/accept/reject: Reworking (pass/accept/reject): Comment:

Module Assembly using a Gantry Positioning System. Kirk Arndt, University of Oxford

Module Assembly using a Gantry Positioning System. Kirk Arndt, University of Oxford Module Assembly using a Gantry Positioning System Kirk Arndt, University of Oxford for the Oxford Particle Physics Microstructure Detector (OPMD) group D. Bortoletto, I. Shipsey, R. Plackett Outline Background

More information

Innovative Lightweight Cooling Systems for the Upgrade of the Inner Tracker System (ITS) of the ALICE Experiment at CERN

Innovative Lightweight Cooling Systems for the Upgrade of the Inner Tracker System (ITS) of the ALICE Experiment at CERN Innovative Lightweight Cooling Systems for the Upgrade of the Inner Tracker System (ITS) of the ALICE Experiment at CERN Enrico DA RIVA Manuel GÓMEZ MARZOA In collaboration with the ALICE ITS Upgrade Project

More information

Mechanics and Cooling of Pixel Detectors

Mechanics and Cooling of Pixel Detectors Mechanics and Cooling of Pixel Detectors Pixel2000 Conference Genoa, June 5th 2000 M.Olcese CERN/INFN-Genoa From physics to reality Very demanding physicists community: Detector has to be transparent Detector

More information

ECAL Mechanics and thermal studies

ECAL Mechanics and thermal studies & Next generation Si -W ECAL Mechanics and thermal studies LCWS 2010 @ Beijing Denis Grondin March 28 th, 2010 1N Si-W ECAL Current baseline W/Si ECAL weight: ~ 112 T (80 barrel+32 End-Cap) No dead zone,

More information

Consumer Electronics: Designing with Flexibility for Reliability by Ellsworth Adhesives and Dow Corning Corporation. Wednesday, May 11, 2016

Consumer Electronics: Designing with Flexibility for Reliability by Ellsworth Adhesives and Dow Corning Corporation. Wednesday, May 11, 2016 Consumer Electronics: Designing with Flexibility for Reliability by Ellsworth Adhesives and Dow Corning Corporation Wednesday, May 11, 2016 Before We Start This webinar will be available afterwards at

More information

Electrical containment penetrations 3 ROUTINE TESTING (PRODUCTION TESTING)

Electrical containment penetrations 3 ROUTINE TESTING (PRODUCTION TESTING) Page 1 (6) EXAMINATION PROCEDURE Electrical containment penetrations Document Issue Date KBE EP-146 3 (E) 2011-06-15 Supersedes KBE EP-146 Issue 2 (E) 1 SCOPE This Examination Procedure is applicable to

More information

VELO module prototype 2

VELO module prototype 2 VELO module prototype 2 Nikhef number: Item number: Date: 06-05-2015 Page: 1 of 19 39300-MT-00662 AA9138 Status: In Work Revision: A.0 Project: LHCb-upgrade VELO Department: Mechanical Technology Top folder:

More information

Assembly and wire bonding of the ALICE SPD

Assembly and wire bonding of the ALICE SPD Assembly and wire bonding of the ALICE SPD - Half-stave layout - Half-stave assembly procedure - Glue overview and test - Wire-bonding R.Santoro for ALICE SPD group Workshop on Bonding and Die Attach Technologies

More information

Tooling gelcoat MGS F 300

Tooling gelcoat MGS F 300 3-15 Tooling gelcoat MGS Hardener MGS page Characteristics 15 Application 16 Specifications 20 Processing details 20 Mixing ratios 20 DMA 21 Content Application tooling Characteristics Operational temperature

More information

Product or Process Modifications Requiring Limited CBTL Retesting to Maintain Safety Certification

Product or Process Modifications Requiring Limited CBTL Retesting to Maintain Safety Certification Product or Process Modifications Requiring Limited CBTL Retesting to Maintain Safety Certification This document sets forth a uniform approach to maintain the safety certification of products that have,

More information

ASME B31.3 Process Piping

ASME B31.3 Process Piping ASME B31.3 Process Piping Charles Becht IV, PhD, PE Don Frikken, PE Instructors BECHT ENGINEERING COMPANY, INC. Fabrication and Installation - 1 Piping Development Process 1. Establish applicable system

More information

IPC Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures IPC-6015

IPC Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures IPC-6015 ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures February 1998 A standard developed

More information

Flip Chip - Integrated In A Standard SMT Process

Flip Chip - Integrated In A Standard SMT Process Flip Chip - Integrated In A Standard SMT Process By Wilhelm Prinz von Hessen, Universal Instruments Corporation, Binghamton, NY This paper reviews the implementation of a flip chip product in a typical

More information

3M Anisotropic Conductive Film (for Touch Screen Panel)

3M Anisotropic Conductive Film (for Touch Screen Panel) Technical Data November 2013 3M Anisotropic Conductive Film 7371-20 (for Touch Screen Panel) Product Description 3M Anisotropic Conductive Film (ACF) 7371-20 is a heat-bondable, electrically conductive

More information

EUROPEAN ORGANIZATION FOR NUCLEAR RESEARCH CERN - ACCELERATORS AND TECHNOLOGY SECTOR

EUROPEAN ORGANIZATION FOR NUCLEAR RESEARCH CERN - ACCELERATORS AND TECHNOLOGY SECTOR EUROPEAN ORGANIZATION FOR NUCLEAR RESEARCH CERN - ACCELERATORS AND TECHNOLOGY SECTOR CERN-ATS-2012-040 13 ka Superconducting Busbars Manufacturing Process R. Principe, P. Fessia, E. Fornasiere CERN, Geneva,

More information

Chapter 3 Silicon Device Fabrication Technology

Chapter 3 Silicon Device Fabrication Technology Chapter 3 Silicon Device Fabrication Technology Over 10 15 transistors (or 100,000 for every person in the world) are manufactured every year. VLSI (Very Large Scale Integration) ULSI (Ultra Large Scale

More information

OPERATION MANUAL. A220 Arc Welding Machine. Serial Number: Where Purchase: Date of purchased:

OPERATION MANUAL. A220 Arc Welding Machine. Serial Number: Where Purchase: Date of purchased: OPERATION MANUAL A220 Arc Welding Machine Serial Number: Where Purchase: Date of purchased: CONTENT 1.Safety... 2 2. Summary... 4 3. Electrical principle drawing... 5 4. Specifications... 6 5. Operation

More information

Composite Manufacturing and Quality Control

Composite Manufacturing and Quality Control Composite Manufacturing and Quality Control Boeing Commercial Airplanes 14 September 2010 BOEING is a trademark of Boeing Management Company. 787 Material Usage Overview Carbon laminate Carbon sandwich

More information

WORLDSKILLS SINGAPORE 2016 TECHNICAL DESCRIPTION AIRCRAFT MAINTENANCE (Information for Competitors)

WORLDSKILLS SINGAPORE 2016 TECHNICAL DESCRIPTION AIRCRAFT MAINTENANCE (Information for Competitors) WORLDSKILLS SINGAPORE 2016 TECHNICAL DESCRIPTION AIRCRAFT MAINTENANCE (Information for Competitors) Name and Description of Skills Category 1 The name of the skills category is Aircraft Maintenance. 2

More information

A CO2 cooling test system

A CO2 cooling test system A CO2 cooling test system Outline: 1. Reduce material budget (by combining cooling pipe, mechanical support and current leads into single structure?) 2. Cooling with CO2 3. First test results CERN Cooling

More information

Reference Only. 2.Part Numbering (ex) NF Z 5B BW 2R9 L N 1 0 L

Reference Only. 2.Part Numbering (ex) NF Z 5B BW 2R9 L N 1 0 L SpecNo.JENF243J-0011A-01 P1/10 CHIP NOISE FILTER NFZ5BBW LN10 REFERENCE SPECIFICATION 1.Scope This reference specification applies to NFZ5BBW_LN10L Series, Chip Noise Filter. 2.Part Numbering (ex) NF Z

More information

SCT End-cap Module Components: Spines

SCT End-cap Module Components: Spines ATLAS SCT END-CAP Module FDR Institute Document No. Created : Page SCT-IS-EN-0009 Modified: 18/07/02 Rev. No. SCT END-CAP MODULE Document SCT End-cap Module Components: Spines Abstract This document describes

More information

Chem 355 Jasperse DISTILLATION

Chem 355 Jasperse DISTILLATION Chem 355 Jasperse DISTILLATION 1 Background Distillation is a widely used technique for purifying liquids. The basic distillation process involves heating a liquid such that liquid molecules vaporize.

More information

Reference Only. Spec. No. JENF243D-0006K-01 P 1/ 8

Reference Only. Spec. No. JENF243D-0006K-01 P 1/ 8 Spec. No. JENF243D-0006K-01 P 1/ 8 Chip EMIFIL LC Combined Monolithic NFL21SP X1C Reference Specification 1. Scope This reference specification applies to Chip EMIFIL LC Combined Monolithic Type NFL21S

More information

Using Vacuum Impregnation to Fill Quality Gaps for Electronics Manufacturers

Using Vacuum Impregnation to Fill Quality Gaps for Electronics Manufacturers Using Vacuum Impregnation to Fill Quality Gaps for Electronics Manufacturers Scott Simmons, Business Development Manager, Henkel Chris Russell, Sales Director, Henkel ABSTRACT Often the most troublesome

More information

Professional Weighing Equipment. K-Series Scales. Operation Manual KHR 6000 KHR 123 KHR 502 KHR 3001

Professional Weighing Equipment. K-Series Scales. Operation Manual KHR 6000 KHR 123 KHR 502 KHR 3001 Professional Weighing Equipment K-Series Scales Operation Manual KHR 6000 KHR 123 KHR 502 KHR 3001 Table of Contents Section Page Declaration of Conformity 3 Customer Service 4 Introduction 5 Safety 6

More information

GAS UTILITY TECHNOLOGY UPDATE

GAS UTILITY TECHNOLOGY UPDATE GAS UTILITY TECHNOLOGY UPDATE NORTHEAST GAS ASSOCIATION 2013 FALL CONFERENCE ULC ROBOTICS www.ulcrobotics.com Who is ULC? We work with energy and utility companies to face infrastructure, technical and

More information

Reference Only. SpecNo.JELF243A-0030T-01 P1/8

Reference Only. SpecNo.JELF243A-0030T-01 P1/8 SpecNo.JELF243A-0030T-01 P1/8 CHIP COIL (CHIP INDUCTORS) LQH32CN 53L REFERENCE SPECIFICATION 1. Scope This reference specification applies to LQH32CN_53 Series, Chip coil (Chip Inductors). 2. Part Numbering

More information

Reference Only. Spec. No. JENF243D-0003J-01 P1/ 8

Reference Only. Spec. No. JENF243D-0003J-01 P1/ 8 Spec. No. JENF243D-0003J-01 P1/ 8 Chip EMIFIL LC Combined Monolithic NFL18SP X1A3 Reference Specification 1. Scope This reference specification applies to Chip EMIFIL LC Combined Monolithic Type NFL18SP

More information

Module number 6 provides an on-line, self-paced training seminar on energy efficiency and energy conservation for residential buildings.

Module number 6 provides an on-line, self-paced training seminar on energy efficiency and energy conservation for residential buildings. Module number 6 provides an on-line, self-paced training seminar on energy efficiency and energy conservation for residential buildings. 1 This chapter sets forth the requirements for energy efficiency

More information

Component Palladium Lead Finish - Specification Approved by Executive Board 1997-xx-xx August 22 Version

Component Palladium Lead Finish - Specification Approved by Executive Board 1997-xx-xx August 22 Version Component Palladium Lead Finish - Specification Approved by Executive Board 1997-xx-xx August 22 Version Appendices 1. User Commitment Form 2. Supplier Compliance Form Table of contents 1. Background 2.

More information

# Core Competency Description. Revision: February 19, 2010 Page 1

# Core Competency Description. Revision: February 19, 2010 Page 1 Supplier: Date Completed: Supplier Contact: Completed By: VCR Sections: I. Core Competencies II. Engineering Capabilities III. Measuring IV. Manufacturing Technologies/Capabilities V. Gaging and Testing

More information

GaAs MMIC Space Qualification

GaAs MMIC Space Qualification GaAs MMIC Space Qualification GaAs MMIC Testing TriQuint Semiconductor has advanced Lot Acceptance Testing (LAT) for High Reliability Applications of GaAs MMICs. A flowchart depicting the entire MMIC processing

More information

Reference Only. DC Resistance Impedance at 100MHz (mω) Rated Current *1 MURATA (A) Part Number. (Ω) Tolerance Typ. Max.

Reference Only. DC Resistance Impedance at 100MHz (mω) Rated Current *1 MURATA (A) Part Number. (Ω) Tolerance Typ. Max. Spec No. JENF243J-0002B-01 P1/8 CHIP NOISE FILTER NFZ2MSM SN10L REFERENCE SPECIFICATION 1. Scope This reference specification applies to NFZ2MSM_SN10L, Chip Noise Filter.. 2. Part Numbering (ex) NF Z 2M

More information

23 rd ASEMEP National Technical Symposium

23 rd ASEMEP National Technical Symposium THE EFFECT OF GLUE BOND LINE THICKNESS (BLT) AND FILLET HEIGHT ON INTERFACE DELAMINATION Raymund Y. Agustin Janet M. Jucar Jefferson S. Talledo Corporate Packaging & Automation/ Q&R STMicroelectronics,

More information

Single Pulse Resistance Welder Instruction Pamphlet CD125SP High Accuracy CD Welder

Single Pulse Resistance Welder Instruction Pamphlet CD125SP High Accuracy CD Welder EN G IN EERI N G Single Pulse Resistance Welder Instruction Pamphlet CD125SP High Accuracy CD Welder Fundamentals of Capacitive Discharge Resistance Welding deliver repeatable welds even during line voltage

More information

STATUS OF THE MECHANICS. G. C. and M. Savrié on behalf of the CGEM-mechanics group

STATUS OF THE MECHANICS. G. C. and M. Savrié on behalf of the CGEM-mechanics group STATUS OF THE MECHANICS G. C. and M. Savrié on behalf of the CGEM-mechanics group OUTLINE mechanical design overview CGEM construction detector shipping installation tooling design 2 MECHANICAL DESIGN

More information

r.tec GmbH The technology provider of the Rabmer Group

r.tec GmbH The technology provider of the Rabmer Group r.tec GmbH The technology provider of the Rabmer Group Know How Technology Quality - Innovation What do we offer? We have developed a technology portfolio from the perspective of a contractor we serve

More information

Be Equipped for Tomorrow s Materials. Atmospheric Plasma. Applications in Electronic Packaging. Industrial Applications Corona

Be Equipped for Tomorrow s Materials. Atmospheric Plasma. Applications in Electronic Packaging. Industrial Applications Corona Be Equipped for Tomorrow s Materials Atmospheric Plasma Applications in Electronic Packaging 1 Basic Function of PlasmaPen Surface treatment tool The PlasmaPen is an atmospheric gas plasma system used

More information

D.9 Particulate Nitrogen and Particulate Carbon

D.9 Particulate Nitrogen and Particulate Carbon D.9 Particulate Nitrogen and Particulate Carbon CEDR Method Codes: PN L01 PC L01 1.1 Scope and Application 1.1.1 Elemental analysis is used to determine total particulate carbon (PC) and total particulate

More information

Exceptional Technology for Material Science TT DMA. Dynamic Mechanical Analyser

Exceptional Technology for Material Science TT DMA. Dynamic Mechanical Analyser Exceptional Technology for Material Science TT DMA Dynamic Mechanical Analyser The Company Triton Technology Ltd was first established in 1997 to design, manufacture and sell a range of instrumentation

More information

Lessons Learned in Solar Thermal Power Plants

Lessons Learned in Solar Thermal Power Plants Allianz Global Corporate & Specialty Lessons Learned in Solar Thermal Power Plants TECHNICAL PERSPECTIVE AGCS Germ / ARC / Dr. B. Persigehl Munich / Nov. 2 nd 2017 Table of contents Damage Experiences

More information

Technology Offer. Ultrafast temperature controlled objective. Keywords. Background. File no.: MI WT-WA

Technology Offer. Ultrafast temperature controlled objective. Keywords. Background. File no.: MI WT-WA Technology Offer Ultrafast temperature controlled objective File no.: MI-1401-4735-WT-WA Max-Planck-Innovation GmbH Amalienstr. 33 80799 Munich Germany Phone: +49 (89) 29 09 19-0 Fax: +49 (89) 29 09 19-99

More information

SPECIAL SPECIFICATION 4631 Cured-In-Place Pipe (CIPP)

SPECIAL SPECIFICATION 4631 Cured-In-Place Pipe (CIPP) 2004 Specifications CSJ 0912-34-171 SPECIAL SPECIFICATION 4631 Cured-In-Place Pipe (CIPP) 1. Description. Reconstruct existing drainage structures by forming a new pipe within an existing deteriorated

More information

Infrared Imaging for Material Characterization in Fracture Mechanics Experiments

Infrared Imaging for Material Characterization in Fracture Mechanics Experiments Infrared Imaging for Material Characterization in Fracture Mechanics Experiments Heat transfers are involved in many phenomena such as friction, tensile stress, shear stress and material rupture. Among

More information

Installation Manual. Omnicell. Model: 9101 FB by Fairbanks Scales, Inc. Revision 2 03/16 All rights reserved

Installation Manual. Omnicell. Model: 9101 FB by Fairbanks Scales, Inc. Revision 2 03/16 All rights reserved Installation Manual Omnicell Model: 9101 FB 51172 2016 by Fairbanks Scales, Inc. Revision 2 03/16 All rights reserved Amendment Record Omnicell 9101 FB DOCUMENT 51172 Manufactured by Fairbanks Scales

More information

Liquid Metal Cleanliness Analyzer for Continuous Monitoring

Liquid Metal Cleanliness Analyzer for Continuous Monitoring LiMCA CM Liquid Metal Cleanliness Analyzer for Continuous Monitoring n Direct, in-line and real-time inclusion measurement n Fully automated n Minimum maintenance n Integrated to the Process To maintain

More information

Imagine... automated onboard disinfection residue free

Imagine... automated onboard disinfection residue free Imagine... automated onboard disinfection residue free EN Redefining state-of-the-art... The next generation of excellence is here. In 3 different configurations to meet your laboratory needs. Select automated

More information

Standard Operating Procedure. Document ID SOP Edition Number 01

Standard Operating Procedure. Document ID SOP Edition Number 01 Happy Pharma Standard Operating Procedure Document ID SOP-123456 Edition Number 01 Document Title Prepared By Verified By Approved By XX XX XX Purpose The purpose of this SOP is to describe the requirements

More information

CLASSIFICATION NOTES. Type Approval. Mechanical Joints. used in Piping

CLASSIFICATION NOTES. Type Approval. Mechanical Joints. used in Piping CLASSIFICATION NOTES Type Approval of Mechanical Joints used in Piping Revision 2 : January, 2014 Contents Sections 1. General 2. Scope 3. Documentation 4. Materials 5. Testing Procedure and Requirements

More information

Reference Only. Spec. No. JENF243E-0003Q-01 P 1 / 8. Chip EMIFIL LC Combined Type for Large Current NFE61PT 1H9 Reference Specification

Reference Only. Spec. No. JENF243E-0003Q-01 P 1 / 8. Chip EMIFIL LC Combined Type for Large Current NFE61PT 1H9 Reference Specification Spec. No. JENF243E-0003Q-01 P 1 / 8 Chip EMIFIL LC Combined Type for Large Current NFE61PT 1H9 Reference Specification 1. Scope This reference specification applies to Chip EMIFIL LC Combined Type for

More information

Technology for Process Heat Applications. and Solar Field Optimization

Technology for Process Heat Applications. and Solar Field Optimization Technology for Process Heat Applications and Solar Field Optimization erfis PARABOLIC TROUGH Technical Data Sheet Parabolic Trough Collector Design Solar Field Engineering Construction Erection Fields

More information

SECTION AIR COILS

SECTION AIR COILS SECTION 23 82 16 PART 1 - GENERAL 1.1 DESCRIPTION SPEC WRITER NOTES: 1. Use this section only for NCA projects. 2. Delete between // // if not applicable to project. Also delete any other item or paragraph

More information

PARYLENE ENGINEERING. For Longer Lasting Products

PARYLENE ENGINEERING. For Longer Lasting Products PARYLENE ENGINEERING For Longer Lasting Products PARYLENE ENGINEERING This presentation serves as a quick overview of the conformal coating material and processes currently used in the industry. The field

More information

APPENDIX A LPR STANDARD OPERATING PROCEDURE

APPENDIX A LPR STANDARD OPERATING PROCEDURE APPENDIX A LPR STANDARD OPERATING PROCEDURE LPR Corrosion Study Standard Operation Procedure Alloys: AA356.2, A36, AA6061-T6, CDA 360, AZ91C-T6 Project: NCHRP, 404-0355-03 June 14, 2005 1.0 Pre-Test Preparation:

More information

Program Description MECHATRONIC SYSTEMS TECHNICIAN ACADEMY

Program Description MECHATRONIC SYSTEMS TECHNICIAN ACADEMY Program Description MECHATRONIC SYSTEMS TECHNICIAN ACADEMY 7107 Elm Valley Drive Kalamazoo, MI 49009 Phone: 269.353.1282 Fax: 269.353.1580 careeracademies@kvcc.edu www.kvcc.edu/training MECHATRONIC SYSTEMS

More information

VVER-440/213 - The reactor core

VVER-440/213 - The reactor core VVER-440/213 - The reactor core The fuel of the reactor is uranium dioxide (UO2), which is compacted to cylindrical pellets of about 9 height and 7.6 mm diameter. In the centreline of the pellets there

More information

Infrared Imaging for Material Characterization in Fracture Mechanic Experiments

Infrared Imaging for Material Characterization in Fracture Mechanic Experiments Infrared Imaging for Material Characterization in Fracture Mechanic Experiments Heat transfers are involved in many phenomena such as friction, tensile stress, shear stress and material rupture. Among

More information

BOD 21M Distance Sensors. Effortless performance High efficiency

BOD 21M Distance Sensors. Effortless performance High efficiency BOD 21M Distance Sensors Effortless performance High efficiency Linear Position Sensing Comprehensive systems expertise. Technological variety. Optimal solutions. Displacement sensing exactly what you

More information

Vibranivo Mononivo. Series VN 4000 MN Series. Instruction manual

Vibranivo Mononivo. Series VN 4000 MN Series. Instruction manual Vibranivo Mononivo Series Series VN 4000 MN 4000 Instruction manual 010516 1 UWT GmbH Westendstraße 5 Tel.: +49 (0)831 57123-0 Internet:www.uwt.de D-87488 Betzigau Fax: +49 (0)831 76879 E-Mail: info@uwt.de

More information

Materials Selection and Design Introduction

Materials Selection and Design Introduction Materials Selection and Design Introduction Design is a common word with elaborate meanings close to fashion, aesthetics, culture, so on Fashion design, hair design, interior design, city planning, industrial

More information

JOINT INDUSTRY STANDARD

JOINT INDUSTRY STANDARD JOINT INDUSTRY STANDARD AUGUST 1999 Semiconductor Design Standard for Flip Chip Applications ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES Semiconductor Design Standard for Flip Chip Applications About

More information

PRESTRESSED CONCRETE STRUCTURES. Amlan K. Sengupta, PhD PE Department of Civil Engineering Indian Institute of Technology Madras

PRESTRESSED CONCRETE STRUCTURES. Amlan K. Sengupta, PhD PE Department of Civil Engineering Indian Institute of Technology Madras PRESTRESSED CONCRETE STRUCTURES Amlan K. Sengupta, PhD PE Department of Civil Engineering Indian Institute of Technology Madras Module 01: Introduction, Prestressing Systems and Material Properties Lecture

More information

FLX2011-MKL Pick&Place

FLX2011-MKL Pick&Place FLX2011-MKL Pick&Place Assembly system for flexible printed circuits and membrane keyboards Glue and paste dispensing SMD and LED placement swiss made Metal dome placement Assembly system for flexible

More information

1. Temperature Change: 120 deg F (67 deg C), ambient; 180 deg F (100 deg C), material surfaces.

1. Temperature Change: 120 deg F (67 deg C), ambient; 180 deg F (100 deg C), material surfaces. SECTION 05500- METAL FABRICATIONS PART 1 - GENERAL 1.1 RELATED DOCUMENTS A. Drawings and general provisions of the Contract, including General and Supplementary Conditions and Division 01 Specification

More information

Bob Willis Process Guides

Bob Willis Process Guides Practical Selection/Problems with SMT Adhesives Bob Willis Surface M ount Technology (SM T) first started with the introduction of mixed technology designs incorporating components mounted on the underside

More information

Welcome to Robatech AG. Improving Line Efficiency and Productivity Through Innovation in Glueing Technology

Welcome to Robatech AG. Improving Line Efficiency and Productivity Through Innovation in Glueing Technology Welcome to Robatech AG Improving Line Efficiency and Productivity Through Innovation in Glueing Technology Date: 08.08.2008 Author: Peter Gyger Director Market Strategy and -Structure Copyright by Robatech

More information

PIPE REHABILITATION. Comply with Division 1 - General Provisions and Covenants, as well as the following:

PIPE REHABILITATION. Comply with Division 1 - General Provisions and Covenants, as well as the following: PIPE REHABILITATION PART 1 - GENERAL 1.01 SECTION INCLUDES A. Sliplining Pipe B. Cured-in-place Pipe Lining C. Deformed/Reformed Pipe Lining D. Folded/Formed Pipe Lining E. Spot Repairs by Pipe Replacement

More information

Profile360 In-Line Profile Measurement System

Profile360 In-Line Profile Measurement System Profile360 In-Line Profile Measurement System For rubber, ceramic, plastic, and wood-plastic composite extrusions, roll-formed metal profiles, wire and any other profile. In-Line Inspection... Bottom Line

More information

Si DRIE APPLICATION In Corial 210IL

Si DRIE APPLICATION In Corial 210IL Si DRIE APPLICATION In Corial 210IL CORIAL 210IL ICP-RIE equipment for deep Si etching applications Enlarged functionality with capability to deep etch silicon, silicon carbide, glass, sapphire, and quartz

More information

SMT Adhesive JU - R2S

SMT Adhesive JU - R2S Lead free SOLUTIONS you can TRUST TECHNICAL INFORMATION SMT Adhesive JU - R2S Page 2 of 15 Adhesive to cope with Lead Free soldering and allows self-alignment JU - R2S (SMT heat -cure adhesive in lead

More information

Stacking columns for automotive logistics

Stacking columns for automotive logistics Stacking columns for automotive logistics Standard and special solutions for all type of car parts transportation www.towersautomotive.com Our Company Towers Automotive is engineering, manufacturing and

More information

FlowCon Fabric Air Diffusers

FlowCon Fabric Air Diffusers FlowCon Fabric Air Diffusers 204 Hallberg St. PO BOX 507 Delavan, WI. 53115 Installation, Operation and Maintenance Manual Project Title: Location Name: Date: Service Contractor: Telephone Number: CONTENTS

More information

ATHENA - Module Construction

ATHENA - Module Construction ATHENA - Module Construction 1998-2000 P. Riedler*, J. Rochet ATHENA Group, University of Zürich * now at CERN ATHENA Silicon Vertex Detector Cylindrical symmetry Outer diameter: 139.7 mm Inner diameter:

More information

AN Handling and processing of sawn wafers on UV dicing tape. Document information. Sawn wafers, UV dicing tape, handling and processing

AN Handling and processing of sawn wafers on UV dicing tape. Document information. Sawn wafers, UV dicing tape, handling and processing Handling and processing of sawn wafers on UV dicing tape Rev. 2.0 13 January 2009 Application note Document information Info Keywords Abstract Content Sawn wafers, UV dicing tape, handling and processing

More information

Method One: Liner/Bladder Assembly-Inversion Method.

Method One: Liner/Bladder Assembly-Inversion Method. CIPP Sectional/Point Repairs Critical Factors Finally Explained By: Shaun M. Flanery Abstract A 1999 report from the American Society of Civil Engineers indicated at that time that the nation s 500,000

More information

NTC Thermistors. Mounting instructions. Date: January 2018

NTC Thermistors. Mounting instructions. Date: January 2018 NTC Thermistors Mounting instructions Date: January 2018 EPCOS AG 2018. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without

More information

REDOX AND REFERENCE ELECTRODE USER MANUAL

REDOX AND REFERENCE ELECTRODE USER MANUAL REDOX AND REFERENCE ELECTRODE USER MANUAL 1 Redox and reference electrode manual Copyright 2017 Unisense A/S Version June 2017 REDOX AND REFERENCE ELECTRODE MANUAL UNISENSE A/S TABLE OF CONTENTS WARRANTY

More information

QuantStudio 6 qpcr instrument (Applied Biosystems) quick start guide

QuantStudio 6 qpcr instrument (Applied Biosystems) quick start guide QuantStudio 6 qpcr instrument (Applied Biosystems) quick start guide Important notes This document is only a quick start guide, please refer to the official instrument user manual for in depth instructions.

More information

Future Electronic Devices Technology in Cosmic Space and Lead-free Solder Joint Reliability

Future Electronic Devices Technology in Cosmic Space and Lead-free Solder Joint Reliability The 22nd Microelectronics Work Future Electronic Devices Technology in Cosmic Space and Lead-free Solder Joint Reliability Key Points (1) High Speed Solder Ball Shear Test (2) Relationship between Surface

More information

Mold Design. 12. Mold Materials. Bong-Kee Lee School of Mechanical Engineering Chonnam National University

Mold Design. 12. Mold Materials. Bong-Kee Lee School of Mechanical Engineering Chonnam National University 12. Mold Materials Bong-Kee Lee Chonnam National University Mold Materials easy toolmaking good performance during production good machining properties ease of hear treatment where hardening is required

More information

: Rodger Jeffery (Principal Author); Hardy Engineering Team; Hardy Tech Support Team

: Rodger Jeffery (Principal Author); Hardy Engineering Team; Hardy Tech Support Team Document : AN EXPLANATION OF TRADITIONAL AND C2 CALIBRATION/VALIDATION METHODS & USE Last Revised : Q2 2017 Authors : Rodger Jeffery (Principal Author); Hardy Engineering Team; Hardy Tech Support Team

More information

3 Thermally Conductive Tapes

3 Thermally Conductive Tapes 3 Thermally Conductive Tapes Technical Data July, 21 Product Description 3M Thermally Conductive Tapes 885, 881, and 8815 are designed to provide a preferential heat-transfer path between heat-generating

More information

AMERICAS Tel or Tel CHINA, SHENZHEN Tel

AMERICAS Tel or Tel CHINA, SHENZHEN Tel www.uic.com email: universal@uic.com AMERICAS Tel. 1-800-432-2607 or Tel. +1-607-779-7522 CHINA, SHENZHEN Tel. +86-755-2685-9108 CHINA, SHANGHAI Tel. +86-21-6495-2100 EUROPE Tel. +36-23-445-500 2010 Universal

More information

5.Rated value. 6.Package. No.JEMCP B. Section 7.1 (-55 to 125 C / -55 to 125 C) 1000MΩmin pf NFM3DPC223R1H3L ±20 % DC 50 V

5.Rated value. 6.Package. No.JEMCP B. Section 7.1 (-55 to 125 C / -55 to 125 C) 1000MΩmin pf NFM3DPC223R1H3L ±20 % DC 50 V No.JEMCP0-010856B CHIP EMIFIL CHIP 3-TERMINAL CAPACITOR FOR LARGE CURRENT FOR GENERAL NFM3DP Series Reference Sheet 1.Scope This product specification is applied to Chip EMIFIL Chip 3-terminal Capacitor

More information

5.Rated value No.JEMCP B MURATA PART NO. (3) Nominal Capacitance Capacitance Tolerance (5) Rated Voltage Rated Current (ma) DC Resistance Insul

5.Rated value No.JEMCP B MURATA PART NO. (3) Nominal Capacitance Capacitance Tolerance (5) Rated Voltage Rated Current (ma) DC Resistance Insul No.JEMCP0-010871B CHIP EMIFIL CHIP 3-TERMINAL CAPACITOR FOR LARGE CURRENT NFM41PC155 Series Reference Sheet 1.Scope This product specification is applied to Chip EMIFIL Chip 3-terminal Capacitor for Large

More information

R Series : IMP SMT BOARD TO BOARD ADAPTATOR H3 REEL OF 600 TECHNICAL DATA SHEET 1 / 7 COMPONENTS MATERIALS.

R Series : IMP SMT BOARD TO BOARD ADAPTATOR H3 REEL OF 600 TECHNICAL DATA SHEET 1 / 7 COMPONENTS MATERIALS. .. pn ao TECHNICAL DATA SHEET 1 / 7 All dimensions are in mm. COMPONENTS BODY CENTER CONTACT OUTER CONTACT INSULATOR GASKET OTHERS PARTS MATERIALS BERYLLIUM COPPER BERYLLIUM COPPER BERYLLIUM COPPER POLYETHER

More information

Reference Only. *B:Bulk packing also available. Inductance DC Resistance ( m ohm)

Reference Only. *B:Bulk packing also available. Inductance DC Resistance ( m ohm) P.1/9 CHIP COIL (CHIP INDUCTORS) LQM18PN FHD REFERENCE SPECIFICATION 1.Scope This reference specification applies to LQM18PN_FH series, Chip Coil (Chip Inductors). 2. Part Numbering (ex) LQ M 18 P N 2R2

More information

HDICE In Beam Cryostat Project

HDICE In Beam Cryostat Project HDICE In Beam Cryostat Project ASME BPVC and Process Piping Code Application and Analysis Orlando Pastor, Jr. Structural Engineer March 30, 2011 Introduction Review current IBC design for compliance with

More information

Industrialization of Silicon Detector Module Production

Industrialization of Silicon Detector Module Production Industrialization of Silicon Detector Module Production CERN PH Dept., Geneva 1211, Switzerland E-mail: alan.honma@cern.ch The large-scale silicon detector projects for upgrades (Super-LHC) or new experiments

More information

6032 SH 3P Residential Shower Installation Instructions Gelcoat & Solid Surface Bathware

6032 SH 3P Residential Shower Installation Instructions Gelcoat & Solid Surface Bathware Tools/materials you might need for proper installation 6D galvanized screws 100% silicone caulking caulking gun acrylic latex caulk shims tape measure 1/8 drill bit Phillips screw driver cardboard china

More information

GLASS DESIGN MODELLING SOFTWARE ELFEN GD

GLASS DESIGN MODELLING SOFTWARE ELFEN GD GLASS DESIGN MODELLING SOFTWARE ELFEN GD INTRODUCTION OVERVIEW TO ELFEN GD Elfen Glass Design (GD) is a suite of numerical modelling programs which are designed to provide glassmakers with decision support

More information

Reference Only. Spec. No. JENF243E-0002Q-01 P1 / 8

Reference Only. Spec. No. JENF243E-0002Q-01 P1 / 8 Spec. No. JENF243E-0002Q-01 P1 / 8 Chip EMIFIL LC Combined Type for Large Current NFE31PT 1E9 Reference Specification 1. Scope This reference specification applies to Chip EMIFIL LC Combined Type for Large

More information

SPECIAL SPECIFICATION 4411 Cured-In-Place Pipe (CIPP) (Drainage Structures)

SPECIAL SPECIFICATION 4411 Cured-In-Place Pipe (CIPP) (Drainage Structures) 2004 Specifications CSJ 6165-86-001 SPECIAL SPECIFICATION 4411 Cured-In-Place Pipe (CIPP) (Drainage Structures) 1. Description. Reconstruct existing cross drainage structures by forming a new pipe within

More information

4. Type & Dimensions No.JEMCP B (Unit:mm) MURATA PART NO. (1)-1 L a (1)-2 W b T e g d p 1 NFA31CC101S1E4D 3.2± ± ± min. 2 N

4. Type & Dimensions No.JEMCP B (Unit:mm) MURATA PART NO. (1)-1 L a (1)-2 W b T e g d p 1 NFA31CC101S1E4D 3.2± ± ± min. 2 N No.JEMCP0-010875B CHIP EMIFIL CHIP 3-TERMINAL CAPACITOR ARRAY TYPE FOR GENERAL NFA31CC Series Reference Sheet 1.Scope 2.Reference PART No. List 1 2 3 4 5 6 7 8 This product specification is applied to

More information

Technological EUDET ECAL Prototype. Marc Anduze CALICE Meeting KOBE 10/05/07

Technological EUDET ECAL Prototype. Marc Anduze CALICE Meeting KOBE 10/05/07 Mechanical lr&d for Technological EUDET ECAL Prototype Why this prototype? ECAL Prototype Next step after the physics prototype and before the module 0 To study full scale technological solutions which

More information

Gerber. Scientific Products. Dear Gerber Sabre Customer:

Gerber. Scientific Products. Dear Gerber Sabre Customer: Gerber Scientific Products 151 Batson Drive, Manchester, CT 06040 (860) 643-1515 Dear Gerber Sabre Customer: Thank you for purchasing the Sabre, Gerber Scientific Products advanced, high-speed, three-dimensional

More information

Tindo Karra. Installation and Specifications Manual. Introduction

Tindo Karra. Installation and Specifications Manual. Introduction Tindo Karra Installation and Specifications Manual Introduction Thank you for choosing a Tindo Solar Module. Background to our name TINDO Tindo is a word from the Kaurna warra Aboriginal language which

More information

Cash Drawer Identification

Cash Drawer Identification Cash Drawer Identification Please use this document to identify the model of cash drawer that is on hand. An FAQ section is listed at the end. 15in MMF Metal Cash Drawer Quick Specs: 15 1/8 inches deep

More information