Solder Paste Inspection Machine
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- Trevor Webb
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1 Solder Paste Inspection Machine VP5200-V Taking SPI speed and accuracy to the next level
2 VP5200-V Inline Detection Inline detection of printing faults at the initial stage, where 70% of defects are developed. Printing quality improvement by utilizing SPC Function FB Adjustment of Printing Machine based on Inspection Result Data. Elimination of Solder Printing Faults at the initial stage. Qual Advice VP5200-V Solder Paste Inspection Machine Mounter Printing Machine Remote Information Monitoring 2
3 Intelligent Eye ity of the total line is improved! Reflow After-Reflow Inspection Machine After-Mounted Inspection Machine High Speed Inspection With an industry leading speed of: 9,400mm2/sec., the VP-V series is designed to achieve a higher speed of inspection to meet the needs of your high speed production line. VP5200-V (25μm) 9,400m m2 /sec 3
![Glue Inspection(Option) [Detected Sample] Size of detectable foreign material (X Y): 100μm or more height: Upper level of printed silk Fiber dust PCB cutting dust Solder paste inspection is also](/docs-images/76/73904511/images/4-3.jpg "available at the time of glue inspection.")
4 VP5200-V High Accuracy High Accuracy and Repeatability support Inspection of Fine Pads Repeatability of height inspection: within 1µm at 3σ. Repeatability of volume inspection: within 3% at 3σ. Inspection Resolution Switch Function Inspection Resolution can be switched by parts number to maximize accuracy or speed pad CSP Solder Shape (microscope) CSP Solder Shape (Shape Display VP6000M-V) QFP Solder Shape (microscope) QFP Solder Shape (Shape Display VP6000M-V) Standard Inspection (25µm) High Resolution INSP (12.5µm) Image Pictures Foreign Material Inspection(Option) Foreign material can be detected at the same time as solder paste inspection. Exclusive NG check screen comes up with alarm. Glue Inspection(Option) [Detected Sample] Size of detectable foreign material (X Y): 100μm or more height: Upper level of printed silk Fiber dust PCB cutting dust Solder paste inspection is also available at the time of glue inspection. Realized 3D glue inspection for quality improvement Dust of cleaning paper Scattering of solder paste Coplanarity Inspection (Standard) Causing loose connection. PCB Warping Distribution Display (Standard) Confirmed excessive warping at this area. 4 Maximum height pad Each pad is judged as OK, but NG on Coplanarity Inspection. Minimum height pad Difference between maximum and minimum height of IC pad (BGA, CSP) can be detected. Trend of PCB warping is displayed in colored distribution. Confirming PCB quality. Possible to examine the relation between warping trend of PCB bottom side and reflow condition. Possible to examine the relation between warping trend of PCB and inspection result.
5 Simple Operation Creating Inspection Program : Only 3 minutes Loading Data Parts Registration Completed Simple Operation Full Touch Panel Method It takes only 3 minutes to complete Inspection Program from loading Gerber Data. Inspection Program without Gerber Data can be created with scanning printed PCB. Optional mount data conversion function can make parts registration easily. Specification Setting Start Inspection Inspection Result Check Pad Shapes Pursuing Simple Operation, full touch panel is adopted. Complete one touch operation can be achieved from setting specifications to checking inspection results. Each menu is tag selecting type with simple menu, which anyone can operate easily. Setting log-in ID to administer operator functions. Inspection Principles of VP Series One Touch Operation Besides displaying 3D shape image, 2D actual image (color display) is also checked on the screen at the same time, and solder paste shapes can be recognized efficiently. Ring Light Outline of only solder paste is extracted with a ring shape (360 circle) light source projecting against inspection object (solder). This method inspect by 3D in the solder paste area, only achieves more reliable inspection. Camera Projectors A camera positioned in the vertical direction, captures inspection object (solder) images with stripe pattern light by a projector from the cross angle. With the height of the objects, the stripe pattern is shifted against the base face and captured, so the shift amount is converted with the triangulation principle. Camera Projector Projector Z axis Auto-Focus Function PCB Warping is recognized per inspection area by correcting the distance between inspection camera and PCB in real time. 5
6 VP5200-V Advanced SPC Function Various statistical work functions achieve process improvement by complete simple operation. (With Color Image Saving Function for All Pads in Real Time) Displaying Print Trend Flexible Statistic Display Solder paste s volume or displacement trend can be confirmed on the PCB layout. It helps to easily recognize issues leaving solder paste displacement areas. Statistic Data can be displayed flexibly per time periods, parts and areas. For instance, it can make a graph of only the same BGA inspection results, produced in the same month. Printing Condition Improvement Report Function By grouping Statistic Data in each category, Printing Trend can be compared. For example, it is easy to compare, before / after cleaning to optimize each printing condition. Environmental Support A report of solder paste issues can be created automatically on the basis of inspection result data. A report with images also is available. Barcode Reading Function, Option Inspection camera reads barcode on PCB. The read information is input to inspection results. Support for RoHS Directive RoHS directive is supported. Pneumatic Supply Not required. This machine is friendly to global environment. 6 Support Experience : 1D, 2D (Data Matrix ECC200, QR Code Model 2) Support for RoHS Directive. Mercury Cadmium 6 Materials RoHS Bans PBDE Sexivalent Chrome Polybrominated Biphenyl AIR The machine which cares for global environment and does not require pneumatic supply. OIL Long term maintenance free guide is adopted to control accuracy degradation and maintenance.
7 Standard Specification Model Inspection Method VP5200-V Phase Shift Method PCB Size (M) 50x50mm~330x250mm (L) 50x50mm~510x460mm PCB Thickness 0.3~5.0mm Projection Single Projector Inspection Resolution Digital Switching Method 25/12.5μm 20/10μm 15/7.5μm Speed (mm2/sec) Standard High Resolution Accuracy (Volume 3 )*1 Within 3% PCB Warping ±5mm Outline Dimension (M) 724x870x1450mm (L) 904x1080x1450mm Power Supply Single Phase AC200~230V 50~60Hz MAX 1KVA Pneumatic Supply Not Required Weight (M) 500kg (L) 560kg UPS Standard Equipped, for PC only Environmental Support RoHS *1 Use CKD sample board Options Data Station, VPDS Up to 6 units can be connected Loading Conveyor Unloading Conveyor Transformer Outline View VP5200M-V Barcode Reading Function Mount Data Conversion Software Glue Inspection Foreign Material Inspection VP5200L-V Advice Function SmartRIn (Remote Monitoring)
8 OMRON Corporation INDUSTRIAL AUTOMATION COMPANY INSPECTION SYSTEMS BUSINESS DIVISION AOI SALES DEPARTMENT Shinagawa Front Bldg. Conference 7F Kounan Minato-ku Tokyo JAPAN TEL FAX: OMRON INDUSTRIAL AUTOMATION (CHINA) Co., LTD. F20,TowerA,NEO Building,6011ShennanAvenue, Futian District, Shenzhen, Guangdong , China TEL: FAX: OMRON AOI BUSINESS EUROPE, OMRON EUROPE B.V. Zilverenberg 2, 5234 GM s-hertogenbosch, The Netherlands TEL: +31(0) FAX:+31(0) OMRON ELECTRONICS LLC 2895 Greenspoint Parkway, Suite 200 Hoffman Estates, IL U.S.A TEL: FAX: OMRON ELECTRONICS KOREA CO., LTD. 21F, B Wing, 465, Gangnam-daero, Seocho-gu, Seoul, Korea TEL: FAX: OMRON ASIA PACIFIC PTE LTD 438A Alexandra Road #05-05/08 (Lobby 2) Alexandra Technopark Singapore TEL: FAX: Authorized Distributor: Q223I-E-01 Note: Specifications are subject to change Omron Electronics LLC Printed in U.S.A. Printed on recycled paper.
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