WELCOME. It is our policy to exceed our customers' expectations. To fulfill this mission we each take personal responsibility for everything we do.

Transcription

1 WELCOME To It is our policy to exceed our customers' expectations. To fulfill this mission we each take personal responsibility for everything we do.

2 Markets Served Military Medical Industrial LED Lighting Telecom

3 Quality Policy Statement It is our policy to exceed our customers' expectations. To fulfill this mission we each take personal responsibility for everything we do.

4 Company Overview Founded Staff Members 2 Shifts Expanded (6AM-11PM) 20,000 Square Feet Facility ISO 9001:2008 Registered 3-Unannounced ISO Audits Annually IPC-A-610 Certified J-STD-001 Certified ITAR Registered Extensive BGA Evaluation Capabilities Including X-Ray and End-Scope Optical Inspection Conceptual Design Engineering PWB Layout Quick-Turn Prototypes. Pre-production & Production Runs Exotic Materials Smallest Comp 0201 s Largest Comp BGA s 1800 Balls ubga s Full Turnkey Capabilities Fully Staffed Purchasing Dept Design Thru Assembly and Test

5 Manufacturing Capabilities Leaded, RoHS, and Mixed Technologies High Layer Count, Up to 32 Layers Quick Reaction Prototyping Services Pre-Production & Production Runs Smallest Component Size Placed, 0201 Largest SMT Processed Board Size 36 by 48 In Excess of 1000 BGA s Placed Each Month Largest BGA, 1800 Balls u BGA s, Fine Pitch Placed In House BGA Rework and Re-balling Expertise Largest # BGA s Places on Single Board, 64 X-Ray and Endo-Scope BGA Inspection Automatic Optical Inspection (AOI) Functional Testing Services

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9 Equipment List Surface Mount Technology MYDATA MY19 Hydra-SMT (21kCPH) (2 Each) MYDATA MY15 Hydra-SMT (15kCPH) MYDATA MY12 Hydra-SMT (21kCPH) MY DATA TP11- Hydra-SMT (10KCPH) MY DATA TP11- UFP-SMT (6KCPH) MYDATA TP9-Hydra SMT (10kCPH) MYDATA TP9-UFP SMT (6kCPH) MYDATA TP9-2 SMT (4.5kCPH) PYRAMAX 98 7 Zone Reflow Oven ELECTROVERT Omniflo-5 Zone Reflow Oven MPM Corp MPM Screen Printer (2 Each) Surface Mount & Thru-Hole Technology AIR-VAC Model DRS22 BGA Split Prism Hot Air Rework System AIR-VAC Model DRS25 BGA Split Prism Hot Air Rework System ELECTROVERT Vectra Solder Wave (Leaded) ELECTROVERT Econopac I Solder Wave (Lead Free) Air-Vac Solder Pot BLUE M Temperature Chamber (3 Each) Ultra-Kool Cold Trap Vapor Degreaser BRANSON Vapor Degreaser KISS Selective Soldering Machine Model 103 PVA Selective Conformal Coating Model Delta 6 Inspection / Test MIRTEC MV - MV-3L Automatic Optical Inspection AOI (2 Each) METCAL 1000 Optical BGA Inspection System V.J. TECHNOLOGIES Model VJ 2000 X-RAY System AQUEOUS TECHNOLOGY Ionic Contamination Tester VISION ENGINEERING Mantis Stereoscopes (6 Each) Temperature Cycling / Burn-In Room Assorted General Purpose Test Equipment

10 Engineering Overview Specializing in High Density / High Performance Applications PWB Layout Services Performed by Degreed, and IPC Certified, Engineers Controlled Impedance, Crosstalk Management, Exotic Materials RF, Microwave, Analog, Digital, and Mixed Technologies Flex and Rigid-Flex Circuitry 2-32 Layers u BGA s, Fine Pitch, Double Sided SMT

11 Product Management & Sustaining Engineering Services CEM offers complete Product Management, Product Life Cycle, and Sustaining Engineering Services. These Services often specifically address long life cycle products such as Military, Medical, and Capital Equipment products. CEM takes responsibility for Configuration Control and Product Modifications. This includes Maintenance of Native and Production Databases, cost reduction management, product enhancements, and product longevity assurance

12 Product Management & Sustaining Engineering Services ITEM: Bill of Materials Periodic End of Life & Obsolescence Analysis Recommendations for replacement parts RoHS Conversions PTH to SMT Conversions Recommendations for buying / stocking long lead & other items Alternate Source recommendations Cost Reduction Analysis

13 Product Management & Sustaining Engineering Services ITEM: Engineering Configuration Control management Schematic & PWB Design / ReDesign Drafting Services Native & Production Tool maintenance & control DFM / DFT Review for cost reduction and improved quality. Cost Reduction Analysis

14 Product Management & Sustaining Engineering Services ITEM: Testing Test Development Custom & semi-custom hardware & software Complete Product testing Maintenance of Customer Supplied Test Equipment

15 Product Management & Sustaining Engineering Services ITEM: Inventory Management Customer inventory maintained in quarantined moisture proof environment. Recommendations for inventory levels based upon supply & demand Both piece parts and finished goods inventory Kanban Tests services for broker parts if necessary

16 World Class Manufacturing Facility

17 Surface Mount Technology 7 SMT Lines

18 Automatic Selective Soldering

19 150 KV Real Time X-Ray

20 CEM ltd. BGA Attachment BGA X-Ray Color enhancement to show solder attachment

21 Real Time BGA Optical Imaging

22 Automatic Optical Inspection

23 Automatic Selective Conformal Coating

24 Inspection Center

25 World Class Design & Manufacturing

26 World Class Design & Manufacturing

27 World Class Design & Manufacturing

28 World Class Design & Manufacturing

29 World Class Design & Manufacturing

30 World Class Design & Manufacturing

31 World Class Design & Manufacturing

32 World Class Design & Manufacturing

33 Quality Management System Quality System SOP 4.01 & SOP 4.02 Management Responsibility Contracts SOP 4.03 Contract Review Design Procurement SOP 4.04 Design SOP 4.06 Purchasing ECN Change control Customer approval Program combine like material Subcontract review Approved vendor list ECN change control Incoming Insp SOP 4.10 Inspect Received material Bare board testing Match purchase orders ISO 9001:2008 Registered

34 Quality Management System Kit Verification Operations In-Process Insp Final Insp SOP 4.09 Process Control SOP 4.09 Process Control SOP 4.10 Inspect SOP 4.10 Insp. Verify to BOM Supply Documentation Create travelers Measure accuracy Process control Traveler Traceability Measurement Prevention 100% Measurement Documentation Control Process feedback Test ISO 9001:2008 Registered SOP 4.10 Insp. & Test In-circuit Functional ESS Measure 1st pass yield

35 Quality Management System Document Cont SOP 4.05 Document and Data control Controlled documents ECN control Customer documents Customer Prod SOP 4.07 Control of customer supplied products Traceability SOP 4.08 Product Identification and Traceability Measuring SOP 4.11 Control of Measuring, Inspection and Test Equipment Corrective Action SOP 4.14 Corrective and Preventative Action CAR Training ISO 9001:2008 Registered

36 Quality Management System General Product Flow T. Blackmon Start Procurement Special Instructions Electrical Assembly Customer Program Kit Verification & Prep Harness Assembly Mechanical Assembly Inspection Inspection Inspection Product Flow General Final Assembly Inspection

37 Quality Management System Process Flow Chart Surface Mount Technology Automatic Start T. Blackmon Surface Mount Technology Automatic Process Laser Cut Stencil Program SMT Equipment Load SMT Devices Into Magazine Screen Print Side 1 Place SMT Components Side 1 100% X -RAY BGA Placement Includes BGA's and BGA Sockets Document Results Control Point Product Flow General 100 % verification to BOM 1st Piece Inspection Side 1 Document Results Control Point To A

38 Quality Management System Process Flow Chart Surface Mount Technology Automatic From A Develop Recipe Re - Flow Side 1 Laser Stencil Recipes X - Ray 100% X -RAY BGA Solder Repeat Process Side % visual Inspection Document Results Document Results No Control Point No Control Point Product Flow General Test Document Results No Control Point Ship Stop

39 Special Instructions: This Job contains Moisture Sensitive Devices. See Manufacturing Traveler Amendment F Work Center Operation Operation Description Oper KV 10 Verify Kit Per WI ASM 20 Set-Up Per WI ASM 30 Verify MSD Sheet Is Filled Out Per WI ASM 40 Screen Boards Per WI II 45 Inspect Solder Paste Per WI ASM 50 Place Parts Per WI II 55 Inspect Side 1 Verification Per WI ASM 60 Reflow 1 Board Per WI II 65 Inspect Solder Per WI XR 75 X-Ray 1 Board Per WI Process Check ASM 80 Reflow Balance Of Boards Per WI ASM 90 Screen Boards Per WI II 95 Inspect Solder Paste Per WI ASM 100 Place Parts Per WI II 105 Inspect Side 2 Verification Per WI ASM 110 Reflow 1 Board Per WI II 115 Inspect Solder Per WI XR 125 X-Ray 1 Board Per WI Process Check ASM 130 Reflow Balance Of Boards Per WI CL 140 Clean Per WI XR 145 X-Ray Per WI % II 155 AOI Inspect Per WI % PS 160 Install Thru Hole Parts Per WI CL 170 Clean Per WI II 175 Inspect Per WI Thru Hole & All Solder PS 180 Install Post Parts Per WI CL 190 Clean Per WI II 195 Inspect Post Parts Per WI TST 205 Test Per WI FI 295 Final Inspect Per WI Serial Numbers - As Required SH 298 Pack Per WI SH 299 Ship Per WI NOTE XX Return Traveler To Material Control This traveler has been issued by Material Control Supervisor: Signature and date. This traveler has been reviewed and approved by Quality Assurance. Qty Comp Process Time* Reviewed by Production Supervisor: Signature and date. Date Product Flow Typical

40 The Contract Engineering and Manufacturer of Choice We are Committed We are Flexible We are the Right Company Size We Exceed Customer s Expectations

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