Lightweight High Thermal Conductivity Mechanically Stable Controlled Expansion Alloys

Transcription

1 Lightweight High Thermal Conductivity Mechanically Stable Controlled Expansion Alloys June 2006

2 Lightweight Thermal Management Solutions What are the CE Alloys? What is Spray Forming? Why use the CE Alloys? Who is Sandvik Osprey? Discussion / Questions

3 Lightweight Thermal Management Solutions What are the CE Alloys? What is Spray Forming? Why use the CE Alloys? Who is Sandvik Osprey? Discussion / Questions

4 OSPREY CE ALLOYS OFFER:- Tailored CTE a range of Si/Al alloys with CTE from 7 to 17ppm/ºC CTE ppm/k CE alloy range wt%si Al Si

5 Alloys currently in production CE20 Al-12%Si/4047 (Dev) CE17 Al-27%Si CE Alloys - Alloy Range CE17M Al-27SiFeMgMn CE15 Al-35%Si CE13 Al-42%Si CE11 Si-50%Al CE9 Si-40%Al CE7 Si-30%Al CE5 Si-20%Al (Dev) CTE ppm/k CE17 CE wt%si

6 The CE Alloys ARE NOT AlSiC Typical AlSiC Microstructure 1 CE7 CE17 AlSiC is a Composite: Engineered materials made from two or more constituent materials that remain separate and distinct on a macroscopic level while forming a single component. An alloy is a combination, either in solution or compound, of two or more elements, at least one of which is a metal, and where the resulting material has metallic properties. An alloy with two components is called a binary alloy. 1 from

7 OSPREY CE ALLOYS OFFER:- Improved performance Copper CTE ppm/k CE17 CE13 CE wt%si Albemet 162, A-40 CE 9 Steel CE 7 Titanium Cu/Mo, Cu/W, AlSiC 1 Kovar

8 Variation of CTE with Temperature Packaging and Thermal Management Alloys CTE ppm/ C Kovar Alumina Al-68SiC Osprey CE7 Titanium Cu 90% W Temp. C

9 25 Thermal Expansion as Function of Temperature Osprey CE alloys between -77 C (-196K) and 127 C (400K) CTE, ppm/ C Aluminium Silicon CE7 (Al-30Si) CE11 (Al-50Si) CE17 (Al-27Si) Temperature, C

10 OSPREY CE ALLOYS OFFER:- High Thermal Conductivity thermal conductivity W/mK Kovar Titanium Conductivity of packaging materials Alumina CE Alloys CE7 CE17 Al-68SiC Cu90%W W/mK

11 Lightweight OSPREY CE ALLOYS OFFER:- the lightest thermal management materials available Cu90%W Kovar Titanium Alumina Al-68SiC CE Alloys Density of packaging alloys g/cc

12 Specific stiffness Specific stiffness (more properly called specific modulus) is Young's modulus/density Most commonly used for comparing materials so the units are not important. Material annealed condition CE7 CE17 Molybdenum Al 6061 Stainless Steel CP Titanium Kovar 85W-Cu Specific Stiffness

13 OSPREY CE ALLOYS OFFER:- High Stiffness/High Thermal Stability CE alloy plates remain flat during thermal cycling specific stiffness of CE7 is 2.5 times that of Kovar Surface finish < 0.4μ Ra Typical tolerance +/- 0.01mm Flatness 1 part in 2000 (0.05%)

14 250 Mechanical Properties CE17M CE17 CE13 CE11 CE9 CE7 UTS Annealed Mpa Elastic modulus Gpa

15 Higher strength Alloys PROPERTY CE17 A 1200 CE17M A6061 CE17M A 6061 Density g/cc Yield ksi UTS ksi Elastic Mod msi Specific Stiffness Thermal Conductivity W/mK CTE (RT) ppm/c CONDITION Annealed Annealed Annealed Annealed T6 T6

16 Under Development higher strength Spray Formed Al-Si alloys Sandvik Osprey are currently working on 4 variants of the standard binary alloys to produce high strength alloys with CTEs in the range 19 to 13ppm/ o C and maximized ductility. PROPERTY CE17M A 6061 A B C D 7034 Density g/cc est 2.7 est 2.7 est 2.7 est 2.88 Yield ksi UTS ksi Elastic Mod msi Specific Stiffness Elongation % Thermal Conductivity W/mK est 130 est 130 est 130 est 130 CTE (RT) ppm/c est 17 est 17 est 17 est 22 CONDITION T6 T6 T6 T6 T6 T6 T6

17 OSPREY CE ALLOYS OFFER:- Low cost 100 Relative costs for carrier plate Cu/W Cu/Mo/Cu AlSiC CE7

18 OSPREY CE ALLOYS OFFER:- Low cost Relative material costs CE7 CE9 CE11 CE13 CE17

19 Lightweight Thermal Management Solutions What are the CE Alloys? What is Spray Forming? Why use the CE Alloys? Who is Sandvik Osprey? Discussion / Questions

20 OSPREY CE ALLOYS OFFER:- Homogeneous/Isotropic Properties The Patented Osprey Process

21 OSPREY CE ALLOYS OFFER:- Homogeneous/Isotropic Properties molten alloy gas atomized The Patented Osprey Process

22 OSPREY CE ALLOYS OFFER:- Homogeneous/Isotropic Properties molten alloy gas atomized The Patented Osprey Process

23 OSPREY CE ALLOYS OFFER:- Homogeneous/Isotropic Properties molten alloy gas atomized The Patented Osprey Process

24 OSPREY CE ALLOYS OFFER:- Homogeneous/Isotropic Properties molten alloy gas atomized sprayed to form solid billet The Patented Osprey Process

25 OSPREY CE ALLOYS OFFER:- Homogeneous/Isotropic Properties molten alloy gas atomized sprayed to form solid billet The Patented Osprey Process

26 OSPREY CE ALLOYS OFFER:- Homogeneous/Isotropic Properties molten alloy gas atomized sprayed to form solid billet The Patented Osprey Process

27 OSPREY CE ALLOYS OFFER:- Homogeneous/Isotropic Properties molten alloy gas atomized sprayed to form solid billet rapid solidification - fine structure The Patented Osprey Process

28 OSPREY CE ALLOYS OFFER:- Homogeneous/Isotropic Properties molten alloy gas atomized sprayed to form solid billet rapid solidification - fine structure The Patented Osprey Process

29 OSPREY CE ALLOYS OFFER:- Homogeneous/Isotropic Properties molten alloy gas atomized sprayed to form solid billet rapid solidification - fine structure product is homogeneous and isotropic The Patented Osprey Process

30 OSPREY CE ALLOYS OFFER:- Homogeneous/Isotropic Properties molten alloy gas atomized sprayed to form solid billet rapid solidification - fine structure product is homogeneous and isotropic The Patented Osprey Process

31 OSPREY CE ALLOYS OFFER:- Homogeneous/Isotropic Properties molten alloy gas atomized sprayed to form solid billet rapid solidification - fine structure product is homogeneous and isotropic The Patented Osprey Process

32 OSPREY CE ALLOYS OFFER:- The Patented Osprey Process billet removed

33 OSPREY CE ALLOYS OFFER:- The Patented Osprey Process billet removed cooled

34 OSPREY CE ALLOYS OFFER:- The Patented Osprey Process billet removed cooled and cut into blocks

35 Spray-form Osprey CE Alloy Plate Typical Production Route HIP Billet Billet Saw Block Slice - Lap Plate EDM or CNC Ni/Au Plate Product

36 CE Alloy Size Capability slice from 15 dia billet 300 mm machined disc Typical manufacturing billets are on the order of 8 12 in diameter, 12 to 24 in length

37 OSPREY CE ALLOYS OFFER:- Machinable alloys

38 OSPREY CE ALLOYS OFFER:- Machinable alloys alloys machinable using CNC or EDM (unlike AlSiC) no NRE costs re-work and design changes easy

39 OSPREY CE ALLOYS OFFER:- Machinability Al6061 CE13 CE7

40 OSPREY CE ALLOYS OFFER:- Plateable alloys plating with Ni, Au and Ag easy similar process to that used for plating Al alloys Clean, etch and activate

41 OSPREY CE ALLOYS OFFER:- Plateable alloys plating with Ni, Au and Ag easy similar process to that used for plating Al alloys Clean, etch and activate Zincate

42 OSPREY CE ALLOYS OFFER:- Plateable alloys plating with Ni, Au and Ag easy similar process to that used for plating Al alloys Clean, etch and activate Zincate Ni Plate

43 OSPREY CE ALLOYS OFFER:- Plateable alloys plating with Ni, Au and Ag easy similar process to that used for plating Al alloys Clean, etch and activate Zincate Ni Plate Bake 200ºC

44 OSPREY CE ALLOYS OFFER:- Plateable alloys plating with Ni, Au and Ag easy similar process to that used for plating Al alloys Clean, etch and activate Zincate Ni Plate Bake 200ºC Au plate

45 Soldering OSPREY CE ALLOYS OFFER:- Standard Microelectronic Package Assembly Procedures any solder up to 550 o C (eg Au/Sn) Feedthroughs Glass insulation with Kovar ring Ceramic insulation with metallization or Kovar ring Laser welded aluminum (Pacific Aerospace)

46 OSPREY CE ALLOYS OFFER:- Standard Circuit Assembly Procedures Soldering any solder up to 550 o C (eg Au/Sn) Adhesives Compatible with surface finish (eg Au) Wire, ribbon bonding Laser welding

47 EFFECTS OF COEFFICIENT OF THERMAL EXPANSION MISMATCH ON SOLDER ATTACHED GaAs MMICs Jeanne Pavio and Don Hyde Published in the 1991 IEEE MTT-S Digest GaAs devices placed under tensile stress with materials such as Kovar (CTE 5.1 ppm/ C) experienced severe cracking and corner fracture through long term reliability screening Although no internal device fractures were exhibited in materials such as copper with a CTE of 16.5 ppm / C, 25 percent corner fractures resulted in classifying this material as unacceptable for GaAs solder mount the failure was caused by CTE mismatch between the copper and the GaAs as was seen with aluminum At 1000 cycles every device mounted on Kovar had fractured. None of the devices on AlSi (60/40) 1, CuMo (15/85) or CuW (10/90) had cracks 1 - AlSi (60/40) is equivalent to CE13

48 OSPREY CE ALLOYS OFFER:- Lid laser welded to CE11 housing 4047 to CE11 weld 4047 lid Machined CE Alloy enclosure, hermetic package

49 Current status Laser Welding of CE Alloys successful laser welded CE11 / CE13 packages by customers worldwide Ongoing development establish conditions for CE11 (CE13, CE17 lids) CE7 / CE11 compound package develop techniques for CE7 and CE9 Courtesy of LazeStar, Livermore, CA

50 Hermetic Packages CE11,13 or 17 Housings can be directly laser welded under optimized conditions using 4047, 6061, CE17 or CE13 lids/selection of lid alloy depends on size/design of housing (lids may require ribs for large housings) can be seam sealed using brazed steel rim CE7 or CE9 Housings OSPREY CE ALLOYS OFFER:- currently cannot be directly laser welded can be laser welded using CE13 or 17 rim or wall produced by diffusion bonding can be seam sealed using brazed Kovar or other Fe-Ni alloy rim

51 Diffusion Bonding of CE Alloys For example CE7 to CE11 Al foil used at interface to reduce interfacial stress due to expansion mismatch CE11 Block CE7 Plate High Pressure, High Temperature

52 For example CE7 to CE7 Diffusion Bonding of CE Alloys All the Si-Al alloys produced by Osprey Metals (CE alloys) can be bonded together to produce compound structures CE7 plate Diffusion bonding CE7 block with machined water cooling channels Ceramics such as Alumina or Beryllia can be bonded to CE7. An Al foil interlayer can help attachment High Pressure, High Temperature Bonded water cooled plate The bond strength is greater than the strength of the CE7

53 Diffusion Bonding of CE Alloys CE7 CE7 Al interlayer CE11 CE7/CE11(direct bond) CE17 CE7/Al foil/ce17 to absorb mismatch

54 Diffusion Bonding of CE Alloys CE13 walls Facilitate laser welding of feedthrus, cover Ease of machining, threading CE7 floor CTE-matched surface for direct substrate, device attach Courtesy of Pacific Aerospace and Electronics, Wenatchee, WA

55 Enhanced Thermal Conductivity Embedded products CE alloy Eg Pyrolithic graphite Diamond composite High Pressure, High Temperature Compound product is a machinable, plateable block with high thermal conductivity through the central section or in selected sections

56 Enhanced Thermal Conductivity Embedded products Two resistors attached to the top of the Al/Si/graphite plate, the bottom to a liquid cooled base plate. Attachment was made with a thermal adhesive. The plate was painted black and voltage was applied to the resistors such that they dissipated a total of 100 W. The thickness of graphite in the 0.5 inch thick plate was 0.06 inches. Thus, the graphite accounts for ~12% of the cross sectional area of the plate, the rest being CE-13. Thermal conductivity of the pyrolytic graphite used is typically 1200 W/mK in the x-y axis, less than 20 W/mK in the z. Measurements, data courtesy is of Rockwell Collins, Inc., Cedar Rapids, IA

57 Enhanced Thermal Conductivity Embedded products IR camera, software used to determine temperature profiles along the center of the plates Measurements, data is courtesy of Rockwell Collins, Inc., Cedar Rapids, IA

58 Enhanced Thermal Conductivity Embedded products 80 Accounting for the loss of heat dissipated by the resistors due to free convection and radiation, the effective thermal conductivity of the graphite layer is calculated to be 870 W/m K. This is consistent with results reported by a major defense customer. temperature ( C) y = x y = x Aluminum Al/Si/graphite position (inch) Measurements, data is courtesy of Rockwell Collins, Inc., Cedar Rapids, IA

59 Enhanced Thermal Conductivity Embedded products 6061 Al Osprey CE13 42% Si Al Osprey CE17 27% Si Al Density - g/cc CTE - ppm/deg C deg C Thermal conductivity shown is for the CE Alloy only composite structure estimates are based on the rule of mixtures. Thermal Conductivity - W/mK Specific Stiffness

60 Enhanced Thermal Conductivity Phase change heat sinks Store thermal energy Act as thermal capacitor to absorb heat during high levels of activity then release heat in period of low activity i.e. simplify thermal management since it can be designed for average rather than peak loading Traditionally use wax ---XCA developing new heat sinks using hydrated salts Advantage can store 4 times the thermal energy per unit volume compared to wax since higher Cp, higher heat of fusion & greater density Typical applications Maintain steady temperature for long periods of time with no external cooling Provide temperature stability for lasers Provide thermal management for missiles Courtesy of XC Associates, Stephentown, NY

61 Enhanced Thermal Conductivity Phase change heat sinks The heat of fusion is the amount of thermal energy which must be absorbed for 1 gram of a substance to change states from a solid to a liquid. Heat_of_fusion Courtesy of XC Associates, Stephentown, NY

62 Phase change heat sinks Paraffin wax Courtesy of XC Associates, Stephentown, NY

63 Phase change heat sinks - Lithium Nitrate Graph for Ba(OH)2 would be similar but with melt at 78 deg C Courtesy of XC Associates, Stephentown, NY

64 Heatplate with Encapsulated Phase Change Material Density - g/cc Osprey CE17 27% Si Al 2.6 CTE - ppm/deg C deg C Thermal Conductivity -W/mK Specific Stiffness Courtesy of XC Associates, Stephentown, NY

65 Competitive Materials vs CE Alloys Cu/W 6 times heavier expensive/strategic material slightly > thermal conductivity Cu/Mo 4 times heavier expensive slightly > thermal conductivity AlSiC difficult/expensive to machine dies needed/costly NRE long delivery/difficult to rework difficult to electroplate can be net-shaped but with limited geometry Kovar 3 times heavier low thermal conductivity/ low stiffness material lower price than CE7/9 but requires heat treatment/de-burring and sometimes heat-sink inserts Titanium 2 times heavier low thermal conductivity lower price but may require heat-sink inserts Aluminium Alloys high expansion mismatch with electronic devices low stiffness very low cost

66 Selection of Osprey s Customers

67 Lightweight Thermal Management Solutions What are the CE Alloys? What is Spray Forming? Why use the CE Alloys? Who is Sandvik Osprey? Discussion / Questions

68 Advantages of CE Alloys Low cost lower cost than Cu/W, Cu/Mo and AlSiC for almost all applications Tailored CTE a range of Si/Al alloys available with CTE values ranging from 7 to 17ppm/ºC customers can select the optimum combination of price and performance CTE of CE7 alloy closely matches that of alumina board and GaAs over wide temperature range. Lightweight the lightest, practical, thermal management materials available CE7/CE9 alloys 10% lighter than conventional Al alloys, one sixth the weight of Cu/W, one quarter the weight of Cu/Mo and one third that of Kovar High Thermal Conductivity thermal conductivity is in the range W/mK, depending on alloy composition CE7 has 6 times the thermal conductivity of Kovar

69 Advantages of CE Alloys 2 High Stiffness/High Thermal Stability CE7/CE9 plates remain flat during thermal cycling specific stiffness of CE7 is 2.5 times that of Kovar Homogeneous/Isotropic Properties unique spray forming, rapid solidification technology used to manufacture billets of CE alloys; the products are extremely homogeneous and isotropic in terms of composition, microstructure and properties product is therefore a consistent and reliable Machinable CE alloys are readily machinable using CNC or EDM methods (unlike AlSiC) no moulds/dies required and therefore no NRE costs re-work is easily/accomplished and changes in design are readily accommodated; good dimensional tolerances can be achieved (e.g. +/- 20μm ) with excellent surface finish (e.g. 0.4μm Ra ) normally no stress relieving is necessary. If required on thin sections simple heating in air to 350 o C (as for Al) is sufficient

70 Advantages of CE Alloys 3 Plateable as the CE alloys are electrically conducting, plating with Ni, Au and Ag can be accomplished without problem technology used is similar to that used for plating Al alloys Weldability hermetic sealing possible using laser welding of 4047 or 6061 lids to CE17,13 and 11 packages diffusion bonding of CE11, CE13 or 4047 to CE7 or 9 allows laser welding to be used for lid sealing Rapid Delivery delivery of prototype blocks, plates, machined components and plated components within 1-4 weeks stocks of standard sizes available at Osprey or via Internet on cealloys.com or cealloys.co.uk Inspection if required, for critical applications, X-ray technology can be readily applied Environmentally Friendly easily re-cycled

71 Lightweight Thermal Management Solutions What are the CE Alloys? What is Spray Forming? Why use the CE Alloys? Who is Sandvik Osprey? Discussion / Questions

72 Sandvik Osprey Ltd. ISO 9001/14000 ACCREDITED Activities based on gas-atomizing molten alloys for Spray Forming or Powder Production BUSINESS AREAS Licensing of patented spray-forming technology over 30 licensees worldwide aluminum/copper/special steels/superalloys/mmcs Production of special powders brazing/pm/filters/plasma spray (Cu/Ni/Co/Fe alloys) MIM / turbine blade coatings (superfine powders<22microns) Manufacture of products in spray-formed Si/Al alloys (CE Alloys) patented range of alloys thermal management/electronic package applications

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74 Invoiced sales, million $2,888 $2,497 $2,166 Dec 2004

75 Focus on new materials / markets (electronics / CE Alloys) High technology stainless steels, special alloy materials and advanced value-added products, developed in close cooperation with customers Five product areas: Tube, Strip, Wire, Kanthal, Process Systems Focus on product niches and customers with high demands on material properties Integrated production Extensive investments in R&D Global presence

76 Thank you for your interest!