PIEZOELECTRIC PLATES. Features:

Size: px
Start display at page:

Download "PIEZOELECTRIC PLATES. Features:"

Transcription

1 PIEZOELECTRIC PLATES Morgan Advanced Materials is a world leader in the design and manufacture of complex electronic ceramic components and assemblies used in a wide range of applications and cutting edge technologies. Morgan s Global Electroceramics Divisions specialise in the development and production of various plate sizes, electrode and metallisation configurations. This range is fabricated from 33 available piezoelectric material formulations to address high power, sensitivity, stability needs in cryogenic temperatures as also in high temperatures and extreme pressure applications. Applications include: 1-3 Composites for SONAR and medical imaging Megasonic cleaning NDT transducers Pressure sensors Tactile feedback Ultrasonic sensors Linear ultrasonic motors Features: Choice of metallisation (Silver, Nickel, Gold, Nickel-Vanadium, Aluminium and others on request) Sputtered and chemically deposited metallisation s available Thickness frequency tuning available on request Wide choice of PZT formulations (Piezoelectric Materials Portfolio) Morgan Advanced Materials is manufacturing what are believed to be the world s thickest piezoelectric ceramic blocks. The blocks, designed for use in ultralow frequency SONAR applications down to 18KHz, are made of high-quality, soft (Navy II) PZT5A1. The blocks offer superb electrical characteristics, are of high sintered density and come in a choice of nine, highly sensitive 'soft' PZT formulations suitable for the manufacture of wide bandwidth 1-3 composite transducers. However, the most striking feature of Morgan's new PZT ceramic blocks is their size, and in particular their thickness reaching a current maximum of 48mm. The ability to manufacture and polarise such large thicknesses of piezoelectric materials represents a step change in the industry.

2 TYPICAL ELECTRODE CONFIGURATIONS Standard Wrap Around Custom Other custom electrode configurations are available on request. DIMENSIONAL RANGE From To Length 1mm (0.04 ) 165mm (6.5 ) Width 1mm (0.04 ) 165mm (6.5 ) Thickness 0.08mm (0.003 ) 48mm (1.9 ) Parts can be produced to the size ranges shown, but not in every combination of dimensions expressed above. STANDARD MECHANICAL TOLERANCES Length & Width Thickness ±0.150mm ±0.05mm Squareness (edge to face) Within 0.15º Flatness (lapped parts) Parallelism 0.012mm (lapped), 0.015mm (sliced) 0.012mm (lapped), 0.06mm (sliced) Tighter mechanical tolerances are achievable but are dependent on the plate length, width and thickness. Wider mechanical tolerances are obtained on large plate components, more information is available on request. METALLISATION TYPE Silver fired thick film Electroless nickel Tin Evaporated Nickel Gold flash Sputtered Gold Nickel Aluminium Vanadium and other available on request Soldering to PZT Ceramics

3 Please follow the guidelines published in our website. TYPICAL IMPEDANCE TRACE (LENGTH MODE)

4 USEFUL EQUATIONS L Capacitance Longitudinal or transversal frequency =... = W Thickness frequency Static displacement = =.. =.. t =. Voltage (static) Effective coupling factor =. =. =... = Planar coupling factor. Mechanical quality factor =.... Ceramic Testing Appropriate statistical methods ranging from AQL s to 100% testing are used on electrical parameters in accordance with EN A brief summary is provided in hard copy and typically includes low field measurements of capacitance, tan delta and the main parameters used to determine piezoelectric activity.

5 Procedures other than this can be negotiated, and additional data requirements (electronic format, sample quantity, etc) are available on request.

Piezoelectric Polycrystalline (PZT) Components and Wafers

Piezoelectric Polycrystalline (PZT) Components and Wafers Piezoelectric Polycrystalline (PZT) Components and Wafers Industry Leading Piezoelectric Polycrystalline (PZT) Component Manufacturing and Engineering CTS offers high-performance piezoelectric materials

More information

Welding characteristics and structures of same and different metal specimens using ultrasonic complex vibration welding equipments

Welding characteristics and structures of same and different metal specimens using ultrasonic complex vibration welding equipments Proceedings of 20 th International Congress on Acoustics, ICA 2010 23-27 August 2010, Sydney, Australia Welding characteristics and structures of same and different metal specimens using ultrasonic complex

More information

Use of Piezoelectric Films for NDT Applications

Use of Piezoelectric Films for NDT Applications ECNDT 2006 - We.2.1.3 Use of Piezoelectric Films for NDT Applications Silvère BARUT, EADS Corporate Research Center, Colomiers, France Abstract. Poly(vinylidene fluoride) i.e. (PVDF) films and its copolymer

More information

Low Voltage Single Crystal Actuators

Low Voltage Single Crystal Actuators Low Voltage Single Crystal Actuators Xiaoning Jiang *a, Paul W. Rehrig a, Jun Luo a, Wesley S. Hackenberger a Shujun Zhang b, and Thomas R. Shrout b a TRS Technologies, Inc. 282 East College Avenue, Suite

More information

Green piezoelectric for autonomous smart textile

Green piezoelectric for autonomous smart textile Journal of Physics: Conference Series PAPER OPEN ACCESS Green piezoelectric for autonomous smart textile To cite this article: E Lemaire et al 2015 J. Phys.: Conf. Ser. 660 012082 View the article online

More information

Piezoelectric ceramics test for crack detection

Piezoelectric ceramics test for crack detection White paper: Technical-scientific informative ITC-01 / ATCP Piezoelectric ceramics test for crack detection ATCP Physical Engineering www.atcp-ndt.com Authors: A. Henrique Alves P. (Pereira, A.H.A.) Cesar

More information

LOW TEMPERATURE PHOTONIC SINTERING FOR PRINTED ELECTRONICS. Dr. Saad Ahmed XENON Corporation November 19, 2015

LOW TEMPERATURE PHOTONIC SINTERING FOR PRINTED ELECTRONICS. Dr. Saad Ahmed XENON Corporation November 19, 2015 LOW TEMPERATURE PHOTONIC SINTERING FOR PRINTED ELECTRONICS Dr. Saad Ahmed XENON Corporation November 19, 2015 Topics Introduction to Pulsed Light Photonic sintering for Printed Electronics R&D Tools for

More information

Three-Dimensional Molded Interconnect Devices (3D-MID)

Three-Dimensional Molded Interconnect Devices (3D-MID) Jörg Frank Three-Dimensional Molded Interconnect Devices (3D-MID) Materials, Manufacturing, Assembly and Applica ons for Injec on Molded Circuit Carriers Sample Pages ISBN 978-1-56990-551-7 HANSER Hanser

More information

R&D STATUS REPORT. CONTRACTOR: Materials Systems Inc. CONTRACT AMOUNT: $1,077,052 CONTRACT NO.: N C-0323 AMOUNT FUNDED: $593,606

R&D STATUS REPORT. CONTRACTOR: Materials Systems Inc. CONTRACT AMOUNT: $1,077,052 CONTRACT NO.: N C-0323 AMOUNT FUNDED: $593,606 MSI Materials Systems Inc. R&D STATUS REPORT CONTRACTOR: Materials Systems Inc. CONTRACT AMOUNT: $1,077,052 CONTRACT NO.: N00014-97-C-0323 AMOUNT FUNDED: $593,606 EFFECTIVE DATE OF CONTRACT: 5 August 1997

More information

JOINT INDUSTRY STANDARD

JOINT INDUSTRY STANDARD JOINT INDUSTRY STANDARD AUGUST 1999 Semiconductor Design Standard for Flip Chip Applications ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES Semiconductor Design Standard for Flip Chip Applications About

More information

Beam Leads. Spider bonding, a precursor of TAB with all-metal tape

Beam Leads. Spider bonding, a precursor of TAB with all-metal tape Beam Leads The vast majority of chips are intended for connection with thermosonic bonds: all other methods require some modification to the wafer. As early as 1972, Jordan described three gang-bonding

More information

Chapter 11: Passives: Discrete, Integrated, and Embedded. Johan Liu

Chapter 11: Passives: Discrete, Integrated, and Embedded. Johan Liu Chapter 11: Passives: Discrete, Integrated, and Embedded Johan Liu jliu@chalmers.se 1 Types of Passive Components 2 Embedded passive devices: advantages Reduced system mass, volume and footprint. Individual

More information

Aluminum Nitride Thin Films for High Frequency Smart Ultrasonic Sensor Systems

Aluminum Nitride Thin Films for High Frequency Smart Ultrasonic Sensor Systems 18th World Conference on Nondestructive Testing, 16-20 April 2012, Durban, South Africa Aluminum Nitride Thin Films for High Frequency Smart Ultrasonic Sensor Systems Thomas HERZOG, Susan WALTER, Susanne

More information

Latest Development in Vacuum Metallisation

Latest Development in Vacuum Metallisation Latest Development in Vacuum Metallisation Professor Nadir Ahmed Vacuum Metallising Consultant General Vacuum Equipment Ltd. Pennine Business Park, Pilsworth Road, Heywood OL10 2TL England Tel: +44(0)1706

More information

METHODS OF COATING FABRICATION

METHODS OF COATING FABRICATION METHODS OF COATING FABRICATION Zbigniew Grzesik http://home.agh.edu.pl/~grzesik Department of Physical Chemistry and Modelling DEFINITION The coating is the thin outer layer of the object, which physiochemical

More information

DITF ToolKit 1. Standard Substrate Sizes (selected at the factory for optimum process)

DITF ToolKit 1. Standard Substrate Sizes (selected at the factory for optimum process) DITF ToolKit 1 DITF Toolkit Substrates Common Substrate Materials Alumina (99.5% min) єr = 9.9 Tan d = 1.5 x10-4 Aluminum Nitride (K170) єr = 8.9 Tan d = 2.0 x10-3 Beryllia (99.5%) єr = 6.7 Tan d = 3.0

More information

Comparison of BS and BS EN for steel materials

Comparison of BS and BS EN for steel materials Comparison of BS and BS EN for steel materials Appendix This table only highlights the comparison of BS and BS EN on steel materials, which are relevant to plan approval. Title of BS BS BS EN Title of

More information

Vibrational energy harvesting microgenerators based on piezoelectric thick films and MEMS

Vibrational energy harvesting microgenerators based on piezoelectric thick films and MEMS Vibrational energy harvesting microgenerators based on piezoelectric thick films and MEMS Erling Ringgaard, Tomasz Zawada, Michele Guizzetti, Karsten Hansen Meggitt Sensing Systems, Kvistgaard, Denmark

More information

Hyun-Taek Oh*, Hyun-Jae Joo*, Moon-Chan Kim*, and Ho-Yong Lee*, **,

Hyun-Taek Oh*, Hyun-Jae Joo*, Moon-Chan Kim*, and Ho-Yong Lee*, **, Journal of the Korean Ceramic Society Vol. 55, No. 2, pp. 166~173, 2018. https://doi.org/10.4191/kcers.2018.55.2.04 Communication Effect of Mn on Dielectric and Piezoelectric Properties of 71PMN-29P [71Pb(Mg

More information

Metallization of MID Dec 2 010

Metallization of MID Dec 2 010 Metallization of MID Dec 2010 Agenda Introduction to Dow Electronic Materials MID Applications & Advantages Dow MID Metallization Processes Plating Equipment Summary Dow Business Structure Where Dow Electronic

More information

Evaluation of Internal Defects in Fabric Belt Joints using NDT Techniques

Evaluation of Internal Defects in Fabric Belt Joints using NDT Techniques Evaluation of Internal Defects in Fabric Belt Joints using NDT Techniques More Info at Open Access Database www.ndt.net/?id=15091 S Balamurugan 1, Pavan Bijalwan 1, R Shunmuga Sundaram 1, Tibin Thomas

More information

CHAPTER 4 PIEZOELECTRIC MATERIAL BASED VIBRATION CONTROL

CHAPTER 4 PIEZOELECTRIC MATERIAL BASED VIBRATION CONTROL 36 CHAPTER 4 PIEZOELECTRIC MATERIAL BASED VIBRATION CONTROL 4.1 INTRODUCTION This chapter focuses on the development of smart structure using piezoelectric patches in order to control the vibration actively.

More information

Frequently Asked Questions about Platinum RTD Elements

Frequently Asked Questions about Platinum RTD Elements Frequently Asked Questions about Platinum RTD Elements Platinum RTD Specifications... 2 What is the difference between the IEC 60751 specification and the DIN EN 60751 specification? What is the difference

More information

Embedded Passives..con0nued

Embedded Passives..con0nued Embedded Passives..con0nued Why Embedded Passives? Improves the packaging efficiency System-on-Package (SOP); SLIM integration Reducing size Eliminating substrate assembly Minimizing solder joint failure

More information

Product Documentation

Product Documentation Product Documentation Quartz Crystal Unit 32.768 khz March 2017 1/12 Rev. 1.0 2. Product Description The is a low frequency SMT Quartz Crystal Unit that incorporates a tuning fork Quartz Crystal Resonator.

More information

PIN Sockets & PIN Connectors General Specifications Part Numbers And Product Identification

PIN Sockets & PIN Connectors General Specifications Part Numbers And Product Identification Sockets & Connectors General Specifications Part Numbers And Product Identification GENERAL SPECIFICATIONS The values listed below are general specs applying for LEYCONN socket and pin connectors. Please

More information

Ceramic Housed Quartz Crystal Resonator

Ceramic Housed Quartz Crystal Resonator Version: February 24, 2017 Ceramic Housed Quartz Crystal Resonator Token Electronics Industry Co., Ltd. Web: www.token.com.tw Email: rfq@token.com.tw Taiwan: No.137, Sec. 1, Zhongxing Rd., Wugu District,

More information

KEMET Portfolio. Hi CV. Low CV. Capacitance. Ta MnO MLCC 0.1. Application Frequency. pf nf μf DC Hz KHz MHz GHz 1.E

KEMET Portfolio. Hi CV. Low CV. Capacitance. Ta MnO MLCC 0.1. Application Frequency. pf nf μf DC Hz KHz MHz GHz 1.E Ceramic SMD Market Overview KEMET Portfolio Capacitance pf nf μf 1.E+09 10 3 1.E+08 10 2 1.E+07 10 1 1.E+06 10 2 1.E+05 10 1.E+04 1 1.E+03 10 2 1.E+02 10 1.E+01 Ta MnO 2 KO MLCC AO Hi CV Low CV 1 1.E+00

More information

Process Condition Optimization for Plastic Membrane Welding by a Ultrasonic Welding

Process Condition Optimization for Plastic Membrane Welding by a Ultrasonic Welding Process Condition Optimization for Plastic Membrane Welding by a Ultrasonic Welding Nam Hoon Jo BS. Scholar, Department of Mechanical Engineering, Graduate School Kongju National University (KNU), South

More information

GRAPHIC MANUFACTURING CAPABILITY Q217-18

GRAPHIC MANUFACTURING CAPABILITY Q217-18 All features are design dependent and may not be achievable in combination Reduced Yield / Special values up ( or down ) to the standard limit are design and application dependent Standard features only

More information

Flexible piezoelectric materials for emerging applications

Flexible piezoelectric materials for emerging applications Flexible piezoelectric materials for emerging applications Konstantin Astafiev, Tomasz Zawada, Karl Elkjaer, and Erling Ringgaard MEGGITT A/S, MSS, Denmark Piezo 2013 - Electroceramics for End-users VII,

More information

Stamping Basics. Die Components Class of Tools Cost Drivers

Stamping Basics. Die Components Class of Tools Cost Drivers Stamping Basics Die Components Class of Tools Cost Drivers Basic Types Of Tools Compound Progressive Draw Secondary Tools Compound Die Lower Volume Flatter Parts No Forms Burrs All One Direction Progressive

More information

HAND BOOK OF ELECTROPLATING ANODIZING & SURFACE FINISHING TECHNOLOGY

HAND BOOK OF ELECTROPLATING ANODIZING & SURFACE FINISHING TECHNOLOGY HAND BOOK OF ELECTROPLATING ANODIZING & SURFACE FINISHING TECHNOLOGY Principles of Electroplating The Electro Chemical Series Electrodeposition Electrochemical Terms Using a Copper Anode Using an Inert

More information

High Performance Alloys. Characteristics

High Performance Alloys. Characteristics Alloy Designation EN DIN CEN/TS 13388 UNS High Performance Alloys Chemical Composition percentage We have developed a wide range of high performance alloys with excellent properties regarding conductivity,

More information

SINGLE CRYSTAL SAPPHIRE

SINGLE CRYSTAL SAPPHIRE SINGLE CRYSTAL SAPPHIRE Single Crystal Sapphire plays an everincreasingly important role as a material for high reliability Opto-Electronics today due to excellent mechanical characteristics, chemical

More information

Product Documentation MS1V-T1K

Product Documentation MS1V-T1K Product Documentation Quartz Crystal Unit 32.768 khz February 2017 1/12 Rev. 1.0 2. Product Description The is a low frequency surface mount technology Quartz Crystal Unit that incorporates a tuning fork

More information

ELECTRONIC SUPPLEMENTARY INFORMATION. On-Skin Liquid Metal Inertial Sensor

ELECTRONIC SUPPLEMENTARY INFORMATION. On-Skin Liquid Metal Inertial Sensor Electronic Supplementary Material (ESI) for Lab on a Chip. This journal is The Royal Society of Chemistry 2017 ELECTRONIC SUPPLEMENTARY INFORMATION On-Skin Liquid Metal Inertial Sensor Matija Varga, a,b

More information

EDEXCEL NATIONALS UNIT 18 ADVANCED MECHANICAL PRINCIPLES. ASSIGNMENT No. 1 - THE AFFECTS OF STRESS

EDEXCEL NATIONALS UNIT 18 ADVANCED MECHANICAL PRINCIPLES. ASSIGNMENT No. 1 - THE AFFECTS OF STRESS EDEXCEL NATIONALS UNIT 18 ADVANCED MECHANICAL PRINCIPLES ASSIGNMENT No. 1 - THE AFFECTS OF STRESS NAME: I agree to the assessment as contained in this assignment. I confirm that the work submitted is my

More information

Smart materials. Piezoelectric materials Shape memory materials Magnetostriction materials Electrostriction materials. w.wang 107

Smart materials. Piezoelectric materials Shape memory materials Magnetostriction materials Electrostriction materials. w.wang 107 Smart materials Piezoelectric materials Shape memory materials Magnetostriction materials Electrostriction materials w.wang 107 Qualitative comparison of different smart technology Active System Driving

More information

Improving coupling coefficient distribution on BAW filters manufactured on 200mm wafers

Improving coupling coefficient distribution on BAW filters manufactured on 200mm wafers Improving coupling coefficient distribution on BAW filters manufactured on 200mm wafers Sergey Mishin Advanced Modular Systems, Inc Goleta, CA/USA smishin@amssb.com Yury Oshmyansky Advanced Modular Systems,

More information

Product Documentation CM7V-T1A

Product Documentation CM7V-T1A Product Documentation Quartz Crystal Unit 32.768 khz February 2017 1/12 Rev. 1.1 2. Product Description The is a low frequency SMT Quartz Crystal Unit that incorporates a tuning fork Quartz Crystal Resonator.

More information

High Performance STOL Alloys. Characteristics. Current Carrying Capacity. Density 8.9 g/cm³. Specific heat capacity J/(g K)

High Performance STOL Alloys. Characteristics. Current Carrying Capacity. Density 8.9 g/cm³. Specific heat capacity J/(g K) Alloy Designation High Performance STO Alloys EN - DIN CEN/TS 13388 - UNS Chemical Composition percentage Cu Rest % Ni 1.4.. 1.7 % Si 0.2.. 0.35 % Sn 0.02.. 0.3 % Zn 0.20.. 0.7 % Others 0.50 % This alloy

More information

Piezoelectric Thick Film Technology Integrated Self-sustained Systems for Industrial

Piezoelectric Thick Film Technology Integrated Self-sustained Systems for Industrial InSensor Piezoelectric Thick Film Technology Integrated Self-sustained Systems for Industrial Applications Wanda W. Wolny, Rasmus Lou-Moeller, Erling Ringgaard, Konstantin Astafjev and Tomasz Zawada Meggitt

More information

Hollow Piezoelectric Ceramic Fibers for Energy Harvesting Fabrics

Hollow Piezoelectric Ceramic Fibers for Energy Harvesting Fabrics Hollow Piezoelectric Ceramic Fibers for Energy Harvesting Fabrics François M. Guillot, Ph.D., Haskell W. Beckham, Ph.D., Johannes Leisen, Ph.D. Georgia Institute of Technology, Atlanta, GA UNITED STATES

More information

Method of Manufacture of Multiple-Element Piezoelectric Transducer

Method of Manufacture of Multiple-Element Piezoelectric Transducer Missouri University of Science and Technology Scholars' Mine Materials Science and Engineering Faculty Research & Creative Works Materials Science and Engineering 11-1-1994 Method of Manufacture of Multiple-Element

More information

Welcome to Streamline Circuits Lunch & Learn. Design for Reliability & Cost Reduction of Advanced Rigid-Flex/Flex PCB Technology

Welcome to Streamline Circuits Lunch & Learn. Design for Reliability & Cost Reduction of Advanced Rigid-Flex/Flex PCB Technology Welcome to Streamline Circuits Lunch & Learn Design for Reliability & Cost Reduction of Advanced Rigid-Flex/Flex PCB Technology Accurate PCB data is critical to the tooling process. Here are some key items

More information

Opti - Cap March 2011 P42BN820MA3152

Opti - Cap March 2011 P42BN820MA3152 Opti - Cap March 2011 P42BN820MA3152 MAXIMUM ENVELOPE (SEE TABLE) Multilayer Capacitor.040 ±.002 Milli Cap.005 ±.001.038 ±.004 Termination Metallization: 7.5 ± 4.5 microinches Au over a minimum of 50 microinches

More information

Michael Checkley 17/12/2010. A Batako Advanced Manufacturing Technology Research Laboratory GERI. My background. PhD aims and objectives.

Michael Checkley 17/12/2010. A Batako Advanced Manufacturing Technology Research Laboratory GERI. My background. PhD aims and objectives. Michael Checkley A Batako Advanced Manufacturing Technology Research Laboratory GERI My background. PhD aims and objectives. Equipment at AMTRel. Background to HEDG. Background to Vibration Assisted Grinding.

More information

Piezo and pyroelectric properties of PZT thick films

Piezo and pyroelectric properties of PZT thick films Piezo and pyroelectric properties of PZT thick films 1st International Workshop on Smart Materials and Structures, 7 th & 8 th October 2004 Dr Robert Dorey Introduction Why thick films? Processing issues

More information

Lead Free, Zero Shrink, Substrate Bonded LTCC System

Lead Free, Zero Shrink, Substrate Bonded LTCC System Lead Free, Zero Shrink, Substrate Bonded LTCC System R.L. Wahlers, A.H. Feingold and M. Heinz Electro-Science Laboratories, 416 E. Church Rd., King of Prussia, PA, 19406 Abstract Previous papers have reported

More information

DESIGNING FILTERS TO WITHSTAND INIMICAL ENVIRONMENTS

DESIGNING FILTERS TO WITHSTAND INIMICAL ENVIRONMENTS DESIGNING FILTERS TO WITHSTAND INIMICAL ENVIRONMENTS By R. V. SNYDER RS MICROWAVE BUTLER, NJ IMS 2005 Workshop WMB Filters II Practical Aspects of Microwave Filter Design and Realization CONTENTS HOW DO

More information

PCB Production Process HOW TO PRODUCE A PRINTED CIRCUIT BOARD

PCB Production Process HOW TO PRODUCE A PRINTED CIRCUIT BOARD NCAB Group Seminars PCB Production Process HOW TO PRODUCE A PRINTED CIRCUIT BOARD NCAB GROUP PCB Production Process Introduction to Multilayer PCBs 2 Introduction to multilayer PCB s What is a multilayer

More information

Low Cost PZT/Polymer Composites as a Sensor Material

Low Cost PZT/Polymer Composites as a Sensor Material Low Cost PZT/Polymer Composites as a Sensor Material Umut GUNAYDIN, Celaletdin ERGUN Istanbul Technical University, Mechanical Engineering Department, Taksim Istanbul, TURKEY. Abstract This research aims

More information

Meggitt Sensing Systems. This document and the information in it is proprietary and is the property of Meggitt Sensing Systems. It may not be copied

Meggitt Sensing Systems. This document and the information in it is proprietary and is the property of Meggitt Sensing Systems. It may not be copied Meggitt Sensing Systems. This document and the information in it is proprietary and is the property of Meggitt Sensing Systems. It may not be copied or disclosed to a third party or used for any purpose

More information

Advanced Power Modules with AlN-Substrates Extending Current Capability and Lifetime

Advanced Power Modules with AlN-Substrates Extending Current Capability and Lifetime Advanced Power Modules with AlN-Substrates Extending Current Capability and Lifetime U.Scheuermann SEMIKRON Elektronik GmbH, Sigmundstraße 2, 9431 Nuremberg, Germany Tel.: ++49-911-6559-381 Fax: ++49-911-6559-414

More information

Optimizing Immersion Silver Chemistries For Copper

Optimizing Immersion Silver Chemistries For Copper Optimizing Immersion Silver Chemistries For Copper Ms Dagmara Charyk, Mr. Tom Tyson, Mr. Eric Stafstrom, Dr. Ron Morrissey, Technic Inc Cranston RI Abstract: Immersion silver chemistry has been promoted

More information

This is an author-deposited version published in: Eprints ID: 17393

This is an author-deposited version published in:   Eprints ID: 17393 Open Archive TOULOUSE Archive Ouverte (OATAO) OATAO is an open access repository that collects the work of Toulouse researchers and makes it freely available over the web where possible. This is an author-deposited

More information

Product Documentation

Product Documentation Product Documentation Quartz Crystal Unit 32.768 khz September 2018 1/12 Rev. 1.2 2. Product Description The is a low frequency SMT Quartz Crystal Unit that incorporates a tuning fork Quartz Crystal Resonator.

More information

High-Temperature Ultrasound NDE Systems for Continuous Monitoring of Critical Points in Nuclear Power Plants Structures

High-Temperature Ultrasound NDE Systems for Continuous Monitoring of Critical Points in Nuclear Power Plants Structures Journal of Energy VOLUME 65-1 2016 journal homepage: http://journalofenergy.com/ High-Temperature Ultrasound NDE Systems for Continuous Monitoring of Critical Points in Nuclear Power Plants Structures

More information

Nickel Temperature Sensors 1/12

Nickel Temperature Sensors 1/12 Nickel Temperature Sensors 1/12 General Information In many industrial sectors and fields of research, temperature measurement is one of the most important parameters which determines product quality,

More information

Optimizing Immersion Silver Chemistries For Copper

Optimizing Immersion Silver Chemistries For Copper Optimizing Immersion Silver Chemistries For Copper Ms Dagmara Charyk, Mr. Tom Tyson, Mr. Eric Stafstrom, Dr. Ron Morrissey, Technic Inc Cranston RI Abstract: Immersion silver chemistry has been promoted

More information

Automotive air or oil temperature Appliances cooking temperature. MOUNTING DIMENSIONS (for reference only)

Automotive air or oil temperature Appliances cooking temperature. MOUNTING DIMENSIONS (for reference only) TD Series FEATURES Interchangeable without sensor-tosensor recalibration Very small thermal mass for fast response Air or liquid temperature sensing Linear temperature sensitivity Proven thin film processing

More information

The Role Of Electroplates In Contact Reliability

The Role Of Electroplates In Contact Reliability The Role Of Electroplates In Contact Reliability W.H. Abbott Battelle-Columbus Abbott@battelle.org 10/24/02 1 Overview Electroplating Is A Process; i.e. It Should Not Be Viewed As Simply A Material The

More information

Chapter 4 Fabrication Process of Silicon Carrier and. Gold-Gold Thermocompression Bonding

Chapter 4 Fabrication Process of Silicon Carrier and. Gold-Gold Thermocompression Bonding Chapter 4 Fabrication Process of Silicon Carrier and Gold-Gold Thermocompression Bonding 4.1 Introduction As mentioned in chapter 2, the MEMs carrier is designed to integrate the micro-machined inductor

More information

Low Impedance Ta Capacitors to Serve the Needs of the Electronics Industry

Low Impedance Ta Capacitors to Serve the Needs of the Electronics Industry Low Impedance Ta Capacitors to Serve the Needs of the Electronics Industry Randy Hahn, and Jonathan Paulsen KEMET Electronics Corp PO Box 5928 Greenville, SC 29606 Tel: +1 864-963-6300 Fax: +1 864-228-4333

More information

Metallization deposition and etching. Material mainly taken from Campbell, UCCS

Metallization deposition and etching. Material mainly taken from Campbell, UCCS Metallization deposition and etching Material mainly taken from Campbell, UCCS Application Metallization is back-end processing Metals used are aluminum and copper Mainly involves deposition and etching,

More information

Selection of Materials and Sensors for Health Monitoring of Composite Structures. Cambridge, MA 02139

Selection of Materials and Sensors for Health Monitoring of Composite Structures. Cambridge, MA 02139 Selection of Materials and Sensors for Health Monitoring of Composite Structures Seth S. Kessler 1,2 and S. Mark Spearing 2 1 Metis Design Corporation, Cambridge, MA, 02141 2 Department of Aeronautics

More information

Applications R Receiver Type of Design Length (mm) Width (mm) Thickness (mm) Model Type. R = 23.6 mm 40 = 4.0 mm 18 = 1.

Applications R Receiver Type of Design Length (mm) Width (mm) Thickness (mm) Model Type. R = 23.6 mm 40 = 4.0 mm 18 = 1. Piezoelectric Acoustic Modules R11 Receivers Overview Multilayer piezoelectric bimorph actuators are ceramic elements used to convert electrical energy into mechanical energy such as displacement or force

More information

Guide for Molded Tantalum Capacitors

Guide for Molded Tantalum Capacitors Guide for Molded Tantalum Capacitors INTRODUCTION Tantalum electrolytic capacitors are the preferred choice in applications where volumetric efficiency, stable electrical parameters, high reliability,

More information

1. Comparison of Inspection Methods

1. Comparison of Inspection Methods NDT.net - The e-journal of Nondestructive Testing (May 2008) For more papers of this publication click: www.ndt.net/search/docs.php3?mainsource=25 Weld Inspection with EMAT Using Guided Waves Borja LOPEZ

More information

FP7 piezovolume High Volume Piezoelectric Thin Film Production Process for Microsystems

FP7 piezovolume High Volume Piezoelectric Thin Film Production Process for Microsystems How to make an "old" material class the cutting edge FP7 piezovolume High Volume Piezoelectric Thin Film Production Process for Microsystems Frode Tyholdt (SINTEF) Piezoelectric microsystems (piezomems)

More information

Improving the piezoelectric properties of thick-film PZT: the influence of paste composition, powder milling process and electrode material

Improving the piezoelectric properties of thick-film PZT: the influence of paste composition, powder milling process and electrode material Sensors and Actuators A 110 (2004) 378 384 Improving the piezoelectric properties of thick-film PZT: the influence of paste composition, powder milling process and electrode material R.N. Torah, S.P. Beeby,

More information

Aerosol Jet International User Group Meeting. Metallization and Functional Structures by Aerosol Jet deposition

Aerosol Jet International User Group Meeting. Metallization and Functional Structures by Aerosol Jet deposition 17.10.2012 1 2012 Aerosol Jet International User Group Meeting Metallization and Functional Structures by Aerosol Jet deposition Andreas Brose Institut für Mikro- und Sensorsysteme Lehrstuhl Mikrosystemtechnik

More information

Table of Contents Page No.

Table of Contents Page No. Table of Contents Page No. Personnel... iii Foreword...v List of Tables...xii List of Figures... xiii 1. General Requirements...1 1.1 Scope...1 1.2 Approval...1 1.3 Definitions...1 1.4 Welding Symbols...1

More information

Passive TCF Compensation in High Q Silicon Micromechanical Resonators

Passive TCF Compensation in High Q Silicon Micromechanical Resonators Passive TCF Compensation in High Q Silicon Micromechanical Resonators A.K. Samarao, G. Casinovi and F. Ayazi IEEE International Conference on Micro Electro Mechanical Systems pp. 116 119, January 2010

More information

METER A THICK FILM SENSING ELEMENT FOR TRUE RMS. AT temperature difference between hot and cold junction of thermocouples (K)

METER A THICK FILM SENSING ELEMENT FOR TRUE RMS. AT temperature difference between hot and cold junction of thermocouples (K) Active and Passive Elec. Comp.. 1990, Vol. 14, pp. 39-45 Reprints available directly from the publisher Photocopying permitted by license only (C) 1990 Gordon and Breach Science Publishers, Inc. Printed

More information

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards Qualification and Performance Specification for High Frequency (Microwave) Printed Boards Developed by the High Speed/High Frequency Board Performance Subcommittee (D-22) of the High Speed/High Frequency

More information

LEAD-FREE MULTILAYER DIELECTRIC SYSTEM FOR TELECOMMUNICATIONS

LEAD-FREE MULTILAYER DIELECTRIC SYSTEM FOR TELECOMMUNICATIONS A1J-08-2001 LEAD-FREE MULTILAYER DIELECTRIC SYSTEM FOR TELECOMMUNICATIONS R. L. Wahlers, S. J. Stein, C. Y. D. Huang, M. R. Heinz and A. H. Feingold ElectroScience Laboratories, 416 E. Church Rd., King

More information

Application of Electronic Devices for Aerosol Deposition Methods

Application of Electronic Devices for Aerosol Deposition Methods Application of Electronic Devices for Aerosol Deposition Methods NAKADA Masafumi, KAWAKAMI Toshihiro, IWANAMI Mizuki, OHASHI Keishi Abstract Oxide materials have superior functional characteristics that

More information

NTC Type SMD. Thermometrics Surface Mount Devices. GE Sensing. Features

NTC Type SMD. Thermometrics Surface Mount Devices. GE Sensing. Features Features Tin plated terminations for soldering High sensitivity to changes in temperature Wide operating temperature range -58 F to 257 F (-50 C to 125 C) Rugged construction Available in other material

More information

Simulation of Cantilever Based Sensors for Smart Textile Applications

Simulation of Cantilever Based Sensors for Smart Textile Applications Simulation of Cantilever Based Sensors for Smart Textile Applications Jaisree Meenaa Pria K N J 1, Sowmya S *1, and Steffie Mano 1 Chandra Devi K 1, Meenakshi Sundaram N 1 1: PSG College of Technology,

More information

We get small. Micron-scale Circuits and Structures from Prototype through Production

We get small. Micron-scale Circuits and Structures from Prototype through Production We get small. Micron-scale Circuits and Structures from Prototype through Production Smaller, tighter, better. When you need to produce ultra-small electrical, mechanical and optical components to extreme

More information

Roll Bonding or Roll Welding

Roll Bonding or Roll Welding 1 2 3 4 Roll Bonding or Roll Welding The pressure required for welding is applied through a pair of rolls Can be performed hot (Hot Roll Bonding) Surface preparation is important for interfacial bonding

More information

Thomas M. Adams Richard A. Layton. Introductory MEMS. Fabrication and Applications. Springer

Thomas M. Adams Richard A. Layton. Introductory MEMS. Fabrication and Applications. Springer Thomas M. Adams Richard A. Layton Introductory MEMS Fabrication and Applications Springer Contents Preface xiü Part I Fabrication Chapter 1: Introduction 3 1.1 What are MEMS? 3 1.2 Why MEMS? 4 1.2.1. Low

More information

DETAIL SPECIFICATION SHEET POWER DIVIDERS, N-WAY, 0 DEGREES, FLAT PACK

DETAIL SPECIFICATION SHEET POWER DIVIDERS, N-WAY, 0 DEGREES, FLAT PACK INCH-POUND MIL-DTL-23971/5D 23 April 2013 SUPERSEDING MIL-DTL-23971/5C 14 May 2007 DETAIL SPECIFICATION SHEET POWER DIVIDERS, N-WAY, 0 DEGREES, FLAT PACK This specification is approved for use by all Departments

More information

Tantalum Wet Electrolytic Capacitor

Tantalum Wet Electrolytic Capacitor INTRODUCTION The structure of a Tantalum Wet Electrolytic Capacitor consists of four main elements: a primary electrode (anode), dielectric, a secondary electrode system (cathode) and a wet (liquid) electrolyte.

More information

THE AIM OF THE presented study is to develop a reliable

THE AIM OF THE presented study is to develop a reliable 134 IEEE SENSORS JOURNAL, VOL. 5, NO. 2, APRIL 2005 Dual-Modality Probe for Characterization of Heterogeneous Mixtures T. Dyakowski, J. M. Hale, A. Jaworski, N. M. White, Senior Member, IEEE, A. Nowakowski,

More information

High Performance Alloys. Characteristics. Stamped parts connectors Relay springs Semiconductor components. Density 8.8 g/cm³

High Performance Alloys. Characteristics. Stamped parts connectors Relay springs Semiconductor components. Density 8.8 g/cm³ Alloy Designation High Performance Alloys EN CuNi3Si DIN CEN/TS 13388 UNS Chemical Composition percentage Cu Rest % Ni 3 % Si.65 % Mg.15 % This alloy is in accordance with RoHS 22/96/CE for electric &

More information

ISO 5817 INTERNATIONAL STANDARD

ISO 5817 INTERNATIONAL STANDARD INTERNATIONAL STANDARD ISO 5817 Second edition 2003-10-01 Welding Fusion-welded joints in steel, nickel, titanium and their alloys (beam welding excluded) Quality levels for imperfections Soudage Assemblages

More information

Y.C. Chan *, D.Y. Luk

Y.C. Chan *, D.Y. Luk Microelectronics Reliability 42 (2002) 1195 1204 www.elsevier.com/locate/microrel Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex

More information

Filing Date 15 November 1995 NOTICE

Filing Date 15 November 1995 NOTICE Serial No. 558.313 Filing Date 15 November 1995 Inventor Manfred Kahn Mark Chase NOTICE The above identified patent application is available for licensing. Requests for information should be addressed

More information

Actuator 3 Piezoelectric and shape memory alloy technology

Actuator 3 Piezoelectric and shape memory alloy technology Actuator 3 Piezoelectric and shape memory alloy technology ME490A Dr. C. Alex Simpkins SDSU Dept. of Mechanical Engineering Adapted from a presentaeon by Dr. Kee Moon Piezoelectric property Direct piezoelectric

More information

Tin mill products. USA schedule of price extras

Tin mill products. USA schedule of price extras Tin mill products USA schedule of price extras PRODUCTS OFFERED Black plate - as rolled, single and double reduced Electrolytic chromium coated steel, single and double reduced Electrolytic tin plate,

More information

Industrial Rolled. High Performance STOL Alloys. Characteristics. Capacity. Density 8.8 g/cm³. Thermal expansion coefficient C 17.

Industrial Rolled. High Performance STOL Alloys. Characteristics. Capacity. Density 8.8 g/cm³. Thermal expansion coefficient C 17. Alloy Designation High Performance STOL Alloys EN DIN CEN/TS 13388 UNS Chemical Composition percentage Cu 99. % Mg.4...9 % P.2...4 % This alloy is in accordance with RoHS 22/96/CE for electric & electronic

More information

(12) United States Patent (10) Patent No.: US 6,880,234 B2

(12) United States Patent (10) Patent No.: US 6,880,234 B2 USOO688O234B2 (12) United States Patent (10) Patent No.: US 6,880,234 B2 Khan (45) Date of Patent: Apr. 19, 2005 (54) METHOD FOR THIN FILM NTC 5,024,966 A 6/1991 Dietrich et al.... 437/60 THERMISTOR 5,206,624

More information

Ellipsometry as a tool for identifying process issues in roll-to-roll sputter deposited metal-oxide coatings

Ellipsometry as a tool for identifying process issues in roll-to-roll sputter deposited metal-oxide coatings Ellipsometry as a tool for identifying process issues in roll-to-roll sputter deposited metal-oxide coatings Sharon Louch Centre for Process Innovation, Wilton Centre, edcar. UK. TS10 3H Abstract Ellipsometry

More information

TransGuard. AVX Multilayer Ceramic Transient Voltage Suppressors GENERAL DESCRIPTION TRANSGUARD DESCRIPTION

TransGuard. AVX Multilayer Ceramic Transient Voltage Suppressors GENERAL DESCRIPTION TRANSGUARD DESCRIPTION GENERA DESCRIPTION The AVX Transient Voltage Suppressors (TVS) with unique high-energy multilayer construction represents state-of-the-art overvoltage circuit protection. Monolithic multilayer construction

More information

CuSn0,15 (STOL 81) C14415 Industrial Rolled

CuSn0,15 (STOL 81) C14415 Industrial Rolled Alloy Designation EN DIN CEN/TS 13388 CuSn,15 CW 117 C High Performance CuSn,15 UNS * * Slight difference in chem. composition We have developed a wide range of high performance alloys with excellent properties

More information

Troubleshooting RTDs and Thermocouples

Troubleshooting RTDs and Thermocouples Troubleshooting RTDs and Thermocouples If you are experiencing audio problems please call the teleconference number below 650-479-3208 Access Code: 663 601 880 Your Host and Presenter 2 Presenter Bill

More information

Transducers and Arrays for Medical

Transducers and Arrays for Medical High Resolution Ultrasound Transducers and Arrays for Medical Imaging Applications Tim Button Applied Functional Materials Ltd Birmingham, UK T W Button, F Dauchy, L Garcia-Gancedo, Gancedo H Hughes, Y

More information