AJICURE. AH-203 Amine adduct Modified MY-24. Faster cure.

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1 AJICURE LATENT CURING AGENTS AND ACCELERATORS PRODUCT Structure type Particle size Melting point ( C) Recommended usage * Special feature av. (micron) (softening point) as hardener as accelerator PN-23 Amine adduct Low temp. rapid cure. Accelerator for DICY. PN-H Amine adduct Modified PN-23 for longer pot life. PN-31 Amine adduct Modified PN-23 for longer pot life. PN-4 Amine adduct Modified PN-23 for longer pot life. PN-23J Amine adduct Micropulverized PN-23. Faster cure. PN-31J Amine adduct Micropulverized PN-31. Faster cure. PN-4J Amine adduct Good tranparency and gloss. MY-24 Amine adduct Good adhision. Accelerator for acidanhydride MY-H Amine adduct Modified MY-24 for longer pot life. MY-HK Amine adduct Micropulverized MY-H AH-23 Amine adduct Modified MY-24. Faster cure. AH-3 complex Modified PN-23. Lower price type of PN-23. AH-154 DICY complex Accelerated DICY. AH-162 DICY complex Accelerated DICY. Long pot life. VDH Dihydrazide 1mesh pass Colorless transparent cured product >98% Can be used as a crosslinking agent for aclylic VDH-J Dihydrazide Micropulverized VDH * Recommended usage : with a liquid epoxy resin having an epoxy equivalent weight of 19 T-E1-4 99/2(1), LAB revised 2/9(2)

2 Recommended method to disperse AJICURE T-E12-6 2/1(1), LAB revised 2/1(1)

3 AJICURE PN-23 : Shear strength Formulation Bisphenol A epoxy(eew 19) : 1 AJICURE PN-23 : 1-3 Fumed silica (Aerosil 2) : 1 (parts) Table 1. Typical properties of AJICURE PN-23 formulations AJICURE 1phr 15phr 2phr 25phr 3phr PN-23 (phr) Gel Time 8 o C (min) 1 o C o C o C Tg ( o C) 12 o C-3min cure o C-6min cure o C-3min cure Shear strength 8 o C-6min cure not cure (kgf/cm 2 ) 1 o C-6min cure o C-6min cure o C-6min cure o C-6min cure Tensile shear strength (kgf/cm2) Tensile shear strength vs PN-23 con PN-23 content (ph 8C-6min cur e 1C-6min cu 12C-6min cu 15C-6min cu T-E4-1 99/9(1), LAB revised 1/12(1)

4 Formulation Bisphenol A epoxy(eew 19) : 1 AJICURE MY-24 : 1-3 Fumed silica (Aerosil 2) : 1 (parts) AJICURE MY-24 : Reactivity LATENT CURING AGENTS AND ACCELERATORS Table 1. Typical properties of AJICURE MY-24 formulations AJICURE 1phr 15phr 2phr 25phr 3phr MY-24 (phr) Gel Time 8 o C >6 >6 >6 >6 >6 (min) 1 o C o C o C > Tg ( o C) 1 o C-3min cure o C-6min cure o C-3min cure o C-6min cure Shear strength 1 o C-6min cure (kgf/cm 2 ) 12 o C-6min cure o C-6min cure o C-6min cure Gel Time vs MY-24 conte Tensile shear strength (kgf/cm2) C 12C 15C MY-24 content (ph T-E6-1 99/9(1), LAB revised 2/1(1)

5 AJICURE MY-24 : Shear strength Formulation Bisphenol A epoxy(eew 19) : 1 AJICURE MY-24 : 1-3 Fumed silica (Aerosil 2) : 1 (parts) Table 1. Typical properties of AJICURE MY-24 formulations AJICURE 1phr 15phr 2phr 25phr 3phr MY-24 (phr) Gel Time 8 o C >6 >6 >6 >6 >6 (min) 1 o C o C o C > Tg ( o C) 1 o C-3min cure o C-6min cure o C-3min cure o C-6min cure Shear strength 1 o C-6min cure (kgf/cm 2 ) 12 o C-6min cure o C-6min cure o C-6min cure Tensile shear strength (kgf/cm2) Tensile shear strength vs MY-24 co MY-24 content (ph 1C-6min cur 12C-6min cu 15C-6min cu 18C-6min cu T-E7-1 99/9(1), LAB revised 2/1(1)

6 Tg of DICY/AJICURE formulation Formulation Epoxy resin 1 (Bisphenol A epoxy:eew19) Dicyandiamide 8 Accelerator 1-5 Tg (1 o C cure) of DICY/AJICURE formulatio n Tg : measured by TMA Tg ( o C) PN-23 (5phr) PN-23 (3phr) MY-24 (5phr) 2MI (1phr) Curing time (min.) 16 Tg (12 o C cure) of DICY/AJICURE formulatio n Tg ( o C) PN-23 (5phr) PN-23 (3phr) MY-24 (5phr) 2MI (1phr) T-E /9(1), LAB revised 99/9(1)

7 Shear strength of DICY/AJICURE formulation DICY with small amount of AJICURE PN-23 as an accelerator provides higher shear strength than DCMU or 2MI as an accelerator. DCMU:3-(3,4-dichlorophenyl)-1,1-dimethylurea 2MI :2-methylimidazole Formulation Epoxy resin 1 (Bisphenol A epoxy:eew19) Dicyandiamide 8 Accelerator 1-5 Shear strength (kgf/cm 2 ) Shear strength (steel/steel) of DICY/AJICURE 12C-1hr cure 15C-1hr cure 5 PN-23 (1phr) PN-23 (3phr) PN-23 MY-24 (5phr) (5phr) Accelerator (phr) DCMU (5phr) 2MI (1phr) T-E /9(1), LAB revised 99/9(1)

8 Water uptake of DICY/AJICURE formulation DICY with small amount of AJICURE PN-23 as an accelerator provides much lower water-uptake than 2MI as an accelerator. 2MI :2-methylimidazole Formulation Epoxy resin 1 (Bisphenol A epoxy:eew19) Dicyandiamide 8 Accelerator 1-5 Cure condition 12 o C-6min weight gain (wt%) 4.5% 4.% 3.5% 3.% 2.5% 2.% 1.5% 1.%.5%.% Water uptake (1 o C=boil / 1hr PN-23(3phr) PN-23(5phr) MY-24(3phr) 2MI(1phr) T-E14-4 2/1(1), LAB revised 2/1(1)

9 PN-23 for solid bisphenol A epoxy resin AJICURE PN-23 usage level to solid bisphenol A type epoxy resin(eew 45) is about 7-1phr. Table.1:Properties of solid bisphenol A epoxy resin and AJICURE PN-23 formulations Formulation Solid bisphenol A epoxy (eew45) AJICURE PN DICY DSC on-set temp. ( o C) peak temp. ( o C) exotherm (cal/g) Tg 12 o C-3min cure ( o C) o C-6min cure ( o C) o C-12min cure( o C) 115 ND ND ND ND o C-24min cure( o C) Solid epoxy resin and AJICURE PN-23 was mixed through dry-blend method. 12 Tg of solid Bisphenol A epoxy resin/pn-23 Tg ( o C) PN-23(5phr) PN-23(7phr) PN-23(1phr) PN-23(15phr) PN-23(2phr) PN-23+DICY Cure time (min) at 12 o C T-E46-1 1/2(1), LAB revised 1/2(1)

10 MY-24 for solid bisphenol A epoxy resin AJICURE MY-24 s usage level to solid bisphenol A type epoxy resin(eew 45) is about 7-1phr. Table.1:Properties of solid bisphenol A epoxy resin and AJICURE MY-24 formulations Formulation Solid bisphenol A epoxy (eew45) AJICURE MY DICY DSC on-set temp. ( o C) peak temp. ( o C) exotherm (cal/g) Tg 12 o C-3min cure ( o C) o C-6min cure ( o C) o C-12min cure( o C) o C-24min cure( o C) 97 ND ND ND ND 17 Solid epoxy resin and AJICURE MY-24 was mixed through dry-blend method. 11 Tg of solid bisphenol A epoxy resin/my-24 1 Tg ( o C) MY-24(5phr) MY-24(7phr) MY-24(1phr) MY-24(15phr) MY-24(2phr) MY-24+DICY Cure time (min) at 12 o C T-E47-1 1/2(1), LAB revised 1/2(1)

11 AJICURE PN-series formulation with various solvents LATENT CURING AGENTS AND ACCELERATORS AJICURE PN-4 formulation can be diluted by various solvents without viscosity increase. AJICURE PN-4 has excellent pot life even when it is used with solvent compared with PN-23. MEK (Methyl ethyl ketone) 2 Viscosity of AJICURE formulations diluted by MEK (storage at 4C) Viscosity (Pa s) PN-23 PN-31 PN-4 Viscosity (Pa s) Toluene DAYS (storage at 4 C) Viscosity of AJICURE formulations diluted by Toluene (storage at 4C) PN-23 PN-31 PN DAYS (storage at 4 C) PGMAC (Propyleneglycol monomethylether acetate) Viscosity of AJICURE formulations diluted by PGMAC (storage at 4C) 2 PN PN-31 Viscosity (Pa s) PN T-E7-1 /3(1), LAB

12 Ajicure PN-31,PN-4 or PN-4J has much better pot life in bisphenol F epoxy resin / diluents system than Ajicure PN-23 or PN-H. <Formulation> Epon ,6-hexandiol diglycidylether 2 Ajicure 2 Aerosil 2 2 Epon87 is equivalent to Epon862. Table 1.Bisphenol F epoxy / 1,6-hexanedioldiglycidylether formulations Ajicure PN-31 PN-4 PN-4J PN-23 PN-H Particle size av. (micron) Gel Time (min 1 o C o C o C Initial Viscosity (mpas ) Viscosity Increase ratio after o C gel cure cure Viscosity Increase ratio after o C Viscosity Increase ratio after o C Viscosity (mpas) Viscosity increase with reactive di PN-23 PN-H PN-31 PN-4 PN-4J TIME (week / 25 o C) T-E /4(1), LAB revised 2/1(1)

13 Gel Time at 15-2 o C of AJICURE PN-series 1 Gel Time (sec.) Gel Time at elavated temp. of AJICURE formula 15?? 16?? 18?? 2?? <Formulation> EP828EL (1 AJICURE (2) Aerosil#2 (1 PN-23 PN-31 PN-4 PN-23J PN-31J PN-4J PN-H * Gel Time was measured by hot plate method. AJICURE PN-23 or PN-23J cures fastest at elevated temp. of all AJICUREs. T-E74-1 2/9(1), LAB

14 Rapid cure at high temperature formulations Bisphenol F epoxy resin formulation with AJICURE PN-23 cures faster than bisphenol A epoxy resin formulation. Combination of AJICURE PN-23 and dicyandiamide(dicy) is good for rapid cure at high temperature. AJICURE PN-23J can cure faster than PN-23. Table 1.PN-23 formulation for rapid cure at high temperature 1 Run No EP EP AJICURE PN-23J AJICURE PN Aerosil# Gel time 15 o C >4 23 (sec.) 18 o C >4 8 Initial viscosity (P) EP87 is equivalent to Epon862. Table 2.PN-23 formulation for rapid cure at high temperature 2 Run No EP EP AJICURE PN-23J AJICURE PN Aerosil# DICY Gel time 15 o C 53 > (sec.) 18 o C 45 > Initial viscosity (P) T-E /9(1), LAB revised 99/9(1)

15 Ajicure PN-31 and PN-31J are amine-epoxy adduct type latent epoxy curing agents and accelerators. Ajicure PN-31J is a micro-grounded type of Ajicure PN-31. These products are very good accelerators for epoxy/dicyandiamide(dicy) system and also very good latent curing agents for epoxy resin. One component epoxy/ajicure PN-31 or PN-31J formulations show rapid cure and very long pot life and provide high Tg when cured. One component DICY cured adhesive accelerated with Ajicure PN-4 or PN-4J show rapid cure and very long pot life and provide high shear strength. We have 3 kinds of Ajicure PN-series; Ajicure PN-23, PN-4 and PN-31. The differences between them are mainly curing speed and stabilities, which are described below; Curing speed : Fast Ajicure PN-23 > PN-31 > PN-4 Pot life : Long Ajicure PN-4 > PN-31 > PN-23 Ajicure PN-23 is very stable in bisphenol A epoxy resin formulations. But in bisphenol F formulations or formulations with diluents Ajicure PN-23 shows shorter pot life. In comparison with Ajicure PN-23 Ajicure PN-31 shows better pot life even in bisphenol F epoxy. Table 1. Typical properties AJICURE PN-31 AJICURE PN-31J Appearance pale yellow powder pale yellow powder Particle size av. 1 micron 3 micron Softening point ( o C) T-E /4(1), LAB revised 99/8(1)

16 RAPID CURE at LOW TEMPERATURE (8 o C) LONG POT LIFE Long pot life during storage at 6 o C HIGH Tg GOOD ACCELERATOR of DICY Table 2. Properties of Bis-F epoxy formulations PN-31 PN-31J PN-23 Formulation Epon Ajicure PN Ajicure PN-31J 2 Ajicure PN Aerosil Gel Time (min 8 o C o C o C o C Tg ( o C) [8 o C-6min cure] [12 o C-3min cure] Initial Viscosity ( Ps ) Viscosity Increase ratio after o C Viscosity Increase ratio after o C 2.2 no data 24.1 Epon87 is equivalent to Epon862. T-E /4(1), LAB revised 99/8(1)

17 Table 3. Properties of Bis-A epoxy formulations PN-23J PN-31J PN-23 PN-31 Formulation Epon Ajicure PN-23J Ajicure PN-31J Ajicure PN Ajicure PN-31-2 Aerosil Gel Time (min 8 o C >3 1 o C o C o C Tg ( o C) [1 o C-3min cure] no data no data [12 o C-3min cure] no data no data Initial Viscosity ( Ps ) Viscosity Increase ratio after o C Viscosity Increase ratio after o C no data no data Viscosity Increase ratio after o C no data no data cure 1.8 Viscosity Increase ratio after o C no data no data Ajicure PN-31 is an excellent accelerator for DICY. Table 4. Properties of Bis-F epoxy / DICY formulations PN-31 PN-23 Formulation Epon DICY 8 8 Ajicure PN Ajicure PN-23-5 Aerosil Gel Time (min 1 o C o C o C o C Tg ( o C) [12 o C-.5hr+15 o C-1hr cure] Initial Viscosity ( Ps ) Viscosity Increase ratio after o C Viscosity Increase ratio after o C Epon87 is equivalent to Epon862. T-E /4(1), LAB revised 99/8(1)

18 Ajicure PN-23J is a micro-grounded type of Ajicure PN-23. Ajicure PN-23J is the fastest curing agent of all Ajicures. However Ajicure PN-23J is so fine particle that its pot life formulated with epoxy resins is relatively short. We have 3 kinds of Ajicure PN-series; Ajicure PN-23, PN-4 and PN-31. The differences between them are mainly curing speed and stabilities, which are described below; Curing speed : Fast Ajicure PN-23 > PN-31 > PN-4 Pot life : Long Ajicure PN-4 > PN-31 > PN-23 Table 1. Typical properties AJICURE PN-23 AJICURE PN-23J Appearance pale yellow powder pale yellow powder Particle size av. 1 micron 3 micron Softening point ( o C) Curing condition 8 o C/6min ~ (Bis A epoxy) 8 o C/3min ~ (Bis A epoxy) Table 2.Properties of Bis-A epoxy formulations PN-23J PN-23 Particle size av. (micron) 3 1 Formulation Epon PN-23J 2 - PN-23-2 Aerosil Gel Time (min) 8 o C o C o C o C Tg ( o C) [1 o C-3min cure] no data 125 [12 o C-3min cure] no data 135 Initial Viscosity ( Ps ) Viscosity Increase ratio after o C Viscosity Increase ratio after o C Viscosity Increase ratio after o C cure 1.6 T-E /4(1), LAB revised 2/3(1)