A New Company & Approach In MEMS Semiconductor Materials & Engineering Services

Transcription

1 A New Company & Approach In MEMS Semiconductor Materials & Engineering Services Semi Networking Day Italy

2 Founded & Location Founded in 2009 Hong Kong & Dongguan, China Company Background Business Model Objective & Focus: A MEMS Low Cost package development resource provider for companies bringing MEMS products to market. To Service MEMS & specialty Semi/MEMS fabless and IDM s for a need. Design & develop MEMS process, Provide molded cavity, LGA Cavity, OM packages, MEMS SIP Provide a source of MEMS engineering & proto-typing services Support transfer developed product into an OSAT where it makes sense. Provide an appropriate volume of MEMS & IR Sensor LED assembly.

3 Paris Locations San Francisco Boston Manila Dongguan Engineering & Development Hong Kong Headquarters Taipei

4 Challenges & Solutions for MEMS Packages Limited OSAT participation in MEMS assembly For higher performance, One Product, One Process, One Package applies. Unique and customer tooling drives cost. Captive assembly lines limits to achieve economy of scale. Increasing interest from OSATS due to rapid growth in MEMS. Standardization of the current unique package solution will drive down cost. MEMS packaging continues to use existing materials for standard semiconductor devices. Difficult to meet high performance. Drives towards unique packaging solutions Increases package and product cost. Material vendors should invest in novel materials for MEMS packages. (ex: low stress, linear properties over temp Market scale is here! Source: Semicon West 2012 ADI Presentation

5 Recognizes Opportunities for OSAT & Material Suppliers! Assembly TAM (in million $) Limited OSAT participation in MEMS assembly and test even today! Wide range of OSATs are getting interested with the potential growth in MEMS devices. - Significant revenue opportunities for both OSAT and material suppliers! Material TAM (in million $) recognized the need and is participating in a very high growth area of materials and assembly for MEMS Devices. Note: All calculations based on total MEMS market projection from isuppli Source: Semicon West, 2012

6 A Leading Off-Shore MEMS Engineering Support Services Advanced Microelectronic Manufacturing Complex integrated circuits ASIC + MEMS Engineering & Product Development Services Package & Substrate design Thermal & Electrical Modeling Product development Prototyping services Package Qualification / Reliability testing Quick-Turn Engineering Build Support Assemblies as fast as One Day Turn Entertain Small to Medium Production To Fit Customers Outcomes

7 Accommodating To MEMS Market Demands QFN Cavity Cavity Mold on Laminate LCP, Metal, Epoxy Lids B-Stage or Dispense Custom LCP Microphone SOIC LTCC Custom Leaded LGA/SIP FBGA LED Stack-Die Overmold QFN Will Custom Design To Fit Customer Needs

8 Cavity MEMS Package Using Metal Lid, LCP, & EMC (Products) Low profile & Low stress package Flexible z- height by using pre-molded side walls Flexible integration using metal lids Variety of uses Accelerometers, Gyros, Microphone Lower cost then Ceramic Flexible integration using metal lids Extension into low stress SIP Low NRE and tooling costs Low stress cavity approach over Molded LGA + LID QFN Pre-molded (3x3-12x12mm)

9 Operations Infrastructure : MEMS Assembly Development and Manufacturing Capability Floor Space 40,000 Square Feet of MEMS Development & Assembly Support Class 10K Cleanroom

10 Meeting Quality System Demands

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