GreenHouse Gases (GHGs) Gases that contribute to atmospheric climate change because of their high Global Warming Potentials (GWP)

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1 Contents 1 GHGs Which gases to worry about? Motivations to reduce PFC emissions COP21 WSC 2010 WSC mm Fab footprint 300mm Fab footprint Impact of HTFs Edwards CO 2 footprint Summary & Conclusions

2 GreenHouse Gases (GHGs) 2 Gases that contribute to atmospheric climate change because of their high Global Warming Potentials (GWP)

3 Which gases to worry about? GWP = Global Warming Potential CO 2 = 1 N 2 O = 298 over 100 years SF6 = 23,900 over 100 years CF 4 = 7,300 over 100 years but has an atmospheric lifetime of 50,000 years! SF 6 & CF 4 are PFCs = Per Fluorinated Compounds 3 Lunch, 48,000 BC

4 Motivations to reduce PFC emissions CO 2 is the primary gas responsible for climate change There is an industry drive to reduce PFC emissions due to their high GWPs (>>CO 2 ) Included in ITRS/IRDS roadmap WSC targets EPA Reporting Rule COP21 Green Labelling is starting to be introduced Many chip manufacturers are auditing fab emissions per product Reducing power and/or fuel consumption reduces CO 2 emissions: 4 1 kwh 500g CO 2

5 COP 21 (Conference of the Parties) Is was the 21 st meeting on Climate Change under the auspices of the United Nations to make policies following reports from the IPCC (Intergovernmental Panel on Climate Change) As a result, delegates signed-up to implement changes that would reduce carbon emissions to levels that would limit the global atmospheric temperature rise to 2.7 o C by 2100 N.B. The Met Office, the UK s official office of meteorology, recently announced that 2015 would be the first year in which the average global temperature exceeded the average temperature for preindustrial years by 1 o C 5

6 WSC 2010 PFC targets 1990 s PFCs recognised as GHGs contributing to climate change 1995 Du Pont threat to restrict C2F6 unless ³80% utilization 1999 WSC voluntary target to limit PFC emissions to 90% of 1995 levels by 2010 (some local variations) Significant reduction given the CAGR of the semiconductor industry! 2010 SIA, ESIA, KSIA & JSIA able to report meeting target Largely achieved by the replacement of PFC CVD chamber clean gases like CF4 & C2F6 by NF3 which is efficiently consumed by the process tool 6

7 WSC 2010 Achieved 7

8 WSC PFC 2020 target In 2011, the following targets were agreed by the WSC: The implementation of best practices for new semiconductor fabs. The industry expects that the implementation of best practices will result in a Normalized Emission Rate (NER) in 2020 of 0.22 kgco 2 e/cm 2, equivalent to a 30% NER reduction from 2010 aggregated baseline. Best practices will be continuously reviewed and updated by the WSC. ads/directory/documentsia/international% 20Trade%20and%20IP/May2014JOINTSTATE MENTTaipei18thWSC%20Final.pdf 8

9 200mm 20,000 wspm Fab PFC footprint PFC chamber cleans 25,000, mm Fabrication Plant. Equivalent CO2 Emission data + Abatement GWP CEkg/yr/20,000 wpm 20,000,000 15,000,000 10,000,000 5,000,000 0 TPU TPU TPU/ TCS GRC TCS TPU Etch TPU TPU Etch Impact of Edwards abatement OXIDE-NITRIDE OXIDE HDP Metal Etch BPSG Oxide Etch W-CVD Poly Etch 9

10 300mm 10,000 wspm Fab PFC footprint PFC chamber cleans 4,000,000 3,500,000 Same area as 20,000 x 200mm wafers 300mm Fabrication Plant. Equivalent CO2 Emission data + Abatement Scale expanded by 6x Importance of etch abatement 3,000,000 2,500,000 2,000,000 1,500,000 1,000, ,000 0 Atlas TCS Atlas TCS Atlas TCS Atlas TCS Atlas TCS Atlas Helios Atlas TPU Atlas TPU Atlas TPU GWP CEkg/yr/10,000wpm Atlas TPU Impact of Edwards abatement ILD-1 ILD-C ILD-F ILD-N HDP CVD W-CVD Metal Etch Oxide Etch Oxide Etch Poly Etch 10

11 Impact of Heat Transfer Fluids (HTFs) These are typically PFC liquids and can have fairly high GWPs (previously treated as zero) The US EPA now include these in a fab s GHG inventory Typically has the effect of increasing the PFC inventory by ~10% for a 300mm fab This increases the challenge of meeting WSC 2020 targets Highlights the importance of treating PFC emissions from etch processes in 300mm fabs 11 ACE PowerPoint Presentation 13/05/2014

12 Edwards Corporate Carbon Footprint 12

13 13 Summary & Conclusions

14 Summary & Conclusions Climate Change concerns put pressure on industry to reduce GHG emissions The industry has responded by the WSC setting voluntary targets bases on normalised emissions per cm 2 Replacing PFC CVD chamber cleaning gases with NF 3 has helped Including PFC-based HTFs has made things worse Treating etch gas emissions will become increasingly important The good news: this is all doable! Take-away thought 14 Internal PowerPoint Presentation

15 To put it the IKEA way

16 Confidentiality Statement This presentation has been prepared exclusively for the benefit and use of Edwards and is confidential in all respects. This presentation does not carry any right of publication or disclosure, in whole or in part, to any other party. This presentation is the property of Edwards. Neither this presentation nor any of its contents may be used for any purpose without the prior written consent of Edwards. This presentation includes certain statements, estimates, targets and projections as to anticipated future business performance. Such statements may reflect significant assumptions and subjective judgements by Edwards which may or may not prove to be correct. Edwards makes no representations as to the accuracy, completeness or fairness of this presentation and so far as is permitted by law, no responsibility or liability whatsoever is accepted by Edwards for the accuracy or sufficiency thereof or for any errors, omissions, or misstatements relating thereto. The contents of this presentation is confidential and should not be distributed. 16

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