IEECAS Power Semiconductor Testing Lab
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1 IEECAS Power Semiconductor Testing Lab Tel:
2 Introduction 2
3 About us Our testing center was founded in 2013, which is the first third-part integrated testing laboratory that specializes in high power devices. We have nearly thirty special use testing equipments, thus can meet the testing requirements for IGBT, MOSFET, Diode based on Automotive Electronics Council(AEC), the International Electro technical Commission(IEC) and Chinese national standards. 3
4 Organization Chinese academy of sciences(cas) The institute of electrical engineering(iee) Power semiconductor testing center Data sheet Reliability Reliability parameters testing lab testing lab testing lab Ⅰ Ⅱ Failure analysis lab
5 Our staff X.H. Wen (Lab chief ) J. Zhang (Technical director) L.L. Zeng (Quality director)
6 Our lab is accredited in accordance with ISO/IEC Our lab is accredited in accordance with 1. International Standard ISO/IEC 17025: China Metrology Accreditation (CMA) Qualification accreditation criteria 6
7 We offer reliable testing service Our test results are recognized by: 1. Chinese government 2. Global accreditation bodies who have signed mutual recognition arrangements (MRAs) 7
8 Our test ability Test type Test description Tes t Name Equipment Standard Datasheet parameters test Reliability test Failure analysis Static test V CES,V GES,I CE S,V GE(th),I GES,V CEsat,V F LEMSYS TRs4070 Dynamic test Parasitic parameters test Thermal characteristic test Isolation test td(on),tr,td(off),tf,eon tr td(off) tf,eoff,trr,qrr,erec Erec Cies, Coes, Cres Static & transient thermal resistance Isolation voltage LEMSYS TRd4045 AGILENT E4980A MICRED T3ster KIKUSUI TOS5300 IEC IEC IEC IEC IEC JESD51-14 GB/T Surge current test I FSM, I 2 t DBC KA IEC Climate reliability test Operating reliability test Mechanical reliability test X-ray test SAM test Thermography test Soldering strength test Low temperature storage High temperature storage High temperature high humility Temperature cycling Thermal shock Salt corrosion High temperature reverse bias High temperature gate bias High temperature t & high h humility bias Power cycling(sec) Power cycling(min) Highly accelerated stress test Mechanical variation Mechanical shock HALT/HASS Soldering voids Soldering delimitation Temperature distribution Shear & pull strength ESPEC EW0470 GB/T ESPEC PV221 GB/T ESPEC GB/T CW0670P1W5 GB/T GIANT FORCE ECT IEC ESPEC TSG-71S-A IEC ATLAS SAE J2334 CCX2000 GB/T HIREL HTRB-IGBT-6KV IEC HIREL HTGB-IGBT-30V IEC HIREL H3TRB201 IEC HIREL PC2400A-IGBT IEC HIREL PC500A-IGBT IEC HIRAYAMA PC-422R8 IEC STI GB/T DC GB/T KING DESIGN GB/T DP GB/T HANSE VCT-1.5 N.A. GE Microme x N.A. SONOSCAN D9600 IEC INFRATEC ImageIR 8325 N.A. XYZTEC IEC Conder 150HF IEC
9 Our customers
10 Our target 1. Quality first, customers supreme; always take the public position, to provide customers with the most efficient, the most high quality testing services. 2. Research the power device test methods and test standards, guide the development of high voltage & high power semiconductor and wide band gap power semiconductor packaging and testing technology. 3. Training the development, testing and management personnel of China power semiconductor industry.
11 Data sheet parameter testing lab 11
12 Data sheet parameter testing lab
13 Static and transient parameter test Static-transient parameter test equipment LEMSYS TRds (Switzerland) Static and transient I-V test and switching test (up to 7000 V, 4000 A) Probe station (semi-auto) Wentworth S200 (UK) Wafer level I-V test up to 8inch Bench-top thermal ESPEC MT3065 (China) Heating and environmental chamber chamber 13
14 LCR meter LCR meter Agilent E4980A (US) Parasitic inductance, parasitic capacitance test 14
15 Thermal impedance test Thermal impedance test meter MicRed T3ster (Hungary) Static and transient thermal impedance test 15
16 High voltage isolation test High voltage test meter Kikusui TOS5300 (Japan) Isolating material breakdown test, leakage current test (up to 5500 VAC) 16
17 Reliability testing lab Ⅰ 17
18 Diode surge current test Surge current test equipment RHEE DBC KA (China) Diode forward maximum surge current IFSM test, I 2 t test, peak current up to 10kA, duration time 10ms) 18
19 Electro-static discharge test Electro-static discharge meter Tokyo Electron ECDM800E (Japan) Human body discharge emulation (up to 8000 V), non-human discharge emulation (up to 800 V) 19
20 High temperature aging test High temperature chamber Espec PV221 (China) High temperature storage and operation stability test (up to 200 C, 80cm 110cm 70cm) 70 20
21 Low temperature aging test Low temperature chamber Espec EW0470 (China) Low temperature storage and operation stability test (low to -70 C, 80cm 110cm 70cm) 21
22 High temperate and high humidity test High temperate and high Espec EW0470 High temperature storage humidity test chamber (China) and operation stability test (up to -70~150 C, 10~98% relative humidity, 80cm 110cm 70cm) 22
23 Power cycling test (air cooled) Power cycling chamber n minutes per cycle Hirel PC500A-IGBT (China) Power cycling test for DBC, soldering assembly (up to 500 A) 23
24 HTRB High temperature t reverse Hirel HTRB-IGBT-6kV High temperature t reverse blocking test chamber (China) blocking test, leakage current for power module (up to 6000 V, 200 C) 24
25 HTGB High temperature gate blocking test chamber Hirel HTGB-IGBT-30V (China) High temperature gate blocking test, leakage current for power module (up to ±30 V, 200 C) 25
26 H3TRB High temperature high humidity reverse blocking test chamber Hirel H3TRB201 (China) High temperature high humidity reverse blocking test for power module (up to 600 V, -20~ 150 C,25~98%RH) 26
27 HAST Highly accelerated stress Hirayama PC422- High temperature, high humidity test chamber R8 (Japan) test, high air pressure environment (up to 120 V, Φ42cm 65cm,105~130 C,65~ 100%RH) 27
28 HALT Highly accelerated life test t HANSE VCT-1.5 High/Low temperature, t high h chamber (US) humidity test, 6-axis vibration ( -70~200,100 /min,80g max) 28
29 Reliability testing lab Ⅱ 29
30 Reliability testing lab Ⅱ
31 Mechanics shocking test Bumping/shocking test King design DP bumping test to emulate machine (China) automobile environment (shocking:15~100g, 6~18ms, bumping: 0~40g, 6~16ms, up to 60 times/min) 31
32 Thermal cycling test Thermal cycling chamber Giant force ECT Thermal cycling test for (China) DBC, soldering assembly (-70~180,up to 15 /min, 50cm 75cm 60cm) 32
33 Thermal shock test Thermal shock chamber Espec TSG-71S-A (China) Thermal shock test for DBC, soldering assembly (-70~200 ) 33
34 Power cycling test (water cooled) Power cycling chamber n seconds per cycle Hirel PC2400A-IGBT (China) Power cycling test for DBC, soldering assembly (up to 2400 A) 34
35 Mechanical vibration test Vibration test machine ChinaSTI DC (China) mechanical vibration stability test for packaging assembly (acceleration up to 30g, force up to 1000 kg, 5~1500Hz) 35
36 Salt spray environment test Salt spray environment test t Atlas CCX2000 Corrusion environment chamber (US) emulation (humidity controlled) 36
37 Low-pressure altitude test Altitude Chambers GWS VH0770W Simulation of high-altitude h conditions like (China) might be found in mountainous regions. Simulation of altitude up to 100,000 feet Temp. range: 30 C to 160 C 37
38 Failure analysis lab 38
39 Failure analysis lab
40 X-Ray test X-ray test machine GE Microme (US) Power module, soldering assembly quality analysis (tube voltage maximum 180kV, 2-D, 3-D scanning) 40
41 Scanning acoustic microscope test WaterPlume scanning Scanning acoustic Sonoscan D9600 Solder layer quality test testmachine (US) (WaterPlume scanning mode avoid the samples in the water) 41
42 Push/Pull test (Die and wirebond test) Push/pull test machine XYZTEC Conder150-3HF (Holland) Die soldering shear stress, wirebond strength (up to 500 kgf) 42
43 Real time temperature monitoring High speed infrared camera Infratec 8325 (Germany) Real time temperature monitoring (up to 640X512 pixel, 0.2 resolution, 1200 Hz frame) 43
44 Thanks! 44
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