Supply Chain Management

Size: px

Start display at page:

Download "Supply Chain Management"

Chloe Price
6 years ago
Views:

1 Supply Chain 1 Logistics and Supply Chain Specific Requirements Components available and qualified for higher temperatures? Component suppliers shift to -conformity at different times! Special storage and processing conditions (dry, pre-bake, postbake )? Organize your component storage and supply chain! 2

2 Do you Need All Components From All Suppliers? Rethink what you ve always done as you do it now there might be better solutions! Opportunity to rationalize and restructure Example: Sony reduces component program globally for more than 90 % from 840,000 down to 100,000 Advantage: Less components to be qualified for lead-free, less logistics and data expenses 3 Cheaper purchasing Standards on Reporting Formats IPC website on lead-free soldering issues: Industry working on several approaches IEC declaration of conformance: ISO-IEC (1S-1T-1D) Materials declarations with composition data Several - but not developed for Web-based business data exchange (e.g. Rosettanet) Free, easily accessible data 4

3 How to Prove Compliance: Self-declaration?! Products presumed to be compliant Authorities conduct random checks Producers prove that they prove that they have taken reasonable steps to comply Analysis of every product and material unrealistic Source: ERA (modified) 5 Communication Documentation Understanding and awareness very different in the supply chain! Contact your suppliers and customers (PERSONALLY)! Make sure they understand as you understand -conformity, lead-free, Green etc. in the context of! Ask them to sign a declaration of conformity! Try to agree on (standard) data formats! DOCUMENT your efforts! Start in time which is yesterday! 6

4 Documentation template, proposed by UK DTI: 7 Confidence and Control of Sharks Carry out selective analysis! Check accuracy of supplier declarations Know and control the sharks in your supply chain! Check high risk items where there is doubt or no information 8 Source: ERA (modified)

5 Some Creatures From the Component Label Jungle Change of Product Number Manufact. A: old: Q ##$$$$$01234// -compl: Q ##$$$$$11234// Manufacturer B: old: MAX220CSE or MAX241CWI-T Some More Labels: -compl.: MAX220CSE+ or E / F / G / L / N / P / Z / LF / NL / PbF /... MAX241CWI+T 9 Source: M. Herrnberger, Zollner Elektronik Proposed Standards for Marking I JEDEC Standard JESD97, May 2004: Marking for Identification of Lead-Free In Assemblies, Components, and Devices IPC-1066, June 2004: Marking for Identification of Lead-Free and Other Regulated Materials In Assemblies, Components and Devices 10

IPC-1066/ JESD97: Only 2nd Level Interconnect Standard reflects only lead, only in solders, component finishes PWB finish assumed lead-free No mark for other -banned materials in solder system No

6 IPC-1066/ JESD97: Only 2nd Level Interconnect Standard reflects only lead, only in solders, component finishes PWB finish assumed lead-free No mark for other -banned materials in solder system No mark for Pb or other -banned material in assembled PWB 11 Components in Reels, Rails, Trays, Bags, Sticks IPC-1066/JEDEC: Terminal Finish and maximum soldering temperature On component (if space available) : On packing material: 12 e4 260 e4 Lead-free Material Categories: e1 SnAgCu e2 other SnX, no Bi, no Zn e3 Sn e4 preplated (i.e. Ag, Au, NiPd, NiPdAu) e5 SnZn, SnZnX, no Bi e6 Bi e7 low tem solder (only JESD) 260 or barcode-label with equivalent information

7 Boards IPC-1066 / JESD97: Assembled PWB Pb-free Unassembled board assumed Pb-free JESD97: Position for mark regulated Pb-free (Text or Logo alternatively) Package: HF/e2, e3/xy Completely Pb-free, no lead in exempted applications 13 HF/e2, e3/xy Only IPC Additional: Board Material, Conformal Coatings Assembly: Pb-free IPC-1066: Halogen free and Lists with coatings Halogen free Accidents, End-of-Life Information for Repair/Service: Board material/ reflow mat./ wave mat./ conf. coating XY HF / e2,e3 / XY 14 HF/e2, e3/xy

Proposed Standards for Marking II ETR-7021 (2004): withdrawn ET-7001 (2005) JEITA Un-assembled PWB assumed -compliant Presence and non-presence of all materials for component packages assembled PWBs

8 Proposed Standards for Marking II ETR-7021 (2004): withdrawn ET-7001 (2005) JEITA Un-assembled PWB assumed -compliant Presence and non-presence of all materials for component packages assembled PWBs 15 Components in Reels, Rails, Trays, Bags, Sticks 16 JEITA ETR 7001 Not -compliant because of the presence of -lead: [[Pb]] or Pb - several substances: [[Pb, Hg]] or Hg, Pb or -compliant: [[G]] or because of non-presence of restricted materials Components labelled on innermost packaging Hg Pb G or: same symbols as barcode label Symbols for other banned substances: [[Cd]] [[CrVI]] [[PBDE]] [[PBB]] G

9 Assembly JEITA ET-7001 Unassembled board assumed lead-free G or Hg, Pb 17 G Z40 Z40: SnZn4.0 solder Lists for different solders: A30C5, B57, C7 Abbreviations according to IEC or ISO 9453 rev. The Queen of Labels: Life Cycle Unit (LCU) Life Cycle Units are integrated in (electronic) products : Design supports Reuse & Recycling improves Manufacturing Test records & analyzes supports Repair, Refurbishment, Predictive Maintenance 18 Transportation Use SFB 281- gov. funded project

10 Category Soldertec/ BeCAP Phase 2 no more required Lead presence: [[Pb]] or Phase 3A JEITA ET-7001 IPC-1066 / JESD97 Comparison of Proposed Standards Non-presence: [[G]] or Component Plus solder exemptions to be marked : characteristic Hg: #1 #4 A30C5 Pb: #5 #7 Cd: #8 Cr(VI): #9 # >>#7-2006<< or Presence of other materials from Annex 1 (if year is required) (equivalent to ) Assembly Phase 3 [[Hg]], [[(PDPE)]], Hg Recommended: MSL, MST None Process Parameters Solder symbol 2nd l. i. label or barcode Solder symbol 2 nd Totally level Pb-free interc. Label For components: Maximum safe temperature (MST) Not required, For solder, terminals and board finishes with For substrates, solder material, conf. finish the chemical formula with categories Material Recommended for solder ( z.b. Z80B30) and Declaration finishes Pb G (PDPE) 19 Benefits Changes in exemptions are traceable, support to service Material declaration makes boards easier to recycle, all -Materials Other restrictions like Halogen-free (HF) (only IPC) included Comparison of Proposed Standards Category Limitation Soldertec/ BeCAP Lead-free, Mercury-free, Tolerance up to maximum concentration value (MCV) < 0,1 (0,01) wt% in homogeneous material JEITA ET-7001 Non-presence means substance < 0,1 (0,01) wt% in the uniform substance or uniform material IPC-1066 / JESD97 Pb-free means Pb < 0,1wt% in raw materials, reference to, process ready, 20 Exemptions Lead-free Phases Solder Material Board Substrate Annex1, Scope Art. 2 (1) Phase 1 - LF processable Phase 2 - LF terminals and solder Phase 3 3A - compliance Phase LF at all SnAgCu A40C5 SnZnBi Z80B30 (see IEC or ISO 9453) Lead-free per order presumed Like without data No more phases, only presence or non-presence of a () substance from Annex I SnAgCu A40C5 SnZnBi Z80B30 It displays at the main unit and the wrapping material under the presence/non-presence sign Lead free presumed Without reference - - 2nd level interconnect - -Totally Pb-free Solder symbol (e1, e2,..) for solder classes e1 - SnAgCu e2 - other SnX, no Bi, no Zn e3 - Sn e4 - preplated(ag, Au, NiPd, NiPdAu) e5 - SnZn, SnZnX, no Bi e6 - Bi e7 - low tem Solder (only JESD97) Pb free presumed IPC : HF = Halogen free

Pulse White Paper Regarding RoHS Compliance

Pulse White Paper Regarding RoHS Compliance Table of Contents Executive Summary... 2 Background/History... 3 Materials Selection... 3 Testing/Validation... 4 Implementation/Conclusion... 5 References...