Product / Process Change Notification
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- Rodger Doyle
- 6 years ago
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1 Dear Customer, Please find attached our INFINEON Technologies PCN: Implementation of halogen-free mold compound and copper wire bonding for products assembled in lead-free package PG-SC59 Important information for your attention: Please respond to this PCN by indicating your decision on the approval form, sign it and return to your sales partner before 12. August Infineon aligns with the widely-recognized JEDEC STANDARD JESD46, which stipulates: Lack of acknowledgement of the PCN within 30 days constitutes acceptance of the change. This PCN includes a Product Discontinuation Notice (JEDEC STANDARD JESD48 ) on page 5/5 Your prompt reply will help Infineon Technologies to assure a smooth and well executed transition. If Infineon does not hear from your side by the due date, we will assume your full acceptance to this proposed change and its implementation. Your attention and response to this matter is greatly appreciated. Disclaimer: If we do not receive any response by the date in the PCN above we consider this as the acceptance of the PCN. After the last order date as stated herein, purchase orders related to the unchanged product(s) cannot be accepted. In case the customer rejects this PCN this PCN shall be considered a product discontinuation notice (PD) Page 1 of 5
2 SUBJECT OF CHANGE: Implementation of halogen-free 1) mold compound and copper wire bonding. Note: Infineon products defined as halogen-free according to IEC meet the following requirements: 900 ppm maximum Chlorine 900 ppm maximum Bromine 1500 ppm maximum sum of Chlorine and Bromine All homogeneous materials in the final product defined as halogen-free according to IEC meet these voluntary substance thresholds defined by the International Electrotechnical Commission (IEC). PRODUCTS AFFECTED: TYPE BSR315P L6327 BSR316P L6327 BSR92P L6327 SP N SP SP SP OPN BSR315PL6327HTSA1 BSR316PL6327HTSA1 BSR92PL6327HTSA1 Package REASON OF CHANGE: To adequately react on the increasing customer requests for eco-friendly products. DESCRIPTION OF CHANGE: OLD NEW Mold Compound Mold compound containing Halogen Wire Bonding Material Au Wire Halogen-free mold compound Cu Wire Product Barcode Label Pb free logo Pb free and halogen-free logo Page 2 of 5
3 PRODUCT IDENTIFICATION: External traceability Barcode Product Label (BPL) A) Halogen-free logo printed on barcode label B) L in sales code will be substituted by H to indicate the halogen free 1) mold compound C) New customer ordering code Internal traceability Ensured via lot number and date code marking TIME SCHEDULE: Final qualification report: First samples available: Intended start of delivery: available available July 2015 depending on approval Last order date of unchanged product: See PD14097 page 5/5 Last delivery date of unchanged product: See PD14097 page 5/ Page 3 of 5
4 ASSESSMENT: Halogen-free according to IEC No change in electrical performance as defined in applied datasheets No change in quality and reliability Product reliability verified by full product qualification Advantages of Cu wire compared to Au wire (see 3_cip14097a) DOCUMENTATION: 3_cip14097a Customer Information Package Page 4 of 5
5 PRODUCT DISCONTINUATION PD14097 referring to PCN Last order date of unchanged product: Last delivery date of unchanged product DISCONTINUED NEW (REPLACEMENT) Device SP N OPN Package Device SP N OPN Package BSR315P L6327 SP BSR315PL6327HTSA1 BSR315P H6327 SP BSR315PH6327XTSA1 BSR316P L6327 SP BSR316PL6327HTSA1 BSR316P H6327 SP BSR316PH6327XTSA1 BSR92P L6327 SP BSR92PL6327HTSA1 BSR92P H6327 SP BSR92PH6327XTSA1 If you have any questions, please do not hesitate to contact your local Sales office Page 5 of 5
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