656T Series Thermally Enhanced XSOP Socket

Transcription

1 T Thermally Enhanced XSOP Socket Open top, Zero Insertion Force design for automatic loading Thermal contact for interfacing to thermal pad on package Thermal contact is timed to interface last and retract first during socket actuation Proven, highly reliable, pre-loaded I/O contacts Dual pinch I/O contacts Heat Flow Heat Flow Thermal Resistance In Socket Pitch e (mm) Width (E1) Tip to Tip (E) Length (D) Part Number Length (A) Width (B) max 656L T max 656L T max. 656L T max. 656L T X X X X X X X X T X X X IC Package Width Pitch (mm) 0=0.50 1=0.65 2=0.80 3=1.00 4=0.635 Total contact positions positions filled 22 : full fill Variation Material 2 = BeCu for contact & PEI for body : Beryllium Copper : Gold over Nickel Normal Force: 40 grams Resistance: 50 mω max. Dielectric: 300V AC for 1 minute Thermal Pin Power Dissipation: 2W min. 55

2 6000 Top Load PSOP Sockets (Single Beam ) Open top, Zero Insertion Force for automatic loading Riveted construction High current 2 Amp contacts Compact design for maximum board density High normal force, scrubbing contacts e Pitch e (mm) Width (E1) Tip to Tip (E) Length(D) Part Number Length (A) Width (B) Height (C) X-XX X-XX X-XX XXX - XXX - X - X X Package Body Length Other Options 0 = Without case contacts 1 = With case contacts 1 = 30 Microinches of Au (Select) : Beryllium Copper Alloy : Gold over Nickel Normal Force: 40 grams Resistance: 30 mω Dielectric: 1,000V AC (RMS) for 1 minute Temperature Rating: -55 C to 150 C Current Rating: 2 amps per contact Insulation Resistance: 5, V DC Durability: 5,000 cycles min. 56

3 648 TSOP-I Socket Available dead bug or live bug with adaptor Open top, Zero Insertion Force design for automatic loading Highly reliable, pre-loaded contacts e Pitch e (mm) Width (E1) Tip to Tip (E) Part Number Adaptor Length (A) Width (B) A A A A01 648A * 648B n/a A A A01 648A A * SA01 n/a A * one-component base construction X XX XX X XX Pitch 0 = 0.50mm 1 = 0.55mm Position Filled 22 = full fill Materials Variation 1 = Au over Ni IC Insertion A = live bug (with adaptor) C = dead bug (no adaptor) Socket Body: PES, PEI, LCP or Equivalent : Beryllium Copper Alloy : Gold over Nickel Normal Force: 30 grams Resistance: 50 mω Dielectric: 600V AC (RMS) for 1 min. 57

4 SOP ZIF Socket Open top, Zero Insertion Force design for automatic loading Compact size for high board density Highly reliable, pre-loaded contacts Pitch e (mm) Width (E1) Tip to Tip (E) Length (D) Part Number Length (A) Width (B) B008221X B008221X B008221X B008221X * 652C W B014221X B014221X B014221X B016221X B016221X B016221X B016221XE X XE D016221X D016221XE D020161X D020181X E018221X D020221X D020221X D020221X D020221X X XE X XE D024221X D024221X D028221X D028221X D028221X D028221X D028221XE E028221X E028221X E028221X D032221X D032221X * 652D W F032221X F040221X F040221X G044221X G044221X G044221X * Dual Points X X X X X X X X - X X X IC Package width Pitch Positions filled 22 = full fill Materials 1 = BeCu Variation Socket Body: PES, PEI, LCP or Equivalent : Beryllium Copper or Titanium Copper Alloys : Gold over Nickel Normal Force: 30 grams Resistance: 50 mω Dielectric: 600V AC for 1 minute 58

5 SSOP ZIF Socket Open top, Zero Insertion Force design for automatic loading Compact size for high board density Highly reliable, pre-loaded contacts Accommodate pitch sizes 0.50, 0.635, 0.65, and 0.80mm Pitch Socket Dimensions (mm e (mm) Width (E1) Tip to Tip (E) Length (D) Part Number Length (A) Width (B) C116221X C116221X C120221X C120221X (depop) X (depop) X C124221X C124221X C X X S132281X * 656J S132221X C232221X (depop) max * 656L (depop) max * 656L (depop) D244361X * 656J D244221X D244221X (depop) * 656K (depop) max * 656L max * 656L * 656K * * 656M * Dual Points X X X X X X X X - X X X IC Package width Pitch (mm) 0=.50 1=.65 2=.80 4=.635 Total contact positions positions filled 22: full fill Materials 1 = BeCu Variation Socket Body: PES, PEI, LCP or Equivalent : Beryllium Copper or Titanium Copper Alloys : Gold over Nickel Normal Force: 35 grams Resistance: 50 mω Dielectric: 600V AC for 1 minute 59

6 TSOP-II Socket Open top, Zero Insertion Force for automatic loading Highly reliable, pre-loaded contacts Live bug insertion Single point contact on package leads For 0.80mm and 1.27mm pitch packages B A Pitch e (mm) Width (E1) Tip to Tip (E) Length (D) Part Number Length (A) Width (B) A E A E A E A E A E A E C E C E C E C E C E C E A E A E C E C E C E C E C E C E C E X X X X X X X X - E X X IC Package Width Body Size Positions filled 22 = full fill Material Alignment Posts 11 = with 08 = without Includes Lid Return Springs Socket Body: PES, PEI, LCP or Equivalent : Beryllium Copper Alloy : Gold over Nickel Normal Force: 40 grams Resistance: 50 mω Dielectric: 600V AC for 1 minute 60

7 676 TSSOP Dual Pinch ZIF Socket Open top, Zero Insertion Force design for automatic loading Dual pinch, highly reliable contacts Live bug insertion A Pitch e (mm) Width (E1) Tip to Tip (E) Length (D) Part Number Length (A) Width (B) Height (C) X X X 0 X X X IC Package width Fence Configuration Insulator Material Material : Beryllium Copper Alloy : Gold over Nickel Normal Force: 30 grams Resistance: 30 mω Dielectric: 600V AC for 2 minutes Insulation Resistance: 12, V DC 61

8 678 HSOP Socket for Small Outline "Heat Slug" Packages "Dual Pinch" highly reliable contacts Separate contacts for interfacing with heat slug Open top, Zero Insertion Force for automatic loading Compact size for high board density D e E1 E Pitch e (mm) Width (E1) Tip to Tip (E) Length (D) Part Number Length (A) Width (B) X X X X X X X X X X X X Heat Sink s 1 = Top s Only 2 = No s 3 = Top & Bottom s Pitch Insulator Material Material : Beryllium Copper Alloy : Gold over Nickel Normal Force: 30 grams Resistance: 30 mω Dielectric: 600V AC for 2 minutes Insulation Resistance: V DC Durability: 5,000 cycles min. 62

9 689 SOP Dual Pinch Socket Open top, Zero Insertion Force for automatic loading Dual pinch; highly reliable contacts Accepts two 8 pin SOP packages Live bug insertion Accommodates 1.27mm pitch packages PART NUMBER: IC Package width Insulator Material Material plating Fence Configuration : Beryllium Copper Alloy : Gold over Nickel Normal Force: 30 grams Resistance: 30 mω Dielectric: 600V AC for 2 minutes Durability: 5,000 cycles min. 63

10 696 TSOP-II Socket Open top, Zero Insertion Force designed for automatic loading Highly reliable, dual pinch, pre-loaded contacts Live bug insertion Pinch style contact interface For 0.50mm, 0.65mm, and 0.80mm pitch packages Pitch e (mm) Width (E1) Tip to Tip (E) Length (D) Part Number Length (A) Width (B) * 696H WE H WE * 696H WE H WE * 696H WE H WE * Includes alignment posts Pitch 1 = 0.80mm 2 = 0.65mm 3 = 0.50mm H X XX XX X X X E XX Dual Beam Positions Filled 22 = full fill 1 = Gold Std. Material Includes Lid Return Springs Alignment Posts 11 = with 08 = without Socket Body: PES, PEI, LCP or Equivalent : Beryllium Copper Alloy : Gold over Nickel Normal Force: 40 grams Resistance: 50 mω Dielectric: 300V AC for 1 minute 64

11 712 TSOP-II Socket "Compact style" for maximum board density Open top Zero Insertion Force design for automatic loading Highly reliable, dual pinch, pre-loaded contacts Live bug insertion For 0.65mm, 0.80mm, and 1.27mm pitch packages Lid holding force is 25% less than peak actuation force Pitch e (mm) Width (E1) Tip to Tip (E) Length(D) Part Number Length (A) Width (B) X X X X - XX Features : Beryllium Copper Alloy : Gold over Nickel Normal Force: 40 grams Resistance: 50 mω Dielectric: 600V AC for 2 minutes Insulation Resistance: V DC 65