Almit SRC Solder Paste LFM-48W TM-HP(Y) For High pre-heat application High performance Lead Free Solder Paste

Transcription

1 Almit SRC Solder Paste LFM-48W For High pre-heat application High performance Lead Free Solder Paste

2 LFM-48W Almit TM-HP series which already has good market share. Upgrade Ver. As is now released. can be good solution against several problems on SMD process. Features 1.Meets high pre-heat Flux can stand even high pre-heat & long profile. good performance on the board. 2.Good wetting property Minimize de-wetting BGA and Tombstones. 3. Improve continuance print performance & stencil life keeps stable print performance for long time with good wetting

3 Spec design LFM-48 Specification Code No. LFM-48 Composition Sn-3Ag-0.5Cu Alloy X:25-45μm Powder Size W:20-38μm U:10-28μm Flux Type Heat resistance Flux % 12% Halide % Under 0.10% Ingredients Resin capacity 40~45% Solvent boiling Point Over 250

4 Flux What is heat resistance? Flux heat resistance = Anti oxidation + Reducing Property Minimize oxidation Reduce oxidation materials Antioxidant Minimize oxidation reaction Flux Heat resistance is improved Reducing agent Reacts Oxidation material, reduces Oxygen Select materials for Sn-Ag-Cu paste PH temp.(100~200 )

5 LFM-48W Heat resistance LFM-48W good Heat resistance Minimize 1. Slump paste under High pre-heat profile Chip side solder ball bridges caused by slumping 2. De-wetting De-wetting on Big pad area BGA De-wetting Chip Tombstone Keep good quality for Big or Ceramic Board, Board with big components etc. which need High temp. pre-heat

6 Chip side ball Test Chip side balls come up under High Temp. PF. minimize chip side ball even under the condition. Normal PF High Temp. PF Ref. Ref (mm) 1005 Print solder paste 120% aperture (t:120μm) and reflowed Normal PF 160~190 90sec Over sec Peak:235 High Temp sec Over sec Peak:237

7 Board wetting Test Paste powder, materials (Components & Board) is oxidized under high heat. Also Flux activation property goes down then Non melting & De-wet tend to coming up. keep good wetting property even under high pre-heat. It minimizes components de-wetting. Ref. 92.7% φ0.20mm Wetting rate 57.2% 2 3mm De-wet Test Board & Stencil Board : test board( ) Stencil :SUS laser cut 120μm Reflow PF PH: sec Peak :236 Over sec

8 BGA/CSP De-wetting Recently SMD process area has BGA/CSP De-wetting problem It is still big issue, because difficult to detect by inspection or AOI. Main reasons are BGA s bump oxidation, BGA warping, Board bending, and Flux activation goes down under High pre-heat. keeps good heat resistance & Flux activity, which solve De-wetting on these packages. De-wetting example

9 BGA bump wetting Test Ref. BGA package Test(BGA Warping, Board bending, bump oxidation can be De-wetting reason) Bump (ball) Test (Wetting test against Oxidized balls) Board & Stencil Board : test board( ) Cu OSP (water solution) Stencil :SUS laser cut 120μm Method Pattern (φ0.45mm) Print paste 100% φ0.45mm area Relow Bump (Ball) SAC305 φ0.50mm 40 /90%RH 24hrs Aging Reflow PF PH: sec Peak :237 Over sec Wetting situation is up to Paste s Flux property (Activity)

10 Viscosity Chart Viscosity Ti Index changes (Stencil Rolling) Viscosity Ti Index 0hr 16hr 32hr 48hr Ref hr 16hr 32hr 48hr Ref 粘度 TI (Pa s) 他社品 TI 他社品 (hr) (hr) Printer:SP-60P Solder paste:500g Measurement Frequency:Each16hrs Stencil:SUS laser cut (200μm ) Squeeze blade :Urethane Hardness :90 Squeeze speed :25mm/sec Pressure : N (close stencil apertures)

11 Viscosity Chart Viscosity (Malcom viscometer) Machine:PCU-2 Solder paste:500g Measurement Frequency:1 回 /60sec Test condition:25 60~70%RH Stencil Rolling 0hr 16hr 32hr 48hr Malcom ローリンク vsmalcom (Pa s) ローリンク malcom (hr) Viscosity value is depends how paste is rolled. (Stencil rolling & Malcom

12 Printing property (Dots Φ) Ref. φ0.22mm φ0.24mm φ0.22mm φ0.24mm 3 rd print 11 th print 21 st print Printer setting Machine:SP10P Board: Test board mm) Stencil:SUS laser cut 120μm Squeeze speed:30mm/sec Print pressure :1.0kgf/cm2 Snap off speed :5.0mm/sec Uniform

13 Printing property (Slit ) Ref. 0.15mm 0.20mm 0.15mm 0.20mm 3 rd print 11 th print 21 st print Printer setting Machine:SP10P Board: Test board mm) Stencil:SUS laser cut 120μm Squeeze speed:30mm/sec Print pressure :1.0kgf/cm2 Snap off speed :5.0mm/sec Uniform

14 Tackiness Test タッキンク 力 タッキンク 力 (gf) 他社品 放置時間 Test method: JIS Z 3284

15 Recommended Heat Profile 温度 ( ) 250 ピーク 230~ プリヒート時間 90±30sec 溶融域 220 以上 25~50sec 昇温速度 TM-HP: 1.0~2.5 /sec 青 黒 1.0~2.5 TM-TS: 緑 黒 1.0~ 時間 (sec) Recommended process window (Between Blue line Black line ) Rump up speed 1.0~2.5 /sec Pre-heat temp. 170~200 /sec 90±30sec Peak 230~245