PASSIVE COMPONENT MATERIALS HIMEC, UNIMEC, OHMCOAT
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1 PASSIVE COMPONENT MATERIALS HIMEC, UNIMEC, OHMCOAT
2 PRODUCT RANGE Sintering Materials =>> HIMEC Used for Electrodes on Passive Components For Photovoltaic Pastes (Front Side & Back Side Silver Paste ) For Termination Electrodes & Inner Electrodes for MLCC and Chip Inductor For Termination Electrode & Bottom Electrode for Chip Resistors As Fine Line Thick Film Paste on various Ceramic Substrates Epoxy Silver Pastes =>> UNIMEC As Polymer (Soft ; Flexible ) Termination for Chip Resistors, MLCCs, and Tantalum Capacitors As Electrical Conductive Adhesive to replace Solders 2
3 SINTERING MATERIALS HIMEC 3
4 COMPOSITION OF HIMEC General Composition Metal Powder Glass Frit Resin Solvent Metal : Silver, Copper, Nickel, etc. Shape: Spherical,Flake, etc. Glass Frit: SiO2, B2O3, ZnO, Bi2O3, R2O, RO etc. Organic Resin Ethylcellulose Resin, Acrylic Resin etc. Organic Solvent Butyl Carbitol, Terpineol etc. 4
5 FORMATION PROCESS Composition Drying Firing Film Formed deg.C deg.C Conductive Powder Glass Frit Resin Solvent Solvent Removal Resin Burn-out Glass Softening Metal Sintering 5
6 Shrinkage(%) INDUCTOR, VARISTOR, THERMISTOR Inner Electrode Silver Characteristics Lead free High Reliability Good Plating Fluid Rresistance Good Adhesion Strength Good Ohmic Contact Good Solderability Low Resistance Various Shrinkage Rate Termination Electrode Ag Material Characteristics can be Adjusted Viscosity Thixotropy Ag Content Sintered Density Shrinkage etc 収縮率 (%) Sintering Temp.(deg.c) 焼成温度 ( )
7 INDUCTOR PRODUCTS Product DP4329 DP4511A DP4366E DP4857L DP4340 Drying Viscosity * (Pas) Max Temp. 150 C 150 C 150 C 150 C 150 C Hold Time 15 Min 15 Min 15 Min 15 Min 15 Min Max Temp. 620 C 640 C 620 C 610 C 620 C Firing Hold Time 10 Min 10 Min 10 Min 10 Min 10 Min In-Out 60 Min 60 Min 60 Min 60 Min 60 Min Silver Contents (%) Application Chip Inductor Chip Inductor Chip Inductor Chip Inductor Chip Inductor Use On Single Chip Single Chip Array Chip Low Silver Content Low Silver Content * Viscosity: Brookfield HB type, SC4-14spindle, 10rpm(4.0-1 s), 25C 7
8 CAPACITOR Characteristics Lead Free High Reliability Good Plating Fluid Resistant Good Adhesion Strength Terminal Electrode: Silver or Copper Paste 8
9 CU- TERMINATION Product Viscosity * (Pas) Drying Max Temp. 150 C 150 C Hold Time 15 Min 15 Min Max Temp. 900 C 850 C Firing Hold Time 10 Min 10 Min In-Out 60 Min 60 Mmin Inorganic Contents (%) Application MLCC MLCC Used For X5R, X7R COG * Viscosity: Brookfield HB type, SC4-14spindle, 10rpm(4.0-1 s), 25C 9
10 THICKFILM PASTES These Series of Pastes makes the use of Palladium or Platin in Silver Pastes obsolete without missing out on any of the Key Characteristics Excellent Solder Wetting Solder Leach Resistance Ag-Migration Resistance Excellent Adhesion Strength 10
11 PRODUCTS FOR AL 2 O 3 SUBSTRATE HR Paste HR4501 HR4441B HR4301A HR4201A Silver Content 86.5 % 87.0 % 86.5 % 87.0 % Viscosity 10 rpm 200 Pa s 200 Pa s 230 Pa s 200 Pa s Resistivity (mω/ at 10 μm Fired Film Thickness) 2.5 mω/ 2.5 mω/ 2.5 mω/ 2.5 mω/ Comparison Chart Ag/Pd/Pt (78/13/9) Ag/Pd (70/30) Ag/Pd (79/21) Ag/Pt (99/1) Compatible to Electroless Plating *1 Brookfield HB type SC4-14 spindle at 25 11
12 CHARACTERISTICS Paste Solderability *2 HR4501 HR4441 HR4301 HR4201 OK at 230, RMA Flux, 100% for 5 second dip Solder Leaching *3 6 dips 3 dips 2 dips 1 dips Resistivity (@10 μm Fired Film Thickness) 2.5 mω/ 2.5 mω/ 2.5 mω/ 2.5 mω/ Fired Film Thickness μm μm μm μm *1 Brookfield HB type SC4-14 spindle at 25 *2 Lead-free solder 96.5Sn-3Ag-0.5Cu (=SENJU METAL INDUSTRY CO.,LTD. M705) at 230, RMA flux, 100% for 5 second dip *3 Lead-free solder 96.5Sn-3Ag-0.5Cu (=SENJU METAL INDUSTRY CO.,LTD. M705) at 250, RMA flux, 10 seconds dip for each dip 12
13 THERMAL CURING CONDUCTIVE PASTES UNIMEC 13
14 BASIC COMPOSITION Conductive Filler Spherical Silver Flake Silver Base Resin Additive Solvent Organic Resin Epoxy Resin, Phenolic Resin, Silicone Resin etc. Surfactant Coupling agent etc. Organic Solvent Ethyl Carbitol, Butyl Carbitol etc. 14
15 FILM FORMATION Composition Drying Curing Film Formed 100 ~ ~200 Conductive Filler Resin Solvent Solvent Removal Resin Curing 15
16 APPLICATIONS Functional Polymer Electrolytic Capacitor Solar Cells Termination for Chip Component Electromagnetic Shield Conductive Adhesive Printed Circuit Die Attach 16
17 CHIP INDUCTOR Features Low Resistivity Low Temp. Curing Plateable UNIMEC Plated Ni / Plated SnPb or Sn Ferrite Copper Wire Inner Electrode Enamel Resin 17
18 INDUCTOR PRODUCTS Product H9132 XH9108A-1 25 C [Pas] T.I. Volume Resistivity Adhesion Strength Non-Volatiles Contents (%) Silver Contents (%) Metal Powder Resin Type Solvent Curing Condition ,0 10,0 30,0 7,0 1,5 2,5 81,0 90,0 76,0 85,0 Sphere / Flake Sphere Epoxy / Phenol Epoxy / Phenol Butyl Carbitol Butyl Carbitol C C Characteristic Low Resistance Good Coating Shape Ultra Low Resistance 18
19 Percent MLCC MATERIALS Features Inner Electrode Low Resistivity High Adhesion Low Elastic Modulus No Plating Solution Penetration Plating Capability UNIMEC (Soft Termination) / Plated Ni / Plated Sn/Pb or Sn Dielectric Material Application Process Dipping Transferring 100% 90% 80% Flexure 70% 60% 50% Sintering Termination 40% 30% Soft Termination 20% 10% 0% 1 10 Flexure (mm) 19
20 2 LAYER BME - MLCC MATERIALS Product 25 C [Pas] T.I. Volume Resistivity (*E-4 Ohm.cm) Adhesion Strength (kn/cm 2 ) Non-Volatile Contents (%) Silver Contents (%) Bending Modulus (GPa) Metal Powder Resin Type Solvent Curing Condition Build H9135 H9198 H ,6 4,4 2,9 4,0 2,0 5,5 2,6 1,8 2,2 84,5 89,0 85,0 67,0 78,0 41,0 7,0 5,0 7,1 Sphere/Flake Sphere/Flake Sphere/Flake Epoxy/Phenol Epoxy/Phenol Epoxy/Phenol Dibasic Acid Ester Butyl Carbitol Butyl Carbitol 200C 170C 170C BME Base, Polymer Top BME Base, Polymer Top BME Base, Polymer Top Characteristics High Adhesion Strength High Bending Strength Good Coating Shape Good Coating Shape Low Cost Solution 20
21 1 LAYER PME-MLCC MATERIALS Product H H C [Pas] T.I Volume Resistivity (*E-4 Ohm.cm) 8,0 2,5 Adhesion Strength (kn/cm 2 ) 2,0 0,8 Non-Volatile Contents (%) 80,0 80,0 Bending Modulus (GPa) 7,0 2,6 Ag Powder Sphere / Flake Sphere / Flake Resin Type Epoxy / Phenol Epoxy / Phenol Solvent Butyl Carbitol Butyl Carbitol Curing C C Application Direct on Inner Direct on Inner Characteristics Standard Low Bending Modulus 21
22 CHIP RESISTOR Marking OHMCOAT (G2) Plated Sn/Pb or Sn Plated Ni UNIMEC (C2) Substrate Resistor H9139 H9134W H9134J 22
23 AG PASTES FOR R-CHIPS Product H9134W H9155 H9139 H9156 H9143 H9117S 25 C [Pas] T.I. 6,6 5,5 20,0 20,0 22,0 6,9 Volume Resistivity (*E-4 Ohm.cm) 4,0 4,0 2,5 2,5 4,0 0,9 Adhesion Strength (N/mm 2 ) 26,0 26,0 17,0 17,0 12,0 16 Non-Volatile Content (%) 82,0 83,5 81,5 82,5 74,0 87,0 Ag Powder Sphere / Flake Sphere / Flake Sphere / Flake Sphere / Flake Sphere / Flake Sphere / Flake Resin Type Epoxy / Phenol Epoxy / Phenol Epoxy / Phenol Epoxy / Phenol Epoxy / Phenol Epoxy / Phenol Solvent Dibasic Acid Ester Dibasic Acid Ester Ethyl Carbitol Ethyl Carbitol Butyl Carbitol Butyl Carbitol Curing Condition C C C C C C Application R Chip R Chip R Chip R Chip R Chip R Chip (Single) (Array) (Single) (Array) (Single) (C4) Characteristic High Adhesion Strength High Adhesion Strength Easy Plating Easy Plating Low Ag Contents Seamless Printing 23
24 CHIP RESISTOR COATINGS Product Ohmcoat1021 Ohmcoat1028 Ohmcoat1057K Color Navy Blue White Black C Pas Tg C CTE < Tg ppm/ K > Tg ppm/ K Water Absorption % 3,8 3,4 3,6 Volume Resitivity Ohm.cm 2,10E+15 2,60E+15 1,00E+15 6H 6H 6H Pencil After Solvent Hardness Immersion 5H 5H 5H Time Min Drying Temperatur e C Time Min Curing Temperatur e C
25 TA ELECTROLYTIC CAPACITOR Features Low Resistivity Low Temperature Curing High Purity UNIMEC Sintered Ta Mold Resin UNIMEC Application by Carbon layer Polymerized Organic Semiconductor Electrolyte Dipping Transferring Cathode Tantalum oxide layer Anode 25
26 MATERIALS FOR TA CAPACITORS Product No. H9480 H9480S H9470 Application Anode Adhesive Ta Body Coating Ta Body Coating Characteristics Low Resistivity Low Resistivity, Low Resistivity Low Viscosity Low Viscosity Good Corner Coverage 25 C Pas T.I. 42,0 44,0 33,0 Silver Contents % 82,0 79,0 83,0 Non-Volatile Contents % 91,0 87,0 87,0 Volume Resistivity Ohm.cm 5,0E-05 5,0E-05 5,0E-05 Adhesion Strength N/mm² 15,0 15,0 10,0 Curing C C C 26
27 THANK YOU FOR YOUR ATTENTION
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