改變世界就是要你 台積電北美徵才. Date & Location. Interview Arrangement Come talk with us to see how tsmc can shape your career in a positive way

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1 台積電北美徵才 改變世界就是要你 Date & Location 4/9-10 Purdue U. 4/11-12 U. of Michigan 4/11-13 San Jose 4/13-14 U. Penn 4/14-15 UCLA 4/16-17 MIT 4/16-17 UT Austin 4/18 Columbia U. Interview Arrangement Come talk with us to see how tsmc can shape your career in a positive way Sign up for private interview by registering your profile (click here) or your resume directly to chenscw@tsmc.com before April 7 th! It s highly recommended to upload your homemade resume together with your submission Video interview can be arranged for people who are unable to meet our delegates in person Concise hot job information could be found in the following pages; visit our official website for more openings!

2 Hot Job Openings # Function Job Title Job Description (Responsibility) Location 1 Advanced Transistor Research 1. Conducting exploratory module projects independently 2. Investigating and developing the required new module capabilities 3. Collaboration with device team to develop modern transistor architecture 2 Optical Proximity Correction (OPC) 1. Recipe development for Optical proximity correction (OPC) recipes and multiple patterning decomposition recipes 2. Optical proximity correction (OPC) taped-out layer sponsors 3. Resolution enhancement technology development 3 1. Be responsible for N5 and beyond FinFET BEOL project Interconnect 1. N5 and beyond BEOL baseline process integration, test pattern design and WAT data analysis Development 2. SRAM yield improvement on BEOL issue 3. BEOL process reliability Qual 4 R&D Advanced Device 1. N10 and beyond device simulation, test key & test circuit design 2. Characterization and documentation 3. Task management and cross-team collaboration among device, product, integration, and module teams. 5 Advanced Integration 1. N10 and beyond process & device integration, window characterization 2. Co-work with device and Process to develop advanced technology 3. WAT trouble shooting & yield improvement by process optimization and technology transfer 4. Communicating with key customers, vendors, and foundry people 6 Advanced Module (Litho/Etch/CMP/Epi) 1. N10 and beyond module process development and baseline sustaining 2. Process stability/manufacturability improvement for yield and reliability qualification 3. Process/tool transfer to volume manufacturing 7 MEMS 1. Process development and integration MEMS technology 2. Support of process troubleshooting and device evaluation 3. Work closely with vendors and customers to resolve any issues related 8 Analog/Mixed Signal 1. Multi-Gbps mixed-signal design for high-speed Serial Link PHY 9 IC Design WiFi/BlueTooth Communication Architect 1. RF, Baseband and communication Architect 2. Define System Level scalable architecture for an Analog/Digital BBP (Base Band Processor) for 4G LTE, WiFi, Bluetooth, GPS and other protocols for futuristic Mobile, Network and IoT Application Processors 3. Define the partition of RF, baseband, protocol and applications. Architect requirements for baseband firmware for real time OS (RTOS). Low Power design (e.g. Low Power LTE modem)

3 10 Virtual Platform ESL Architect 1. Analyze virtual platform requirements for next generation SOC and AP (Mobile and IoT). 2. Design SystemC/TLM 2.0 methodology to determine Power and Performance that is tied to TSMC technology. 3. Architect, design and implement virtual platform for complex SOC. 4. Evaluate commercial VP tools for next generation SOC/AP/IoT devices. Play leading role to guide TSMC partners develop new virtual platform method with TSMC process technologies. 11 Timing and Characterization Technical 1. R&D in chip timing methodology and library characterization 2. Design and Process co-optimization for advanced technology 3. EDA enablement and Timing methodology development 4. R&D, innovation, and path finding IC Design Physical design methodology/ Power and IREM technical Standard Cell Layout Designer Automatic Placement and Routing (APR) Process (Etch/Litho/PVD/CVD/ CMP/Diffusion/Wet Clean) Process Integration (Logic, CIS, MEMS, IR Sensor) 1. R&D in physical design methodology and chip implementation 2. Design and Process co-optimization for advanced technology 3. EDA enablement and design methodology development 4. R&D, innovation, and path finding 1. Defining standard cell layout structure for latest technology 2. Co-working with process RD for appropriate design rules 3. Designing the most competitive standard cell libraries 4. Communicating with key customers, vendors, and foundry people 1. Responsible for N7/N10/N16 chip implementation for internal or customer projects. EDA tool enablement and customer s support if necessary 2. Physical implementation of advanced technology chips 3. Design methodology development and innovation to overcome advanced technology challenges 1. Develop and sustain N10/N16/N20/N28 process technologies for flash memory and logic products 2. Work with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements 3. Responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians 1. Maintain and control Inline defect baseline and excursion 2. Responsible for N10/N16/N20/N28 technology yield/defect problem 3. New technology defect study and early detection 1. Oversee the daily operations of IC foundry to ensure that all profiling operations, work flow, and customer reports are consistent with agreed upon service operations 2. Improve productivity in effective and efficient way to meet the organization objectives 3. Work on scheduling projects and running projects upon compound receipt, analyzing data using database systems/tools built and updating tracking programs to keep operation smoothly 4. Interact with different functions like Process/Integration and Equipment to ensure robotic workstations, detection instruments, and database/informatics tools are built to meet the demands on service

4 18 Product 1. Involve and work with RD/Process integration/process engineering team for yield improvement by Failure Analysis expertise 2. FinFET device design and yield ramp-up 3. Involve and work with RD in early stage to develop N10/N16 FinFET device 19 Quality System 1. Quality system improvement 2. Develop and improve quality related procedure, such as SPC and Fab engineering change management 3. Coordinate quality related CIM project to support N16 and beyond quality/manufacturing efficiency improvement and customer satisfaction 4. Integrate and promote SPC and FCCB related knowledge 20 System Reliability Technical 1. Work with R&D to solve product reliability issues for advanced technology development and high volume manufacturing 21 Quality & Reliability Metrology Quality 22 SPC 23 TEM engineer 1. Fab metrology quality gating/enhancement and change control 2. RD new metrology develop assessment 3. RD to Fab / Fab to Fab metrology transfer management 4. Develop metrology quality improvement project 1. Develop statistical methodology to solve operation or non-operation problems 2. Consult and solve customer and internal statistical problems 3. SPC/FDC management 1. TEM Methodology Development 2. N10 and beyond R&D TEM Support 3. STEM-EELS analysis for Failure Analysis IT IT Big Data Analyst / 1. Project management and System development/maintenance 2. System development/maintenance to sustain user operation and support for enabling internal project 3. Role play as the system consultant for supporting site operation support team to smooth business operation 1. Use advanced quantitative analysis, data mining techniques and strong industry acumen to interpret, connect and predict data (e.g. security, sales/marketing, fab engineering) to deliver insight and recommendations for decisions 2. Drive improvements based on analysis result; design and develop statistical models based on the operating needs of the organization as well as oversee the ongoing data processing cycles 26 HR HR Specialist 1. Employee champion to create the working environment with balanced of work life and belonging 2. Change agent as identify issue, diagnostic situation, initiate idea and action plan to help the organization execute the necessary change 3. Services provider on the daily basis to serve the employees and business partners

5 27 Finance Corporate Finance Associate 1. Job scope includes funding, FX risk management, debt/equity offerings, investment valuation, various projects to support management decisions, credit risk management, multiple insurance programs to reduce TSMC s operating risk, financial risk control/modeling, ROC/US SEC compliance, and post-investment management 2. The new hire will rotate among 2~3 functions within a timeframe of 3 years+. Such functions include treasury operations, Financial Planning, Customer Credit, Insurance, Financial Risk Management, SEC Compliance and Investment Management 28 Marketing Forecast 1.Analyze the market macro-trend, and model the usage of key electronic ICs and modules 2.Propose business strategy to executives CPO 29 Pricing 30 Legal Patent Attorney / Agent 31 Audit Internal Auditor 1. Review and make recommendations for the price proposal to maximize tsmc profitability 2. Format the pricing strategy 3. Work with BD to set the technology value 4. Provide comments for the biz agreement 1. Review drafts/office actions prepared by outside counsel for domestic and foreign filings 2. Draft patent applications for filing in the United States 3. Support confrontational actions 1. Participate audit projects from risk assessment to final audit as well as periodic follow-up on improvement status 2. Participate organizational capability establishment activities. Examples include knowledge management system enrichment, data analytics and application, risk universe update, fraud case study, training materials development, etc 3. Organize, plan, and execute on all aspects of fraud investigation, including scoping, detailed test work, data analysis, electronic discovery, interviewing, reporting, and follow-up. 4. Assist promoting an ethical corporate environment through training and leading process/policy enhancements 5. Coordinate company-wide activities such as annual Control Self-Assessment, streamlining policy/procedure/sop, internal control maturity assessment, and Internal Control Champion (ICC) program Find more job openings HERE!