VDA AK 8D definition of failure cause categories for 8D reporting Version: 1.0 Date: November 15, 2016 Contact:

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Download "VDA AK 8D definition of failure cause categories for 8D reporting Version: 1.0 Date: November 15, 2016 Contact:"

Primrose Johnston
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1 VDA AK 8D definition of failure cause categories for 8D reporting Version: 1.0 Date: November 15, 2016 Contact: rootcausecat change qmc.de VDA download: qmc.de/publikationen/formulare/ Level 1 Level 2 Level 3 Examples QDX ID Specification missing Specification Requirements changed Specification unclear Requirements insufficient Miscellaneous Compatibility Fixing points do not match, incorrect bus protocol Industrial feasibility Screw not reachable, inadequate test possibilities Architecture Increased bus load for data flow, insufficient electromagnetic compatibility in the system, runtime problems Cable routing or cable harness routing Fixation inadequate Usability Menu navigation (multimedia), haptic feedback for switch Internal interface Incorrect connection technology, software driver for hardware components Concept Plug design incorrect, syntax protocol for communication, inadequate External interface sealing concept Change to the application profile Deviating product lifecycle, modified installation space Software update process Diagnostic capability Clear correlation between failure memory entry and failure location, basic diagnostic capability Test planning concept Definition of test parameters, limit values for stress test in production, identifying test criteria Miscellaneous No alignment with requirements Unsuitable temperature range for component Contact corrosion, expansion coefficients, material pairing unsuitable, Material selection insufficient insulation for cable harness Circuit board design Placement on the circuit board, design rules not adhered to Construction Tolerances incorrectly determined Circuit diagram Pull-up resistor missing, ESD protective circuit missing Product development Product drawing Incorrect or no dimensions Development environment and IT tools Incorrect data formats, incorrect versioning, faulty tool chain Basic software and functional software Matlab model incorrect, faulty AUTOSAR module, faulty hardware drivers, parameterization incorrect, firmware error Data management Incorrect or old coding data/software version Development Change management After correcting the active component, the external circuitry interim solution was not removed Miscellaneous

2 Process development Verifying and validating No alignment with requirements Development environment selection Low process optimization due to selected development environment Production process selection Unfavorable material selection in relation to the production process (e.g. silver migration when soldering) Production control system selection Production planning system selection Inadequate plant utilization Manufacturing sequence Transport system automation planning PLC programming, material flow simulation Plant control automation planning Soldering profile programming for wave soldering Production line layout Spatially separated production lines, limited spatial options (doors too narrow), building planning Plant planning Selection of the appropriate production machines Logistics planning Packaging planning Not ESD-compliant Personnel planning Maintenance planning Maintenance cycles, maintenance concept Quality planning and test planning No visual inspection Energy planning Emergency power supply Rework planning Production resource preparation Tool manufacturing Start-up planning Construction, conversion, commissioning, start-up protection Selection of programming location and programming procedure, switching from programmable memory to hardware programming (ROM Programming process planning mask) Data management Change management Missing or insufficient change management Miscellaneous Protection missing Test coverage insufficient Testing from the customer's point of view Methodological error Durability test (e.g. battery missing) Miscellaneous Storage Semi-finished product Order picking Handling Storage period Storage period exceeded, storage concept (e.g. FIFO) not adhered to Storage conditions Humidity, temperature Miscellaneous Processing period Processing period exceeded Miscellaneous Type error An incorrect item is available as a replacement or in addition to the correct item Quantity error The quantity of the correct item is too high or too low Completeness error An item is missing Miscellaneous Manual handling Electrostatic discharge (ESD) specifications inadequate Machine handling Driverless transport unit, contact points unsuitable, electrostatic discharge (ESD) specifications inadequate

3 Joining Contamination Contamination that is external to the process Miscellaneous Gluing with physically binding adhesives, wet gluing process, contact gluing process, activated gluing process, adhesive process Gluing process Dispensing process Applying heat-conducting paste or liquid seal Contact welding process, laser welding process, friction welding process, ultrasonic welding process, resistance welding process, manual welding process, crack formation in weld, cavities in the weld, raised weld seam Welding process Dip soldering process, wave soldering process and flow soldering process, selective soldering process, reflow soldering process, light soldering process, inductive soldering process, resistance soldering process, cold soldering process, vacuum soldering process, hot air soldering process, laser soldering process, soldering with an open gas flame, diffusion soldering process, amorphous brazing foil, vapor phase soldering process, ultrasonic soldering process, manual soldering Soldering process process Riveting process Solid rivet process, piercing rivet process, blind rivet process Inadequate definition of the process window, monitoring of process Wire bonding process parameters on production equipment not activated Fastening process Clicking Clamping process Clipping process Securing housing cover with clip Latching process Plugging process Bent pin in electrical plug connection, pushing through of plug pin (incorrect connection) Screwing process Screw sequence not adhered to Sealing process Clinching process Clinching, toxing, pressure joining, forming joining Shrinking process Lamination process Press-fit process Press-fit (plug in circuit board), force fitting (e.g. pressing in ball or bolts), pressing on Sewing process Seats, steering wheel Weaving process Carbon fibers Crimping process Crimped insulation; missing crimp-force monitoring Woven fabric production process Carbon mat production Embroidery process Carbon mat production Miscellaneous Casting process Tempering, hardening, casting (e.g. also ECU or sensor housing) Injection molding process Too much raw material, air pockets, clogged nozzle, injection position incorrect, melting temperature too low Metal vapor process Vulcanization process Tires Spray compacting process

4 Production Shaping Forming Chipping cutting Chipless cutting Sintering process Foaming process Thixoforming process Calendering process Film production Extrusion process Forming with a mold Blow mold process Glass production process Permanent mold casting process Overmolding process Glass pane overmolding process Miscellaneous Bending process Pressing process Cold pressing, hot pressing Folding process Rolling process Rolling, cold rolling, hot rolling Forging process Caulking Deep drawing process Pull-through process Wire drawing Flanging process Rolling process Resin injection process Carbon fiber reinforced plastics, resin transfer molding Wet pressing process Carbon fiber reinforced plastics Draping process Carbon fiber reinforced plastics Tooth setting process, twisting of rods or molded parts (e.g. crankshaft) Twisting process Miscellaneous Cutting process Thread-cutting, deburring and cleaning processes Drilling process Technical cleanliness for blind holes Milling process Depanelization Turning process Honing process Grinding process Sawing process Deburring process Rotational turning process Miscellaneous Stamping process Tool wear influence Crushing process Depanelization Laser cutting process Electron beam cutting process Water jet cutting process Knife cutting process Miscellaneous Painting process Color and gloss level Heat treatment process Tempering, annealing, burning, baking Diffusion process Galvanizing

5 Surface treatment Lubricating Cleaning Assembling Set-up Programming the control unit Hardening process Irradiation, or hardening or irradiating (e.g. paint with UV) Flame treatment process Plastic production (e.g. preconditioning of surface) Coating process Powder-coating process Etching process Galvanization process Chroming, galvanizing Polishing process Flocking process Anodizing process Embossing process Leather embossing Preservation process Brake disc preservation, corrosion protection Shot peening process Miscellaneous Missing Insufficient Methodological error Miscellaneous Air cleaning process Laser cleaning process Plasma cleaning process Unclean bond pad surface Ultrasonic cleaning process Sandblasting process Water jet cleaning process Washing process Labels not removed Miscellaneous Assembly process Assembling of electronic component Depositing process or placement process Telescoping process Application process Mounting process Spring-assisted forming joining process Setting process Process sequence Positioning process of the component Orienting process of the component or position incorrect, imprecise, variation Miscellaneous Balancing process Adjustment process Adjusting headlights or sensor Teaching-in process Brake, clutch Miscellaneous Software version Incorrect version Coding process Incorrect parameterization Programming process Flash error, abort Miscellaneous Network Server

6 Infrastructure Testing Packaging Reworking Production software Production control system Power failure Conveyor technology Miscellaneous Incoming goods inspection Checking completeness, properties Alignment process and adjustment process Leakage test Inadequate method or process, test coverage insufficient Torque test Test equipment error Test process, in-circuit test, electrical characterization of the lithium-ion cell, open circuit voltage test after storage period and formation, and Electrical test metallic particles as impurities Electric component test Water test, slippage, insufficient test coverage, insufficient test depth, incorrect bin limits or bin classes Electric component final test Final test, slippage, insufficient test coverage, insufficient test depth, incorrect bin limits or bin classes Final test and function test High temperature test Hydraulic test Dimension check Position check Automatic visual check Laser scanning Manual visual check Reference sample faulty Pneumatic test Pre-measurement process Concentricity test Two-dimensional force measurement X-ray test Computer tomography Unbalance test Tire unbalance Thermal imaging test Hardness test Eddy current test Ultrasonic test Test marking Type plate Rheology test Test of the viscosity and dispersion of the substance applied as part of cell coating Humidity test Temperature test Miscellaneous Packaging missing Packaging incorrect Unsuitable packaging, e.g. does not comply with technical cleanliness Packaging faulty Marking and labeling Labeling Miscellaneous Reworking not permitted Reworking insufficient

7 Reworking Maintenance Component production process Reworking missing Miscellaneous Maintenance cycle Maintenance intervals too long Maintenance Maintenance incorrect, insufficient or not carried out Miscellaneous Single error chip production Defect density problems, single error, statistical error Systematic chip production error Process problem, batch problem, contamination Single error chip housing Contamination, damage during manual visual inspection, statistical error Systematic chip housing error Process problem, batch problem, contamination, equipment fault Passive components production process Miscellaneous Logistics Transport Packaging Marking and labeling Data exchange Loading process Mechanical damage because box falls down Transportation process Mechanical damage due to shifting in the truck Storage Environmental influences, e.g. rain, sun Delivery documents Missing, incorrect or incomplete delivery documents Miscellaneous Packaging size Packaging goods Porous film Packaging cleanliness Contaminated Packaging material Incorrect packaging material used for sea freight/air freight Packaging concept No ESD-safe packaging Specification not adhered to Miscellaneous Marking or label missing Marking or label cannot be read Marking or label incorrect Multiple markings Marking or label mixed up Right or left Marking or label pasted over Marking no longer clear (e.g. dangerous goods), marking covered Accompanying documents missing Variant mix-up, semi-finished products Scanning process Positioning incorrect Information carrier Radio frequency identification, data matrix code, bar code Miscellaneous Data Incorrect or no data Transfer Interrupted data transmission, delayed, too early, incomplete Miscellaneous OK according to analysis OK according to No Trouble Found process According to standard test According to "VDA volume Field Failure Analysis" According to load test According to "VDA volume Field Failure Analysis" Data collection and data analysis According to "VDA volume Field Failure Analysis" System test According to "VDA volume Field Failure Analysis" Process evaluation According to "VDA volume Field Failure Analysis" Contamination Particles, fluids

8 Failure cause unfamiliar or unknown Caused by customer Failure cause cannot be determined Damage or destruction Mechanical, thermal damage; assembly, disassembly, improper external intervention Logistics Marking, packaging, storage, transportation Handling Electrical application error, programming process, diagnosis Incorrect diagnosis and disassembly Diagnostics, guided troubleshooting, exchange of non-causative component Out of warranty Mileage exceeded Not in accordance with the contract Manipulation, chip tuning Electrical overstress EOS Electrical overstress EOS Electrostatic discharge ESD Electrostatic discharge ESD Miscellaneous Part lost during analysis Part destroyed during analysis Failure could be proven once, failure disappeared, e.g. pressuresensitive mat for seat occupancy detection shifted slightly and moved into Failure cannot be reproduced the correct position itself after loosening the screws Miscellaneous

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