Prime Technology Inc.(PTI), Engineering Capability

Transcription

1 Technology, Knowhow, Services & Market Segments With large-scale resources and the broadest capital in the Electronics Manufacturing Services (EMS) industry, Prime Technology (PTI) provides services from design through the entire life-cycle of the product that are vertically integrated and include end-to-end global supply chain services. As a leading service provider in this industry, PTI invests sufficient resources to offer the finest manufacturing processes that can be found in the industry. PTI s Manufacturing Competence: Advanced Micro-Optoelectronics Component Technology: Glued, Soldered and Flip Chip with die size of 0.5~ 50 mm CSP, BGA, CBGA, PBGA & CCGA, down to 140 micron pitch with 0.1mm of ball size Passive Discrete down to Featuring Comprehensive Manufacturing Services: Electronic Assembly Test & Validation System Integration Supply Chain Management Complete Device Assembly Traceability to building lot Process Design & Optimization After Sale Support Material Acquisition & Handling Electronic Miniaturization: Chip-on-Board Multi-Chip Flip-Chip Experience, Technology and Know-How from NPI PTI endeavors to be a practical realization of the product development process to launch new products and reduce the time to market window. With professional NPI and MSS systems for PWB design, testing and simulation, PTI offers services from product inception to turn-key manufacturing solutions with special focus on the following market segments: --1/6--

2 I. Microelectronics & Optoelectronics PTI specializes in high technology Electronic Manufacturing Services including Optoelectronics, Microelectronics and high mix, low to medium volume manufacturing for complex, high reliability products where quality and on time delivery are essential. It has fully equipped facilities for bare die placement, wire bonding, and integration of micro-assembled boards using COB, CSP and Flip Chip packaging technology, creating the infrastructure for the following applications: OE and OECB Optical Integration Optical Connect SiP Technology Sip Modules Advanced Micro-Opto/Electronics Component Technology: Glued, Soldered and Flip Chip with die size of 0.5~ 50 mm BGA, CSP, CBGA, CCGA, & PBGA down to 140 micron pitch with 0.1mm of ball size Passive Discrete down to Experiences in Advanced Optical Technologies: Hybrid optical/electrical assemblies and integration for Optical transport line cards Flip-Chip with Underfill, glob-top packaging and conformal/selective coating. Highly machine Cpk >1.41~1.67 of Underfill High precision integration on CFP Module Connector Plug (More than 100pin) and HDI board, less than 0.1in both and //, in line SMT and Reflow COB/die & wire bonding/discrete production and testing for high volume optical transceiver Precision assembly on 01005, CSP-BGA with 140 micron pitch with 0.1mm of ball size Precision Ribbon fiber cleaving, splicing, termination and polishing for lens array Lens/Array assembly / precision glue dispense SAN/FC/Ethernet switching assembly and test systems FTTH system assembly and test ICT/HALT/HASS / Lightwave / functional testing Traceability on components, boards and assembly --2/6--

3 II. Automotive Embedded System and Network Automotive electronics is a sub-system consisting mainly of semiconductor devices used to sense, compute and actuate the different features/functions in a vehicle. Many of the automotive innovations in sophisticated engine management and transmission control have been driven by powerful micro-controllers, semiconductor switches, sensors and actuators. The experience obtained from manufacturing automotive embedded systems and networks ranging from Electronics, Embedded Systems, Hardware & Mechanical Engineering and Project Management for automotive OEMs has helped PTI understand the importance of delivering value to the end customer for Automotive Embedded System & Network and Electronic Control Unit (ECU) technologies: Powertrain Engineering Body and Convenience Safety Infotainment Gateways Experiences in ECU Technologies: Optimum profile design for PowerPC MCU such as MPC-P/BGA reflow and wave-soldering Underfill Flip-Chip with high machine Cpk >1.41~1.67, glob-top packaging Ultrasonic sealing for moisture protection per IP69K ECU Gateway Analog CAN bus data conversion Telematic system integration of WiFi Router, GPS and surveillance --3/6--

4 III. Industrial Control & Management With in-depth experience in the assembly and testing of products applied in the Industrial Control & Management segment, PTI realizes that these products will operate in a variety of applications and be adapted for severe environmental conditions. The experience and discipline that PTI has learned and applied to Manufacturing Services, Process & Quality Control, Validation Test and Supply Chain Management all result in a seamless transition from product design to final manufacturing. Strict adherence to IPC Class 2 ensures that the products comply with the highest quality criterion. PTI is also equipped with extensive experience in testing Industrial Control & Management products from ICT to complete Functional Test and Environmental Stress Screening. Time-to-market and cost objectives are achieved through rigorous Project Scheduling, complemented by effective Project Management governing the following applications: Industrial Tablet and Panel PC Data Center Computer Wireless Air conditioning and humidity monitoring and control units Forced Electrical Controller Building Automation Controllers Machine-to-Machine Gateways Manufacturing Expertise & Experiences in Industrial Products: IP65 Rugged Tablet w/intel Cedar Trail Platform 3.5G or 4G LTE Seamless communication Wireless Force Electrical Controller for air-cond. ATM banking devices Precision component assembly Tape feeder for SMT production lines Flip-Chip with underfill, glob-top packaging Ultrasonic sealing for moisture protection per IP69K Boot loader add on to app program & fixture optimization Temperature sensing and setting --4/6--

5 IV. Computing & Communication PTI s core competences stem from a history of manufacturing Computing & Communication grade products for over 20 years. This experience was developed by learning then integrating the requirements of carriers and OEMs into all manufacturing process to continue pursuing excellence in product cost, functionality, and reliability. The plants in China specialized in manufacturing computing and telecommunications equipment. With this tradition and experience coupled with the latest high-end manufacturing facilities and testing equipment, PTI concentrates on manufacturing products in the following categories that demand guaranteed quality and reliability: SAN Switch / Tablet /Wireless Router Wireless CPE 1-10Gb/s Optical Port Product Experience: Desktop Tablet Server Blade Host Bus Adapter SAN Switch, L2/L3 Switch xdsl Router, Wireless Router FTTH Customer Premises Equipment Network Management System etc. Manufacturing Expertise & Experiences: Embedding System implementation, RF system & subsystem design Bluetooth / mesh-enabled WLAN products WLAN subsystems / Transmitting & Receiving modules Multipoint to multipoint routers Enclosure with effective sealant and connector & cabling Boot loader add on to app program & fixture optimization Dynamic CMTD Reliability Burn-In by connecting types of gigabit bus --5/6--

6 V. Marine and Navigation PTI is one of the leading EMS suppliers with operations in Taiwan and China, where manufacturing and related services are delivered to customers globally. It is recognized that quality constraints are extremely rigid in this market segment where special coating process and traceability are often required. Although product series and quantity are often limited and complex, PTI is equipped with project teams, flexibility and manufacturing expertise to manage such projects, enabling value added services implementation to global customers. In doing so, PTI has focused on manufacturing the following products: Vessel Domain Control Unit/Remote Control Unit/Digital Sonar Conformal Coating Product Experience: Autopilot Chart Plotter Monitor Display GPS Speed Log Voyage Data Recorder Vessel Domain Controller Manufacturing Expertise & Experiences: Embedding System implementation Precision component assembly Enclosure with effective sealant and marine connector & cabling Ultrasonic sealing for moisture protection per IP69K Boot loader add on to app program & fixture optimization Dynamic CMTD Reliability Burn-In by connecting types of gigabit bus --6/6--