PERFECT MARKS SHARP CUTS

Transcription

1 PERFECT MARKS SHARP CUTS SEMICONDUCTOR INDUSTRY LASER ROFIN WE THINK LASER

2 High-precision semicon applications High-speed marking on different compounds High-quality isolation cut on TFT L = 36,125 μm Leading Laser Solutions for the Semiconductor Industry Marking solutions for mobile devices Comprehensive Laser Selection Backed by many years of experience in laser material processing, ROFIN offers you a comprehensive product line for the semiconductor industry. Our portfolio ranges from laser sources to turn-key solutions for micro and marking applications such as LED processing, IC and wafer marking, leadframe marking, TFT cutting and IC decapping. Available laser technologies reach from efficient fiber lasers, to compact end-pumped and transversally pumped lasers with different wavelengths, to disc lasers. Working closely with our customers and partners, we have established considerable expertise in customer-specific solutions. Worldwide Customer Service ROFIN's first-class laser systems feature the company's own laser technology designed for low maintenance, cost-efficient and reliable operation. Whatever you require, whether beam sources or high-precision all-in-one solutions, you will find it at ROFIN. With worldwide sales and service network and experienced R&D, ROFIN has optimum, single-source solutions for a variety of semicon applications.

3 LED production processes Hybrid cutting of QFN Wafer ID Marking LCD Panel Diffusor LED Backlight Best Solutions for Well-Established and Upcoming Markets PCB marking A Standard in Semiconductor Manufacturing Laser marking and laser material processing are well established in various application fields in the semiconductor industry. In wafer production lasers are used for traceability marking and scribing. High-speed laser marking on mold compounds, metal housings or wafer backsides is an essential final production step for any semiconductor device. Applications besides marking include cutting of leadframes and deflashing as well as processing of compound materials, such as hybrid cutting of QFN packages and separation of irregular shaped multimedia cards. Indispensable for Efficient Production of LCD Panels Whether only a few centimeters big or screen sizes of over 50 inches hardly any electronic device can do without an LCD display these days. For the efficient production of TFT-LCD panels, rows and columns of the matrix are initially connected. In a later production step this connection must be cut with the laser accurately and absolutely reliably but with high speed as well. Reliable High Speed Marking LED Processing with Lasers LEDs are developing to one of the predominant light sources over the coming decades. Among the most promising application areas are the LED display backlight technology and high-power LEDs in the automotive and mobile phone industry. Laser marking is an essential step in manufacturing high-power LEDs as well as LEDs used for LCD panel backlighting. ROFIN's strengths are the real-time compensation of position tolerances which is indispensable for a reliable production process.

4 End-pumped Laser Beam Source Fiber Laser Marker Disc Laser Field-Tested Technology, Ready for 24/7 Production Laser marker / double head configuration Tried and Tested Laser Sources for Any Type of Application All ROFIN lasers feature compact design, low operational cost, high availability with low maintenance and easy integration with virtually any handling configuration. They use state-of-the-art laser technology, comprising diode end-pumped and side-pumped rod lasers as well as fiber and disc lasers and are available with different output powers. Depending on laser power, the systems are completely air-cooled or use air-to-water cooling. With wavelengths of 1064 nm, 532 nm and 355 nm, virtually any material used in semiconductor manufacturing such as mold compounds, silicon, epoxy, ceramics, etc. can be processed efficiently. Comprehensive Application Knowledge ROFIN offers a comprehensively equipped laser application lab. Customer applications and lab studies can be carried out with the assistance of experienced engineers. Practically all of ROFIN's marking systems are available for application trials. Based on characteristic application data, the material to be processed, the desired marking geometry and constraints of the process environment, ROFIN presents all possible laser concepts for consideration, with benefits and implications.

5 IC marking LED marking Traceability marking of wafers Marking Applications Waferlase ID 200 IC Marking ROFIN's laser markers generate characters at sizes precisely in accordance with the user's requirements. They still ensure best quality even at very small character sizes. Line widths are selectable with controlled material penetration depths. Integrated circuit packages mold compound, epoxy or ceramics can be processed with reliable and predictable results. For marking directly on silicon or PCB, the use of 532 nm lasers is essential. These dedicated solutions archive high contrast with excellent performance at small character heights. LED Marking Not only the automotive industry asks for complete traceability of every single high-power LED today. Fequency-doubled PowerLine lasers mark leadframes during the LED production process with minuscule 2D matrix codes. They also mark white ceramics used as substrate for LEDs, with very small character heights and line widths. Traceability Marking of Wafers Our Waferlase systems produce traceability markings on transparent, semitransparent and opaque wafer materials used for IC and high-power LED production. Two methods are used which differ in terms of process, depth and location of the mark. With the "hard" marking method, which produces durable marking even after a large number of etching and polishing steps, the dots have a depth of up to 90 micrometers and are created through material ablation. Debris-free marking, which is set for clean-room environments, is just 2.5 µm deep, and is achieved solely by melting of the silicon.

6 Package decapping Laser deflashing End-pumped laser marker Cutting Applications TFT Cutting The columns and rows of a TFT pixel matrix are activated using transparent indium tin oxide (ITO) conductive paths. For efficient production of TFT displays, a conductive connection must be established between the columns and rows of the matrix. In a later production step, the lasers will cut the ITO conductive paths with a fine line and at high speed. Cutting of μsd cards Separation of QFN Packages Separation of QFN packages is a challenge in the production process so far due to the need to cut a combination of soft and hard material. A new hybrid cutting technology, using the disc laser StarDisc and mechanical sawing, increases the production output significantly. The process is twice as fast and saw blade lifetime is quintupled. Cutting of Multimedia Cards Laser technology used for isolating of MMC cards is in particular beneficial in its environmental and cost aspects. Water jet cutting, commonly used for cutting compound plastic materials, requires substantial ecological efforts of purifiying cutting water which is polluted with abrasive particles. Deflashing Excess encapsulation material on unmolded surfaces can have serious negative impact on proper contacting or optimum thermal conduction. Laser deflashing systems use integrated pattern recognition to identify crucial areas and remove excess mold with a diode pumped solid state laser. Decapping Decapping is a precisely-controlled laser process which ablates layers of the molding compound and reveals the inner structures for failure analysis. Compared to chemical cauterizing or other procedures, the laser allows selective ablation of certain areas and removing of the compound underneath the wiring.

7 Specially designed Semicon objects software Semicon Software Functions Integration in Factory Control Systems Powerful and Simple to Use Software Easy Operation Each laser marker comes with a powerful, entirely customizable software package based on Windows XP. Text, logos or graphics can be created with drag-and-drop functions or imported from existing files. VisualLaserMarker (VLM) is a sophisticated "what you see is what you get" type software and offers the flexibility to be simple to use and yet powerful. VLM handles a wide variety of marking content e.g. matrix-codes, barcodes and serial numbers. Extremely small marks can be realized depending on the material. The software controls marking on flat and curved surfaces and even marking-on-the-fly applications. A built-in wizard provides a variety of templates and assists in setting up marking layout quickly. A preview function helps to check programming at a glance. Easy Integration VLM is able to fully integrate into any production software and is configured to handle all common communication protocols from (TCP/IP) to SEMI standards (SECS/GEM). VisualLaserMarker functions can be controlled through ActiveX technology giving the user full control of the entire laser process. Semicon Key Features Matrix Object (for easy setup of Tray and Strip models) JEDEC Tray and Leadframe database Device ID and BinCode Mapping 2D codes like datamatrix, QR code and various barcodes SECS-GEM /Remote Control XML Layout Import / Recipe Up & Download Autoteach Interface for Vision Inspection Status /Data Logging and Unit-Level-Tracking

8 LASER MICRO ROFIN-BAASEL Lasertech Medical Device Technology Flexible Packaging Semiconductor Jewelry Solar Power GmbH & Co. KG Petersbrunner Str. 1b Starnberg Phone +49(0) Fax: +49(0) LASER MACRO ROFIN-SINAR Laser GmbH Berzeliusstraße Hamburg Phone:+49(0) Fax: +49(0) SOLUTIONS FROM A SINGLE SOURCE LASER MARKING ROFIN-SINAR Laser GmbH Dieselstraße Bergkirchen/Günding Phone:+49(0) Fax: +49(0) info@rofin-muc.de Austria: Phone: +49-(0) sales@baasel.de Benelux: Phone: +31-(0) info@rofin-baasel.nl Canada: Phone: info-canada@rofin-inc.com China: Phone: +86-(0) info@rofin-baasel.com.cn France: Phone: +33-(0) info@rofin.fr Great Britain: Phone: +44-(0) info@rofin-baasel.co.uk Italy: Phone: info@rofin.it Japan: Phone: +81-(0) info@rofin-baasel.co.jp Singapore: Phone: reception@rofin-baasel.com.sg South Korea: Phone: +82-(0) info@rofin-baasel.co.kr Spain: Phone: info@rofin-es.com Switzerland: Phone: +41-(0) info@rofin-baasel.ch ROFIN-SINAR/SEMICON/09.10/E/0.5/V2.0/ROBI-ORTMANN/LUXARTSILK200 WE THINK LASER Taiwan: Phone: +886-(0) info@rofin-baasel.com.tw USA: Phone: info@rofin-baasel.com