SMB/6282/R STRATEGIC BUSINESS PLAN (SBP) TC 119 Korea The title of the technical committee 119 is Printed Electronics.

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1 SMB/6282/R STRATEGIC BUSINESS PLAN (SBP) IEC/TC OR SC: SECRETARIAT: DATE: TC 119 Krea Please ensure this frm is annexed t the Reprt t the Standardizatin Management Bard if it has been prepared during a meeting, r sent t the Central Office prmptly after its cntents have been agreed by the cmmittee. A. STATE TITLE AND SCOPE OF TC The title f the technical cmmittee 119 is Printed Electrnics. The scpe f TC 119 is the standardizatin f terminlgy, materials, prcesses, equipment, prducts and health/safety/envirnment in the field f printed electrnics Due t the trend twards a glbalised, technical and cnnected sciety there is a rising demand fr a new breed f technlgies enabling lw-priced, flexible and new-cncept prducts. Sme cnventinal technlgies (including silicn based micrelectrnics) have reached their limits due t their high fabricatin csts and envirnmental issues. Armed with new printing technlgies (including screen, gravure, reverse gravure, flex, ffset, ink jet, etc.) and innvative materials, printed electrnics has recently emerged as a prmising envirnmentally friendly alternative rute t prduce electrnic/display/energy prducts at a lw cst and with new pssibilities f such creative technlgies as flexible electrnics. Currently this technlgy is ready t be applied t the manufacture f items such as phtvltaic devices, signage, RFID, batteries, lighting devices, etc., where cst, flexibility and recycling are very critical issues. Recently printing technlgies in cmbinatin with ther electrnics technlgies frm hybrid systems which shwed prmising market ptential in areas such as wearable smart devices. Fr successful industrializatin f this technlgy, reliability and repeatability in equipment and prcesses shuld be prvided under glbal standardizatin. Standardizatin needs in printed electrnics had been discussed wrld-widely in academic scieties and industrial scieties since Hwever, a practical mvement was initiated by Krean prpsal t frm a new TC under the IEC in June The SMB in IEC decided t establish a new technical cmmittee fr the field f printed electrnics, TC 119, and appinted the Republic f Krea as the secretariat cuntry in Octber Currently the TC has 13 P-members and 7 O-members. B. MANAGEMENT STRUCTURE OF THE TC Since printed electrnics is still evlving and expanding vigrusly, the structure f the TC is preferred t be flexible s as t effectively fllw the rapid change but nt cnstrain it. Careful cnsideratin f the results f several discussins in early Plenary Meetings made a decisin that the WG structure shuld cver the fllwing essential areas: terminlgy, materials, equipment, printability, printed prducts, and quality assurance. In the 7th Plenary Meeting duratin held in Manchester, GB n , this SBP dcument was revised with mdificatins r cnfirmed with changes t the scpes f AG, WGs and AHG as fllw. AG1 (Advisry Grup) The scpe was changed t remve the secndary bjectives. It nw reads as fllws. The Scpe f TC 119 Liaisn strategy and cnflict management 9 / 15 SMB/6282/R

2 Maintenance f the Strategic Business Plan WG1 (Terminlgy) T prduce terminlgy definitins fr the field f printed electrnics WG2 (Materials) T develp measuring methds and evaluatin methds fr materials such as substrates, inks and related materials fr printed electrnics T analyse the effectiveness f the existing methds specific t the materials f printed electrnics T define specific terms and t determine assessments, requirements, and specificatins fr materials f printed electrnics WG3 (Equipment) Standardizatin fr printing, cating, ther related equipment, tls, sub-units and parts, used fr the manufacture and evaluatin f printed electrnics. WG4 (Printability) The measurements r requirements f bth the qualities f printed patterns and the reprducibility f printing designs as the result f interactin f printing media, inks, substrates, and envirnmental cnditins. Cncerning prcess cnditins fr sme specific prducts, they wuld be discussed at sectinal specificatin r blank detail specificatin. Printing media includes the parts invlved in printing prcess such as plate, cliché, blanket, nzzle, etc, excluding inks and substrate. WG5 (Quality assessment) The wrk prcess in this grup will generate test methds and prcedures fr the measurement f specified prduct parameters, fr lifetime assessment and fr reliability testing and stressing f printed and/r flexible electrnics cmpnents and prducts AhG8 (Radmap) T cllect radmaps frm the WGs and distribute them T get inputs frm technlgy and market radmaps, R&D prjects, cnsrtia and cllate fr value t TC 119 C. BUSINESS ENVIRONMENT The 21st century glbal sciety demands that any new technlgy gives due cnsideratin t envirnmental as well as ecnmic factrs. This creates an incentive fr alternatives t cnventinal silicn technlgy based n phtlithgraphy and creates an pprtunity fr printed electrnics t manufacture devices with high vlume capability, high efficiency, lw cst and high perfrmance. Owing t this innvative methd, the cmmercializatin f ubiquitus electrnics such as phtvltaics, RFID, signage, etc. is being accelerated. Furthermre, devices with a new cncept such as large area flexible displays culd be intrduced t the glbal market within the next few years. Besides the efficiency frm an engineering view pint, there is anther advantage in this technlgy in terms f eclgical aspect. Industrializatin f this field is nw acknwledged by several cuntries including Krea, Japan, Germany, USA, UK etc. In the case f Krea, the rganizatin fr printed electrnics named KPEA was funded in 2010 in rder t prmte its industrializatin. Current market size fr printed and ptentially printed electrnics including rganic, inrganic, and cmpsites frm IDTechEx reprt in 2015 is $29.80 billin in It is expected t be grwn up 10 / 15 SMB/6282/R

3 t $54.19 billin in Market segmentatin is presented in the Figure 1. Figure 1. Market frecast by cmpnent type fr 2015~2025 in US $ billins, fr printed and ptentially printed electrnics including rganic, inrganic, and cmpsites. [Surce: IDTechEx (2015), There are mre than 3000 cmpanies related t printed electrnics. In Figures 2 (a) and (b), the distributin f these cmpanies is presented in terms f regin and technical field, respectively. Figure 2 (a) Distributin f the related cmpanies (Regin) 11 / 15 SMB/6282/R

4 Figure 2 (b) Distributin f the related cmpanies (Prduct) D. MARKET DEMAND As described in the previus sectin mre than 3000 cmpanies are primary custmers fr the internatinal standards which will be prduced by TC 119. Since this technlgy is ready t industrialize and facilitate ubiquitus electrnics, it is agreed that nly standardizatin can reduce the initial cst fr this industrializatin and guide effective directin s as t stabilize and expand this market. Fr example, the need fr standardizatin was expressed by academic and industrial delegates at Internatinal Cnferences such as ICFPE in The prpsal t establish a standardizatin bdy fr the printed electrnics was presented at Printed Electrnics Eurpe 2011 and the agreement n this prpsal was made amng participants frm many cuntries. The prpsal indicated the IEC as the mst suitable place fr the printed electrnics since the technlgy intends t develp mainly electrnic and electric devices fr the glbal sciety. Als there was n bjectin frm any cuntry n the IEC scheme. IEC TC110 (Title : Electrnic Display Devices) started t cver nly a flexible display panel, nly a small part f standardizatin issues which are related t the areas f the printed electrnics. IEC TC 119 will cver entire fields in ubiquitus electrnics where new cncepts f technlgy including materials, equipment, parts, prcesses, etc. are highly demanded. E. TRENDS IN TECHNOLOGY AND IN THE MARKET As a technlgy trend, there are many printing techniques t be cnsidered in fabricating electrnic devices such as flex, ffset, inkjet, gravure, screen printing, etc where rll t rll, rll t sheet r sheet t sheet web transfer methds are utilized. Each printing technique fr electrnics fabricatin has been develped ver the previus decades. As a result, they are ready t be applied t the practical prductin f ubiquitus electrnics. Fr example, there were many cre technlgies develped fr rll-t-rll (R2R) printing methds such as substrate handling, ink transfer, register cntrl, fast curing under lwer temperature, and nncntact transprtatin. These cre technlgies had been develped ver the last ten years. Integratin f the cre technlgies are cmpleted s as t guarantee the high perfrmance f devices fabricated by R2R printing. The target devices include lw cst dispsable and flexible slar cells, flexible batteries, large area display, RFID, NFC and sensrs fr ubiquitus electrnics and wearable electrnics. Reliability and reprducibility shuld be a majr cnsideratin in rder t successfully bring these prducts t market. Hwever, reliability and reprducibility are nt nly an equipment issue, but mre cmplex issues exist between materials, prcess and equipment. That is why unlike ther TCs in IEC r ISO, the standardizatin in printed electrnics, TC 119, requires cmbinatrial standardizatin in materials, prcesses, equipment and devices. This standardizatin is urgently necessary t lead printed electrnics t successful cmmercializatin Fr market s pint f view there are lts f advantages when this technlgy is applied t the electrnic and electrical industry. It enables us t fabricate massive scale prducts with high thrughput and extremely lw cst. Accrdingly the current silicn technlgy based n phtlithgraphy shuld be replaced by printing technlgy in the field f ubiquitus electrnics. The expected grwth f the market is listed in the Figure 1. The technlgy fcus has nw shifted t applying these techniques t fabricate real devices frm develping cre technlgies. TC 119 will fcus n supprting the strategy and rad map reflecting the ubiquitus electrnic market trends. Hence the internatinal standards published by the TC 119 will pen the related market 12 / 15 SMB/6282/R

5 and industry. F. SYSTEM APPROACH ASPECTS (REFERENCE - AC/33/2013) Printed electrnics has emerged frm cnventinal electrnics by reshaping and empwering them with printing technlgies. The success f this field hinges n hw effectively the leaders f the field team up with cunterparts f pre-existing electrnics industries. Thus, it is critical t carry ut standardizatin activities in clse cllabratin with ther pre-existing TCs by using the fllwing strategy. Identifying all ptential areas that require cllabratin and prepare a systematic apprach plan (as shwn belw) that shws hw each area f TC 119 needs cperatin with ther TCs r academic/industrial rganizatin. Building a supprt netwrk by establishing liaisns with ther TCs r cnjunctins with ther academic r industrial rganizatins. Established liaisns with fllwing TCs : TC47, TC 47/SC 47F, TC91, TC110, TC113 Established liaisn with fllwing rganizatin via D categry : IPC Cnsidering liaisn with fllwing TCs : TC21, TC34, TC40, TC56, TC82, ISO TC61, and ISO TC130 G. CONFORMITY ASSESSMENT TC 119 des nt currently have any publicatins used fr IEC cnfrmity assessment system. H. HORIZONTAL ISSUES TC 119 des nt currently have any hrizntal issues. I. 3-5 YEAR PROJECTED STRATEGIC OBJECTIVES, ACTIONS, TARGET DATES STRATEGIC OBJECTIVES 3-5 YEARS (Wrking Grup 1) Prduce terminlgy standards fr printed electrnics ACTIONS TO SUPPORT THE STRATEGIC OBJECTIVES A wrk item is already in prgress IEC The maintenance wrks f the basic items f materials standards (IEC and 202) have started. Standard fr paper substrates will be cmpleted as IEC AMD TARGET DATE(S) TO COMPLETE THE ACTIONS (Wrking Grup 2) Prduce material standards t bst the PE industry. Fur wrk items f the functinal inks as cnductive inks, semicnductr inks, and insulatr inks are already in prgress. IEC , 5~7 and IEC , IEC Based n the TR (Material technlgies required in printed electrnics fr wearable smart devices), new wrk items related with stretchable / 15 SMB/6282/R

6 materials technlgy are already in prgress. IEC ; IEC Tw wrk items fr measurement f critical dimensins f flat plate master are published IEC and IEC (Wrking Grup 3) Establishment f standards fr printing equipment, used fr the manufacture and evaluatin f printed electrnics We have three wrk items fr inkjet head. One wrk item is published and anther wrk item is already in prgress, and the ther ne is under preparatin IEC and IEC (Wrking Grup 4) Establishment f measurement methd and reprducibility requirements f qualities in printed patterns (Wrking Grup 5) Reliability fr mechanical/ envirnmental testing fr printed and/r devices The wrk item f Web size fr printing equipment is already in prgress. A wrk item f measurement f edge waviness is already in prgress IEC A wrk item f basic patterns fr evaluatin f printing machine is already in prgress IEC A wrk item f measurement f vids is already in prgress IEC A wrk item fr Flexible primary and secndary batteries is in prgress IEC A wrk item fr Flexible OLED elements has been cmpleted IEC Wrk item in prgress: Cmbined reliability fr flexible OLEDs elements IEC Wrk item in prgress: Printed TFT channel prperties IEC Wrk item in prgress: TFT band gap measurements IEC IS IS 2017 CD FDIS 2019 IS CD 2017 CDV FDIS IS 2019 PWI 2017 NP CD 2019 FDIS 2020 IS / 15 SMB/6282/R

7 Wrk item in prgress: Rll-t-rll printed TFT matrix IEC Wrk item in prgress: Printed flexible gas sensrs IEC Wrk item in prgress: Flexible & Transparent Electrdes NP CD 2019 FDIS 2020 IS 2021 CD FDIS 2019 IS 2020 PWI 2017, NP, CD 2019, FDIS 2020, IS 2021 Wrk item in prgress: Printed film heater Planned wrk item: Cmbined mechanical and thermal testing framewrk Planned wrk item: Printed actuatrs Planned wrk item: Printed smart tags Planned wrk item: Sensr systems PWI 2017, NP, CD 2019, FDIS 2020, IS 2021 PWI PWI PWI 2019 PWI 2019 Nte: The prgress n the actins shuld be reprted in the RSMB. 15 / 15 SMB/6282/R