Cleaning Before Coating. Presented by Jigar Patel, Senior Process Engineer
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1 Cleaning Before Coating Presented by Jigar Patel, Senior Process Engineer
2 Cleaning Before Coating Influencing factors Failure mechanisms Coating failures Cleaning before coating Analytics and test methods
3 Influencing Factors Mechanical Thermal Chemical Electrical
4 Influencing Factors Temperature Atmospheric change Vibrations Migration Humidity Corrosive gas Corrosion Salt spray
5 Industry Trends Trend Larger components Low component densities High standoff spaces Simple component types Miniaturized components High component densities Low standoff spaces <1mil Complex component types
6 Advantages of Coating Coating protects against failures due to humidity: Electrochemical migration Leakage current Signal distortion on high-frequency circuits
7 Possible Contamination Manufacturing of PCBs Manufacturing of Components Assembly Residues from acid processes Developer chemistry Alkaline cleaner HAL-Residues Residues of ENiG-/ CSN-Process Rinse water quality Residues from metallization baths Rinse water quality Deflashing Chemicals Mold release agent Flux residues Solder pastes Wave soldering Rinse water quality Reflow soldering Reflow condensates Gas emission Hand perspiration etc.
8 Critical Residues Resin or rosin Activator organic or inorganic Solvent (dilution) Thixotropic agent Fluxes/pastes Contamination due to handling i.e. Fingerprints, dust, oil, salts
9 Cleaning Before Coating Influencing factors Failure mechanisms Coating failures Cleaning before coating Analytics and test methods
10 Climatic Failure Mechanisms Electrochemical Migration Leakage current Signal distortion on high-frequency circuits
11 Climatic Failure Mechanisms Dendrite growth between solder joints
12 Electrochemical Migration Influence factor: Moisture Influence factor: Humidity Material factor: Fluxes
13 Electrochemical Migration Influence factor: Condensation Influence factor: Stress voltage Influence factor: Humidity Vapor/Humidity + Ionic contamination (salts, flux activators) = Conductive electrolytes + Stress voltage = Electrochemical migration VCC Material factor: Fluxes Ground
14 Reaction rate Electrode potential E Dissociation of Water and Tin Corrosion OH - alkalinity 2,0 V 1,5 SnO 2 H 2 O Passivity 1,0 Corrosion 0,5 Sn 4 + Sn ,5 Sn 2 + Sn0 Passivity Sn0 2 3 Corrosion HSn0 2-1,0 Sn Immunity SnH 4 Corrosion -1, ph-value
15 Mechanisms of Dendrite Growth Metal-ions Me Me n+ + ne* Dissolving Anode PCB Cathode V Ion migration Me Me n+ + ne* ne* + Me n+ Me Anode PCB Cathode Deposition Me Me n+ + ne* ne* + Me n+ Me Anode PCB Cathode
16 Dendrite Growth Lead free/ag containing solder pastes tend to build up short-lived dendrites Electrochemical migration Proven by continuous resistance measurement
17 Climatic Failure Mechanisms Electrochemical migration Leakage current Signal distortion on high frequency circuits
18 Leakage Current Optically clean FR4 surface Loading contrast of optical invisible, conductive contaminations (SEM)
19 Activator Residues High Non-critical Danger of leakage current under conformal coating
20 Activator Residues Coating Resin layer Flux indicator After soldering Cracks After climate change Important: no humidity, only temperature change day/night Activators influence leakage current and climate safety
21 Climatic Failure Mechanisms Electrochemical migration Leakage current Signal distortion on high frequency circuits
22 Influence of Geometry on the Complex Resistance Conventional contact connections HF contact connection Inductance Capacity
23 Bit Failures in HF Connections Signal 1 Cleaned PCB no transmission failure 0 Time Signal 1 Dielectricity of the rosin/resin disturbs transmission Bit failure 0 Time
24 Cleaning Before Coating Influencing factors Failure mechanisms Coating failures Cleaning before coating Analytics and test methods
25 Coating Failures Blister type failure Electrochemical migration underneath protective coating
26 Coating Failures Wetting failures under components Pore formation and delamination
27 Coating Failures Cracks due to temperature change and reaction of coating with resin
28 Water vapor permeability, standardized [g / m 2 x h] Water Vapor Permeability PU-coating AY-coating Wax coating C 30 C 40 C 50 C 60 C 70 C 80 C 68 F 86 F 104 F 122 F 140 F 158 F 176 F Temperature
29 Influences on Uncleaned Substrates Contamination Contamination reduces adhesive forces and leads to delamination
30 Residues Consequences Resin based residues as part of the flux Flux activators Organic tin-salts (reaction product from flux and solder paste) Sulphur and ammonium compounds (can be contained in fluxes) Chemical facilitators for component release Oligomeric parts of substrates and solder mask interaction Subsequent delamination when exposed to climatic changes Cracks in coatings Failures in HF connections Hygroscopic danger of failure Corrosion on connections Leakage currents Insufficient adhesion and creeping underneath coatings Insufficient adhesion and creeping underneath coatings Impacts wetting properties Delamination possible Contamination film Similar effect as with chemical facilitators
31 Surface Tension and Cleaning Higher surface tension = better coating adhesion
32 Cleaning Before Coating Contamination under coating is hygroscopic Limited adhesion on un-cleaned PCB Coating alone is inadequate because of vapor permeability (even worse than cleaning without coating) Coating is applied to increase climatic reliability Reliable coatings require cleaning confirmed by coating suppliers
33 Cleaning Before Coating Influencing factors Failure mechanisms Coating failures Cleaning before coating Analytics and test methods
34 Stages of Flux Removal Partially removed residues Almost removed residues LESS CRITICAL! Partially attacked residues CRITICAL!!! Flux Residues completely removed TARGET!
35 Cleaning Before Coating H 2 O Aqueous cleaning Spray-in-air Ultrasonic Spray-under- immersion Semiaqueous Cleaning Ultrasonic Spray-under-immersion
36 Aqueous Spray-in-Air High Pressure Inline Process Process characteristics: Medium to high throughput Spray pressure psi Dosage Station Pre- Wash Wash Chemical Isolation Rinse Final Rinse Dryer Dryer Pre- Wash Wash Chemical Isolation Rinse Final Rinse Dryer Dryer Treatment system Treatment system
37 Aqueous Spray-in-Air Batch Process Process characteristics: For low to medium throughput Spray pressure < psi Small footprint Rinsing 1 with tap water Rinsing 2 with DI-water Chamber tank Heating Tank for cleaning agent
38 Cleaning Before Conformal Coating Influencing factors Failure mechanisms Coating failures Cleaning before coating Analytics and test methods
39 Requirements for Coating Evaluation of cleanliness (prior to coating): Test Required value Ionic contamination < 0.4 µg/cm 2 Surface tension > 40 mn/m ZESTRON Flux Test Residue-free ZESTRON Resin Test Residue-free
40 Test Method Ionic Contamination Measurement using an ionic contamination meter
41 Test Method Ionic Contamination Process schematic Measuring cell VE - H IPA Pump PCB Regeneration
42 Wettability and Surface Cleanliness Bad wetting= unclean surface Testing method ink test Good wetting= clean surface
43 Activator Analysis Application Rinsing Drying
44 Samples of Results after Flux Test Resin residues do not become colored No encapsulation of activators in the resin
45 Resin Analysis Approval of synthetic and natural resins Shows local dispersion Based on color reaction
46 Samples of Results after Resin Test Before After Resin residues are colored
47 Test Method Tin Test Evidence of stannous components Based on color reaction Tin test negative Tin test positive
48 Coating Approval Coating Test Climatic Reliability Coating Reliability Test
49 Climatic Reliability Ag-containing solder pastes have a tendency to illustrate temporary dendrites Test according to IEC Ca 40 C, 93% RF, 21 days
50 Coating Analsysis + 1kOhm Gas development at defects Coating Reliability Test (CoReTest)
51 Advantages of the Coating Reliability Tests Weak point analysis (Coating Reliability Test) Life expectancy test (for example IEC 68-2 Standard) + During development - After development (type approval) + Fast (max. 10 hrs) - Time consuming (about 6 months) + Low costs - High costs + Identification of all weak points - Failures could remain undiscovered - Pseudo failure rate +No pseudo failure rate
52 Conclusion Coating neccessary due to moisture / condensation Residues harm the coating Simple test methods for Q-analysis available Cleaning increases reliability of coating Different cleaning processes are available
53 Cleaning Before Coating Presented by Jigar Patel, Senior Process Engineer
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