Passive components : 5 years failure analysis feedback From all markets

Transcription

1 2 nd SPCD October 2016 Passive components : 5 years failure analysis feedback From all markets Eric ZAIA (Material Engineer) Béatrice MOREAU (Passive components & PCB dpt. Manager)

2 SUMMARY 1 Introduction SERMA Technologies 2 Facts & Figures on Failure Analysis (FA) Statistics about Passive FA Main defects observed on Passive Components Ceramic capacitors Ta capacitors Thick + Thin films Resistors 2

3 1- Introduction 3

4 Information Technology Security SERMA Technologies From Serma Group Audits & Consulting TECHNOLOGY & PROCESSES Energy Storage Devices Physical Expertise Two labs: - Pessac - Grenoble Electrical Testing The most important independent electronic laboratory in Europe 4

5 Physical Expertise Main markets (by Turnover) ELECTRONIC INDUSTRY 6,5% AUTOMOTIVE 5,2% RAILWAY 4,8% SEMICONDUCTOR 4,0% MEDICAL 2.7% SPACE 31,7% ENERGY 19,4% AVIONICS 25,2% 5

6 : analyses in Serma s Lab Physical Expertise Type of analysis (by quantity) Assembly (Solder/Coating inspection) 7% PCB/Board (FA+CA+Q+CP) 11% Physical analysis (SEM/ionic contamination/ ) 17% Actives (FA+CA) 14% Passives (FA+CA) 8% Broker/Lot inspection 13% DPA (Actives+Passives) 30% 6

7 SERMA Technologies Physical expertise A WIDE RANGE OF TECHNIQUES Non Destructives: Optical microscopes 2D & 3D X-Ray Electrical Tests Micro-probing X-Ray Fluorescence IR Thermography Acoustic microscopy Emission Microscopy Destructives: Cross section Laser Cutter Chemical etch and plasma dry etch SEM with EDX system Focused ion Beam imaging 3D Slice & View Transmission Electron Microscopy 7

8 2- Facts & Figures on FA 8

9 EXPERIENCE CAPITALIZATION 2009: Creation of a Data base Fulfillment of a Key Words Sheet after each analysis 9

10 FAILURE ANALYSES Type of component (by quantity) : failure analyses on passive components Other (filters, quartz, cables, ) 27% Ceramic capacitors 19% Ta capacitors 8% Connectors 10% Relays 10% Selfs + Transformer 10% Resistors 13% Film capacitors 3% 10

11 Ceramic Capacitors Main Defects 60% 50% 40% 30% 20% 10% 0% 11

12 Ceramic Capacitors Cracks Solder PCB Diagonal cracks ) due to Thermo and/or Mechanical stresses caused by soldering/testing/depanelization/handling Short circuit occurs when dielectric between opposite electrodes is cracked

13 Ceramic Capacitors Main Defects Qty= % 50% 40% 30% 20% 10% 0% 13

14 Ceramic Capacitors Delamination: Electrode/Ceramic Delamination relative to the component process: Part lamination/sintering Results in insulation reduction up to Short circuit 14

15 Ceramic Capacitors Delamination Electrodes/Termination Soldering process + Component Weakness (at termination) Revealed after ageing test results in loss of capacitance up to Open circuit UV light 15

16 Ceramic Capacitors Main Defects 60% 50% 40% 30% 20% 10% 0% 16

17 Ceramic Capacitors Migration Failure occurred during Environmental tests: Moisture and contaminant (Cl,..) leading to Silver dendritic growth Short circuit

18 Ceramic Capacitors Main Defects 60% 50% 40% 30% 20% 10% 0% 18

19 Ceramic Capacitors Porosity SAM - Component quality - Ceramic preparation issue or organic/inorganic contamination Insulation reduction up to short circuit

20 Particular Technique Voltage contrast coupled SEM Presence of a short circuit on a ceramic capacitor, Infra red thermography confirmed the presence of the Short Cross section showed the presence of specific phases Conductive or not? 20

21 Classical SEM view (Chemical contrast) 21

22 Classical SEM view (Chemical contrast) 22

23 SEM view (Voltage contrast) 23

24 SEM view (Voltage contrast) 24

25 Tantalum Capacitors Main Defects 40% 35% 30% 25% 20% 15% 10% 5% 0% 25

26 Tantalum Capacitor MnO2 deposition Heat affected area Ta MnO 2 Ag - Component quality - MnO2 layer thin and inhomogeneous - Ag penetration Local ESR reduced Overheating until short circuit 26

27 Tantalum Capacitors Main Defects 40% 35% 30% 25% 20% 15% 10% 5% 0% 27

28 Tantalum Capacitors Delamination Delamination due to component quality or assembly process ESR increase up to thermal runaway 28

29 SMT Resistors (Thick+Thin film) Main defects 30% 25% 20% 15% 10% 5% 0% 29

30 SMT Resistors (Thin film) Corrosion Oxidation of the resistive layer in presence of humidity Resistance increases up to open circuit 30

31 SMT Resistors (Thick+Thin film) Main defects 30% 25% 20% 15% 10% 5% 0% 31

32 SMT Resistors (Thick film) Corrosion (sulfuration) Ag2S No continuity of Ag layer Environment: Sulfur attack of silver occurs at the interface of the glass passivation layer and the resistor termination Open circuit 32

33 Headquarters in Pessac Thank you SERMA TECHNOLOGIES 14, Rue Galilée PESSAC cedex FRANCE Main Phone: +33 (0) serma-technologies.com 33