"Thin Film Technology" "Physics of Thin Films"

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2 "Thin Film Technology" "Physics of Thin Films" Contents: Preface 1. Introduction 1.1. General 1.2. History 1.3. Definition of Terms 1.4. Applications of Thin Film Technology 1.5. Deposition Methods - Overview 1.6. Coating Thickness and Deposition Rates 2. Deposition Methods 2.1. PVD (Physical Vapor Deposition) Evaporation Introduction Fundamentals of Evaporation Evaporation Sources Evaporation Materials Special Evaporation Methods Sputtering Introduction Fundamentals of Sputtering Practical Aspects of Sputtering Ion Plating Introduction Influence of Particle Bombardement on Interface - and Film Properties Practical Aspects of Ion Plating 2.2. CVD (Chemical Vapour Deposition) PACVD (Plasma Assisted Chemical Vapour Deposition) Introduction Practical Aspects of PACVD "Thin Film Technology/Physics of Thin Films" I

3 2.3. Other Coating Methods Plasma Polymerization Electrochemical and Chemical Deposition Introduction Fundamentals of Galvanics Practical Aspects Applications Fundamentals of Anodization Fundamentals of Chemical-Reductive Deposition Thermal Spraying Introduction Practical Aspects of Thermal Spraying Applications Build up Welding and Plating Introduction Practical Aspects Melt Dipping Emulsions and Pastes 3. Condensation and Thin Film Growth 3.1. Introduction 3.2. Theory Elementary Processes at Surfaces Condensation Regimes Complete Condensation Incomplete Condensation Nucleation General Considerations Droplet Model Particle Model Film Growth Growth Modes 3.3. Advanced Concepts of Thin Film Formation Rate Equations Kinetic Monte-Carlo-Simulations: Local Effects and Surface Defects Concluding Remarks " Thin Film Technology/Physics of Thin Films " II

4 4. Properties and Characterization of Thin Films 4.1. Film Thickness Introduction Gravimetric Methods General Weighing Quartz Oscillator Method Microbalance Dosed Mass Supply Optical Methods General Photometer Method Tolansky Interferometer FECO Method Other Optical Methods Direct Methods General Stylus Method Optical and Electron Microscopy for Thickness Measurement Film Thickness Measurement by Electrical or Magnetic Quantities Resistance Method Capacitance Method Eddy Current Method Magnetic Method Thickness Measurement by Interaction with Particles Evaporation Rate Monitor Other Methods 4.2. Roughness Introduction Types of Roughness Stochastic Roughness Self Affine Surfaces Pore Formation and non "Solid-on-Solid"-Surfaces Waviness and defined Structures Roughness Measurement Stylus or Probe Methods Optical Methods und Scattering Roughness Quantification Global Quantities Correlation Functions Methods Based on Fourier Analysis " Thin Film Technology/Physics of Thin Films " III

5 4.3. Mechanical Properties Introduction Structure Zone Models General Model of Movchan und Demchishin Thornton-Model Incorporation of Foreign Atoms Stresses General Stress Measurement Adhesion General Interface between Substrate and Coating Substrate Pre Treatment Adhesion Measurement Friction and Wear Ductility Hardness General Micro Hardness Measurement 4.4. Electrical Properties Introduction Definition and Measurement Theoretical Fundamentals Conductivity of Continous Thin Films Conductivity of Discontinuous Thin Films Practical Aspects General NiCr-Thin Film Resistors Cermet Thin Film Resistors Semiconductor Films Magnetic Thin Films " Thin Film Technology/Physics of Thin Films " IV

6 4.5. Optical Properties Introduction Theory Fresnel's Equations Anti Reflection Coatings Single Layer Double Layer Multilayer Coatings Reflection Enhancement Metal Mirrors Dielectric Mirrors - Multilayer Systems Filters Fabry-Perot-Filter Edge Filter Characterization of Optical Coatings General Characterization Methods 4.6. Chemical Composition Introduction Electron Probe Microanalysis (EPM) Auger Electron Spectroscopy (AES) Photo Electron Spectroscopy (UPS, XPS) Secondary Ion Mass Spectroscopy (SIMS) Secondary Neutral Mass Spectroscopy (SNMS) Ion Scattering Spectroscopy (ISS) Rutherford Backscatter Spectroscopy (RBS) " Thin Film Technology/Physics of Thin Films " V

7 Preface: The present Volume of Lecture notes is based on the Lecture "Physics and Technology of Thin Films". The basic version was authored by Dr. Anton Bergauer in Starting 2000 Lhe lecture notes were regularily updated by Dr. Christoph Eisenmenger-Sittner. In 2006 the four hour lecture "Physics and Technology of Thin Films" was devided into two two hour lectures, "Thin Film Technology", LVA and "Physics of Thin Films", LVA Together, both lectures comprise the topics of the present script. Within the script the contents of the two lectures are cab be distibguished by different fonts. Contents which concern LVA , " Thin Film Technology " are written in "Areal" font. The lecture deals with the most important technologies of thin film deposition from the vapor and the liquid phase as well as the most common methods of thin film characterization in respect to e. g. thickness, mechanical, electrical and optical properties. Also the most important applications of thin films are discussed. The lecture specifically aims at bachelor students and does not comprise a deeper analysis of the methods discussed. Contents which concern LVA , "Physics of Thin Films" betreffen, are written in "Areal italic" font. The topics of this lecture are the basic physical principles of thin film deposition and thin film formation. The physical principles of vacuum technology, the emission of atoms from the solid phase by thermal or mechanical processes and the elementary steps of film condensation from the vapor phase are discussed. Additionally, the reasons why the mechanical, electronical and optical properties of thin films differ from the theree dimensional bulk are elucidated. The lecture aims at master students and therefore requires knowledge about certain advanced mathematical and physical methods and concepts as e. g. distribution functions, transport theory and thermodynamics. Contents which are treated in both lectures (of course this part was reduced to the maximum, but could not completely be avoided) finally are written in the "Times New Roman" font. " Thin Film Technology/Physics of Thin Films " VI

Metallization deposition and etching. Material mainly taken from Campbell, UCCS

Metallization deposition and etching Material mainly taken from Campbell, UCCS Application Metallization is back-end processing Metals used are aluminum and copper Mainly involves deposition and etching,