Nano-Scale Manufacturing:

Transcription

1 The Second U.S.-Korea Forum on Nanotechnology: Nanomanufacturing Research and Education Nano-Scale Manufacturing: Top-down, Bottom-up and System Engineering Cheng Sun, Xiang Zhang Center of Scalable and Integrated Nanomanufacturing (SINAM) University of California, Berkeley Los Angeles, CA February 17-18, 2005 NSF Nanoscale Science and Engineering Center (NSEC)

2 Future Integrated Nano-Systems Ultra Compact light source & integrated photonics 3D Terabit Memory Nano Fluidic Circuits Ultra Sensitive Bio-sensor

3 Nano-Manufacturing Grand Challenges State of Art Prohibitive cost (EUV>$25M/tool), low speed (EBL) Not suitable for 3D (nanoimprint, soft lithography) Prone to defects (self-assembly) Technological Barriers Dimension below 20 nm High density devices 3D complex nanostructures Low power, high speed (Rent s law) Heterogeneous integration Multiple functionality

4 Center of Scalable & Integrated Nanomanufacturing Vision: To Develop A New Nano-Manufacturing Paradigm that Enables the Quantum Leap from Lab Science to Industry floor Societal Impact Impact System Focus Design for NanoMfg Top-Down Nano-Mfg Tools Hybrid Top-Down/ Bottom-up Industrial Consortium Product Development Education & utreach Workforce Training

5 Core Research Competence Physical Science Stoddart, sher Manufacturing Materials Hahn, Chen, Frechet, Maynard Design & Modeling Grigoropoulos, Caflisch, Goodson Dornfeld, Prinz, Hocken, Tsao, Lavine, Zhang Devices Heller, Majumdar, Ho, Ho, Yablonovitch 1+1>2!

6 IRG I. Top-Down Nano-manufacturing Participants: Zhang (lead), Yablonovitch, Frechet, Goodson, sher, Grigoropoulos Critical Challenges Semiconductor Manufacturing at a crossroads 50 nm resolution limit Lacking 3D capability Goal 3D nano-manufacturing with 1-20 nm resolution Approaches: Plasmonic Imaging Lithography (PIL) Ultra Mold Imprinting Lithography (UMIL)

7 Plasmonic Imaging lithography Surface plasmon: ptical wave frequencies, with X-ray wavelengths! ε 2 >0 E dielectric ε 1 < Hy metal kz kx Mask fabricated by FIB ω light ω=ck x Vacuum wavelength Surface Plasmons Higher resolution k sp = 2π ε d ε m λ ε d +ε m 90nm features 170 nm 90 nm Wave Vector k x (Illumination at 365 nm)

8 Characterization, Modeling and Material Engineering Nanolitho Characterization Platform Materials issues at very small dimensions: Dendrimer molecules as molecular pixels 0 ~10 nm licon and carbon for etch resistance μm Process Modeling [Grigoropoulos, UCB] Cl Chemical linker [Grigoropoulos, Zhang, UCB ; Hahn, UCLA] [Frechet, Grigoropoulos, UCB]

9 Ultra Molding Imprint Lithography Conventional Nanoimprint Lithography Press mold into polymer Ultra Molding Imprint Lithography Sub-10 nm mold fabricated using Superlattice of alternating Ge and multilayers. Deposition Etching Imprinting Cure polymer Ge Remove mold nm Etch underlying layer L.J. Gou, J. Phys. D, nm imprinted features [Chen, Hahn, Tsao, UCLA; Wang, HP; Hocken, UNCC]

10 IRG II. Hybrid Top-down and Bottom-up Nanomanufacturing Participants: Ho (lead), Chen, Majumdar, Caflisch, Stoddart, Heller, Maynard Critical Challenges Self-assembly CANNT: Heterogeneously assemble pattern for devices Avoid defects due to thermodynamic nature Goal Massive and parallel integration of heterogeneous nano-legs into devices Approaches Hybrid Top-down and Bottom-up technologies

11 Field-Assisted Parallel Nano-Assembly (FAPNA) Electronic Pick and Place A A Nano-LEGs 1µm Nano-LEGs: DNA/RNA, Proteins, cells, nanoparticles, molecules [Chen, Ho, Maynard, UCLA; Heller, UCSD]

12 Hybrid Top-down and Bottom-up Nanomanufacturing 100 nm 100 µm 100 mm Bio-Fluidic Micro pump filter Micro/nano Fluidics Micro sensor utlet Bio-Chip Addressing & Data acquisition Assembly Motherboard Integrated assembler system will bridge the multifunctional nano-legs onto bio-mems devices and lead to scalable and cost effective manufacturing at macro-world.

13 IRG III Manufacturing System Engineering Participants: Tsao and Prinz (lead), Dornfeld, Hocken, Hahn, Caflisch, Lavine Critical Challenge Scaled-up nano-manufacturing for high throughput and high yield Goal Develop Nano-manufacturing cluster tool Approaches Design for nano-manufacturing Tooling and metrology Reliability and scalability

14 NanoManufacturing Platform - UMIL UNCC 3D Sub-atomic Measuring Machine Multiscale Alignment and Positioning System (MAPS) X (nm) nm step Time (s) [Hocken] Dynamic Positioning Control [Hocken, UNCC] Imprinting Module The Ultimate Imprint Machine 1 nm Alignment Precision Sub 5 nm Imprinting Precision [Tsao, UCLA] [Chen, UCLA]

15 SINAM NanoMFG Technologies and Tools Top-down NanoMfg Hybrid Top-down & Bottom-up Plasmonic Imaging Lithography Ultra Mold Imprint Lithography System Level Focus and Testbed Design for Nanomanufacturing Metrology 3D nano-cad

16 Integrated Educational Program GR UG HS MS Graduate Young Investigator Program Enhancing interdisciplinarity and connections between faculty Interdisciplinary Curricula Five interdisciplinary, research-integration courses developed by SINAM faculty Nano-Manufacturing Summer Academy/REU x undergrad and Three high school students into faculty labs, integrating research into their education Discover Nanotechnology (Grades 7-12) SINAM is developing an education module using Nano- manipulator

17 SINAM Collaborative Network SINAM Industrial Collaborations HP Lab RAND Corporation Boeing Company Northrop Grumman Establishing Broad Collaborative Network National Institute of Health Focus: Muscle Molecule assembly Semiconductor Industrial Association Focus: Nanoelectronic Research Initiative and collaboration with SIA members Center for Nanoscale Mechatronics and Manufacturing Focus: International collaboration in the Nanomanufacturing