SUSS MICROTEC - SEMI MEMS TECH SEMINAR Mailand, 23. September Margarete Zoberbier, Product Manager Bonder

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1 SUSS MICROTEC - SEMI MEMS TECH SEMINAR Mailand, 23. September 2014 Margarete Zoberbier, Product Manager Bonder

2 SUSS MICROTEC AT A GLANCE Facts 60+ years of experience in semiconductor equipment Two facilities in Germany for development and manufacturing 2 One production facility in Corona, US Strong global support infrastructure with sales and service offices in USA, Singapore, Korea, Taiwan, China, Japan Strong competitive positioning: first or second in the target markets Solid financial situation More than 8,000 systems installed worldwide Key Figures 2013 Order entry: million Sales: million EBIT: million Free cash flow: 4.1 million Installed base: > 8,000 systems 655 employees worldwide

3 SEGMENTS AND MARKETS Segments Photomask Equipment Lithography Wafer Bonder Products MaskTrack Pro Exposure Systems Coater/Developer Bonding Systems Frontend Backend Process Steps Markets Photomask Cleaning Mask Manufacturing UV Projection (Stepper, Scanner) Laser Ablation Advanced Packaging Proximity Exposure (Mask Aligner) Nano Imprinting Coating Developing Bond Alignment Permanent Bonding Temporary Bonding Debonding 3D Integration MEMS LED 3

4 MASK ALIGNER PRODUCT OVERVIEW Manual Equipment (100mm, 150mm, 200mm) Automated Equipment (100/150mm, 200mm, 300mm) Integrated Lithography Clusters MJB4 MA/BA6 MA/BA8 Gen3 MA12 MA100/150e MA200 Gen3 MA300 Gen2 LithoPack 200 / 300 Support also emerging applications like UV-NIL, SCIL, bond alignment, wafer level microlens UV replication and UV-bonding (SMILE). Provide best possible cost of ownership by achieving highest throughput at superior alignment accuracy. Combine state of the art pattern recognition with excellent print results. Different product enhancements available to further optimize and advance the level of automation. SUSS Lithography Clusters are integrated coat, bake, expose, develop solutions that are especially used in volume production. 4

5 COATER/DEVELOPER PRODUCT OVERVIEW Manual Equipment Automated Equipment Integrated Lithography Clusters LabSpin 6/8 RCD8 Gamma, ACS200 Gen3, ACS300 Gen2 LithoFab 200, LithoPack 300 LabSpin systems, the smallest coater/developer system for basic applications are offered as table top systems or for integration into a wet bench. The RCD8 and Delta12 series are the perfect tools for R&D, universities and start-up companies. Highly automated, modular systems for wafers up to 300mm configurable with different modules like: spin/spray coaters, aqueous/solvent developer, primer and temperature stack. SUSS Lithography Clusters are integrated coat, bake, expose, develop solutions that especially used in high volume production for superior process stability. 5

6 WAFER BONDER PRODUCT OVERVIEW Manual And Semi-Automated Equipment (Small pieces to 200mm) Automated Equipment SB6/8e XBC300 Gen 2 XBS300 Manual Wafer Bonders are designed for R&D, pilot production and low labor cost production environments. One chamber designed for all types of bond processes including anodic, glass frit, thermocompression, polymer and adhesive bonding offers ultimate flexibility Automated Temporary Wafer Bonding, Debonding and Cleaning Systems are designed for volume production. Wide selection of process modules for temporary bonding, debonding and cleaning for greater flexibility. High throughput with smallest footprint 6

7 SUSS MICROTEC A GLOBAL PLAYER NORTH AMERICA EUROPE ASIA Yokohama, JP Hwaseong City, KR Headquarters Production Sales Sunnyvale, US Corona, US Garching, DE Sternenfels, DE Hauterive, CH Pierre-Bénite, FR Coventry, UK Singapore, SG Shanghai, CN Hsin Chu, TW 7

8 SÜSS MicroTec AG Schleissheimer Str Garching 8