EV Group Product Range

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1 EV Group Product Range

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3 Process Development and Services With state-of-the-art application labs based at its headquarters in Austria, as well as in the U.S. and Japan, EV Group (EVG) is focused on delivering superior process expertise to its growing global customer base - from the initial development until the final integration at the customer s site. Featuring state-of-the-art cleanrooms and a highly experienced staff of process and application engineers, the company's process development business unit works hand in hand with customers on a number of areas. The company's application labs provide demonstrations of its various products for potential customers looking to leverage EV Group's extensive line up of advanced wafer processing solutions for semiconductor, MEMS and nanotechnology markets. Furthermore, our labs provide process development support for custom applications to address customer s unique and challenging requirements - at any stage of the development process. These advanced process development and application labs are designed to accommodate independent research work to explore and develop baseline processes that will open up new market opportunities. This includes working with key partners, like material suppliers, to develop and optimize new processes and capabilities. Case in point, EV Group's ongoing relationship with Brewer Science, who by working closely together, have demonstrated temporary wafer bonding capabilities for a wide range of backside processes. EV Group's process development team works with customers needing "demonstrator" parts for their respective customer-specific requirements. As a result, EV Group's multiple application labs are equipped to conduct smallvolume pilot line runs to simulate an actual production line process, when necessary. This is very advantageous, especially for those customers with extremely complex demands - ensuring seamless process capability that suits all parties ahead of time and ultimately puts EV Group's customers a step ahead of the competition. In all, these advanced labs provide customized tooling capabilities - enabling EV Group's customers to effectively compete in today's ever-changing, fast-paced environment by enabling a shorter time to market, easing integration headaches and eliminating the risk to schedule across multiple industries and applications. This is the passion and commitment that makes EV Group a value-added partner and why companies demanding nothing less than the best continue to turn to EV Group for its unparalleled worldclass process and technology expertise....etc. EVG Process Expertise Wafer & Template Fabrication Substrate Bonding for SOI Substrate Cleaning Plasma Activation Resist Coating Spin/Spray Alignment Verification Proximity Lithography Nanoimprint Lithography Resist Developing RIE, DRIE Wet Etching Resist Lift-Off CVD, LPCVD, PVD,... Metrology Bond Alignment Wafer Bonding Thinning, CMP Temporary Bonding/ Debonding Wafer Dicing Stress Relief Etching Electroplating Chip-to- Wafer Bonding EVG Processes Metallization Oxidation Wafer Bumping & Redistribution EVG Applications Lab Quality Assurance Process Monitoring on an EVG 850 DB System

4 Solutions for PERMANENT WAFER BONDING The introduction of EV Group's wafer-bonding approach, which separates the bond alignment from the bonding step, immediately revolutionized the market. Utilizing high-contact forces under elevated temperatures and a controlled atmosphere, this novel approach is today's process standard, with EV Group holding the dominant market share for both semi- and automated wafer bonding systems and a growing install base of more than 1100 bond chambers. Regarding systems applying low-contact forces under room temperature at utmost clean conditions, EV Group is also leading the market. EV Group's wafer bonding systems offer manufacturers numerous benefits, including optimal total cost of ownership (TCO), as well as a real wafer-wedge compensation unit to maximize the bonding yield. Their bond alignment systems can be integrated into a GEMINI Automated Production Bonding System. These systems, such as the patented (U.S. Pat.: 6,214,692 B1) SmartView face-to-face Bond Aligner, can support sub-micron alignment accuracies even with non-infrared (IR) transparent wafers. As it did with MEMS manufacturing, the company is now leveraging its technology strengths to accelerate the success of 3D wafer stacking. For this the GEMINI FB Automated Production Fusion Bonding System has been developed. In further support of this technology transfer, EV Group developed chip-to-wafer bonding tools for high-yield heterogeneous 3D integration schemes and was the first to market with 300 mm wafer bonding systems. Addressing new market challenges in beyond CMOS applications, power devices, silicon photonics and high-vacuum MEMS packaging, EVG has introduced the automated high-vacuum wafer bonding system EVG ComBond. The ComBond technology enables covalent and conductive wafer bonding processes at room temperature or low temperatures. This process facilitates the direct integration of heterogeneous materials, including III-V compound semiconductor materials like gallium nitride (GaN), gallium arsenide (GaAs) and indium phosphide (InP) on silicon substrates, GaAs on germanium (Ge), crystalline silicon carbide (csic) on SiC or on silicon, and lithium tantalate (LiTaO 3 ) on silicon. Key markets and applications include engineered substrates, high efficiency solar cells and MEMS devices. EVG 500 Bond series chamber EVG 560 Automated Solutions for TEMPORARY WAFER BONDING Building on its success in permanent wafer bonding, EV Group introduced automated temporary bonding and debonding technology to address compound semiconductor and 3D IC manufacturers' immediate need for high-yield processing of ultra-thin and fragile wafers. The EV Group technology temporarily mounts a wafer onto a carrier by applying thermal or UV-release intermediates (e.g., spinon polymers, waxes, resists and dry-film laminates), providing manufacturers with several key benefits. These include optimal design-process flexibility, high yield (via the rigid carrier support), ease of integration into an existing fabrication infrastructure, and a highly reliable debonding step following complete front and backside processing. SUPPORTED WAFER BONDING STEPS Permanent wafer bonding and chip-to-wafer bonding Thermal and UV cured bonding interfaces Anodic, glass-frit, metal-diffusion, eutectic, silicon-direct, polymer bonding, and LowTemp plasma activated bonding Face-to-face SmartView, backside, IR and transparent bond alignment Temporary bonding to carrier substrates with spin-on polymers or dry-film laminates Debonding of thin wafers from carrier substrates Void and alignment inspection ComBond technology: room temperature bonding, oxide-free conductive interface High vacuum encapsulation

5 WAFER BONDING SYSTEMS EVG 501 Wafer Bonding System EVG 510 Semi-automated EVG 520 IS Semi-automated EVG 540 Automated EVG 540C2W Automated Wafer & Chip-to-Wafer Bonding System EVG 560 Automated EVG 560 Automated ComBond Automated High-Vacuum BOND ALIGNMENT SYSTEMS EVG 610 Semi-automated Bond Alignment System EVG 620 Semi-automated Bond Alignment System up to 150 mm INTEGRATED BONDING SYSTEMS EVG 6200 Semi-automated Bond Alignment System SmartView NT Automated Bond Alignment System for Universal Alignment GEMINI Automated Production Wafer Bonding System GEMINI Automated Production GEMINI FB Automated Production Fusion Bonding System SOI & ENGINEERED SUBSTRATES BONDING SYSTEMS GEMINI FB Automated Production Fusion Bonding System EVG 301 Semi-automated Single Wafer Cleaning System EVG 320 Automated Single Wafer Cleaning System EVG 810 LT LowTemp Plasma Activation System EVG 850 LT Automated Production Bonding System for SOI and Direct Wafer Bonding EVG 850 Automated Production Bonding System for SOI and Direct Wafer Bonding TEMPORARY BONDING and DEBONDING SYSTEMS EVG 805 Semiautomated Debonding System EVG 820 Lamination System INSPECTION SYSTEMS EVG 850 TB Automated Temporary Bonding System EVG 850 TBL Automated Temporary Bonding System with integrated Lamination System EVG 20 IR Inspection Station EVG 50 Automated Metrology System EVG 850 DB Automated Debonding System EVG 850 TB XT Frame Automated Bonding System EVG 850 DB XT Frame Automated Debonding System

6 Application Examples The different drivers for employing wafer bonding, as well as the applications served by EV Group bonding technology, are as diversified as the markets from which these applications originate. Product Wafer Carrier Wafer Adhesive Cross-section of temporary bond utilizing Brewer Science 's HT series adhesive 8-layer direct bond cross-section Courtesy of MIT SOI wafers produced utilizing SmartCut technology Courtesy of Soitec Glass-frit bond interface Courtesy of ST Microelectronics Ziptronix direct bond Interconnect Courtesy of Ziptronix Metal/Adhesive via first 3D bonding Interface Courtesy of RPI 200 mm chip-to-wafer bond Courtesy of Datacon Sub 0.5 µm aligned, bonded color filter Courtesy of MicroEmissive Displays (MED) Si Amorphous layer Bond Interface Si Cross-section SEM image of an InP/GaAs wafer pair bonded using a Au:Sn eutectic wafer bonding process Scanning Acoustic Microscope (SAM) image of an InP/GaAs wafer pair bonded using a Au:Sn eutectic wafer bonding process EVG ComBond : Particle- and void-free bond EVG ComBond : Oxide-free, conductive interface silicon/silicon Markets The key below denotes each systems' market applicability. MEMS Advanced Packaging & 3D Interconnect SOI & Engineered Substrates Compound Semiconductor Nanotechnology

7 Solutions for LITHOGRAPHY Since introducing the industry's first backside-alignment microscope on a proximity mask alignment system more than two decades ago, EV Group has been committed to pioneering advances in lithography for semiconductor and MEMS manufacturing. The company's key competencies in lithographic technology lie in the high-throughput contact and proximity exposure capabilities of its mask alignment systems (EVG600, EVG6000 and IQ series) and in its highly integrated coating platform (EVG100 series). All of EV Group's lithography equipment platforms are 300 mm ready, can be fully integrated into its HERCULES lithography track systems, and are complemented by its metrology tools for top-to-bottom side alignment verification. Other important advancements by EV Group in the lithography space include the company's special resist coating technologies - OmniSpray and the revolutionary NanoSpray. Not only do these unique technologies allow for extremely conformal coatings over high-topography structures - for example, through-silicon-via (TSV) structures with an aspect ratio of 1:5 (W:H) - but, ultimately, they enable customers to realize significantly reduced fabrication costs. Through its commitment to continued innovation and customer collaboration, EV Group has consistently raised the bar for costeffective, nanometer-scale lithography processing. This future-focused approach enabled the accelerated introduction of its UVnanoimprint lithography (UV-NIL) and hot-embossing systems. Today, the company holds the dominant market share in these promising technologies. EVG 150 Automated Resist Processing System IQ Aligner NT Automated Mask Alignment System SUPPORTED LITHOGRAPHY PROCESS STEPS Top and bottom side mask alignment both near-ultraviolet (NUV) or deep-ultraviolet (DUV) in proximity and contact exposure mode Spin coating and resist development Dry-film resist lamination OmniSpray and NanoSpray coating Top-to-bottom side alignment inspection UV-NIL, hot embossing and Micro Contact Printing (µ-cp) Metrology tasks like CD, Box-in-Box or Overlay measurement

8 MASK ALIGNMENT SYSTEMS EVG 610 Semi-automated Mask Alignment System EVG 620 Semi-automated Mask Alignment System up to 150 mm EVG 620 NT Automated Mask Alignment System up to 150 mm EVG 620HBL Automated Mask Alignment System up to 150 mm EVG 6200 Automated Mask Alignment System LITHOGRAPHY TRACK SYSTEMS EVG 6200NT Semi-automated Mask Alignment System IQ Aligner NT Automated Mask Alignment System HERCULES Lithography Track System coat, UV-exposure and develop modules HERCULES L Lithography Track System resist processing & expose configuration RESIST PROCESSING SYSTEMS EVG 101 Advanced Resist Processing System EVG 105 Bake Module EVG 101 LA Large Area Coating System for > 300 mm EVG 120 Automated Resist Processing System EVG 150 Automated Resist Processing System EVG 150 Automated Resist Processing System EVG 150 LA Large Area Resist Processing System > 300 mm EVG 150 N Automated NanoSpray Coating System EVG 150 XT Automated Resist Processing System NANOIMPRINT LITHOGRAPHY SYSTEMS (UV-NIL / SmartNIL, µ-cp, HE) EVG 610 Semi-automated UV-NIL, µ-cp System up to 150 mm EVG 620 Semi-automated UV-NIL, µ-cp System up to 150 mm EVG 620(0) NT Semi-automated UV-NIL, µ-cp System up to 150/200 mm EVG 6200 Semi-automated UV-NIL, µ-cp System IQ Aligner Automated UV-NIL, µ-cp System EVG 720(0) Automated UV-NIL System up to 150/200 mm EVG 7200 LA Semi-automated Large-Area SmartNIL System up to 370 x 470 mm (Gen 2) HERCULES NIL Integrated UV-NIL Track System EVG 770 Automated NIL Stepper EVG 510 HE Semi-automated Hot Embossing System EVG 520 HE Semi-automated Hot Embossing System EVG 750 Automated Hot Embossing System EVG 750 R2R Automated Roll-to-Roll Hot Embossing System INSPECTION SYSTEMS EVG 40 NT Automated Measurement System EVG 40 NT Semi-automated Measurement System EVG 40NT Automated Measurement System

9 Application Examples Advanced Lithography EV Group's solutions enable a broad range of applications that are key in the manufacture of today's leading edge electronics products. 80 µm SU-8 resist features with sidewall angles approaching 90 Courtesy of DALSA Corporation 2 µm 500 µm Sub-µm high-aspect ratio structures created with DUV-Lithography Courtesy of CEETAM Patterned, spray coated resist layer in anisotropically etched cavity Courtesy of TU-Delft DIMES Through-silicon-via (TSV) structure conformally coated utilizing NanoSpray Technology 100 µm 10 µm High-Q-3D solenoid inductors for RF ICs Courtesy of SIMIT 3 µm thick resist with 0.5 µm line/ space exposed using DUV setup SU-8 structures 470 µm high, developed in PGMEA with megasonic-enhanced development Nanoimprint Lithography (NIL) Nanoimprint lithography is a cost efficient manufacturing technique for sub-100 nm features and complex 3D structures. It enables the fabrication of new, demanding applications requiring single step or step&repeat processes. 200 µm 10 µm 50 nm resolution pattern utilizing UV-NIL Courtesy of Quantiscript Inc. Wafer-level micro-lens arrays created utilizing UV-NIL Biological sample interacting with directly imprinted functional array Courtesy of FH Wels 20 nm wide 3D structure produced utilizing Soft UV-NIL Courtesy of AMO 1 mm 20 µm Topas hot embossed micro fluidic structures utilizing soft working stamp polymers 20 µm 3-D honeycomb anti-reflective layer imprinted using SmartNIL Courtesy of FHG ISE 2 µm 100 nm resolution lines replicated using SmartNIL Fully populated 6 Si substrate imprinted on EVG 720

10 Customer Support We act globally. Our lithography, bonding and imprint equipment is designed for reliability, productivity and quality, without any limits. Our highly qualified employees are part of a worldwide network and react quickly and flexibly to customer requests and inquiries. We are always prepared for new challenges. EVG Services Key Benefits Field Service On-Site Visits Preventive maintenance and repair carried out in accordance with EV Group's high-quality standards Immediate assistance by factory trained, certified field service engineers On call support Equipment relocation Worldwide service through our subsidiaries and partners Certified engineers are taking care of all equipment related issues Engineers' long-term experience and technology expertise ISO certification ensures consistent high quality Technical Support Remote diagnostics and trouble shooting via secure internet line, phone and Assistance with spare part number research Access to Best Known Methods (BKM's) and trouble shooting advise Expert help from experienced Senior Engineers Guaranteed fast response time Spare Parts Recommended spare parts packages Guaranteed lead times Regional spare part stocks Parts repair and refurbishment servces Consignment stock options Cost optimization through parts repair, refurbishment or new parts replacement Customized spare part packages Short lead times due to customized spare part stocking options Upgrades Off the shelf upgrades for additional features and performance enhancement Tailored soft- and hardware upgrades based on your requirements Performance enhancement based on your actual production needs Customized solutions for new challenges Product Training Worldwide distributed training locations Standardized modules for operation, maintenance & process training from novice to expert level available on-site and at EV Group training centers. Optimum uptime and tool performance through EV Group certified operators and maintenance personnel Extended Equipment Warranty Includes spare parts and labor Set costs with priority support EVG Applications Lab EVG Customer Support

11 Commitment Without Borders Corporate Headquarters EVG Subsidiaries EVG Japan EVG Korea EVG North America EVG Taiwan EVG China Our highly qualified employees are part of a worldwide network.

12 Global Locations Headquarters Worldwide Sales and Customer Support EV Group Europe & Asia/Pacific GmbH DI Erich Thallner Strasse St.Florian am Inn Austria Phone: Fax: Sales@EVGroup.com Germany EV Group E. Thallner GmbH Hartham Neuhaus Germany Phone: Fax: Sales@EVGroup.com Europe Tech Support Phone: TechSupportEurope@EVGroup.com Japan EV Group Japan KK Yokohama Business Park East Tower 1F 134, Godo-cho, Hodogaya-ku, Yokohama-shi, Kanagawa, Phone: Fax: Sales@EVGroup.jp Japan Tech Support Phone: (Yokohama) Phone: (Fukuoka) TechSupportJapan@EVGroup.com Korea EV Group Korea Ltd. Room 503, Seokun Tower, 178, Pangyoyeok-ro, Bundang-gu, Seongnam-si, Gyeonggi-do, , South Korea Phone: Fax: Sales@EVGroup.co.kr North America EV Group Inc South River Parkway Tempe, AZ Phone: Fax: SalesNorthAmerica@EVGroup.com EV Group Inc. 100 Great Oaks Blvd; Suite #119 Albany, NY SalesNorthAmerica@EVGroup.com North America Tech Support Phone: TechSupportNorthAmerica@EVGroup. com Taiwan Sales EVG-JOINTECH CORP. No. 400, Hwang-Pei Road Chung-Li City, Phone: Fax: Sales@EVG-Jointech.com.tw Taiwan Customer Support EV Group Taiwan Ltd. North Office: No. 400, Hwang-Pei Road Chung-Li City, South Office: Rm203, NO.12, Nanke 2nd RD, Xinshi Dist., Tainan City, Phone: Fax: (North Office) Fax: (South Office) TechSupportTaiwan@EVGroup.com China EV Group China Ltd. Room , Building No. 3, No. 498 Guo Shou Jing Road, Zhangjiang High-Tech Park, Pudong New Area, Shanghai, PR China, Shanghai Phone: Fax: Sales@EVGroup.cn TechSupportChina@EVGroup.com EV Group (EVG). All rights reserved. V17/02 Data, design and specifications may not simultaneously apply; or depend on individual equipment configuration, process conditions and materials and may vary accordingly. EVG reserves the right to change data, design and specifications without prior notice. All trademarks, logos, website addresses or equipment names that contain the letters or words EVG or EV Group or any combination thereof, as well as the following names and acronyms are registered trademarks and/or the property of EV Group: ComBond, CoverSpin, EZB,EZ Bond, EZD, EZ Debond, EZR, EZ Release, GEMINI, HERCULES, HyperIntegration, IQ Aligner, LowTemp, NanoAlign, NanoFill, NanoSpray, NIL-COM, NILPhotonics, OmniSpray, SmartEdge, SmartNIL, SmartView, The Triple i Company Invent-Innovate-Implement, Triple i. Other product and company names may be registered trademarks of their respective owners. Printed on paper from sustainable sources