Statement of Work (SOW) Board Assembly TIG inemi PCBA Reliability Qualification Project

Transcription

1 Statement of Work (SOW) Board Assembly TIG inemi PCBA Reliability Qualification Project Version # 2.0 Date: 9/26/12 Project Leader: Thomas Homorodi, Dell Co-Project Leader: Aamir Kazi, Dell inemi Staff: Mark Schaffer Basic Project Information Background/Context Reliability is a key customer and market concern in computing products in enterprise, client and mobile spaces. In some cases, new technologies, materials and assembly processes may be introduced and/or qualified in a manner that is inconsistent with typical OEM requirements. Various industry standards and procedures exist today to assess acceptability and test the quality and reliability of electronic soldered-assemblies (PCBs and PCBAs). Due to this variety, any given CM/EM/OEM manufacturer s product reliability qualification methodology and results are not easily correlated with their peers results and OEM expectation. A common qualification framework is desired. Scope of Work The work: A qualification process document already exists at Dell which is being proposed as the starting point for the enterprise-product-wide applicable document. o The team will review these documents for Applicability to the charter Qualification will be at the PCBA level: PCB materials are presumed qualified (starting point) but will include tests/evaluations that look at PCB for version control Page 1 of 7

2 risk sites for assembly; not qualifying at the un-soldered PCB-level resin/construction A single project for qualification of Enterprise products Flow, of qualification Qualification procedure and process Pass/Fail criteria, for individual tests, not for the qualification-suite as a whole Establish minimum recommendations/guidelines for sample quantities and related test conditions Enhancement, of relevant sections Omissions, sections/procedures that need appending Exceptions, to certain sections o These reviews may be done in the context of members existing qualification process framework. o Agreement on the reviewed items and revisions thereof. o Editing/rewriting sections with team s agreed-upon modifications. o Invite CM/EMS/ODM feedback incorporate as needed. o Approval by team. o Release completed document. Decide on the visibility: current direction is for it to be public Major goal: Development of a standardized reliability qualification procedure for enterprise products utilizing existing industry specs for acceptability and testing of PCBAs. Timeframe: 9-12 months. Purpose of Project Explain how the project aligns to the roadmap and what gaps will be filled: The project serves to establish a common hardware reliability qualification process for suppliers manufacturing computing hardware (servers, storage and switches) to be deployed in offices, datacenters, as well as environmentally controlled telecom datacenters. Will the project provide a complete solution or be part of a complex solution? This is projected to deliver a complete solution addressing new product T/M/P Reliability Qualification Process. List anticipated benefits to participants, to the inemi membership in general, and the industry Level the playing field for qualification requirements. Reduce ambiguity with qualification processes at CMs/EMSs to satisfy customers qualification demands. Limit complexity of negotiating qualification requirements. Reduce effort to have suppliers accept responsibility for qualification work. for version control Page 2 of 7

3 Reduce cost for EMSs/CMs/ODMs or repeated full qual to comply with variegated demands of similar goals. Allow for leveragability of previous qualification work for ceteris paribus (all other things being equal) technology. Document will serve as suite baseline for existing CMs re-qualification efforts for new sites moves and transfers. IS/IS NOT Analysis This Project IS: To define an OEM/industry-wide set of PCBA reliability qualification methods and processes (toolbox) for: new suppliers new technologies new materials new processes as applies to ODM/CM PCBA manufacturers - Primary focus will be on Enterprise products (including telecom data centers) Reliability evaluations are done for designs and materials. Supplier qualifications are intended to evaluate capability and quality. This document is meant to qualify new technologies for which the process definition/development work is complete. Review/identification of Best Known Methods/Best Known Practices in reliability of electronic OEMs for new qualifications. Utilizing existing industry standards/procedures wherever appropriate. Decide on whether the output will culminate in a guideline (that may/may not evolve into a standard, e.g., QS9000). For reliability qualification of new solder assembly processes, technologies, materials at manufacturing facilities of new and existing suppliers. Definition of test-level failure criteria. PCBA-level qualification, with evaluation of risk sites on PCB s that depend on solder-assembly process This Project IS NOT: Not intended for High Rel: Outdoor-telecom Military/aerospace Medical Early R&D for new technology/process or materials viability Is not process definition/development or material evaluation Developing new reliability test standards/procedures/test methods Testing/materials resources commitment Regulatory/environmental materials compliance Re-creation of component qualification test methods and processes Failure Analysis requirement/procedure development Definition of qualification-suite level failure criteria This is the domain of each OEM, and defined by them Raw PCB material/construction evaluation for version control Page 3 of 7

4 Business Impact Resolving ambiguity with qualification processes at CMs/EMSs to satisfy their various customers qualification demands. Have suppliers accept responsibility for qualification work. Reduce cost for EMSs/CMs/ODMs due to varied test protocols/qualification process flows to comply with variances between multiple customers qualification requirements for similar hardware. Participating Organizations inemi member companies Industry as a whole Outcome of Project A one-stop-shop unified qualification process document for new process/technology/materials reliability qualification List expected deliverables Reliability qualification document List any project milestones Existing/starting point document introduction & invitation for markups from members Invite and review similar qualification documents from stakeholder firms Identification and critical analysis of industry tests/procedures that have parity with OEMs internal test procedures Discuss the differences between similar tests amongst different industry specs invite/recruit spec org representation for explanation Receive markups from membership stakeholders Focus of document is the enterprise product space (including telecom datacenters) Incorporate suggested changes, distribute for review Completion of second review and receipt of markups Changes incorporated Voting on changes Voted-on changes incorporated and sent out Invite inputs from ODM/CM/EM community Comment period Final amendments and vote Release Sharing Project Results: To be determined by the project team on what information will be shared outside of the team. However, the expectation is that information will be shared as a public domain document. for version control Page 4 of 7

5 Previous Related Work Review any related research or development done within the industry Summarize, briefly, directly related academic research, if any Prospective Participants inemi staff Mark Schaffer: North America Haley Fu: Asia Industry members Tom Homorodi, Dell Chair Aamir Kazi, Dell Kim Hyland, Cisco Michael Roesch, HP Jim Wilcox, IBM Mitch Ferrill, IBM Rob Taylor, Lenovo Leo Zhao, Lenovo Michael Stark, Intel John Godfrey, Microsoft IST (Taiwan), Jeffrey Lee Celestica (Asia), George Lim ODM and EMS participants will be recruited when the project is opened up to the inemi membership. Other participants: Academia, Test labs, and Test Standards bodies may be useful to vet test methods looks for education, looking for omissions, expansions, etc. Project Plan: Schedule with Milestones TASK LIST Q1 Q2 Q3 Q4 Q5 Task 1: Disseminate current document Task 2: Review OEM documents Task 3: Gap analyses Task 4: Develop Flow, of qualification Task 5: Develop agreement/modifications Task 6: Editing/rewriting Task 7: Approval by team Task 8: Invite EM/CM/ODM feedback Task 9: Release completed document for version control Page 5 of 7

6 Editable excel sheet: PCBA Reliability Qualification Plan.xls Phase 1 Detailed Information Task list Task 1: Disseminate current (Dell) document Task 2: Call for OEMs similar qualification documentation Scrub and share internal documents that may be referenced in member qualification suite docs Pair internal standards with relevant industry specs Task 3: Gap analyses on differing industry standards for similar tests Recruit/invite industry standards experts/reps to comment as needed Call on team s internal expertise Discuss and decide on the appropriate standard to reference in the final output Task 4: Develop flow, of qualification Qualification procedure and process Test-level Pass/Fail criteria Enhancement, of relevant sections Omissions, that need appending sections/procedures Exceptions, to certain sections Task 5: Agreement on the reviewed items and revisions thereof Task 6: Editing/rewriting sections with team s agreed-upon modifications Task 7: Approval by team Task 8: Invite EM/CM/ODM community to comment and feedback Incorporate any feedback Task 9: Release completed document: direction is to release this as a public-domain document Project monitoring plans Ensure open lines of communication among participants. Review all project requirements with participants before the project begins. Project participants will meet weekly/bi-weekly to review various aspects of the project and make plans for next phases of the project. Proposed weekly meeting schedule and to accommodate US and foreign time zones by alternating day/night timeslots. Meeting minutes provided through . Follow-up with individuals on an as-needed basis. Provide any project specific monitoring or communications plans, e.g., multiple project meetings to cover multiple regions (EMEA, Asia, Americas). Workshops and face-to-face meetings as determined by the project team. for version control Page 6 of 7

7 Progress reports will be provided upon request for presentation at regularly scheduled inemi meetings (e.g., a short series of PowerPoint slides showing the work in progress at member council meetings). Track and document approximate man-months per quarter per team member (this will require the active members of the team to provide estimates). Track and document approximate number of people on the project per quarter (this can be tracked through inemi's WebEx account.) General and Administrative Guidelines for this project and all other inemi Projects are documented at for version control Page 7 of 7