Call for Participation In High Speed Signaling Metrology and Standard Reliability Qualification Project Formation

Transcription

1 Call for Participation In High Speed Signaling Metrology and Standard Reliability Qualification Project Formation Session 1 Friday, March 14 10:00 am 11:00 am EDT

2 inemi Connectors Interest Survey Background inemi is exploring several electronic connector initiatives recommended through discussions with leading OEMs and EMS firms The purpose of these projects is to highlight, study, and develop metrics on potential manufacturing challenges facing the industry's use of certain connector types as we move forward 2

3 inemi Connectors Interest Survey Background (Continued) High Speed Signaling Metrology: as circuit speeds and noise margins approach difficult parameters Product Examples: Processor Sockets, Memory Sockets, Backplane Connectors, next generation IO Connectors Standard Reliability Qualification: Designed to provide predictive MTBFs or other reliability measures for mainstream products and applications Product Examples: CPU Sockets, DDR4 Memory Sockets, Press-Fit Backplane Connectors, HDD and SSD Connectors, IO Connectors to 100Gbps Dynamic Warpage Measurements: Designed to test susceptible products with larger areas, thin/long LCP housings combined with SMT attach Product Examples: DDR4 Memory Sockets, Processor Sockets > 2,000 Pins 3

4 inemi Connectors Interest Survey Background (Continued) Key Challenges for Press-Fit Connectors: Designed for high speed applications with short pins - or automotive apps desiring press-fit assembly Product Examples: Backplane Connectors, Automotive Connectors with short pins State of Art Memory Connectors: Designed for future DRAM applications beyond DDR4 Product Examples: Memory Connector surpassing DDR4 requirements > 5Gt/s range Emerging Special Needs Automotive Connectors: Perhaps focusing on EV/PHEV electric vehicle HV/motor control interconnects Product Examples: HV Wiring Harness and Cable Connectors for Hybrid and Electric Vehicle electronics and battery interconnects 4

5 inemi Connectors Interest Survey Sixty people participated in the survey There were a number of responses from 5 OEMs, m 3 EMS firms and only one connector firm In addition there were responses from others in the supply chain (such as material suppliers) Greatest interest was shown in the following topics (in rank order). Standard Reliability Qualification - drive standard reliability test conditions & equipment capabilities High-Speed Signaling Metrology - effort to measure socket & connector electrical parameters Key Challenges on Press Fit Connectors - address connector development lagging needs State of the Art Memory Connectors 5

6 inemi Connectors Interest Survey 6

7 inemi Connectors Interest Survey 7

8 Inputs Received Proposal Standard Reliability Qualification - drive standard reliability test conditions & equipment capabilities Potential Leaders IBM, Alcatel-Lucent, Intel, IEC Electronics High-Speed Signaling Metrology - effort to measure socket & connector electrical parameters IBM, Alcatel-Lucent, Intel Key Challenges on Press Fit Connectors - address connector development Cisco, Alcatel-Lucent State-of-the-Art Memory Connectors - design and application of DDR3 and DDR4 sockets Intel, Alcatel-Lucent,, Bull, 8

9 High Speed Signaling Metrology Brent Stone, Intel

10 High Speed Signaling Metrology BACKGROUND Higher interconnect signaling speeds & bandwidth requirements driving the need for characterizing signal integrity of sockets and connectors Need for consistent measurement methodologies PROPOSAL: inemi coordinated effort to measure socket & connector electrical parameters Define metrology requirements for time and frequency domain Cross-company matching of socket and connector electrical parameters using predefined test boards and sample units Drive common database / data formats of test results for customers to use 10

11 High Speed Signaling Metrology On High Speed Signaling... a lot of work has already been done by major connector manufacturers on things like sockets, backplane connectors and high speed IO connectors This is done through various modeling and simulation tools. Some mfrs publish Spice models for use by customers online. Molex, TE, FCI, Samtec and other do this The current state-of-art in high speed connectors includes: 10-25Gbps backplane, 10-40GbE, 10Gbps Thunderbolt, 4.8 going to 9.6Gbps USB and of course fiber optic solutions Input - John L MacWilliams Principal: US Competitors LLC 11

12 High Speed Signaling Metrology Scope of Work Develop Industry Survey Survey of current existing methods for socket/connector HSIO measurements Benchmark OEM and suppliers socket and connector electrical parameters using predefined test boards and sample units Develop a standard format (template) for presentation of test results for use by industry 12

13 This Project IS: IS / IS NOT Analysis Project 1: XXX This Project IS NOT: Defining the need for characterizing signal integrity of sockets and connectors Defines metrology requirements for time and frequency domain Definition of and agreement on key metrics & parameters socket/connector HSIO measurements: Frequency domain: S-parameters, insertion/return loss, cross-talk, frequency range of interest, etc. Time domain: Time domain reflectometry (TDR), time domain transmission (TDT), cross-talk, rise time range of interest, etc. Survey of currently existing methods for socket/connector HSIO measurements Benchmark OEM and suppliers socket and connector electrical parameters using predefined test boards and sample units Develop a standard format(template) for presentation of test results for use by customers Summary of equipment required for measurement of agreed upon metrics and parameters (multi-port PNA, etc.) Based on interest, participation, and validated capabilities, cross-company matching of socket/connector HSIO data using pre-defined test boards & sample units Output: Publish a white paper on the metrology requirements for time and frequency domain of High Speed Signaling sockets and connectors. Present the results of the benchmark using the proposed test result template Report-out of key findings & recommendations Repeat of prior or existing work Biased towards specific suppliers, geographies, or market segments Development of a specific standard(s)

14 High Speed Signaling Metrology Phase 1 Develop Survey Survey Distribution Survey Results Review Documentation of survey results Analysis of survey results Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8 Outputs End of Project Webinar White Paper TENTATIVE (18months) TENTATIVE (18months) TENTATIVE (18months) 14

15 Connector Standard Reliability Test Recommendations Project Anne Ryan, Alcatel-lucent

16 Connector Standard Reliability Test Recommendations BACKGROUND Test capabilities for socket reliability (such as temp cycle and shock, failure analysis) are different across socket/ connector manufacturers Associated criterion for passing is not consistent PROPOSAL Scope/drive opportunity for industry level standard reliability test conditions and equipment capabilities, FA capability and criteria Drive common database / data formats of test results for customers to use 16

17 Connector Standard Reliability Test Recommendations Scope of work Define a standard list of levels for each connector type. Based on the guidelines developed, the project will identify and document these for industry awareness Below is an example of the connector levels but this list varies industry wide, most only define 5 levels Level 0: On Chip Interconnects Level 1: Chip to Package Level 2: Package to Board Level 3: PCB mount Level 4: Board to Board Level 5: Chassis to Chassis Level 6: I/O connectors Level 7: Intersystem Cabling Level 8: Campus/Metropolitan Area Level 9: Long Haul Telecom/Datacom Level 10: Special Application Connectors Input - John L Mac Williams Principal: US Competitors LLC 17

18 Connector Standard Reliability Test Recommendations Scope of work (Continued) Survey Connector supplier s/oem list of packaging levels Develop connector standard list of packaging levels from outputs of survey Develop a guideline set of standard reliability test conditions for connector classes (as an example apply to one connector class could be achieved in Phase I others to follow in Phase II) Propose recommended Pass/Fail criterion for each test condition 18

19 Connector Standard Reliability Test Recommendations Scope of work (Continued) Propose a standard test report format for presentation of test results Alignment of critical elements that will be included in the connector reliability report 19

20 IS / IS NOT Analysis This Project IS: This Project IS NOT: Provide initial analysis of what the Project IS and IS NOT Drive standard Test Capabilities for socket reliability Create level of uniformity for how socket/connectors can be evaluated for reliability (stresses, interpretation of electrical targets, and test structure ) Gap Analysis of test capabilities Review current classes of connectors and define standard list of levels for one packaging type(could be expanded further in Phase II) Develop a set of standard reliability test conditions for one class of connector(phase I) Develop Pass/Fail Criterion for each test condition Step toward aligning a knowledge based connector certification process Alignment how to select the appropriate accelerated conditions Alignment of standard methods for failure analysis Alignment of critical elements that will be included in connector reliability report Output: Proposals for follow-on projects to work on specific solutions Output: Develop a white paper which would define the levels for each packaging class of connector, propose the test conditions associated with one class and associated Pass/Fail criteria. Development of a specific standard(s) Repeat of prior or existing work Biased towards specific suppliers, geographies, or market segments

21 Schedule with Milestones Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8 Task Phase 1 Phase 1.1 Phase 1.2 Phase 1.3 Phase 1.4 Survey supplier/oem list of packaging levels Develop connector standard list of package levels Develop a standard reliability test condition and criteria for one packaging level Propose Pass/Fail Criteria Project Outputs White Paper Project Webinar TENTATIVE (18months)

22 Details on Objective of Project Formation Team

23 Outline of Statement of Work (SOW) 1. Background to work 2. Scope of project 3. Purpose of project 4. What the project IS/IS NOT 5. Business Impact 6. Previous/current related work 7. Outcome of project 8. Prospective Participants (Generic nonspecific list) 9. Project Schedule with Milestones 10. Resources required from project participants 11. Project monitoring plan 12. General and administrative guidelines 23

24 Initiative Timeline First 1-3 meetings: Define overall project goal Break into project phases Engage key participants needed for project planning Second 3-6 meetings: Refine Statement of Work Prepare resource requirements Prepare project schedule 24

25 Outline of Statement of Work (SOW) Background to work Scope of project Purpose of project What the project IS/IS NOT Business Impact Previous/current related work Outcome of project Prospective Participants Project Schedule with Milestones Resources required from project participants Project monitoring plan General and administrative guidelines. 25

26 inemi Statement of Work Basic Information Scope of Work definition of what is to be done Describe what work will be done State the major goals of the project at the end of project deliverables Provide an approximate timeframe for major phases of the project and for completion Purpose of Project Explain how the project aligns to the roadmap and what gaps will be filled Will the project provide a complete solution or be part of a complex solution? List anticipated benefits to participants, to the inemi membership in general, and the industry 26

27 inemi Statement of Work (SOW) Business Impact Provide information on what impact this project will have on Participating organization inemi member companies Industry as a whole Outcome of Project List addressed issues that are expected to addressed and/or resolved, e.g., identify gaps, report(s) on results of any testing, etc. List expected deliverables and project milestones Sharing Project Results: To be determined by the project team on what information will be shared outside of the team. NOTE: All changes to SOW must be approved by TC 27

28 inemi Project Process

29 IS / IS NOT Analysis 29

30 Successful inemi Projects Address knowledge gap(s) of industry: Common problem Best solved by working together Timed success that aligns to business needs Best manifested on complex far reaching issues Often includes reliability testing & verification Requires teamwork across multiple levels of the supply chain: Ensures efficient alignment of goals and investments of the varied team players; Supports the company s commercial interests. Delivers a coordinated industry wide response and capability set. OEM/ODM/EMS/Suppliers at multiple levels. 30

31 The Project Development Process - 5 Steps INPUT SELECTION DEFINITION Initiative Open for Industry input PLANNING EXECUTION / REVIEW CLOSURE Project Limited to committed Members 31

32 2 Definition Organization Stakeholders Background Objectives Deliverables Benefits Skills required Risks Scope Costs TC APPROVAL TO PROCEED Decision after Review Is it still valid? Is the market forecast valid? Do we have resources? What is current priority? What are the consequences of aborting now? 32

33 3 Planning TC Time estimates Initial schedule Resource analysis Optimization Risk review Issue resolution Prepare to implement Decision after Review Is the schedule acceptable to participating member companies? Are resources committed? Do we still want to do it? Is current priority correct? APPROVAL TO PROCEED 33

34 3 Output of Planning Process Project Leadership SOW (Statement of Work) Document Describing the Project PS (Project Statement) Document Defining: What each Firm Will Contribute The rules for the Project Firm Commitment from Management SOW and PS are described at TC APPROVAL TO PROCEED 34

35 Potential Project Structure 1. Current Situation Analysis Phase Understand current systems and gaps/issues Defines Next Phase Builds participants Trust 2. Development Phase Drafts Tentative Requirements Validate effectiveness 3. Marketing Phase Work with all Stakeholders to obtain acceptance 35