Co-Tech. The First Choice Of Copper Foil Solution Provider P A
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- Calvin Parsons
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1 P A
2 Agenda Company overview Product & technology roadmap Production line Quality Assurance Certificates P 1
3 Company Overview Taiwan Stock market : OTC 8358 Date Established : 1998 May Capital: NTD 2.1 Billion Products: Copper Foil No. of Employees: 295 P 2
4 Company Milestone 1998 Co-Tech established, started to build manufacturing site 2000 Plant 1 started production ISO-9001 / ISO Plant 2 started production Shen Zhen customer svc & logistics commenced operations 1/3oz(12u)started production 2003 Successfully developed Copper Foil for hi-speed digital PCB(Microwave) Taiwan (Patent NO:199216) China (Patent NO:184828) 2005 Successfully developed Halogen Free & Lead Free Copper Foil P 3
5 Company Milestone 2006 ISO-14001: 2004 certified Honored with Sustainable Development Awards No 1 ranking Honored with Green Products Award 2007 Started trading in Taiwan emerging stock market Ticker : Switch from emerging market to OTC successfully Annual production capacity 18,000 Ton From Lead anode to Titanium anode 2012 FR4, BGA, Double Shinny LIB 2016 Double treatment foil. VLP. Thin RTF. FCCL. P 3
6 Company Philosophy Integrity Innovation Commitment Quality Technology Service Delivery P 4
7 Production Sites (Copper Foil) Production site 1 (Yunlin Technology Industrial District) Year Built : 1998 Total floor space: 24,998 m2 Quality Cert: ISO-9001, ISO Capacity:600mt, 500k sheet Products: ED copper foil - SD, HB, RT Series---9u,18u, 35u, 70u,105u,140u Production site 2 (Yunlin Technology Industrial District) Year Built : 2002 Total floor space: : 39,999 M2 Quality: ISO-9001, ISO Capacity: 1000mt, 1M sheet Products: ED copper foil- LP, HB, VLP, AKH LP RT Series---9u, 18u, 35u, 70u,105u,140u P 8
8 Application of Copper Foil Lithium-ion Bat 5.2% CCL PCB 77.2% Others 11.2% EMI. Paper. PDP Copper Foil FCCL FPCB 2.6% Packaging 3.8% Battery Assembly
9 1. IC Substrate VL FPCB RV-410(<8um) Technology Roadmap 1. HDI LP310/RT LIB DS620/DS FPCB RV410 Future BGA/FCCL(<8um) Now HDI /Battery/FCCL 2006 Green product Yates Technology 2004 Microwave. Base Station Flex. Automotive. Military. Portable Computer. Notebook. Peripheral. Electronic Devices.
10 Raw Material of Copper Foil
11 Production of Copper Foil
12 Automatic Control System for Drum Solution Automatic X-ray fluorescence(xrf) On-line analyzer for Drum solution control
13 Automatic X-ray fluorescence(xrf) On-line analyzer for Treater solution control Automatic Control System for Treater Solution Temperature Control System Temp. Control of Line 1 Solution Temp. control
14 Clean Room Environment Slitting room under class 10,000 clean room environment Installed HEPA filter particles down to 0.3 micron meter and 99.99%efficiency Avoid Pits and Dents defect
15 Sticky Roller Copper Chip Control Sticky Paper Sticky Roller
16 Double Side Sheeter Cut matte/shiny twin sheet at once Advantage for PCB House: Eliminate flipping foil procedure Avoid wrinkle during flipping Simple lay up system, less space Improve yield rate
17 Sheeter Sheeter Cosmetic Inspection
18 CCD Inspection
19 Packaging Warehouse Package
20 Equipment UV Spectrophotometer Cu,Cl - Titrator Metallurgical Microscope AA (Atomic Absorption Spectrometer)
21 Equipment TOC 分析儀 CVS 分析儀 電解分析儀 GC (Gas Chromatography)
22 Equipment 高溫灰化爐 ICP (Inductively Coupled Plasma) Sieve Tester Haring Cell Hull Cell
23 Structure Analysis SEM/EDX EDX Analysis
24 Environment Protection
25 Awards
26 Our PCB Clients
27 Our CCL Clients
28 Certification ISO/TS Certificate CNS Certificate OHSAS Certificate ISO-9001 Certificate ISO Certificate ISO Certificate
29 THANK YOU
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