Stretchable electronics

Size: px
Start display at page:

Download "Stretchable electronics"

Transcription

1

2 Stretchable electronics Constraints and possibilities for direct printing on thermoplastic polyurethanes From flexible printed electronics to stretchable Eric Rubingh, Corné Rentrop, Piet Bouten

3 < 3 Holst Centre in a nutshell Who we are Open innovation research institute Founded in 2005 by imec (1300 fte, BE) and TNO (4500 fte, NL) Located at the High Tech Campus in Eindhoven, The Netherlands Own staff 310 researchers What we do Developing technologies for printed electronics and wireless autonomous microsystems In close collaboration with leading industrial partners along the value chain Holst Centre R2R lab Thin Film clean room Electronic measurement OLED Device Processing Equipment Engineering Life Sciences Materials Analysis Photonics cleanroom EMC lab Electronic Prototyping Reliability lab Holst Centre Offices

4 < 4 Holst Centre: Technologies targeted Hybrid printed electronics such as wearable health monitoring and pressure sensor systems Low power sensor systems for monitoring food, air, water quality Low-cost solar cells, CIGS, Thin film, Perovskites, OPV Flexible OLED lighting and displays

5 < 5 Holst Centre: Technologies targeted Hybrid printed electronics such as wearable health monitoring and pressure sensor systems Low power sensor systems for monitoring food, air, water quality Combine into wearables Low-cost solar cells, CIGS, Thin film, Perovskites, OPV Flexible OLED lighting and displays

6 < 6 An explosion of wearable tech

7 < 7 Clothing as wearable tech platform Smart clothing We all wear it and it covers most of our body Monitor vital signs, location, Electronics should be conformable, stretchable, washable,

8 < 8 Wearable electronics, from flexible to stretchable Version 1 Lamination of printed flexible structures Printing of functional structures on thin films Assembly of components Textile lamination with TPU Using standard printed electronics materials Version 2 Lamination of printed stretchable structures Printing functional structures with meanders on films Assembly of components Laser structuring of meanders Textile lamination on TPU Using standard printed electronics materials Version 3 Direct printed stretchable structures Printing of functional structures on TPU Assembly of components Textile lamination Using special stretchable materials

9 < 9 Wearable electronics, from flexible to stretchable Version 1 Lamination of printed flexible structures Printing of functional structures on thin films Assembly of components Textile lamination with TPU Using standard printed electronics materials Version 2 Lamination of printed stretchable structures Printing functional structures with meanders on films Assembly of components Laser structuring of meanders Textile lamination on TPU Using standard printed electronics materials Version 3 Direct printed stretchable structures Printing of functional structures on TPU Assembly of components Textile lamination Using special stretchable materials

10 Version 1: Lamination of printed flexible structures Start from thin plastic films Holst Centre < 10 Typical polymers: polyesters (PEN/PET), polycarbonate (PC), polystyrene (PS) Typical thicknesses: um

11 Version 1: Lamination of printed flexible structures Printing of complex multi-layer structures Holst Centre < 11 Physical activity monitoring patch Multi-layer circuit patterns Done by printing alternating layers of conductive and isolating inks Printing up to 5 circuit layers demonstrated

12 Version 1: Lamination of printed flexible structures Component integration Holst Centre < 12 WiFi tag on film, 5 stacked circuit layers Component integration Several technologies available for reliable integration of components on PE foils Based on ACA, ICA or special soldering technologies

13 Smart textiles Accelerometer Heart rate monitoring Location Not Stretchable Version 1: Lamination of printed flexible structures Textile lamination with TPU Holst Centre 13

14 < 14 Wearable electronics, from flexible to stretchable Version 1 Lamination of printed flexible structures Printing of functional structures on thin films Assembly of components Textile lamination with TPU Using standard printed electronics materials Version 2 Lamination of printed stretchable structures Printing functional structures with meanders on films Assembly of components Laser structuring of meanders Textile lamination on TPU Using standard printed electronics materials Version 3 Direct printed stretchable structures Printing of functional structures on TPU Assembly of components Textile lamination Using special stretchable materials

15 < 15 Version 2: Meander approach for stretchable PE Meander approach Make local spring structures ( meanders ) in the printed electronics film Structures are stretchable through opening/out-of-plane bending Less strain on printed structures/lines The result A stretchable device made from a flexible printed electronics film

16 < 16 Version 2: Meander approach for stretchable PE start from polyester film print electronic structures assemble components laser structure meander Encapsulate in TPU film Washable Laminate on fabric TPU PEN TPU Out of plane deformation of meanders allows stretchability Encapsulation into polyurethane enables washability

17 < 17 Version 2: Meander approach for stretchable PE

18 < 18 Version 2: Meander approach for stretchable PE

19 Version 2: Meander approach for stretchable PE Holst Centre < 19 or PCB s that are stretchable Reliability of meander approach Reliability of meander approach + component integration Flex testing 2 mm radius) and stretch testing 20% strain) Washability: 25 washing cycles at 50 o C successfully completed Main failure cause: mechanical damage (drum rotation)

20 Version 2: Meander approach for stretchable PE Health Patch Holst Centre < 20 Wearables: Health patch Printed electrical sensors Enables ECG, EMG and breathing analysis Worn as a patch on the body for several days Using stretch technologies for improved comfort

21 Version 2: Meander approach for stretchable PE Smart garment Holst Centre < 21 Smart Garment: Printed electrical sensors Enables ECG, EMG etc. Lamination into shirt using TPU Using stretch technologies for reduction of motion artifacts

22 < 22 Wearable electronics, from flexible to stretchable Version 1 Lamination of printed flexible structures Printing of functional structures on thin films Assembly of components Textile lamination with TPU Using standard printed electronics materials Version 2 Lamination of printed stretchable structures Printing functional structures with meanders on films Assembly of components Laser structuring of meanders Textile lamination on TPU Using standard printed electronics materials Version 3 Direct printed stretchable structures Printing of functional structures on TPU Assembly of components Textile lamination Using special stretchable materials

23 Version 3: Direct printing of electronics on TPU < 23 Thermoplastic polyurethane: Foldable and stretchable One step lamination onto textile TPU used extensively in garments and graphical printing industry

24 < 24 Thermoplastic polyurethanes (TPU) Stretchable Robust Solvent resistant Washable Adjustable mechanical properties Hardness, young s module, stress /strain characteristics But also: Creep /Hysteresis Thermal shrinkage Time dependency Strain hardening Residual strain *Desmophan - Covestro

25 < 25 Mechanical testing of TPU s and printed structures Test Set-up Instron Tensile Tester Influence stress-strain on resistance Monitor Load, displacement and resistance Evaluate TPU substrates Different types of TPU Polyester or polyether based Different thicknesses and E-moduli Characteristics Compatibility with printing process Thermal shrinkage, creep, residual strain Evaluate stretchable inks and pastes Types of materials Conductive pastes, dielectrics, sensor materials, adhesives Characteristics Stretchability, adhesion, cohesion Conductivity under/after strain Component assembly and die shear testing

26 < 26 Mechanical testing of TPU s and printed structures Typical test regimes Linear strain Stretching until failure Report absolute and relative resistance (ΔR/R [%]) Progressive strain Deformation: 2% - 5% - 10% - 15% - 20% Hysteresis effect Report residual strain Report absolute and relative resistance (ΔR/R [%]) Cyclic strain tests Repeated deformation (20% - relaxation) 100 times and up Report maximum and minimum stress/resistance

27 < 27 Mechanical testing: Linear strain Stress/resistance under line strain Resistance is increasing exponentially Conductivity in line fully lost at 70% strain Workable resistance until 30% strain End Start

28 < 28 Mechanical testing: Progressive strain Progressive strain curves as a function of used TPU Residual strain varies per type But residual strain is not the only important parameter! Residual strain 5% Residual strain 2.1% Residual strain 1.3%

29 ΔR/R [%] Stress [MPa] Holst Centre < 29 Mechanical testing: Progressive strain Influence progressive strain on line resistance Resistance increases with increasing strain Max ΔR/R at 20% strain: 275% Resistance in relaxed state after testing important ΔR/R after progressive strain test: 100% Partly caused by residual strain in TPU Partly caused by reorientation of particles in structure No visible defects/cracks in line Visual inspection after test Bright field: 50x Bright field: 500x Dark field: 200x Strain [%] 0

30 < 30 Mechanical testing: Progressive strain Stress-strain-resistance curves as a function of used silver paste Several commercial silver pastes tested Paste A: Time dependency observed in relaxation curve Paste A: Time dependency resolved by over-coating Paste B: High stretchability with increased stiffness Paste C: High conductivity, no stretchability Paste D: High conductivity, high residual strain Silver paste characteristics Printability Adhesion and cohesion Stretchability Conductivity Initial Max strain After strain Component assembly Die shear strength

31 < 31 Mechanical testing: Progressive strain Stress-strain-resistance curves as a function TPU substrate Using silver paste B TPU with high residual strain TPU with low residual strain Observations Resistance curves on both TPU substrates very similar Minimal resistance for low residual strain TPU slightly lower Maximal resistance at strain for high residual strain TPU lower

32 < 32 Mechanical testing: Cyclic strain test Stress-strain-resistance curves as a function of cycles Using silver paste B Resistance at min and max strain increases After ~70 cycles min strain stabilizes After ~150 cycles max strain stabilizes Stress 20% strain (high) Stress 7% strain (low) Resistance 20% strain Resistance 7% strain

33 Demonstrator direct printing on TPU Holst Centre < 33 Health patch on TPU Monitor vital signs 3 layer prints Sufficient registration Stretchable

34 < 34 Demonstrator direct printing on TPU Flex smell platform Sensor platform on TPU Temperature and capacitive sensors NFC enabled, app assisted

35 < 35 Other applications Light in clothing Designer jacket Display in clothing Solar shirt Pressure sensor shoe-inlay

36 < 36 Conclusions and work in progress Large variety of TPU substrates available Stress-strain behavior and residual strain important Several other parameters also important Thermal stability, printability, lamination quality and washability Cyclic tests typically reveal stability after ~70 cycles Change of TPU changes stress/strain behavior and performance of pastes Large difference between stretchable pastes Conductivity Stretchability Compatibility with TPU Possible to create functional demonstrators Work in progress Improved component integration in stretchable electronics Washability of devices with larger components Other substrate types like Silicone

37 < 37 Thank you

Manipulation and control of spatial ALD layers for flexible devices. Aimcal Memphis 2016; Edward Clerkx

Manipulation and control of spatial ALD layers for flexible devices. Aimcal Memphis 2016; Edward Clerkx Manipulation and control of spatial ALD layers for flexible devices Meyer Burger Netherlands Equipment manufacturer Functional inkjet printing Based in Eindhoven, the Netherlands Part of world-wide Meyer

More information

Graphic overlays and touch foils High volume printed products

Graphic overlays and touch foils High volume printed products Graphic overlays and touch foils High volume printed products Mekoprint for more than 60 years Mekoprint is a privately owned company with approx. 260 employees and several production sites. We supply

More information

Polymer Thick Film Paste & Material Compatibility Discussion

Polymer Thick Film Paste & Material Compatibility Discussion Polymer Thick Film Paste & Material Compatibility Discussion John Crumpton September 14, 2015 Agenda What is a Polymer thick Film Basic Thick Film Paste Technology Standard Processing (Printing & Drying)

More information

Novel Wiring Structure for 3D-Conformable Devices

Novel Wiring Structure for 3D-Conformable Devices Sawada et al.: Novel Wiring Structure for 3D-Conformable Devices (1/6) [Technical Paper] Novel Wiring Structure for 3D-Conformable Devices Susumu Sawada*, Yoshihiro Tomita*, Koichi Hirano*, Hiromi Morita*,

More information

Integration and Packaging

Integration and Packaging Workshop on Smart Systems for Healthcare and Wellness Brusselles 4.2.2014 Hosted by the CATRENE Scientific Committee Integration and Packaging Erik Jung, Harald Pötter Medical Innovations.. and requirements

More information

Novel Polysulfide Substrates for Flexible Electronics. Tolis Voutsas, Ph.D. VP, Business Development Ares Materials, Inc.

Novel Polysulfide Substrates for Flexible Electronics. Tolis Voutsas, Ph.D. VP, Business Development Ares Materials, Inc. Novel Polysulfide Substrates for Flexible Electronics Tolis Voutsas, Ph.D. VP, Business Development Ares Materials, Inc. Contents 6/21/2017 2 Company overview Founded 2014, spin-out of the University of

More information

Reliability of Interconnects in LED Lighting Assemblies Utilizing Metal Clad Printed Circuit Boards Stefano Sciolè BDM I.M.S.

Reliability of Interconnects in LED Lighting Assemblies Utilizing Metal Clad Printed Circuit Boards Stefano Sciolè BDM I.M.S. Reliability of Interconnects in LED Lighting Assemblies Utilizing Metal Clad Printed Circuit Boards Stefano Sciolè BDM I.M.S. Henkel Electronic Materials Agenda 1. Introduction 2. Motivation 3. Interconnect

More information

Silicone based sensors and actuators for medical diagnosis

Silicone based sensors and actuators for medical diagnosis Silicone based sensors and actuators for medical diagnosis Dr. Bernhard Brunner, Fraunhofer ISC, Würzburg Aachen - Dresden - Denkendorf International Textile Conference 11-30-2017 / 12-1-2017, Stuttgart

More information

ScienceDirect. Arbitrarily shaped 2.5D circuits using stretchable interconnections and embedding in thermoplastic polymers

ScienceDirect. Arbitrarily shaped 2.5D circuits using stretchable interconnections and embedding in thermoplastic polymers Available online at www.sciencedirect.com ScienceDirect Procedia Technology 15 (2014 ) 208 215 2nd International Conference on System-Integrated Intelligence: Challenges for Product and Production Engineering

More information

HONEYCOMB MECHANICAL BEHAVIOR USING MACROINDENTATION

HONEYCOMB MECHANICAL BEHAVIOR USING MACROINDENTATION HONEYCOMB MECHANICAL BEHAVIOR USING MACROINDENTATION. Prepared by Duanjie Li, PhD 6 Morgan, Ste156, Irvine CA 92618 P: 949.461.9292 F: 949.461.9232 nanovea.com Today's standard for tomorrow's materials.

More information

Printable elastic conductors by in situ formation of silver nanoparticles from silver flakes

Printable elastic conductors by in situ formation of silver nanoparticles from silver flakes In the format provided by the authors and unedited. DOI: 10.1038/NMAT4904 Printable elastic conductors by in situ formation of silver nanoparticles from silver flakes Naoji Matsuhisa 1, Daishi Inoue 2,

More information

Thermo-Mechanical Analysis of Flexible and Stretchable Systems Mario Gonzalez 1, Bart Vandevelde 1, Wim Christiaens 2, Yung-Yu Hsu 1, François Iker 1, Frederick Bossuyt 1, Jan Vanfleteren 1,2, Olaf van

More information

Flexible piezoelectric materials for emerging applications

Flexible piezoelectric materials for emerging applications Flexible piezoelectric materials for emerging applications Konstantin Astafiev, Tomasz Zawada, Karl Elkjaer, and Erling Ringgaard MEGGITT A/S, MSS, Denmark Piezo 2013 - Electroceramics for End-users VII,

More information

All-Polyimide Thermal Interface Products

All-Polyimide Thermal Interface Products All-Polyimide Thermal Interface Products SMTA Harsh Environment Electronics Workshop Dearborn, MI 6/24/03 Jim Fraivillig Fraivillig Technologies Boston, MA Why polyimide? HARSH ENVIRONMENT ELECTRONICS.

More information

I VE GOT YOU UNDER MY SKIN

I VE GOT YOU UNDER MY SKIN I VE GOT YOU UNDER MY SKIN Stretchable electronic arrays. The LED sheets can be twisted by 720 degrees and considerably stretched. The wavy metal wires are visible in the image on the on the right. Reprinted

More information

EXCIMER LASER ANNEALING FOR LOW- TEMPERATURE POLYSILICON THIN FILM TRANSISTOR FABRICATION ON PLASTIC SUBSTRATES

EXCIMER LASER ANNEALING FOR LOW- TEMPERATURE POLYSILICON THIN FILM TRANSISTOR FABRICATION ON PLASTIC SUBSTRATES EXCIMER LASER ANNEALING FOR LOW- TEMPERATURE POLYSILICON THIN FILM TRANSISTOR FABRICATION ON PLASTIC SUBSTRATES G. Fortunato, A. Pecora, L. Maiolo, M. Cuscunà, D. Simeone, A. Minotti, and L. Mariucci CNR-IMM,

More information

Soft Micro/Nano-structured Sensors for Flexible and Wearable Physical Sensing

Soft Micro/Nano-structured Sensors for Flexible and Wearable Physical Sensing The 15 th Korea-US Forum on Nanotechnology Soft Micro/Nano-structured Sensors for Flexible and Wearable Physical Sensing Inkyu Park, Ph.D. Associate Professor, Department of Mechanical Engineering Co-director,

More information

Durable Conductive Inks and SMD Attachment for Robust Printed Electronics

Durable Conductive Inks and SMD Attachment for Robust Printed Electronics Durable Conductive Inks and SMD Attachment for Robust Printed Electronics Leonard Allison Engineered Materials Systems, Inc. Delaware, OH lallison@conductives.com Abstract Polymer Thick Film (PTF)-based

More information

Anisotropic Conductive Films (ACFs)

Anisotropic Conductive Films (ACFs) Anisotropic Conductive Films (ACFs) ACF = Thermosetting epoxy resin film + Conductive particles Chip or substrate 1 Heat Pressure ACF Substrate 2 Chip or substrate 1 ACF Substrate 2 Applications Chip-on-Board

More information

Characterization of Physical Properties of Roadware Clear Repair Product

Characterization of Physical Properties of Roadware Clear Repair Product Characterization of Physical Properties of Roadware Clear Repair Product November 5, 2009 Prof. David A. Lange University of Illinois at Urbana-Champaign Introduction Roadware MatchCrete Clear (MCC) is

More information

Adhesives, Inks and Encapsulants

Adhesives, Inks and Encapsulants Selector Guide Electronic Materials Series Adhesives, Inks and Encapsulants Printed Electronics Conductive Inks Non-Conductive Inks Stretchables Microelectronic Assembly Electrically Conductive Adhesives

More information

InMold Electronics. Flexible Hybrid Electronics, MEMS and Sensors in the Automotive Industry and Related Transportation Markets Workshop 9/13/2017

InMold Electronics. Flexible Hybrid Electronics, MEMS and Sensors in the Automotive Industry and Related Transportation Markets Workshop 9/13/2017 Flexible Hybrid Electronics, MEMS and Sensors in the Automotive Industry and Related Transportation Markets Workshop 9/13/2017 InMold Electronics John Crumpton Agenda What is InMold Electronics Enabling

More information

Affix Technology Sdn. Bhd.

Affix Technology Sdn. Bhd. Affix Technology Sdn. Bhd. Double Sided Foam Tapes Double Sided Foam Tape is made out of foam of PE, PU, PVC and EVA coated with various types of adhesive for various applications. This tape is available

More information

Progress in Printed TEGs Thermoelectric Network, Manchester, 15/02/2017. Thomas Fletcher

Progress in Printed TEGs Thermoelectric Network, Manchester, 15/02/2017. Thomas Fletcher Progress in Printed TEGs Thermoelectric Network, Manchester, 15/02/2017 Thomas Fletcher Introduction to CDT CDT is a spin-out company from the Cavendish Laboratory, University of Cambridge (1992), part

More information

Thermal-Tab and Thermal-Ribbon Sensors

Thermal-Tab and Thermal-Ribbon Sensors Thermal-Tab and Thermal-Ribbon Sensors Install these compact sensors anywhere for accurate point sensing and fast response. All Thermal-Tab modules use a thin-film RTD element. All Thermal-Ribbon models

More information

Embedded Passives..con0nued

Embedded Passives..con0nued Embedded Passives..con0nued Why Embedded Passives? Improves the packaging efficiency System-on-Package (SOP); SLIM integration Reducing size Eliminating substrate assembly Minimizing solder joint failure

More information

YIELD & TENSILE STRENGTH OF STEEL & ALUMINIUM USING MICROINDENTATION

YIELD & TENSILE STRENGTH OF STEEL & ALUMINIUM USING MICROINDENTATION YIELD & TENSILE STRENGTH OF STEEL & ALUMINIUM USING MICROINDENTATION Prepared by Duanjie Li, PhD & Pierre Leroux 6 Morgan, Ste156, Irvine CA 9618 P: 949.461.99 F: 949.461.93 nanovea.com Today's standard

More information

The Global Market for Single-Walled Carbon Nanotubes TABLE OF CONTENTS 1 RESEARCH METHODOLOGY... 18

The Global Market for Single-Walled Carbon Nanotubes TABLE OF CONTENTS 1 RESEARCH METHODOLOGY... 18 TABLE OF CONTENTS 1 RESEARCH METHODOLOGY... 18 1.1 Market opportunity rating system... 18 1.2 Market challenges rating system... 20 2 EXECUTIVE SUMMARY... 23 2.1 Exceptional properties... 24 2.2 Products

More information

AIMCAL R2R Conference

AIMCAL R2R Conference Contents Introduction Markets OLED Structures Technology Fabrication Process Evaluation (Microstructure & etc) Summary Introduction [Merit of Rigid OLED Display] Cheap product cost Mass production Free

More information

3M Electromagnetic Compatible Products

3M Electromagnetic Compatible Products 3M Electromagnetic Compatible Products Selection Guide Revision E 3 Innovation Faster, smaller, lighter, easier the skyrocketing development of today s electronics requires new solutions for significant

More information

ACS Nano, 2014, 8, Anirban Som

ACS Nano, 2014, 8, Anirban Som ACS Nano, 2014, 8, 4689 4697. Anirban Som 04-06-14 Introduction Human skin possesses a high degree of flexibility and stretchability and can sense pressure, shear, strain, temperature, humidity, fluid

More information

AIMCAL Fall Technical Conference & 19th International Conference on Vacuum Web Coating

AIMCAL Fall Technical Conference & 19th International Conference on Vacuum Web Coating AIMCAL Fall Technical Conference & 19th International Conference on Vacuum Web Coating A.G. Talma, R. Schlatmann, J.W.G. Mahy Akzo Nobel Chemicals bv, P.O. Box 9300, 6800 SB Arnhem, The Netherlands. Phone

More information

Stretching the limits of high conductivity ~High-performing elastic conductor realized by self-forming Ag nanoparticles~

Stretching the limits of high conductivity ~High-performing elastic conductor realized by self-forming Ag nanoparticles~ School of Engineering, The University of Tokyo Japan Science and Technology Agency (JST) RIKEN Press release May 11 th, 2017 Stretching the limits of high conductivity ~High-performing elastic conductor

More information

CONDUCTIVE ADHESIVES FOR LOW-STRESS INTERCONNECTION OF THIN BACK-CONTACT SOLAR CELLS

CONDUCTIVE ADHESIVES FOR LOW-STRESS INTERCONNECTION OF THIN BACK-CONTACT SOLAR CELLS ECN-RX--02-027 CONDUCTIVE ADHESIVES FOR LOW-STRESS INTERCONNECTION OF THIN BACK-CONTACT SOLAR CELLS D.W.K. Eikelboom J.H. Bultman A. Schönecker M.H.H. Meuwissen * M.A.J.C. van den Nieuwenhof * D.L. Meier

More information

Microelectronic Materials CATALOG

Microelectronic Materials CATALOG Microelectronic Materials CATALOG LORD partners with customers to leverage expertise in multiple chemistries and diverse applications to develop customized solutions. Design Without Compromise At LORD,

More information

BGA Package Underfilm for Autoplacement. Jan Danvir Tom Klosowiak

BGA Package Underfilm for Autoplacement. Jan Danvir Tom Klosowiak BGA Package Underfilm for Autoplacement Jan Danvir Tom Klosowiak NIST-ATP Acknowledgment Project Brief Microelectronics Manufacturing Infrastructure (October 1998) Wafer-Scale Applied Reworkable Fluxing

More information

Engineering. Composiies. CRC Press. Taylor & Francis Croup. Boca Raton London New York. CRC Press is an imprint of the

Engineering. Composiies. CRC Press. Taylor & Francis Croup. Boca Raton London New York. CRC Press is an imprint of the Engineering Design with Polymers and Composiies Second Edition lames G. Gerdeen, PhD, PE Ronald A. L. Rorrer, PhD, PE CRC Press Taylor & Francis Croup Boca Raton London New York CRC Press is an imprint

More information

ELASTIC-PLASTIC RESPONSE OF POLYMER COATING UNDER REPETITIVE IMPACT

ELASTIC-PLASTIC RESPONSE OF POLYMER COATING UNDER REPETITIVE IMPACT ELASTIC-PLASTIC RESPONSE OF POLYMER COATING UNDER REPETITIVE IMPACT Prepared by Duanjie Li, PhD & Braden Altstatt 6 Morgan, Ste156, Irvine CA 9618 P: 949.461.99 F: 949.461.93 nanovea.com Today's standard

More information

Flexible Substrates for Smart Sensor Applications

Flexible Substrates for Smart Sensor Applications Flexible Substrates for Smart Sensor Applications A novel approach that delivers miniaturized, hermetic, biostable and highly reliable smart sensor modules. AUTHORS Dr. Eckardt Bihler, Dr. Marc Hauer,

More information

NANO SCRATCH TESTING OF THIN FILM ON GLASS SUBSTRATE

NANO SCRATCH TESTING OF THIN FILM ON GLASS SUBSTRATE NANO SCRATCH TESTING OF THIN FILM ON GLASS SUBSTRATE Prepared by Jesse Angle 6 Morgan, Ste156, Irvine CA 92618 P: 949.461.9292 F: 949.461.9232 nanovea.com Today's standard for tomorrow's materials. 2010

More information

Challenges for Embedded Device Technologies for Package Level Integration

Challenges for Embedded Device Technologies for Package Level Integration Challenges for Embedded Device Technologies for Package Level Integration Kevin Cannon, Steve Riches Tribus-D Ltd Guangbin Dou, Andrew Holmes Imperial College London Embedded Die Technology IMAPS-UK/NMI

More information

The Pros of Conformal Coatings

The Pros of Conformal Coatings The Pros of Conformal Coatings Choosing the right coating to preserve and protect electronics in harsh environments Introduction Many chemicals found in the oil, gas, and petrochemical industries can consign

More information

DURABILITY OF PRESSURE SENSITIVE ADHESIVE JOINTS

DURABILITY OF PRESSURE SENSITIVE ADHESIVE JOINTS DURABILITY OF PRESSURE SENSITIVE ADHESIVE JOINTS Paul Ludwig Geiss, Daniel Vogt Kaiserslautern University of Technology, Faculty Mechanical and Process Engineering, Workgroup Materials and Surface Technologies

More information

Microelectronic Materials. Catalog

Microelectronic Materials. Catalog Microelectronic Materials Catalog LORD partners with customers to leverage expertise in multiple chemistries and diverse applications to develop customized solutions. Design Without Compromise At LORD,

More information

3M Electrically Conductive Adhesive Transfer Tape 9707

3M Electrically Conductive Adhesive Transfer Tape 9707 Technical Data May 2014 3M Electrically Conductive Adhesive Transfer Tape 9707 Product Description 3M Electrically Conductive Adhesive Transfer Tape (ECATT) 9707 is a pressure sensitive adhesive (PSA)

More information

IMRE/ETPL Flagship Project

IMRE/ETPL Flagship Project IMRE/ETPL Flagship Project Nanoparticulate Barrier Films & Gas Permeation Measurement Techniques for Thin Film Solar & Display Application Problems Senthil Ramadas Institute of Materials Research & Engineering

More information

Advances in Printed Electronic Materials that Meet Cost and Performance Needs

Advances in Printed Electronic Materials that Meet Cost and Performance Needs Advances in Printed Electronic Materials that Meet Cost and Performance Needs Mark S. Critzer DuPont Microcircuit Materials Research Triangle Park, NC mcm.dupont.com 1-800-284-3382 Agenda DuPont & Printed

More information

C Technical Data Sheet. Heat transfer Elastic Domestic wash Silver. Product Description. Product Construction. Areas of Applications

C Technical Data Sheet. Heat transfer Elastic Domestic wash Silver. Product Description. Product Construction. Areas of Applications C532 100 Heat transfer Elastic Domestic wash Silver Technical Data Sheet Product Description Coats Signal C532 100 is an elastic retro reflective heat transfer for all types of high visibility applications.

More information

Bonding to different materials possible (multi-purpose). Sealing, molding and potting purpose. Items Units Results Testing Method Remarks

Bonding to different materials possible (multi-purpose). Sealing, molding and potting purpose. Items Units Results Testing Method Remarks TB 53 TECHNICAL DATA ThreeBond 53 Single Component Moisture Cure Type Elastic Adhesive Three Bond 53 is a single-component elastic adhesive, which cures in the presence of moisture. The polymer material

More information

Electronic Design & Manufacture Hardware, Software and IoT Capabilities Under One Roof

Electronic Design & Manufacture Hardware, Software and IoT Capabilities Under One Roof Electronic Design & Manufacture Hardware, Software and IoT Capabilities Under One Roof Electronic Design & Manufacture Selecting a development and manufacturing partner is often the most important decision

More information

Compression Sensing Element

Compression Sensing Element Compression Sensing Element #0SEC Compression Sensing Element Technical Data Sheet Product overview Compression Sensing Elements are soft and highly precise, designed to measure the forces between the

More information

Chapter 15: Characteristics, Applications & Processing of Polymers

Chapter 15: Characteristics, Applications & Processing of Polymers Chapter 15: Characteristics, Applications & Processing of Polymers What are the tensile properties of polymers and how are they affected by basic microstructural features? Hardening, anisotropy, and annealing

More information

Modelling Embedded Die Systems

Modelling Embedded Die Systems Modelling Embedded Die Systems Stoyan Stoyanov and Chris Bailey Computational Mechanics and Reliability Group (CMRG) University of Greenwich, London, UK 22 September 2016 IMAPS/NMI Conference on EDT Content

More information

PEC (Printed Electronic Circuit) process for LED interconnection

PEC (Printed Electronic Circuit) process for LED interconnection PEC (Printed Electronic Circuit) process for LED interconnection Higher wattage LED s/ power components or their placement in higher densities, requires a larger dissipation of heat in a more effective

More information

Flexible functional devices at mass production level with the FLEx R2R sald platform

Flexible functional devices at mass production level with the FLEx R2R sald platform Flexible functional devices at mass production level with the FLEx R2R sald platform D. Spee, W. Boonen, D. Borsa and E. Clerkx Meyer Burger (Netherlands) B.V. Meyer Burger Introduction to sald Challenges

More information

About Thermal Interface Materials

About Thermal Interface Materials About Thermal Interface Materials Thermal management is to ensure a long-term lifetime and functioning of electronic components such as power semiconductors in electronic circuits. All starts with a profound

More information

Building HDI Structures using Thin Films and Low Temperature Sintering Paste

Building HDI Structures using Thin Films and Low Temperature Sintering Paste Building HDI Structures using Thin Films and Low Temperature Sintering Paste Catherine Shearer, James Haley and Chris Hunrath Ormet Circuits Inc. - Integral Technology California, USA chunrath@integral-hdi.com

More information

Piezoelectric All-Rounder

Piezoelectric All-Rounder Piezoelectric All-Rounder Sensor, Actuator or Both? PI Ceramic GmbH, Lindenstraße, 07589 Lederhose, Germany Page 1 of 5 The Piezo Effect By the end of the 19th century Jacques und Pierre Curie had already

More information

TOUCHING EVERYDAY LIFE

TOUCHING EVERYDAY LIFE TOUCHING EVERYDAY LIFE Who are we? Our Brands Coating Services Medical Components WELCOME TO COVERIS ADVANCED COATINGS are global leaders in the development, manufacture and distribution of precision coated

More information

Energy-Efficient Strain Gauges for the Wireless Condition Monitoring Systems in Mechanical Engineering

Energy-Efficient Strain Gauges for the Wireless Condition Monitoring Systems in Mechanical Engineering 6th European Workshop on Structural Health Monitoring - We.4.C.2 More info about this article: http://www.ndt.net/?id=14052 Energy-Efficient Strain Gauges for the Wireless Condition Monitoring Systems

More information

Table of Contents. Robert A. Malloy. Plastic Part Design for Injection Molding. An Introduction ISBN:

Table of Contents. Robert A. Malloy. Plastic Part Design for Injection Molding. An Introduction ISBN: Table of Contents Robert A. Malloy Plastic Part Design for Injection Molding An Introduction ISBN: 978-3-446-40468-7 For further information and order see http://www.hanser.de/978-3-446-40468-7 or contact

More information

3M Electromagnetic Compatible Products

3M Electromagnetic Compatible Products 3M Electromagnetic Compatible Products 3Innovation Faster, smaller, lighter, easier the skyrocketing development of today s electronics requires new solutions for significant new problems. These solutions

More information

Chapter 15: Characteristics, Applications & Processing of Polymers

Chapter 15: Characteristics, Applications & Processing of Polymers Chapter 15: Characteristics, Applications & Processing of Polymers Study: 15.1-15.14 Read: 15.15-15.24 What are the tensile properties of polymers and how are they affected by basic microstructural features?

More information

"ITO Film Trend for Touch Panel Applications"

ITO Film Trend for Touch Panel Applications AIMCAL Web Coating Conference 2011 October 23-26 Reno, Nevada USA 1 "ITO Film Trend for Touch Panel Applications" Teijin Chemicals Ltd. Haruhiko Itoh 2 Content 1. Structure and Features of TCF 2. Touch

More information

Gage Series Stress Analysis Gages

Gage Series Stress Analysis Gages GAGE SERIES All Micro-Measurements strain gages incorporate precision foil grids mounted on organic backing materials. The strain-sensing alloys and backing materials cannot be arbitrarily combined in

More information

Introduction: Standard Plastic Terminology Plastic Program Analysis and Development p. 1 Selecting the Design Team for Success p. 3 Using Checklists

Introduction: Standard Plastic Terminology Plastic Program Analysis and Development p. 1 Selecting the Design Team for Success p. 3 Using Checklists Preface p. xv Introduction: Standard Plastic Terminology p. xix Plastic Program Analysis and Development p. 1 Selecting the Design Team for Success p. 3 Using Checklists to Develop Product Requirements

More information

Photonic Curing and Soldering

Photonic Curing and Soldering Photonic Curing and Soldering Ultra-fast Fabrication of Printed Electronics AIPIA Conference, Utrecht November 19 th, 215 Rob Hendriks Research Engineer Presentation overview Introduction Photonic Curing

More information

A novel pick-and-place process for ultra-thin chips on flexible smart systems Thomas Meissner (Hahn-Schickard)

A novel pick-and-place process for ultra-thin chips on flexible smart systems Thomas Meissner (Hahn-Schickard) A novel pick-and-place process for ultra-thin chips on flexible smart systems Thomas Meissner (Hahn-Schickard) Dr. rer. nat. Outline 1. Introduction to Hahn-Schickard 2. Motivation 3. Pick process 4. Application

More information

EMC & RFI Products. EMC & RFI Products. OEM Electrical Insulation Tapes. OEM Liquid Resins. Heat Shrink

EMC & RFI Products. EMC & RFI Products. OEM Electrical Insulation Tapes. OEM Liquid Resins. Heat Shrink EMC & RFI Products For more than 40 years 3M Company has been one of the foremost sources of effective electromagnetic compatible (EMC) solutions. Many of the world s leading electronic and electrical

More information

3M Thermal Bonding Film 668

3M Thermal Bonding Film 668 Technical Data May 2014 3M 668 Product Description 3M 668 is a flexible, light colored, thermoplastic adhesive bonding film which exhibits good adhesion to a variety of substrates. The bonding film is

More information

Epoxy. Epoxy 90, ,000. Epoxy. Epoxy. low ion content, Encapsulation of electronic

Epoxy. Epoxy 90, ,000. Epoxy. Epoxy. low ion content, Encapsulation of electronic - - and Light Curing Adhesives Our comprehensive range of systems covers a multitude of applications and offers many advantages: systems are used in many fields in both trade and industry. adhesives and

More information

Technische Information

Technische Information Technische Information Replaces Technical Information dated 11.03.04 Update: 09.02.05 Screenable, solvent based pressure sensitive adhesive KIWOPRINT TC 2000 is a high-quality pressure sensitive adhesive

More information

Introduction of CSC Pastes

Introduction of CSC Pastes Introduction of CSC Pastes Smart Phones & Conductive Pastes Chip Varistors Chip Inductors LC Filters Flexible Printed Circuit Boards Electronic Molding Compounds ITO Electrodes PCB Through Holes Semiconductor

More information

The word design means many different things to different people. Here, design is used to denote an educated method of choosing and adjusting the

The word design means many different things to different people. Here, design is used to denote an educated method of choosing and adjusting the The word design means many different things to different people. Here, design is used to denote an educated method of choosing and adjusting the physical parameters of a vibrating system in order to obtain

More information

Henkel to feature wide range of adhesive innovations for healthcare applications

Henkel to feature wide range of adhesive innovations for healthcare applications Press Release September 11, 2018 Henkel at COMPAMED 2018 Henkel to feature wide range of adhesive innovations for healthcare applications Düsseldorf, Germany At the COMPAMED fair in Düsseldorf (November

More information

3M Anisotropic Conductive Film (for Touch Screen Panel)

3M Anisotropic Conductive Film (for Touch Screen Panel) Technical Data November 2013 3M Anisotropic Conductive Film 7371-20 (for Touch Screen Panel) Product Description 3M Anisotropic Conductive Film (ACF) 7371-20 is a heat-bondable, electrically conductive

More information

Trends and Developments

Trends and Developments Trends and Developments Monique Mayr Monique.Mayr@eu.panasonic.com European R&M Group Panasonic Corporation Electronic Material Business Division Weitere Informationen finden Sie auch auf: http://www3.panasonic.biz/em/pcbm/en/index.html

More information

IPC Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures IPC-6015

IPC Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures IPC-6015 ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures February 1998 A standard developed

More information

Effect of Chip Dimension and Substrate Thickness on the Solder Joint Reliability of Plastic Ball Grid Array Packages* S.-W. Lee, J.H.

Effect of Chip Dimension and Substrate Thickness on the Solder Joint Reliability of Plastic Ball Grid Array Packages* S.-W. Lee, J.H. Page 1 of 9 Effect of Chip Dimension and Substrate Thickness on the Solder Joint Reliability of Plastic Ball Grid Array Packages* The Authors S.-W. Lee, J.H. Lau** S.-W. Lee, Center for Advanced Engineering

More information

Typical Properties. THERMATTACH Dielectric Thickness Thermal Material Strength Carrier Color inches (mm) Impedance Features/Typical Applications (Vac)

Typical Properties. THERMATTACH Dielectric Thickness Thermal Material Strength Carrier Color inches (mm) Impedance Features/Typical Applications (Vac) THERMATTACH Typical Applications bonding heat sinks to plastic packages (T410 and T411) bonding heat sinks to metal or ceramic packages (T404,T405 and T412) heat spreader to circuit board attachment (T413

More information

Design and Manufacturing of a Flexible Hybrid Electronics (FHE) Biometric Human Performance Monitor (BHPM)

Design and Manufacturing of a Flexible Hybrid Electronics (FHE) Biometric Human Performance Monitor (BHPM) Design and Manufacturing of a Flexible Hybrid Electronics (FHE) Biometric Human Performance Monitor (BHPM) Presented by Professor Mark Poliks Systems Science and Industrial Engineering Binghamton University

More information

VISION INNOVATE INSPIRE DELIVER

VISION INNOVATE INSPIRE DELIVER INSPIRE Vision About NovaCentrix Photonic Curing INNOVATE History Applications DELIVER Our Products SimPulse Conductive Inks NanoPowders VISION NovaCentrix partners with you to take ideas from inspiration

More information

Joining Sub Platform

Joining Sub Platform Joining Sub Platform to Manufuture Joining A Core Element to Innovative and Sustainable Manufacturing Top Level Objectives Support the European 2020 Strategy in addressing the grand challenges in the areas

More information

THE DESIGN OF EXTERNALLY BONDED REINFORCEMENT (EBR) FOR REINFORCED CONCRETE STRUCTURES BY MEANS OF FIBRE REINFORCED POLYMERS (FRP)

THE DESIGN OF EXTERNALLY BONDED REINFORCEMENT (EBR) FOR REINFORCED CONCRETE STRUCTURES BY MEANS OF FIBRE REINFORCED POLYMERS (FRP) THE DESIGN OF EXTERNALLY BONDED REINFORCEMENT (EBR) FOR REINFORCED CONCRETE STRUCTURES BY MEANS OF FIBRE REINFORCED POLYMERS (FRP) Introduction Dott. Ing. Giovanni Cerretini Studio Technica (studio@technica.net)

More information

LTCC gas viscosity sensor

LTCC gas viscosity sensor LTCC gas viscosity sensor Th. Maeder, N. Dumontier, C. Jacq, G. Corradini and P. Ryser Laboratoire de Production Microtechnique Ecole Polytechnique Fédérale de Lausanne EPFL - LPM, Station 17, CH-1015

More information

Samuel Graham. Acknowledgements

Samuel Graham. Acknowledgements Development of Barrier Films for Packaging Flexible Electronics Samuel Graham Woodruff School of Mechanical Engineering School of Materials Science and Engineering Center for Organic Photonics and Electronics

More information

Automated Laser Welding for Textiles

Automated Laser Welding for Textiles EC CONTRACT COOP-CT-2005-017614 Automated Laser Welding for Textiles Horizontal Research Activities Involving SME's Co-operative Research (CRAFT) Publishable Final Activity Report Date of preparation:

More information

Linear Strain Gauges for Bending Beam Force Transducers

Linear Strain Gauges for Bending Beam Force Transducers Linear Strain s Description BCM SENSOR linear strain gauges are specially developed for manufacturing precision force transducers which employ bending beam working principle. For the purpose of this specific

More information

CHARACTERIZATION OF FLEXIBLE HYBRID ELECTRONICS USING STRETCHABLE SILVER INK AND ULTRA-THIN SILICON DIE

CHARACTERIZATION OF FLEXIBLE HYBRID ELECTRONICS USING STRETCHABLE SILVER INK AND ULTRA-THIN SILICON DIE CHARACTERIZATION OF FLEXIBLE HYBRID ELECTRONICS USING STRETCHABLE SILVER INK AND ULTRA-THIN SILICON DIE A Thesis presented to the Faculty of California Polytechnic State University, San Luis Obispo In

More information

Non-Radiometric Measurement. Innovative concept of on-line measurement

Non-Radiometric Measurement. Innovative concept of on-line measurement Innovative concept of on-line measurement Simple Effective Reliable - Secure On-line measurement systems are needed for: Production machineries control Save in scrap Higher quality product and product

More information

High Recovery TPU Elastomer Tapes

High Recovery TPU Elastomer Tapes High Recovery TPU Elastomer Tapes Why High Recovery TPU Elastomers? Stitch Free Garments are here to stay... The replacement of sewn seams and hems with tape or film bonded garments has attracted increasing

More information

Heat Curing Application Methods. Fastelek Temp. Optimal Heating Temp o F to 270 o F 3 ~ 10 seconds 6 ~ 8 seconds 20 ~ 30 seconds

Heat Curing Application Methods. Fastelek Temp. Optimal Heating Temp o F to 270 o F 3 ~ 10 seconds 6 ~ 8 seconds 20 ~ 30 seconds Fastelek is a customizable heat activated electrically conductive adhesive available in a few performance fillers, thicknesses and phase-change (melt point) temperatures. Fastelek is designed to adhere

More information

Deformable Microsystem for In Situ Cure Degree Monitoring of GFRP (Glass Fiber Reinforced Plastic)

Deformable Microsystem for In Situ Cure Degree Monitoring of GFRP (Glass Fiber Reinforced Plastic) Mater. Res. Soc. Symp. Proc. Vol. 1798 2015 Materials Research Society DOI: 10.1557/opl.2015.790 Deformable Microsystem for In Situ Cure Degree Monitoring of GFRP (Glass Fiber Reinforced Plastic) Yang

More information

Complex Flexible Hybrid Electronic Labels

Complex Flexible Hybrid Electronic Labels Complex Flexible Hybrid Electronic Labels 2018FLEX Session 9.1: Flexible Electronics Applications 14 February 2018 Doug Hackler President & CEO Label Quest Labels are cheap The Motivation - used everywhere,

More information

Microsystem Integration (March 20, 2017)

Microsystem Integration (March 20, 2017) Microsystem Integration (March 20, 2017) Mid-term exam: open notes/computers/ - 1:00 to 1:50 p.m., Wednesday, March 22. Homeworks #1 to 7. - Solutions of #1 to 7 are posted. Workshops #1 to 15. - Workshops

More information

The Effects of Defects on the Moisture-Barrier Performance of Clear Coatings on Polymer Substrates.

The Effects of Defects on the Moisture-Barrier Performance of Clear Coatings on Polymer Substrates. AIMCAL, CHARLESTON, SC, 2013 The Effects of Defects on the Moisture-Barrier Performance of Clear Coatings on Polymer Substrates. The National Centre for Printed Electronics ALF part SMITH of Centre for

More information

Chips Face-up Panelization Approach For Fan-out Packaging

Chips Face-up Panelization Approach For Fan-out Packaging Chips Face-up Panelization Approach For Fan-out Packaging Oct. 15, 2015 B. Rogers, D. Sanchez, C. Bishop, C. Sandstrom, C. Scanlan, TOlson T. REV A Background on FOWLP Fan-Out Wafer Level Packaging o Chips

More information

EDGE CHIPPING RESISTANCE USING MACROINDENTATION TESTING

EDGE CHIPPING RESISTANCE USING MACROINDENTATION TESTING EDGE CHIPPING RESISTANCE USING MACROINDENTATION TESTING Prepared by Ali Mansouri 6 Morgan, Ste156, Irvine CA 92618 P: 949.461.9292 F: 949.461.9232 nanovea.com Today's standard for tomorrow's materials.

More information

Smart Packaging Solutions for Secure Applications

Smart Packaging Solutions for Secure Applications Tamper Respondent Envelope Solutions Realized by Additive Manufacturing F. Roscher, N. Saeidi, F. Selbmann T. Enderlein, E. Kaulfersch, J. Albrecht, E. Noack, C. Hannauer, A. Lecavelier, M. Wiemer and

More information

Cyclic Stress-Strain Curve for Low Cycle Fatigue Design and Development of Small Specimen Technology

Cyclic Stress-Strain Curve for Low Cycle Fatigue Design and Development of Small Specimen Technology 1 PD/P8-2 Cyclic Stress-Strain Curve for Low Cycle Fatigue Design and Development of Small Specimen Technology A. Nishimura 1, S. Nogami 2, E. Wakai 3 1 National Institute for Fusion Science (NIFS), Toki,

More information