Stretchable electronics
|
|
- Lillian Osborne
- 5 years ago
- Views:
Transcription
1
2 Stretchable electronics Constraints and possibilities for direct printing on thermoplastic polyurethanes From flexible printed electronics to stretchable Eric Rubingh, Corné Rentrop, Piet Bouten
3 < 3 Holst Centre in a nutshell Who we are Open innovation research institute Founded in 2005 by imec (1300 fte, BE) and TNO (4500 fte, NL) Located at the High Tech Campus in Eindhoven, The Netherlands Own staff 310 researchers What we do Developing technologies for printed electronics and wireless autonomous microsystems In close collaboration with leading industrial partners along the value chain Holst Centre R2R lab Thin Film clean room Electronic measurement OLED Device Processing Equipment Engineering Life Sciences Materials Analysis Photonics cleanroom EMC lab Electronic Prototyping Reliability lab Holst Centre Offices
4 < 4 Holst Centre: Technologies targeted Hybrid printed electronics such as wearable health monitoring and pressure sensor systems Low power sensor systems for monitoring food, air, water quality Low-cost solar cells, CIGS, Thin film, Perovskites, OPV Flexible OLED lighting and displays
5 < 5 Holst Centre: Technologies targeted Hybrid printed electronics such as wearable health monitoring and pressure sensor systems Low power sensor systems for monitoring food, air, water quality Combine into wearables Low-cost solar cells, CIGS, Thin film, Perovskites, OPV Flexible OLED lighting and displays
6 < 6 An explosion of wearable tech
7 < 7 Clothing as wearable tech platform Smart clothing We all wear it and it covers most of our body Monitor vital signs, location, Electronics should be conformable, stretchable, washable,
8 < 8 Wearable electronics, from flexible to stretchable Version 1 Lamination of printed flexible structures Printing of functional structures on thin films Assembly of components Textile lamination with TPU Using standard printed electronics materials Version 2 Lamination of printed stretchable structures Printing functional structures with meanders on films Assembly of components Laser structuring of meanders Textile lamination on TPU Using standard printed electronics materials Version 3 Direct printed stretchable structures Printing of functional structures on TPU Assembly of components Textile lamination Using special stretchable materials
9 < 9 Wearable electronics, from flexible to stretchable Version 1 Lamination of printed flexible structures Printing of functional structures on thin films Assembly of components Textile lamination with TPU Using standard printed electronics materials Version 2 Lamination of printed stretchable structures Printing functional structures with meanders on films Assembly of components Laser structuring of meanders Textile lamination on TPU Using standard printed electronics materials Version 3 Direct printed stretchable structures Printing of functional structures on TPU Assembly of components Textile lamination Using special stretchable materials
10 Version 1: Lamination of printed flexible structures Start from thin plastic films Holst Centre < 10 Typical polymers: polyesters (PEN/PET), polycarbonate (PC), polystyrene (PS) Typical thicknesses: um
11 Version 1: Lamination of printed flexible structures Printing of complex multi-layer structures Holst Centre < 11 Physical activity monitoring patch Multi-layer circuit patterns Done by printing alternating layers of conductive and isolating inks Printing up to 5 circuit layers demonstrated
12 Version 1: Lamination of printed flexible structures Component integration Holst Centre < 12 WiFi tag on film, 5 stacked circuit layers Component integration Several technologies available for reliable integration of components on PE foils Based on ACA, ICA or special soldering technologies
13 Smart textiles Accelerometer Heart rate monitoring Location Not Stretchable Version 1: Lamination of printed flexible structures Textile lamination with TPU Holst Centre 13
14 < 14 Wearable electronics, from flexible to stretchable Version 1 Lamination of printed flexible structures Printing of functional structures on thin films Assembly of components Textile lamination with TPU Using standard printed electronics materials Version 2 Lamination of printed stretchable structures Printing functional structures with meanders on films Assembly of components Laser structuring of meanders Textile lamination on TPU Using standard printed electronics materials Version 3 Direct printed stretchable structures Printing of functional structures on TPU Assembly of components Textile lamination Using special stretchable materials
15 < 15 Version 2: Meander approach for stretchable PE Meander approach Make local spring structures ( meanders ) in the printed electronics film Structures are stretchable through opening/out-of-plane bending Less strain on printed structures/lines The result A stretchable device made from a flexible printed electronics film
16 < 16 Version 2: Meander approach for stretchable PE start from polyester film print electronic structures assemble components laser structure meander Encapsulate in TPU film Washable Laminate on fabric TPU PEN TPU Out of plane deformation of meanders allows stretchability Encapsulation into polyurethane enables washability
17 < 17 Version 2: Meander approach for stretchable PE
18 < 18 Version 2: Meander approach for stretchable PE
19 Version 2: Meander approach for stretchable PE Holst Centre < 19 or PCB s that are stretchable Reliability of meander approach Reliability of meander approach + component integration Flex testing 2 mm radius) and stretch testing 20% strain) Washability: 25 washing cycles at 50 o C successfully completed Main failure cause: mechanical damage (drum rotation)
20 Version 2: Meander approach for stretchable PE Health Patch Holst Centre < 20 Wearables: Health patch Printed electrical sensors Enables ECG, EMG and breathing analysis Worn as a patch on the body for several days Using stretch technologies for improved comfort
21 Version 2: Meander approach for stretchable PE Smart garment Holst Centre < 21 Smart Garment: Printed electrical sensors Enables ECG, EMG etc. Lamination into shirt using TPU Using stretch technologies for reduction of motion artifacts
22 < 22 Wearable electronics, from flexible to stretchable Version 1 Lamination of printed flexible structures Printing of functional structures on thin films Assembly of components Textile lamination with TPU Using standard printed electronics materials Version 2 Lamination of printed stretchable structures Printing functional structures with meanders on films Assembly of components Laser structuring of meanders Textile lamination on TPU Using standard printed electronics materials Version 3 Direct printed stretchable structures Printing of functional structures on TPU Assembly of components Textile lamination Using special stretchable materials
23 Version 3: Direct printing of electronics on TPU < 23 Thermoplastic polyurethane: Foldable and stretchable One step lamination onto textile TPU used extensively in garments and graphical printing industry
24 < 24 Thermoplastic polyurethanes (TPU) Stretchable Robust Solvent resistant Washable Adjustable mechanical properties Hardness, young s module, stress /strain characteristics But also: Creep /Hysteresis Thermal shrinkage Time dependency Strain hardening Residual strain *Desmophan - Covestro
25 < 25 Mechanical testing of TPU s and printed structures Test Set-up Instron Tensile Tester Influence stress-strain on resistance Monitor Load, displacement and resistance Evaluate TPU substrates Different types of TPU Polyester or polyether based Different thicknesses and E-moduli Characteristics Compatibility with printing process Thermal shrinkage, creep, residual strain Evaluate stretchable inks and pastes Types of materials Conductive pastes, dielectrics, sensor materials, adhesives Characteristics Stretchability, adhesion, cohesion Conductivity under/after strain Component assembly and die shear testing
26 < 26 Mechanical testing of TPU s and printed structures Typical test regimes Linear strain Stretching until failure Report absolute and relative resistance (ΔR/R [%]) Progressive strain Deformation: 2% - 5% - 10% - 15% - 20% Hysteresis effect Report residual strain Report absolute and relative resistance (ΔR/R [%]) Cyclic strain tests Repeated deformation (20% - relaxation) 100 times and up Report maximum and minimum stress/resistance
27 < 27 Mechanical testing: Linear strain Stress/resistance under line strain Resistance is increasing exponentially Conductivity in line fully lost at 70% strain Workable resistance until 30% strain End Start
28 < 28 Mechanical testing: Progressive strain Progressive strain curves as a function of used TPU Residual strain varies per type But residual strain is not the only important parameter! Residual strain 5% Residual strain 2.1% Residual strain 1.3%
29 ΔR/R [%] Stress [MPa] Holst Centre < 29 Mechanical testing: Progressive strain Influence progressive strain on line resistance Resistance increases with increasing strain Max ΔR/R at 20% strain: 275% Resistance in relaxed state after testing important ΔR/R after progressive strain test: 100% Partly caused by residual strain in TPU Partly caused by reorientation of particles in structure No visible defects/cracks in line Visual inspection after test Bright field: 50x Bright field: 500x Dark field: 200x Strain [%] 0
30 < 30 Mechanical testing: Progressive strain Stress-strain-resistance curves as a function of used silver paste Several commercial silver pastes tested Paste A: Time dependency observed in relaxation curve Paste A: Time dependency resolved by over-coating Paste B: High stretchability with increased stiffness Paste C: High conductivity, no stretchability Paste D: High conductivity, high residual strain Silver paste characteristics Printability Adhesion and cohesion Stretchability Conductivity Initial Max strain After strain Component assembly Die shear strength
31 < 31 Mechanical testing: Progressive strain Stress-strain-resistance curves as a function TPU substrate Using silver paste B TPU with high residual strain TPU with low residual strain Observations Resistance curves on both TPU substrates very similar Minimal resistance for low residual strain TPU slightly lower Maximal resistance at strain for high residual strain TPU lower
32 < 32 Mechanical testing: Cyclic strain test Stress-strain-resistance curves as a function of cycles Using silver paste B Resistance at min and max strain increases After ~70 cycles min strain stabilizes After ~150 cycles max strain stabilizes Stress 20% strain (high) Stress 7% strain (low) Resistance 20% strain Resistance 7% strain
33 Demonstrator direct printing on TPU Holst Centre < 33 Health patch on TPU Monitor vital signs 3 layer prints Sufficient registration Stretchable
34 < 34 Demonstrator direct printing on TPU Flex smell platform Sensor platform on TPU Temperature and capacitive sensors NFC enabled, app assisted
35 < 35 Other applications Light in clothing Designer jacket Display in clothing Solar shirt Pressure sensor shoe-inlay
36 < 36 Conclusions and work in progress Large variety of TPU substrates available Stress-strain behavior and residual strain important Several other parameters also important Thermal stability, printability, lamination quality and washability Cyclic tests typically reveal stability after ~70 cycles Change of TPU changes stress/strain behavior and performance of pastes Large difference between stretchable pastes Conductivity Stretchability Compatibility with TPU Possible to create functional demonstrators Work in progress Improved component integration in stretchable electronics Washability of devices with larger components Other substrate types like Silicone
37 < 37 Thank you
Manipulation and control of spatial ALD layers for flexible devices. Aimcal Memphis 2016; Edward Clerkx
Manipulation and control of spatial ALD layers for flexible devices Meyer Burger Netherlands Equipment manufacturer Functional inkjet printing Based in Eindhoven, the Netherlands Part of world-wide Meyer
More informationGraphic overlays and touch foils High volume printed products
Graphic overlays and touch foils High volume printed products Mekoprint for more than 60 years Mekoprint is a privately owned company with approx. 260 employees and several production sites. We supply
More informationPolymer Thick Film Paste & Material Compatibility Discussion
Polymer Thick Film Paste & Material Compatibility Discussion John Crumpton September 14, 2015 Agenda What is a Polymer thick Film Basic Thick Film Paste Technology Standard Processing (Printing & Drying)
More informationNovel Wiring Structure for 3D-Conformable Devices
Sawada et al.: Novel Wiring Structure for 3D-Conformable Devices (1/6) [Technical Paper] Novel Wiring Structure for 3D-Conformable Devices Susumu Sawada*, Yoshihiro Tomita*, Koichi Hirano*, Hiromi Morita*,
More informationIntegration and Packaging
Workshop on Smart Systems for Healthcare and Wellness Brusselles 4.2.2014 Hosted by the CATRENE Scientific Committee Integration and Packaging Erik Jung, Harald Pötter Medical Innovations.. and requirements
More informationNovel Polysulfide Substrates for Flexible Electronics. Tolis Voutsas, Ph.D. VP, Business Development Ares Materials, Inc.
Novel Polysulfide Substrates for Flexible Electronics Tolis Voutsas, Ph.D. VP, Business Development Ares Materials, Inc. Contents 6/21/2017 2 Company overview Founded 2014, spin-out of the University of
More informationReliability of Interconnects in LED Lighting Assemblies Utilizing Metal Clad Printed Circuit Boards Stefano Sciolè BDM I.M.S.
Reliability of Interconnects in LED Lighting Assemblies Utilizing Metal Clad Printed Circuit Boards Stefano Sciolè BDM I.M.S. Henkel Electronic Materials Agenda 1. Introduction 2. Motivation 3. Interconnect
More informationSilicone based sensors and actuators for medical diagnosis
Silicone based sensors and actuators for medical diagnosis Dr. Bernhard Brunner, Fraunhofer ISC, Würzburg Aachen - Dresden - Denkendorf International Textile Conference 11-30-2017 / 12-1-2017, Stuttgart
More informationScienceDirect. Arbitrarily shaped 2.5D circuits using stretchable interconnections and embedding in thermoplastic polymers
Available online at www.sciencedirect.com ScienceDirect Procedia Technology 15 (2014 ) 208 215 2nd International Conference on System-Integrated Intelligence: Challenges for Product and Production Engineering
More informationHONEYCOMB MECHANICAL BEHAVIOR USING MACROINDENTATION
HONEYCOMB MECHANICAL BEHAVIOR USING MACROINDENTATION. Prepared by Duanjie Li, PhD 6 Morgan, Ste156, Irvine CA 92618 P: 949.461.9292 F: 949.461.9232 nanovea.com Today's standard for tomorrow's materials.
More informationPrintable elastic conductors by in situ formation of silver nanoparticles from silver flakes
In the format provided by the authors and unedited. DOI: 10.1038/NMAT4904 Printable elastic conductors by in situ formation of silver nanoparticles from silver flakes Naoji Matsuhisa 1, Daishi Inoue 2,
More informationThermo-Mechanical Analysis of Flexible and Stretchable Systems Mario Gonzalez 1, Bart Vandevelde 1, Wim Christiaens 2, Yung-Yu Hsu 1, François Iker 1, Frederick Bossuyt 1, Jan Vanfleteren 1,2, Olaf van
More informationFlexible piezoelectric materials for emerging applications
Flexible piezoelectric materials for emerging applications Konstantin Astafiev, Tomasz Zawada, Karl Elkjaer, and Erling Ringgaard MEGGITT A/S, MSS, Denmark Piezo 2013 - Electroceramics for End-users VII,
More informationAll-Polyimide Thermal Interface Products
All-Polyimide Thermal Interface Products SMTA Harsh Environment Electronics Workshop Dearborn, MI 6/24/03 Jim Fraivillig Fraivillig Technologies Boston, MA Why polyimide? HARSH ENVIRONMENT ELECTRONICS.
More informationI VE GOT YOU UNDER MY SKIN
I VE GOT YOU UNDER MY SKIN Stretchable electronic arrays. The LED sheets can be twisted by 720 degrees and considerably stretched. The wavy metal wires are visible in the image on the on the right. Reprinted
More informationEXCIMER LASER ANNEALING FOR LOW- TEMPERATURE POLYSILICON THIN FILM TRANSISTOR FABRICATION ON PLASTIC SUBSTRATES
EXCIMER LASER ANNEALING FOR LOW- TEMPERATURE POLYSILICON THIN FILM TRANSISTOR FABRICATION ON PLASTIC SUBSTRATES G. Fortunato, A. Pecora, L. Maiolo, M. Cuscunà, D. Simeone, A. Minotti, and L. Mariucci CNR-IMM,
More informationSoft Micro/Nano-structured Sensors for Flexible and Wearable Physical Sensing
The 15 th Korea-US Forum on Nanotechnology Soft Micro/Nano-structured Sensors for Flexible and Wearable Physical Sensing Inkyu Park, Ph.D. Associate Professor, Department of Mechanical Engineering Co-director,
More informationDurable Conductive Inks and SMD Attachment for Robust Printed Electronics
Durable Conductive Inks and SMD Attachment for Robust Printed Electronics Leonard Allison Engineered Materials Systems, Inc. Delaware, OH lallison@conductives.com Abstract Polymer Thick Film (PTF)-based
More informationAnisotropic Conductive Films (ACFs)
Anisotropic Conductive Films (ACFs) ACF = Thermosetting epoxy resin film + Conductive particles Chip or substrate 1 Heat Pressure ACF Substrate 2 Chip or substrate 1 ACF Substrate 2 Applications Chip-on-Board
More informationCharacterization of Physical Properties of Roadware Clear Repair Product
Characterization of Physical Properties of Roadware Clear Repair Product November 5, 2009 Prof. David A. Lange University of Illinois at Urbana-Champaign Introduction Roadware MatchCrete Clear (MCC) is
More informationAdhesives, Inks and Encapsulants
Selector Guide Electronic Materials Series Adhesives, Inks and Encapsulants Printed Electronics Conductive Inks Non-Conductive Inks Stretchables Microelectronic Assembly Electrically Conductive Adhesives
More informationInMold Electronics. Flexible Hybrid Electronics, MEMS and Sensors in the Automotive Industry and Related Transportation Markets Workshop 9/13/2017
Flexible Hybrid Electronics, MEMS and Sensors in the Automotive Industry and Related Transportation Markets Workshop 9/13/2017 InMold Electronics John Crumpton Agenda What is InMold Electronics Enabling
More informationAffix Technology Sdn. Bhd.
Affix Technology Sdn. Bhd. Double Sided Foam Tapes Double Sided Foam Tape is made out of foam of PE, PU, PVC and EVA coated with various types of adhesive for various applications. This tape is available
More informationProgress in Printed TEGs Thermoelectric Network, Manchester, 15/02/2017. Thomas Fletcher
Progress in Printed TEGs Thermoelectric Network, Manchester, 15/02/2017 Thomas Fletcher Introduction to CDT CDT is a spin-out company from the Cavendish Laboratory, University of Cambridge (1992), part
More informationThermal-Tab and Thermal-Ribbon Sensors
Thermal-Tab and Thermal-Ribbon Sensors Install these compact sensors anywhere for accurate point sensing and fast response. All Thermal-Tab modules use a thin-film RTD element. All Thermal-Ribbon models
More informationEmbedded Passives..con0nued
Embedded Passives..con0nued Why Embedded Passives? Improves the packaging efficiency System-on-Package (SOP); SLIM integration Reducing size Eliminating substrate assembly Minimizing solder joint failure
More informationYIELD & TENSILE STRENGTH OF STEEL & ALUMINIUM USING MICROINDENTATION
YIELD & TENSILE STRENGTH OF STEEL & ALUMINIUM USING MICROINDENTATION Prepared by Duanjie Li, PhD & Pierre Leroux 6 Morgan, Ste156, Irvine CA 9618 P: 949.461.99 F: 949.461.93 nanovea.com Today's standard
More informationThe Global Market for Single-Walled Carbon Nanotubes TABLE OF CONTENTS 1 RESEARCH METHODOLOGY... 18
TABLE OF CONTENTS 1 RESEARCH METHODOLOGY... 18 1.1 Market opportunity rating system... 18 1.2 Market challenges rating system... 20 2 EXECUTIVE SUMMARY... 23 2.1 Exceptional properties... 24 2.2 Products
More informationAIMCAL R2R Conference
Contents Introduction Markets OLED Structures Technology Fabrication Process Evaluation (Microstructure & etc) Summary Introduction [Merit of Rigid OLED Display] Cheap product cost Mass production Free
More information3M Electromagnetic Compatible Products
3M Electromagnetic Compatible Products Selection Guide Revision E 3 Innovation Faster, smaller, lighter, easier the skyrocketing development of today s electronics requires new solutions for significant
More informationACS Nano, 2014, 8, Anirban Som
ACS Nano, 2014, 8, 4689 4697. Anirban Som 04-06-14 Introduction Human skin possesses a high degree of flexibility and stretchability and can sense pressure, shear, strain, temperature, humidity, fluid
More informationAIMCAL Fall Technical Conference & 19th International Conference on Vacuum Web Coating
AIMCAL Fall Technical Conference & 19th International Conference on Vacuum Web Coating A.G. Talma, R. Schlatmann, J.W.G. Mahy Akzo Nobel Chemicals bv, P.O. Box 9300, 6800 SB Arnhem, The Netherlands. Phone
More informationStretching the limits of high conductivity ~High-performing elastic conductor realized by self-forming Ag nanoparticles~
School of Engineering, The University of Tokyo Japan Science and Technology Agency (JST) RIKEN Press release May 11 th, 2017 Stretching the limits of high conductivity ~High-performing elastic conductor
More informationCONDUCTIVE ADHESIVES FOR LOW-STRESS INTERCONNECTION OF THIN BACK-CONTACT SOLAR CELLS
ECN-RX--02-027 CONDUCTIVE ADHESIVES FOR LOW-STRESS INTERCONNECTION OF THIN BACK-CONTACT SOLAR CELLS D.W.K. Eikelboom J.H. Bultman A. Schönecker M.H.H. Meuwissen * M.A.J.C. van den Nieuwenhof * D.L. Meier
More informationMicroelectronic Materials CATALOG
Microelectronic Materials CATALOG LORD partners with customers to leverage expertise in multiple chemistries and diverse applications to develop customized solutions. Design Without Compromise At LORD,
More informationBGA Package Underfilm for Autoplacement. Jan Danvir Tom Klosowiak
BGA Package Underfilm for Autoplacement Jan Danvir Tom Klosowiak NIST-ATP Acknowledgment Project Brief Microelectronics Manufacturing Infrastructure (October 1998) Wafer-Scale Applied Reworkable Fluxing
More informationEngineering. Composiies. CRC Press. Taylor & Francis Croup. Boca Raton London New York. CRC Press is an imprint of the
Engineering Design with Polymers and Composiies Second Edition lames G. Gerdeen, PhD, PE Ronald A. L. Rorrer, PhD, PE CRC Press Taylor & Francis Croup Boca Raton London New York CRC Press is an imprint
More informationELASTIC-PLASTIC RESPONSE OF POLYMER COATING UNDER REPETITIVE IMPACT
ELASTIC-PLASTIC RESPONSE OF POLYMER COATING UNDER REPETITIVE IMPACT Prepared by Duanjie Li, PhD & Braden Altstatt 6 Morgan, Ste156, Irvine CA 9618 P: 949.461.99 F: 949.461.93 nanovea.com Today's standard
More informationFlexible Substrates for Smart Sensor Applications
Flexible Substrates for Smart Sensor Applications A novel approach that delivers miniaturized, hermetic, biostable and highly reliable smart sensor modules. AUTHORS Dr. Eckardt Bihler, Dr. Marc Hauer,
More informationNANO SCRATCH TESTING OF THIN FILM ON GLASS SUBSTRATE
NANO SCRATCH TESTING OF THIN FILM ON GLASS SUBSTRATE Prepared by Jesse Angle 6 Morgan, Ste156, Irvine CA 92618 P: 949.461.9292 F: 949.461.9232 nanovea.com Today's standard for tomorrow's materials. 2010
More informationChallenges for Embedded Device Technologies for Package Level Integration
Challenges for Embedded Device Technologies for Package Level Integration Kevin Cannon, Steve Riches Tribus-D Ltd Guangbin Dou, Andrew Holmes Imperial College London Embedded Die Technology IMAPS-UK/NMI
More informationThe Pros of Conformal Coatings
The Pros of Conformal Coatings Choosing the right coating to preserve and protect electronics in harsh environments Introduction Many chemicals found in the oil, gas, and petrochemical industries can consign
More informationDURABILITY OF PRESSURE SENSITIVE ADHESIVE JOINTS
DURABILITY OF PRESSURE SENSITIVE ADHESIVE JOINTS Paul Ludwig Geiss, Daniel Vogt Kaiserslautern University of Technology, Faculty Mechanical and Process Engineering, Workgroup Materials and Surface Technologies
More informationMicroelectronic Materials. Catalog
Microelectronic Materials Catalog LORD partners with customers to leverage expertise in multiple chemistries and diverse applications to develop customized solutions. Design Without Compromise At LORD,
More information3M Electrically Conductive Adhesive Transfer Tape 9707
Technical Data May 2014 3M Electrically Conductive Adhesive Transfer Tape 9707 Product Description 3M Electrically Conductive Adhesive Transfer Tape (ECATT) 9707 is a pressure sensitive adhesive (PSA)
More informationIMRE/ETPL Flagship Project
IMRE/ETPL Flagship Project Nanoparticulate Barrier Films & Gas Permeation Measurement Techniques for Thin Film Solar & Display Application Problems Senthil Ramadas Institute of Materials Research & Engineering
More informationAdvances in Printed Electronic Materials that Meet Cost and Performance Needs
Advances in Printed Electronic Materials that Meet Cost and Performance Needs Mark S. Critzer DuPont Microcircuit Materials Research Triangle Park, NC mcm.dupont.com 1-800-284-3382 Agenda DuPont & Printed
More informationC Technical Data Sheet. Heat transfer Elastic Domestic wash Silver. Product Description. Product Construction. Areas of Applications
C532 100 Heat transfer Elastic Domestic wash Silver Technical Data Sheet Product Description Coats Signal C532 100 is an elastic retro reflective heat transfer for all types of high visibility applications.
More informationBonding to different materials possible (multi-purpose). Sealing, molding and potting purpose. Items Units Results Testing Method Remarks
TB 53 TECHNICAL DATA ThreeBond 53 Single Component Moisture Cure Type Elastic Adhesive Three Bond 53 is a single-component elastic adhesive, which cures in the presence of moisture. The polymer material
More informationElectronic Design & Manufacture Hardware, Software and IoT Capabilities Under One Roof
Electronic Design & Manufacture Hardware, Software and IoT Capabilities Under One Roof Electronic Design & Manufacture Selecting a development and manufacturing partner is often the most important decision
More informationCompression Sensing Element
Compression Sensing Element #0SEC Compression Sensing Element Technical Data Sheet Product overview Compression Sensing Elements are soft and highly precise, designed to measure the forces between the
More informationChapter 15: Characteristics, Applications & Processing of Polymers
Chapter 15: Characteristics, Applications & Processing of Polymers What are the tensile properties of polymers and how are they affected by basic microstructural features? Hardening, anisotropy, and annealing
More informationModelling Embedded Die Systems
Modelling Embedded Die Systems Stoyan Stoyanov and Chris Bailey Computational Mechanics and Reliability Group (CMRG) University of Greenwich, London, UK 22 September 2016 IMAPS/NMI Conference on EDT Content
More informationPEC (Printed Electronic Circuit) process for LED interconnection
PEC (Printed Electronic Circuit) process for LED interconnection Higher wattage LED s/ power components or their placement in higher densities, requires a larger dissipation of heat in a more effective
More informationFlexible functional devices at mass production level with the FLEx R2R sald platform
Flexible functional devices at mass production level with the FLEx R2R sald platform D. Spee, W. Boonen, D. Borsa and E. Clerkx Meyer Burger (Netherlands) B.V. Meyer Burger Introduction to sald Challenges
More informationAbout Thermal Interface Materials
About Thermal Interface Materials Thermal management is to ensure a long-term lifetime and functioning of electronic components such as power semiconductors in electronic circuits. All starts with a profound
More informationBuilding HDI Structures using Thin Films and Low Temperature Sintering Paste
Building HDI Structures using Thin Films and Low Temperature Sintering Paste Catherine Shearer, James Haley and Chris Hunrath Ormet Circuits Inc. - Integral Technology California, USA chunrath@integral-hdi.com
More informationPiezoelectric All-Rounder
Piezoelectric All-Rounder Sensor, Actuator or Both? PI Ceramic GmbH, Lindenstraße, 07589 Lederhose, Germany Page 1 of 5 The Piezo Effect By the end of the 19th century Jacques und Pierre Curie had already
More informationTOUCHING EVERYDAY LIFE
TOUCHING EVERYDAY LIFE Who are we? Our Brands Coating Services Medical Components WELCOME TO COVERIS ADVANCED COATINGS are global leaders in the development, manufacture and distribution of precision coated
More informationEnergy-Efficient Strain Gauges for the Wireless Condition Monitoring Systems in Mechanical Engineering
6th European Workshop on Structural Health Monitoring - We.4.C.2 More info about this article: http://www.ndt.net/?id=14052 Energy-Efficient Strain Gauges for the Wireless Condition Monitoring Systems
More informationTable of Contents. Robert A. Malloy. Plastic Part Design for Injection Molding. An Introduction ISBN:
Table of Contents Robert A. Malloy Plastic Part Design for Injection Molding An Introduction ISBN: 978-3-446-40468-7 For further information and order see http://www.hanser.de/978-3-446-40468-7 or contact
More information3M Electromagnetic Compatible Products
3M Electromagnetic Compatible Products 3Innovation Faster, smaller, lighter, easier the skyrocketing development of today s electronics requires new solutions for significant new problems. These solutions
More informationChapter 15: Characteristics, Applications & Processing of Polymers
Chapter 15: Characteristics, Applications & Processing of Polymers Study: 15.1-15.14 Read: 15.15-15.24 What are the tensile properties of polymers and how are they affected by basic microstructural features?
More information"ITO Film Trend for Touch Panel Applications"
AIMCAL Web Coating Conference 2011 October 23-26 Reno, Nevada USA 1 "ITO Film Trend for Touch Panel Applications" Teijin Chemicals Ltd. Haruhiko Itoh 2 Content 1. Structure and Features of TCF 2. Touch
More informationGage Series Stress Analysis Gages
GAGE SERIES All Micro-Measurements strain gages incorporate precision foil grids mounted on organic backing materials. The strain-sensing alloys and backing materials cannot be arbitrarily combined in
More informationIntroduction: Standard Plastic Terminology Plastic Program Analysis and Development p. 1 Selecting the Design Team for Success p. 3 Using Checklists
Preface p. xv Introduction: Standard Plastic Terminology p. xix Plastic Program Analysis and Development p. 1 Selecting the Design Team for Success p. 3 Using Checklists to Develop Product Requirements
More informationPhotonic Curing and Soldering
Photonic Curing and Soldering Ultra-fast Fabrication of Printed Electronics AIPIA Conference, Utrecht November 19 th, 215 Rob Hendriks Research Engineer Presentation overview Introduction Photonic Curing
More informationA novel pick-and-place process for ultra-thin chips on flexible smart systems Thomas Meissner (Hahn-Schickard)
A novel pick-and-place process for ultra-thin chips on flexible smart systems Thomas Meissner (Hahn-Schickard) Dr. rer. nat. Outline 1. Introduction to Hahn-Schickard 2. Motivation 3. Pick process 4. Application
More informationEMC & RFI Products. EMC & RFI Products. OEM Electrical Insulation Tapes. OEM Liquid Resins. Heat Shrink
EMC & RFI Products For more than 40 years 3M Company has been one of the foremost sources of effective electromagnetic compatible (EMC) solutions. Many of the world s leading electronic and electrical
More information3M Thermal Bonding Film 668
Technical Data May 2014 3M 668 Product Description 3M 668 is a flexible, light colored, thermoplastic adhesive bonding film which exhibits good adhesion to a variety of substrates. The bonding film is
More informationEpoxy. Epoxy 90, ,000. Epoxy. Epoxy. low ion content, Encapsulation of electronic
- - and Light Curing Adhesives Our comprehensive range of systems covers a multitude of applications and offers many advantages: systems are used in many fields in both trade and industry. adhesives and
More informationTechnische Information
Technische Information Replaces Technical Information dated 11.03.04 Update: 09.02.05 Screenable, solvent based pressure sensitive adhesive KIWOPRINT TC 2000 is a high-quality pressure sensitive adhesive
More informationIntroduction of CSC Pastes
Introduction of CSC Pastes Smart Phones & Conductive Pastes Chip Varistors Chip Inductors LC Filters Flexible Printed Circuit Boards Electronic Molding Compounds ITO Electrodes PCB Through Holes Semiconductor
More informationThe word design means many different things to different people. Here, design is used to denote an educated method of choosing and adjusting the
The word design means many different things to different people. Here, design is used to denote an educated method of choosing and adjusting the physical parameters of a vibrating system in order to obtain
More informationHenkel to feature wide range of adhesive innovations for healthcare applications
Press Release September 11, 2018 Henkel at COMPAMED 2018 Henkel to feature wide range of adhesive innovations for healthcare applications Düsseldorf, Germany At the COMPAMED fair in Düsseldorf (November
More information3M Anisotropic Conductive Film (for Touch Screen Panel)
Technical Data November 2013 3M Anisotropic Conductive Film 7371-20 (for Touch Screen Panel) Product Description 3M Anisotropic Conductive Film (ACF) 7371-20 is a heat-bondable, electrically conductive
More informationTrends and Developments
Trends and Developments Monique Mayr Monique.Mayr@eu.panasonic.com European R&M Group Panasonic Corporation Electronic Material Business Division Weitere Informationen finden Sie auch auf: http://www3.panasonic.biz/em/pcbm/en/index.html
More informationIPC Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures IPC-6015
ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures February 1998 A standard developed
More informationEffect of Chip Dimension and Substrate Thickness on the Solder Joint Reliability of Plastic Ball Grid Array Packages* S.-W. Lee, J.H.
Page 1 of 9 Effect of Chip Dimension and Substrate Thickness on the Solder Joint Reliability of Plastic Ball Grid Array Packages* The Authors S.-W. Lee, J.H. Lau** S.-W. Lee, Center for Advanced Engineering
More informationTypical Properties. THERMATTACH Dielectric Thickness Thermal Material Strength Carrier Color inches (mm) Impedance Features/Typical Applications (Vac)
THERMATTACH Typical Applications bonding heat sinks to plastic packages (T410 and T411) bonding heat sinks to metal or ceramic packages (T404,T405 and T412) heat spreader to circuit board attachment (T413
More informationDesign and Manufacturing of a Flexible Hybrid Electronics (FHE) Biometric Human Performance Monitor (BHPM)
Design and Manufacturing of a Flexible Hybrid Electronics (FHE) Biometric Human Performance Monitor (BHPM) Presented by Professor Mark Poliks Systems Science and Industrial Engineering Binghamton University
More informationVISION INNOVATE INSPIRE DELIVER
INSPIRE Vision About NovaCentrix Photonic Curing INNOVATE History Applications DELIVER Our Products SimPulse Conductive Inks NanoPowders VISION NovaCentrix partners with you to take ideas from inspiration
More informationJoining Sub Platform
Joining Sub Platform to Manufuture Joining A Core Element to Innovative and Sustainable Manufacturing Top Level Objectives Support the European 2020 Strategy in addressing the grand challenges in the areas
More informationTHE DESIGN OF EXTERNALLY BONDED REINFORCEMENT (EBR) FOR REINFORCED CONCRETE STRUCTURES BY MEANS OF FIBRE REINFORCED POLYMERS (FRP)
THE DESIGN OF EXTERNALLY BONDED REINFORCEMENT (EBR) FOR REINFORCED CONCRETE STRUCTURES BY MEANS OF FIBRE REINFORCED POLYMERS (FRP) Introduction Dott. Ing. Giovanni Cerretini Studio Technica (studio@technica.net)
More informationLTCC gas viscosity sensor
LTCC gas viscosity sensor Th. Maeder, N. Dumontier, C. Jacq, G. Corradini and P. Ryser Laboratoire de Production Microtechnique Ecole Polytechnique Fédérale de Lausanne EPFL - LPM, Station 17, CH-1015
More informationSamuel Graham. Acknowledgements
Development of Barrier Films for Packaging Flexible Electronics Samuel Graham Woodruff School of Mechanical Engineering School of Materials Science and Engineering Center for Organic Photonics and Electronics
More informationAutomated Laser Welding for Textiles
EC CONTRACT COOP-CT-2005-017614 Automated Laser Welding for Textiles Horizontal Research Activities Involving SME's Co-operative Research (CRAFT) Publishable Final Activity Report Date of preparation:
More informationLinear Strain Gauges for Bending Beam Force Transducers
Linear Strain s Description BCM SENSOR linear strain gauges are specially developed for manufacturing precision force transducers which employ bending beam working principle. For the purpose of this specific
More informationCHARACTERIZATION OF FLEXIBLE HYBRID ELECTRONICS USING STRETCHABLE SILVER INK AND ULTRA-THIN SILICON DIE
CHARACTERIZATION OF FLEXIBLE HYBRID ELECTRONICS USING STRETCHABLE SILVER INK AND ULTRA-THIN SILICON DIE A Thesis presented to the Faculty of California Polytechnic State University, San Luis Obispo In
More informationNon-Radiometric Measurement. Innovative concept of on-line measurement
Innovative concept of on-line measurement Simple Effective Reliable - Secure On-line measurement systems are needed for: Production machineries control Save in scrap Higher quality product and product
More informationHigh Recovery TPU Elastomer Tapes
High Recovery TPU Elastomer Tapes Why High Recovery TPU Elastomers? Stitch Free Garments are here to stay... The replacement of sewn seams and hems with tape or film bonded garments has attracted increasing
More informationHeat Curing Application Methods. Fastelek Temp. Optimal Heating Temp o F to 270 o F 3 ~ 10 seconds 6 ~ 8 seconds 20 ~ 30 seconds
Fastelek is a customizable heat activated electrically conductive adhesive available in a few performance fillers, thicknesses and phase-change (melt point) temperatures. Fastelek is designed to adhere
More informationDeformable Microsystem for In Situ Cure Degree Monitoring of GFRP (Glass Fiber Reinforced Plastic)
Mater. Res. Soc. Symp. Proc. Vol. 1798 2015 Materials Research Society DOI: 10.1557/opl.2015.790 Deformable Microsystem for In Situ Cure Degree Monitoring of GFRP (Glass Fiber Reinforced Plastic) Yang
More informationComplex Flexible Hybrid Electronic Labels
Complex Flexible Hybrid Electronic Labels 2018FLEX Session 9.1: Flexible Electronics Applications 14 February 2018 Doug Hackler President & CEO Label Quest Labels are cheap The Motivation - used everywhere,
More informationMicrosystem Integration (March 20, 2017)
Microsystem Integration (March 20, 2017) Mid-term exam: open notes/computers/ - 1:00 to 1:50 p.m., Wednesday, March 22. Homeworks #1 to 7. - Solutions of #1 to 7 are posted. Workshops #1 to 15. - Workshops
More informationThe Effects of Defects on the Moisture-Barrier Performance of Clear Coatings on Polymer Substrates.
AIMCAL, CHARLESTON, SC, 2013 The Effects of Defects on the Moisture-Barrier Performance of Clear Coatings on Polymer Substrates. The National Centre for Printed Electronics ALF part SMITH of Centre for
More informationChips Face-up Panelization Approach For Fan-out Packaging
Chips Face-up Panelization Approach For Fan-out Packaging Oct. 15, 2015 B. Rogers, D. Sanchez, C. Bishop, C. Sandstrom, C. Scanlan, TOlson T. REV A Background on FOWLP Fan-Out Wafer Level Packaging o Chips
More informationEDGE CHIPPING RESISTANCE USING MACROINDENTATION TESTING
EDGE CHIPPING RESISTANCE USING MACROINDENTATION TESTING Prepared by Ali Mansouri 6 Morgan, Ste156, Irvine CA 92618 P: 949.461.9292 F: 949.461.9232 nanovea.com Today's standard for tomorrow's materials.
More informationSmart Packaging Solutions for Secure Applications
Tamper Respondent Envelope Solutions Realized by Additive Manufacturing F. Roscher, N. Saeidi, F. Selbmann T. Enderlein, E. Kaulfersch, J. Albrecht, E. Noack, C. Hannauer, A. Lecavelier, M. Wiemer and
More informationCyclic Stress-Strain Curve for Low Cycle Fatigue Design and Development of Small Specimen Technology
1 PD/P8-2 Cyclic Stress-Strain Curve for Low Cycle Fatigue Design and Development of Small Specimen Technology A. Nishimura 1, S. Nogami 2, E. Wakai 3 1 National Institute for Fusion Science (NIFS), Toki,
More information